2A3LS-KDTAGKD Tag

KEYDIY 2.911(d)(5)(i)EquipmentTypeAttestationv1.2 Section2.911(d)(5)(i)Certification–EquipmentType Companyname:KEYDIY Address:Room201,BuildingA,5#,ChuangweiInnovationValley,TangtouNo.1Road,Shiyan Subdistrict,Bao'anShenzhen ProductName:KDTag FCCID:2A3LS-KDTAG Model(s):KDTag 2.911(d)(5)(i)EquipmentType We,KEYDIY(“theapplicant”)certifythattheequipmentforwhichauthorizationissoughtthrough certificationisnot:  Prohibitedfromreceivinganequipmentauthorizationpursuantto§2.903;oftheFCCrules.  Identifiedasanequipmenttypeinthe“CoveredList” NOTE1 Yourssincerely, Name:TerryZHOUDate:2023/6/25 TitleandCompanyname:manager/KEYDIY NOTE1 “CoveredList”;istheListofEquipmentandServicesCoveredBySection2ofTheSecureNetworksAct,availableat https://www.fcc.gov/supplychain/coveredlist References; 1)986446D01CoveredEquipmentv01 https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?switch=P&id=325672 2)FederalRegisterdocument2022-28263publishedon02/06/23 https://www.federalregister.gov/documents/2023/02/06/2022-28263/protecting-against-national-security-threats-to-the-com munications-supply-chain-through-the

KEYDIY 2.911(d)(5)(ii)ApplicantAttestationv1.2 Section2.911(d)(5)(ii)Certification–Applicant(CoveredList) Companyname:KEYDIY Address:Room201,BuildingA,5#,ChuangweiInnovationValley,TangtouNo.1Road,Shiyan Subdistrict,Bao'anShenzhen ProductName:KDTag FCCID:2A3LS-KDTAG Model(s):KDTag 2.911(d)(5)(ii)Applicantfiling We,KEYDIY(“theapplicant”)certifythat,asofthedateofthefilingoftheapplication,theapplicant isnotidentified NOTE1 onthe“CoveredList” NOTE2 ,establishedpursuantto §1.50002ofthischapter,asanentityproducingcoveredcommunicationsequipment. Yourssincerely, Name:TerryZHOUDate:2023/6/25 TitleandCompanyname:manager/KEYDIY NOTE1 Deleteoptionnotapplicabletothisapplication. NOTE2 “CoveredList”;istheListofEquipmentandServicesCoveredBySection2ofTheSecureNetworksAct,availableat https://www.fcc.gov/supplychain/coveredlist References; 1)986446D01CoveredEquipmentv01 https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?switch=P&id=325672 2)FederalRegisterdocument2022-28263publishedon02/06/23 https://www.federalregister.gov/documents/2023/02/06/2022-28263/protecting-against-national-security-threats-to-the-com munications-supply-chain-through-the

KEYDIY AgentAuthorization Company:KEYDIY Address:Room201,BuildingA,5#,ChuangweiInnovationValley,TangtouNo.1 Road,ShiyanSubdistrict,Bao'anShenzhen ProductName:KDTag ModelNumber(s):KDTag ProductDescription:KDTag WeauthorizeMiCOMLabsInc.,575BoulderCourt,Pleasanton,California94566,USA, toactonourbehalfonallmattersconcerningthecertificationofabovenamed equipment. WedeclarethatMiCOMLabsInc.isallowedtoforwardallinformationrelatedtothe approvalandcertificationofequipmenttotheregulatoryagenciesasrequiredandto discussanyissuesconcerningtheapprovalapplication.Anyandallactscarriedoutby MiCOMLabsonourbehalfshallhavethesameeffectasactsofourown. Signature:Date:2023/06/25 Name:TerryZHOU Title:Manager Company:KEYDIY

KEYDIY OfficeofEngineeringTechnology FederalCommunicationsCommission 7435OaklandMillsRoad Columbia,MD21046 USA Date:2023/6/25 Subject;RequestforConfidentiality FCCID:2A3LS-KDTAG ToWhomItMayConcern, PursuanttotheprovisionsoftheCommission’srulesTitle47Sections§0.457and§0.459,we arerequestingtheCommissiontowithholdthefollowingattachment(s)asconfidential documentsfrompublicdisclosureindefinitely. Thesedocumentscontaindetailedsystemandequipmentdescriptionsandareconsideredas proprietaryinformationinoperationoftheequipment.Thepublicdisclosureofthesedocuments mightbeharmfultoourcompanyandwouldgivecompetitorsanunfairadvantageinthemarket. SchematicDiagram BlockDiagram PartsList OperationalDescription Tune-upProcedure Inadditionaltoabovementioneddocuments,inordertocomplywiththemarketingregulations inTitle47CFR§2.803andtheimportationrulesinTitle47CFR§2.1204,whileensuringthat businesssensitiveinformationremainsconfidentialuntiltheactualmarketingofnewly authorizeddevices,werequestShortTermConfidentialityofthefollowingattachment(s); ExternalPhotos TestSetupPhotos InternalPhotos UserManual For45days,pursuanttoPublicNoticeDA04-1705. OR For180dayspursuanttoKDB726920D01. Itisourunderstandingthatallmeasurementtestreports,FCCIDlabelformatand correspondenceduringthecertificationreviewprocesscannotbegrantedasconfidential documentsandthisinformationwillbeavailableforpublicreviewoncethegrantofequipment authorizationisissued. Sincerely, Signature: Name:TerryZHOU Title:Manager

