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2A36J-VENUS20Venus

Yi Tunnel (Beijing) Technology Co., Ltd.
Venus - FCC ID 2A36J-VENUS20 - Yi Tunnel (Beijing) Technology Co., Ltd.
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Application Details

Equipment Class
PCB - PCS Licensed Transmitter
Date of Grant
Jan 19, 2022
Application Purpose
Original Equipment
Date of Application
Jan 18, 2022
Equipment Note
Venus
Frequency Range
2506.00000000 - 2680.00000000
Company
Yi Tunnel (Beijing) Technology Co., Ltd.
Country
China

Documents & Files

Select a file to view

Users Manual

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Block Diagram

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Cover Letter(s)

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External Photos

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ID Label/Location Info

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Internal Photos

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Operational Description

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Parts List/Tune Up Info

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RF Exposure Info

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Schematics

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Test Report

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Test Setup Photos

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Document Text

Text extracted from the exhibit documents filed with the FCC. Open a document above to read the original.

Users Manual

1 Venus Industrial Computer User Manual Model: Venus 20-US-4G-PCIE-M2 2 User Manual Chapter I Product Version List ................................................................................................................................. 3 Chapter II Product Appearance Description ............................................................................................................. 4 2.1 Top View of Product ................................................................................................................................. 4 2.2 Bottom View of Product .......................................................................................................................... 4 2.3 Product Front View .................................................................................................................................. 5 2.4 Rear View of Product ............................................................................................................................... 5 2.5 Three-Dimensional Product Ruler (unit|mm) ....................................................................................... 5 2.6 Internal Product Description .................................................................................................................... 6 2.7 Description of Product Keys and Indicator Lights .................................................................................... 7 Chapter III Interface Description ............................................................................................................................... 8 3.1 Power Supply ........................................................................................................................................... 8 3.2 MFP .......................................................................................................................................................... 8 3.3 RELAY ..................................................................................................................................................... 10 3.4 RS485 ..................................................................................................................................................... 10 3.5 LOCK、EOB ............................................................................................................................................ 11 3.6 LED ......................................................................................................................................................... 12 3.7 Product External Interface Description .................................................................................................. 13 Chapter IV Function Declaration .............................................................................................................................. 13 4.1 System Information ................................................................................................................................ 13 4.2 System State........................................................................................................................................... 14 4.3 4G Network ............................................................................................................................................ 15 4.4 Wired Network Configuration Method .................................................................................................. 16 Chapter V Tz_gpio Operating Instructions .............................................................................................................. 17 5.1 4G Function Module .............................................................................................................................. 17 5.2 USB Function Module ............................................................................................................................ 19 5.3 Communication Control Link Master Control ........................................................................................ 19 5.4 NX System Operation Lamp Module: ..................................................................................................... 20 5.5 RS485 Peripheral Power Supply Control ................................................................................................ 20 Chapter VI Usage Scenarios and Precautions .......................................................................................................... 21 6.1 Usage Scenario ....................................................................................................................................... 21 6.2 Peripheral Installation Schematic Diagram ............................................................................................ 21 6.3 Typical Installation Case ......................................................................................................................... 22 6.4 TF Card Insertion and Extraction Problem ............................................................................................. 25 3 Chapter I Product Version List This chapter records all previous version changes. imprint Product version V1.0 2020.12 Used for the first batch of formal 20 sets of production. MCU version R1.0 2020.11 NX version R1.0 2020.11 4G module version BVE12 Ee_WUS Xinke domestic version Shell version V3.0 / 3D printing imprint Product version V2.0 2021.1 Used for the second batch of formal production of 180 sets. MCU version R1.0 2020.11 NX version R1.0 2020.11 4G module version BVE12 Ee_WUS Xinke domestic version Shell version V4.0 / Screen printing content is only SANDSTAR, and S and Shida Chinese characters are cancelled. 4 Chapter II Product Appearance Description 2.1 Top view of product 2.2 Bottom view of product 5 2.3 Product Front View 2.4 Rear View of Product 2.5 Three-Dimensional Product Ruler (Unit|mm) 6 2.6 Internal product description The parts …

Text truncated - open the document above for the full version.

Block Diagram

5 5 4 4 3 3 2 2 1 1 DD CC BB AA Jetson XAVIER NX HDMI DDC Volta GPU: 48 Tensor cores 1100MHz Carmel CPU: ARMv8.2 64-bit 3 x dual-core L3 Cache 4MB Memory:128-bit LPDDR4 interface 8GB 1600MHz EMMC 5.1 16G HDMI2.0a/b HDMI RESETRecoverySW RECOVERYbutton SD CARD SDIO GPIO LED GREEN USB2.0 USB2.0 *2 4G module MCU HEADER UART 3P header UART0 UART1 UART2 Debug MDI 100M Ethernet Switch RTL8305NB I2S AUDIO CODEC ALC5616 LINEOUT M.2 Key M SSD PCIEX4 4G Router FROM MCU BOARD header *RST *PWR_EN *heart beat *SYS recovey TO MCU BOARD header *RST *PWR_EN *heart beat *SYS recovey GPIOX8 SPI to UART WK2132 SPIUART WAN(RJ45) MCU BOARD HD RJ45 5V load switch X2 1A per port GPIOX2 4G LED X4 GREEN EEPROM 1kb(SN NO.) I2C ALWAYS ON POWER RAIL MDI MDI SIM PMOS SW PWR UART RS232ST202ECDR 4P RS485 12V4A 4P RS485 5V 2A 5V load switch X4 1A per port GPIOX4 USB3.0 USB3.0 HUB RTS5411 USB3.0 *4 PCIEX1 PCIE TO USB3.0*2 CRYSTAL 25MHZ CRYSTAL 16MHZ CRYSTAL 12MHZ CRYSTAL 20MHZ Title SizeDocument NumberRev Date:Sheetof T20I751300 TZTEK Confidential A1 225Tuesday, December 14, 2021 <Core Design> Title SizeDocument NumberRev Date:Sheetof T20I751300 TZTEK Confidential A1 225Tuesday, December 14, 2021 <Core Design> Title SizeDocument NumberRev Date:Sheetof T20I751300 TZTEK Confidential A1 225Tuesday, December 14, 2021 <Core Design> 5 5 4 4 3 3 2 2 1 1 DD CC BB AA FUSE INPUT 12V HDMI,U2*2, U3*4,HUB 5V 7A 35W M.2 GE SWITCH 3.3V 4A 13.2W VDD_5V 8A SY8368AQQC BUCK VDD_3V3 8A SY8368AQQC BUCK VDD_1V8 1A APL5932AKAI-TRG LDO 5G minpcie (NC reserve) 35W 12W VDD_5VSB 8A SY8368AQQC BUCK XAVIER NX 5V 3A 15W 4G module 12V 0.5A 6W 15W VDD_3V3_NX PMOS Title SizeDocument NumberRev Date:Sheetof T20I751300 TZTEK Confidential A1 325Wednesday, March 31, 2021 <Core Design> Title SizeDocument NumberRev Date:Sheetof T20I751300 TZTEK Confidential A1 325Wednesday, March 31, 2021 <Core Design> Title SizeDocument NumberRev Date:Sheetof T20I751300 TZTEK Confidential A1 325Wednesday, March 31, 2021 <Core Design> 5 5 4 4 3 3 2 2 1 1 DD CC BB AA MCU RS485/5V 2A 4P NX headerPHY STM32F407 512KB ROM 96KB RAM 10/100 Ethernet MAC to NX header 12V 2P BAT 12V 7500mAH I2C Battery management header GPIOX4 RS485/12V4A 4P 2P MAIN 12V 150W max NX header RS232 GPOX8 3P +3P RelayX2 (5A) GPIOX2 header 2*RGB LAMP CTL X3 GPIOX6 6P X2 + header LOCK CTL X3 GPIOX3 2P LED CTL X1 (30W) GPIOX1 toggle switch *3 2P emergency button L *3 peak 2A per port 12V GPIOX3 MOS header 12V/5V 3A per port GPIOX2 GPIX6 UART+GPIO UART+GPIO RS232 header LED CTL X1 GPIOX1 GPIOX1 inform MCU main power loss GPIO LED FLASH 1Mb SPI FROM NX BOARD header *RST *PWR_EN *heart beat *SYS recovey TO NX BOARD header *RST *PWR_EN *heart beat *SYS recovey RST BUTTON Debug RS232 Debug UART SWD SWD CRYSTAL 25MHZ CRYSTAL 32.768KHZ CRYSTAL 25MHZ Title SizeDocument NumberRev Date:Sheetof MCU_T20I751_board300 TZTEK Confidential A0 2712Tuesday, December 14, 2021 Title SizeDocument NumberRev Date:Sheetof MCU_T20I751_board300 TZTEK Confidential A0 2712Tuesday, December 14, 2021 Title SizeDocument NumberRev Date:Sheetof MCU_T20I751_board300 TZTEK Confidential A0 2712Tuesday, December 14, 2021 5 5 4 4 3 3 2 2 1 1 DD CC BB AA FUSE INPUT 12V_MAIN BQ24725A12V_BAT VDD_5VSB 8A SY8368AQQC BUCK VDD_3V3 8A SY8368AQQC BUCK 12V 2.5A 12V 1.5A LAN8720A-CP-TR MCU RS485_CTL_5V 2A XL485CS ST202ECDR OUT_CTL_5V 3A 10W15W NX_12V 6A OUT_CTL_12V 3A 72W36W RS485_CTL_12V 4A LED_12V 5A 12W60W LOCK_CTL_12V 4.5A RGB_12V 2A 54W24W Title SizeDocument NumberRev Date:Sheetof MCU_T20I751_board300 TZTEK Confidential A0 2812Tuesday, December 14, 2021 B1 Title SizeDocument NumberRev Date:Sheetof MCU_T20I751_board300 TZTEK Confidential A0 2812Tuesday, December 14, 2021 B1 Title SizeDocument NumberRev Date:Sheetof MCU_T20I751_board300 TZTEK Confidential A0 2812Tuesday, December 14, 2021 B1

Cover Letter(s)

APPENDIX B (Yi Tunnel (Beijing) Technology Co., Ltd.) [Jan.6th,2022] Federal Communications Commission 445 12 th Street SW Washington, DC 20554 Subject: Limited Agency Agreement (Yi Tunnel (Beijing) Technology Co., Ltd.) FCC ID: 2A36J-VENUS20 To Whom It May Concern: We, (Yi Tunnel (Beijing) Technology Co., Ltd.), hereby authorized Intertek Testing Services to act as our Agent for the purpose of preparing application for FCC ID number 2A36J-VENUS20 under all applicable parts of the FCC rules and regulations. The effective date of this limited agency agreement is (Jan.6th,2022). The Limited Agency Agreement expires on (Jan.5th,2023), unless sooner terminated or extended by written notice to Intertek Testing Services and the Federal Communications Commission. This i s to advise that we are in full compliance with the Anti-Drug Abuse Act. The applicant is not subject to a denial of federal benefits pursuant to Section 5301 of the Anti-Drug Act of 1988, 21 U.S.C. 862, and no party to the application is subject to a denial of federal benefits pursuant to that section. If you have any questions or comments, please do not hesitate to contact me. Sincerely, [Guangjie Xiang] [Senior Manager]

Cover Letter(s)

APPENDIX E [Yi Tunnel (Beijing) Technology Co., Ltd.] Attention: Certification reviewer RE: Request for Confidentiality FCC ID: 2A36J-VENUS20 To Whom It May Concern: Permanent Confidentiality [Complete this section if permanent confidentiality is requested] Request to withhold permanently from public review certain portions of the application for equipment certification for the referenced FCC identifiers. This request for confidentiality is made pursuant to 47 CFR 0.457(d) and 0.459 of the FCC Rules. In particular, the following sections of the application are to be kept permanently confidential: [Select one or more of items below, as appropriate] Schematics Block Diagrams Operational Description Tune-up Procedure Parts List Internal Photos (see note) Users Manual (see note) Note 1: Internal Photos may be held confidential 1) if the circuit board or internal components are not accessible to users. For example, it is acceptable if the circuit board is enclosed in epoxy. 2) Also, it is acceptable if the device is not accessible to the public, for example, a device mounted on the top of a large tower (or in a fenced enclosure) such that it is only serviceable by professional designated technicians under a Non-Disclosure Agreement (NDA). All sales for these devices must be under a NDA restricting the disclosure of the propriety information, including internal photos. Users Manual may be held confidential only when the manual contains proprietary technical information intended for professional technicians obligated under a NDA. All sales and distribution of the user’s manual must be under a NDA that restricts the disclosure of the information. In the application cover letter requesting permanent confidentiality the following additional description and the NDA exhibit is required: 1. Describe in detail how internal photos and/or users manual information are controlled to prevent them from becoming public or disclosed to unauthorized persons. 2. Describe how public access is restricted for products serviceable by professional designated technicians. 3. A statement that all sales of the non-consumer device will be under a NDA to include third party sales and that the final user of the device is subject to the NDA. 4. Provide an example of the NDA between the grantee and a purchaser. The request for confidentiality must Note 2: For scanning receiver, the schematics, block diagrams, operational description, tune-up procedure, parts list and internal photos are always held permanently confidential. Short-term Confidentiality [Complete this section if short-term confidentiality is requested] Request to withhold from public review for a period of [180] days from the date of the Grant of Equipment Authorization and prior to marketing, certain portions of the application for equipment certification for the referenced FCC identifiers. This request for confidentiality is made pursuant to 47 CFR 0.457(d) and 0.459 of the FCC Rules. In particular, the following sections of the application are to be kept short-term confidential for a period above from the date of the grant [Select one or more of items below that are not selected in the list above, as appropriate] Schematics Block diagrams Operational Description Tune-up Procedure Parts List Test Setup Photos External Photos Internal Photos Users Manual Rationale for request for confidentiality: We have invested considerable time and materials in research and development to produce the referenced product. Permanent confidentiality: Disclosure of the permanently confidential portions of this application to competitors would not only give them significant competitive advantages in developing similar products, but would also disclose successful implementation of unpublished, leading edge technology developed by us. Short-term confidentiality: Disclosure of the short-term confidential portions of this application during the period of importation and/or distribution would reveal key aspects of proprietary technology to competitors and diminish the value of our investment in research and development. If you have questions or need further information, please contact the undersigned. Sincerely, _________________ [Guangjie Xiang] [Senior Manager] [Jan.6th, 2022]

Cover Letter(s)

Declaration on model difference 产品差异声明 Page 1 of 1 page We the undersigned hereby confirm that any of our production units bearing the following model numbers are identical in circuitry and electrical, mechanical and physical construction; the only differences are the appearance 、trade name and model no. for trading purpose. 我们在下面签名并据此确认:以下产品型号之间的差异仅为外观、商标及型号不同,其它设计完全相同。  The above appearance is for color and silk-screen only. 上述所说外观仅指产品的颜色及丝印. Production name 产品名称 Trade name 商标 Model no. 型号  Please provide at least 1 sample with difference except specified as above for further evaluation. 如有以下所述差异,需提供1个样板做进一步评估。 Production name 产品名称 Trade name 商标 Model no. 型号 Description 差异描述 Venus SANDSTAR Venus 20-US-4G-PCIE-M2 Add one more PCIE chip 2 USB2.0 ports are native ports Among them, the 2 USB3.0 interfaces are transferred by a native USB3.0 through the HUB, and the 2 USB3.0 interfaces share a native USB3.0 bandwidth. Two of the USB3.0 interfaces are transferred by PCIE, and each channel can fully use the bandwidth of USB3.0 Venus SANDSTAR Venus 20-US-4G-NA-M2 2 USB2.0 ports are native ports The 4-channel USB3.0 interface is transferred from a native USB3.0 through the HUB, and the 4-channel USB3.0 interface shares a native USB3.0 bandwidth Venus SANDSTAR Venus 20-CN-4G-NA-M2 2 USB2.0 ports are native ports The 4-channel USB3.0 interface is transferred from a native USB3.0 through the HUB, and the 4-channel USB3.0 interface shares a native USB3.0 bandwidth Confirmed by Authorized Signature: 授权人签字 Company Stamp : Date: 公司盖章 日期

ID Label/Location Info

Size:60*40mm

Operational Description

Venus 20-US-4G-PCIE-M2, Venus 20-CN-4G-NA-M2, and Venus 20-US-4G-NA-M2 are Engineering control equipments in the GSM/UMTS/LTE system. The GSM frequency band includes GSM850 and GSM900 and DCS1800 and PCS1900. but only GSM850/1900 test data included in this report. The UMTS frequency band are band I /II /IV/V/VI/VIII/XVIIII, but only band II and Band IV and Band V test data included in this report. The LTE frequency band is Band I/II/III/IV /V/VII/VIII/XII/XIII/XVIII/XVIIII/XX/XXV/XXVI/XXVIII/XXXVIII/XXXVIIII/XXXX/XXXXI, but only Band II/IV /V/VII/XII/XIII/XXV/XXVI/XXXVIII/XXXXI test data included in this report. The Engineering control equipments implements such functions as RF signal receiving/transmitting, LTE/UMTS and GPRS/EDGE protocol. Externally it provides micro SD card interface and USIM card interface. The EUT is powered by DC 12V/12.5A. For more detailed features description, please refer to the user’s manual. 1) Power Supply Working Voltage : DC 12V, provided by power adaptor. 2) Main System MCU board's main chip is STM32F407VET6, responsible for program files and data storage. A frequency of 25MHz and a frequency of 32.768 kHz clock signals are used as the basic clock signal. NX board uses NVIDIA's JetsonXavierNX module. Jetson Xavier NX delivers up to 21 TOPS for running modern AI workloads.etson Xavier NX integrated 6 core ARM 64-bit processor, 6 core up to 1.4ghz, integrated L2 6MB + L3 4MB cache, There is also 8GB 1600MHz 128bit LPDDR4x memory (write bandwidth 51.2GB/s) and 16GB eMMC storage. All chips and all crystals are described in the table below: U1_MCU BQ24725A battery charge management U9 STM32F407VET6 STM32 Series 32-Bit 512 KB Flash 192 KB RAM ARM Based Microcontroller - LQFP-100 U10 FM25F01-SO-U-G FLASH 1Mb (128K x 8)Non-Volatile SPI - Dual I/O U11 LAN8720A-CP-TR 2/2 Transceiver Full RMII 24-QFN (4x4) U15,U16,U17,U18 74LVC1T45W6-7 Voltage Level Translator Bidirectional 1 Circuit 1 Channel - SOT-26 Y1,Y3 E3SB25E00000DE crystal 25M Y2 X1A000061000200 CRYSTAL 32.768K HBU1 RTS5411-GR USB3.0 HUB 4PORT QFN-76 9X9MM RTS5411-GR REALTEK HBX1 X322512MSB4SI CRYSTAL 12M,3225 MY2 JYXT32S4-020.00000-91C4B0 crystal 20MHz 3225 PU2,PU4,PU7 SY8368AQQC SY8368AQQC PU3,PU8 APL5932AKAI-TRG Ultra Low Dropout (0.23V Typical) Linear Regulator U1 ALC5616-CGT low power audio codec for mobile device U2,U4,U6,U8,U15,U16,U17,U24 APL3511CBI-TRG 1A load switch U5 M24C02-RMN6TP 2kb I2C EEPROM U14 WK2132 SPI to dual UART port U18 RTL8305NB-CG 5 port 100M switch RTL8305NB U20 TXB0108PWR 8-Bit Bidirectional Voltage-Level Translator with Auto-Direction Sensing U21,U23 XL485CS RS-485/RS-422 U22 ST202ECDR TTL to RS232 U31 ASM1042A-48 2 ports USB3.0 xHCI Rev1.0 Host Controller Y1_NX X322525MSB4SI CRYSTAL 25M,3225 Y2_NX X322516MLB4SI CRYSTAL 16M,3225 3)4G BC8420-G is an LTE CAT4 4G wireless routing board developed based on Quectel EG25-G module, supporting standard 4-wire,The Ethernet interface can realize fast and convenient access to the operator's 4G wireless network for customer terminal equipment.Supply voltage range: 5V ~ 16V, typical supply voltage: DC12V/1A, Connection form: 2pin terminal with 1.25mm pitch The 4G communication board uses a 25MHz crystal oscillator 7M25000033:XTAL CRY 25MHz ± 10PPM 12pF -40 to +85°C 3225 H0.8mm H1102NL:10/100BASE-T Single Port Magnetic; TR 1:1; / -40 to +85°C / RoHS / SOP16; MP2233DJ:Up to 16V input 3A Output 1.4MHz High-Efficiency Synchronous Step-Down Converter / -40 to +125°C / TSOT-23-8, H:1.0mm / RoHS SGM706-SYS8G/TR:Low-Cost, Microprocessor Supervisory Circuit / -40 to +85°C / SOIC-8 SGM2036-3.3YN5G/TR:300mA, Low Power, Low Dropout,RF Linear Regulators,SOT-23-5,-40°C to +85°C Operating Temperature SR9900A:Ultra-low power USB 2.0 to 10/100m fast Ethernet control circuit,QFN24-04x04,0°C to +70°C Operating Temperature SGM7222YWQ10:High-Speed USB2.0 DPDT Analog Switch / -40 to +85°C / UQFN10 102314442:SIM Card / Push-push Nano SIM CARD With Detect Switch,-40 to +85°C Eg25-g module supports the following frequency bands: LTE-FDD(with receive diversity): B1/B2/B3/B4/B5/B7/B8/B12/B13/B18/B19/B20/B25/B26/B28 LTE-TDD(with receive diversity): B38/B39/B40/B41 WCDMA(with receive diversity): B1/B2/B4/B5/B6/B8/B19 GSM 850/900/1800/1900 MHz

Parts List/Tune Up Info

Tune Up Procedure Tune-up procedure During manufacturing each Device is individually calibrated. Measurement is performed in a fully calibrated setup using an Agilent 8960 base station simulator (system tester). Measurement procedure is outlined below: Measurement Procedure: 1. Set the device to nominal operating voltage and on a predefined channel in a special test mode. 2. The actual output power is measured at several power levels. 3. The gain factors of each individual device are adjusted until the target value is met. The appropriate gain control settings for each output power level are stored in each device individually. The user has no possibility to change these settings. 4. The maximum gains of each individual device are adjusted and measured until the target value is met. The production target power with tolerance compiles with the maximum power in test report. Target Value is Average Output Power Value GSM850 Tune up Power tolerant (dBm) GPRS 1 slots 29±1 GPRS 2 slots 29±1 GPRS 3 slots 28±1 GPRS 4 slots 26±1 EGPRS 1 slots 26±1 EGPRS 2 slots 24±1 EGPRS 3 slots 22±1 EGPRS 4 slots 19.5±1 PCS1900 Tune up Power tolerant (dBm) GPRS 1 slots 29±1 GPRS 2 slots 27±1 GPRS 3 slots 25.5±1 GPRS 4 slots 23.5±1 EGPRS 1 slots 26±1 EGPRS 2 slots 25.5±1 EGPRS 3 slots 25.5±1 EGPRS 4 slots 23.5±1 WCDMA Band II Tune up Power tolerant (dBm) RMC 12.2k 22.5±1 HSDPA Subtest-1 22.5±1 HSDPA Subtest-2 22.5±1 HSDPA Subtest-3 22.5±1 HSDPA Subtest-4 22.5±1 HSUPA Subtest-1 20±1 HSUPA Subtest-2 21±1 HSUPA Subtest-3 21±1 HSUPA Subtest-4 21±1 HSUPA Subtest-5 22.5±1 WCDMA Band IV Tune up Power tolerant (dBm) RMC 12.2k 22.5±1 HSDPA Subtest-1 22.5±1 HSDPA Subtest-2 22.5±1 HSDPA Subtest-3 22.5±1 HSDPA Subtest-4 22.5±1 HSUPA Subtest-1 19±1 HSUPA Subtest-2 19±1 HSUPA Subtest-3 19±1 HSUPA Subtest-4 19±1 HSUPA Subtest-5 21±1 WCDMA Band V Tune up Power tolerant (dBm) RMC 12.2k 22.5±1 HSDPA Subtest-1 22.5±1 HSDPA Subtest-2 22.5±1 HSDPA Subtest-3 22.5±1 HSDPA Subtest-4 22.5±1 HSUPA Subtest-1 21±1 HSUPA Subtest-2 21.5±1 HSUPA Subtest-3 21.5±1 HSUPA Subtest-4 20.5±1 HSUPA Subtest-5 22±1 LTE Band 2: BW(MHz) Ch. Freq(MHz) Mode UL RB Allocation UL RB Offset Tune up limited(dBm) 1.4MHz 18607 1850.7 QPSK 1 0 21.5±1 1 2 21.5±1 1 5 21.5±1 3 0 21.5±1 3 1 21.5±1 3 2 21.5±1 6 0 21.5±1 16QAM 1 0 20.5±1 1 2 20.5±1 1 5 20.5±1 3 0 20.5±1 3 1 20.5±1 3 2 20.5±1 6 0 20.5±1 18900 1880 QPSK 1 0 21.5±1 1 2 21.5±1 1 5 21.5±1 3 0 21.5±1 3 1 21.5±1 3 2 21.5±1 6 0 21.5±1 16QAM 1 0 20.5±1 1 2 20.5±1 1 5 20.5±1 3 0 20.5±1 3 1 20.5±1 3 2 20.5±1 6 0 20.5±1 19193 1909.3 QPSK 1 0 21.5±1 1 2 21.5±1 1 5 21.5±1 3 0 21.5±1 3 1 21.5±1 3 2 21.5±1 6 0 21.5±1 16QAM 1 0 20.5±1 1 2 20.5±1 1 5 20.5±1 3 0 20.5±1 3 1 20.5±1 3 2 20.5±1 6 0 20.5±1 BW(MHz) Ch Freq(MHz) Mode UL RB Allocation UL RB Offset Tune up limited(dBm) 3MHz 18615 1851.5 QPSK 1 0 21.5±1 1 8 21.5±1 1 14 21.5±1 6 0 21.5±1 6 4 21.5±1 6 9 21.5±1 15 0 21.5±1 16QAM 1 0 20.0±1 1 8 20.0±1 1 14 20.0±1 6 0 20.0±1 6 4 20.0±1 6 9 20.0±1 15 0 20.0±1 18900 1880 QPSK 1 0 21.5±1 1 8 21.5±1 1 14 21.5±1 6 0 21.5±1 6 4 21.5±1 6 9 21.5±1 15 0 21.5±1 16QAM 1 0 20.0±1 1 8 20.0±1 1 14 20.0±1 6 0 20.0±1 6 4 20.0±1 6 9 20.0±1 15 0 20.0±1 19185 1908.5 QPSK 1 0 21.5±1 1 8 21.5±1 1 14 21.5±1 6 0 21.5±1 6 4 21.5±1 6 9 21.5±1 15 0 21.5±1 16QAM 1 0 20.0±1 1 8 20.0±1 1 14 20.0±1 6 0 20.0±1 6 4 20.0±1 6 9 20.0±1 15 0 20.0±1 BW(MHz) Ch Freq(MHz) Mode UL RB Allocation UL RB Offset Tune up limited(dBm) 5MHz 18625 1852.5 QPSK 1 0 21.0±1 1 12 21.0±1 1 24 21.0±1 12 0 21.0±1 12 6 21.0±1 12 11 21.0±1 25 0 21.0±1 16QAM 1 0 20.0±1 1 12 20.0±1 1 24 20.0±1 12 0 20.0±1 12 6 20.0±1 12 11 20.0±1 25 0 20.0±1 18900 1880 QPSK 1 0 21.0±1 1 12 21.0±1 1 24 21.0±1 12 0 21.0±1 12 6 21.0±1 12 11 21.0±1 25 0 21.0±1 16QAM 1 0 20.0±1 1 12 20.0±1 1 24 20.0±1 12 0 20.0±1 12 6 20.0±1 12 11 20.0±1 25 0 20.0±1 19175 1907.5 QPSK 1 0 21.0±1 1 12 21.0±1 1 24 21.0±1 12 0 21.0±1 12 6 21.0±1 12 11 21.0±1 25 0 21.0±1 16QAM 1 0 20.0±1 1 12 20.0±1 1 24 20.0±1 12 0 20.0±1 12 6 20.0±1 12 11 20.0±1 25 0 20.0±1 BW(MHz) Ch Freq(MHz) Mode UL RB Allocation UL RB Offset Tune up limited(dBm) 10MHz 18650 1855 QPSK 1 0 21.0±1 1 24 21.0±1 1 49 21.0±1 25 0 21.0±1 25 12 21.0±1 25 24 21.0±1 50 0 21.0±1 16QAM 1 0 20.0±1 1 24 20.0±1 1 49 20.0±1 25 0 20.0±1 25 12 20.0±1 25 24 20.0±1 50 0 20.0±1 18900 1880 QPSK 1 0 21.0±1 1 24 21.0±1 1 49 21.0±1 25 0 21.0±1 25 12 21.0±1 25 24 21.0±1 50 0 21.0±1 16QAM 1 0 20.0±1 1 24 20.0±1 1 49 20.0±1 25 0 20.0±1 25 12 20.0±1 25 24 20.0±1 50 0 20.0±1 19150 1905 QPSK 1 0 21.0±1 1 24 21.0±1 1 49 21.0±1 25 0 21.0±1 25 12 21.0±1 25 24 21.0±1 50 0 21.0±1 16QAM 1 0 20.0±1 1 24 20.0±1 1 49 20.0±1 25 0 20.0±1 25 12 20.0±1 25 24 20.0±1 50 0 20.0±1 BW(MHz) Ch Freq(MHz) Mode UL RB Allocation UL RB Offset Tune up limited(dBm) 15MHz 18675 1857.5 QPSK 1 0 21.0±1 1 37 21.0±1 1 74 21.0±1 36 0 21.0±1 36 16 21.0±1 36 35 21.0±1 75 0 21.0±1 16QAM 1 0 20.5±1 1 37 20.5±1 1 74 20.5±1 36 0 20.5±1 36 16 20.5±1 36 35 20.5±1 75 0 20.5±1 18900 1880 QPSK 1 0 21.0±1 1 37 21.0±1 1 74 21.0±1 36 0 21.0±1 36 16 21.0±1 36 35 21.0±1 75 0 21.0±1 16QAM 1 0 20.5±1 1 37 20.5±1 1 74 20.5±1 36 0 20.5±1 36 16 20.5±1 36 35 20.5±1 75 0 20.5±1 19125 1902.5 QPSK 1 0 21.0±1 1 37 21.0±1 1 74 21.0±1 36 0 21.0±1 36 16 21.0±1 36 35 21.0±1 75 0 21.0±1 16QAM 1 0 20.5±1 1 37 20.5±1 1 74 20.5±1 36 0 20.5±1 36 16 20.5±1 36 35 20.5±1 75 0 20.5±1 BW(MHz) Ch Freq(MHz) Mode UL RB Allocation UL RB Offset Tune up limited(dBm) 20MHz 18700 1860 QPSK 1 0 21.0±1 1 49 21.0±1 1 99 21.0±1 50 0 21.0±1 50 24 21.0±1 50 49 21.0±1 100 0 20.5±1 16QAM 1 0 20.5±1 1 49 20.5±1 1 99 20.5±1 50 0 20.5±1 50 24 20.5±1 50 49 20.5±1 100 0 20.5±1 18900 1880 QPSK 1 0 21.0±1 1 49 21.0±1 1 99 21.0±1 50 0 21.0±1 50 24 21.0±1 50 49 21.0±1 100 0 21.0±1 16QAM 1 0 20.5±1 1 49 20.5±1 1 99 21.0±1 50 0 20.5±1 50 24 20.5±1 50 49 20.5±1 100 0 20.5±1 19100 1900 QPSK 1 0 21.0±1 1 49 21.0±1 1 99 21.0±1 50 0 21.0±1 50 24 21.0±1 50 49 21.0±1 100 0 21.0±1 16QAM 1 0 20.0±1 1 49 20.0±1 1 99 21.0±1 50 0 20.0±1 50 24 20.0±1 50 49 20.0±1 100 0 20.0±1 LTE Band 4: BW(M…

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RF Exposure Info

Test Report FCC ID: 2A36J-VENUS20 RF Exposure Venus 20-US-4G-PCIE-M2, Venus 20-CN-4G-NA-M2, and Venus 20-US-4G-NA-M2 are Engineering control equipments in the GSM/UMTS/LTE system. The GSM frequency band includes GSM850 and GSM900 and DCS1800 and PCS1900, but only GSM850/1900 test data included in this report. The UMTS frequency band are band I /II /IV/V/VI/VIII/XVIIII, but only band II and Band IV and Band V test data included in this report. The LTE frequency band is Band I/II/III/IV/V/VII/VIII/XII/XIII/XVIII/XVIIII/XX/XXV/XXVI/ XXVIII/XXXVIII/XXXVIIII/XXXX/XXXXI, but only Band II/IV/V/VII/XII/XIII/XXV/XXVI/XXXVIII/ XXXXI test data included in this report. The Engineering control equipments implements such functions as RF signal receiving/transmitting, LTE/UMTS and GPRS/EDGE protocol. Externally it provides micro SD card interface and USIM card interface. The EUT is powered by DC 12V/12.5A. For more detailed features description, please refer to the user’s manual. Limits Frequency range (MHz) Electric field strength (V/m) Magnetic field strength (A/m) Power density (mW/cm2) Averaging time (minutes) (A) Limits for Occupational/Controlled Exposures 0.3-3.0 614 1.63 *(100) 6 3.0-30 1842/f 4.89/f *(900/f2) 6 30-300 61.4 0.163 1.0 6 300-1500 / / f/300 6 1500-100,000 / / 5 6 (B) Limits for General Population/Uncontrolled Exposure 0.3-1.34 614 1.63 *(100) 30 1.34-30 824/f 2.19/f *(180/f2) 30 30-300 27.5 0.073 0.2 30 300-1500 / / f/1500 30 1500-100,000 / / 1.0 30 F=frequency in MHz *=Plane-wave equivalent power density RF exposure compliance will need to be determined with respect to 1.1307(c) and (d) of the FCC rules. The emissions should be within the limits at 300kHz in Table 1 of 1.1310(use the 300kHz limits for 150kHz:614V/m,1.63A/m). Friis Formula Friis transmission formula: Pd = (Pout*G)/(4* Pi * R 2) Where Pd = power density in mW/cm 2 Pout = output power to antenna in mW G = gain of antenna in linear scale Pi = 3.1416 R = distance between observation point and center of the radiator in cm Test Report FCC ID: 2A36J-VENUS20 Pd id the limit of MPE, 1 mW/cm 2 . If we know the maximum gain of the antenna and the total power input to the antenna, through the calculation, we will know the distance r where the MPE limit is reached. EUT RF Exposure Evaluation Antenna Gain: The maximum Gain measured in fully anechoic chamber is 2.0 / 2.0 in linear scale. Output Power Into Antenna & RF Exposure Evaluation Distance: Operating Band Frequency (MHz) Antenna Gain (dBi) Max Conducted Average Output Power (dBm) Output Power to Antenna (dBm) EIRP(ERP) Limit (dBm) Output Power to Antenna (mw) Power Density at R = 20 cm (mW/cm2) Limit (mW/cm2) conclusion GSM850 824.20 4.04 30.00 31.89 38.50 1000.0000 0.5043 0.5495 PASS GSM1900 1850.20 3.14 30.00 33.14 33.00 1000.0000 0.4099 1.0000 PASS WCDMA B2 1852.40 4.04 25.00 29.04 33.00 316.2278 0.1595 1.0000 PASS WCDMA B4 1712.40 3.14 25.00 28.14 30.00 316.2278 0.1296 1.0000 PA…

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Contact Information

Applicant

Guangjie Xiang
[email protected]010-56152707Fax: 010-56152707

Test Firm

Intertek Testing Services Shenzhen Ltd. Longhua BrHolly Ou
[email protected]+86 755 86140691

Technical Specifications

#Rule PartsFrequency RangePower OutputEmissionTolerance
29272.51 GHz - 2.68 GHz486.40 mW17M9W7D0.01 ppm
Confidentiality
Long Term
Grant Notes
Power output listed is ERP for Part 22 and Part 27 below 1 GHz, EIRP for Part 24 and Part 27 above 1 GHz, and conducted for Part 90 operations. The RF exposure compliance is addressed for 1.1310 and 2.1091 MPE limits - this filing complies with KDB 447498 and is approved for mobile/fixed operation. End Users must be provided with transmitter operation conditions for satisfying RF exposure compliance. This device contains functions that are not operational in the U.S. Territories. This filing is only applicable for U.S. operations.