FCCID:2A3LS-KDTAG External FCCID:2A3LS-KDTAG FCCID:2A3LS-KDTAG

Label:20*10mm FCCID:2A3LS-KDTAG

FCCID:2A3LS-KDTAG Internal ANT FCCID:2A3LS-KDTAG FCCID:2A3LS-KDTAG

FCCID:2A3LS-KDTAG RFExposureEvaluation AccordingtoKDB447498D01GeneralRFExposureGuidancev06，Unlessspecificallyrequired bythepublishedRFexposureKDBprocedures,standalone1-gheadorbodyand10-gextremity SARevaluationforgeneralpopulationexposureconditions,bymeasurementornumerical simulation,isnotrequiredwhenthecorrespondingSARTestExclusionThresholdcondition(s), listedbelow,is(are)satisfied. For100MHzto6GHzandtestseparationdistances≤50mm,the1-gand10-gSARtest exclusionthresholdsaredeterminedbythefollowing: TheEUTisaportabledevice [(max.powerofchannel,includingtune-uptolerance,mW)/(min.testseparationdistance, mm)]·[√f (GHz) ]≤3.0for1-gSAR,and≤7.5for10-gextremitySAR,where f (GHz) istheRFchanneltransmitfrequencyinGHz PoweranddistanceareroundedtothenearestmWandmmbeforecalculation Theresultisroundedtoonedecimalplaceforcomparison Theproductisusedatadistanceof5mmfromthehumanbody. Here, BLE2M-worstmodeandchannel Frequency (MHz) MaxPower (dBm) Tuneuptolerance (dBm) Maximumtune-up (dBm)(mW) 2402-2.38-2±1-10.794 Maxtune-upPower (dBm) Max tune-up Power (mW) Frequency (MHz) Min.distance (mm) Calc. thresholdslimit -10.794240250.2463.0 Calculatedvalue0.246<3.0,SothereisnorequireSARtest

咏成國際科技有限公司 RAINInternationalTechnologyCo.,Ltd13530576606 2.4GHz3216ChipAntenna:3216F245M02 第 1 页共 10 页 3216Chipantenna ForBluetooth/WLANApplicationsd P/N:RANT3216F245G2 Dimension(mm) L3.23±0.20 W1.66±0.20 T1.23±0.20 咏成國際科技有限公司 RAINInternationalTechnologyCo.,Ltd13530576606 2.4GHz3216ChipAntenna:3216F245M02 第 2 页共 10 页 PartNumberInformation RANT3216F245G2 ABCDEF A ProductSeriesAntenna BDimensionLxW3.2X1.6mm(+-0.2mm) CMaterialHighKmaterial D WorkingFrequency2.4~2.5GHz E FeedingmodeMonopole&SingleFeeding F AntennatypeType=02 1.ElectricalSpecification Specification PartNumberRANT3216F245M02 CentralFrequency2450MHz Bandwidth100(Min.)MHz ReturnLoss-6.5(Max)dB PeakGaindB2.7i Impedance50Ohm OperatingTemperature -40～+85°C MaximumPower4W ResistancetoSolderingHeats 10(@260 °C ) sec. PolarizationLinear AzimuthBeamwidthOmni-directional TerminationCu/Sn(Leadless) Remark:Bandwidth&PeakGainwasmeasuredunderevaluationboardofnextpage 咏成國際科技有限公司 RAINInternationalTechnologyCo.,Ltd13530576606 2.4GHz3216ChipAntenna:3216F245M02 第 3 页共 10 页 2.RecommendedPCBPattern EvaluationBoardDimension Unit:mm SuggestedMatchingCircuit 咏成國際科技有限公司 RAINInternationalTechnologyCo.,Ltd13530576606 2.4GHz3216ChipAntenna:3216F245M02 第 4 页共 10 页 LayoutDimensionsinClearancearea ( Size=5.2*5.0mm ) 50ohmtransmissionLine MatchingCircuit FootPrint(Unit:mm) 咏成國際科技有限公司 RAINInternationalTechnologyCo.,Ltd13530576606 2.4GHz3216ChipAntenna:3216F245M02 第 5 页共 10 页 3.MeasurementResults ReturnLoss 咏成國際科技有限公司 RAINInternationalTechnologyCo.,Ltd13530576606 2.4GHz3216ChipAntenna:3216F245M02 第 6 页共 10 页 RadiationPattern Y X Z EfficiencyPeakGainDirectivity 2400MHz55.21%1.45dBi5.32dBi 2450MHz66.45%5.21dB2.7dBii 2500MHz57.53%1.98dBi5.29dBi ChamberCoordinateSystem 咏成國際科技有限公司 RAINInternationalTechnologyCo.,Ltd13530576606 2.4GHz3216ChipAntenna:3216F245M02 第 7 页共 10 页 4.ReliabilityandTestCondictions ITEMREQUIREMENTSTESTCONDITION Solderability1.Wettingshallexceed90%coverage 2.Novisiblemechanicaldamage TEMP(°C) 230°C 4±1sec. 150 °C 60sec Pre-heatingtemperature:150°C/60sec. Soldertemperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Fluxforleadfree:rosin Solderheat Resistance 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% TEMP(°C) 260°C 10±0.5sec. 150°C 60sec Pre-heatingtemperature:150°C/60sec. Soldertemperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Fluxforleadfree:rosin Component Adhesion (Pushtest) 1.Novisiblemechanicaldamage Thedeviceshouldbereflow soldered(230±5°Cfor10sec.)toatinned coppersubstrateAdynometerforce gaugeshouldbeappliedthesideofthe component.Thedevicemustwith-ST-F 0.5Kgwithoutfailureofthetermination attachedtocomponent. Component Adhesion (Pulltest) 1.Novisiblemechanicaldamage Insert10cmwireintotheremainingopen eyebend,theendsofevenwirelengths upwardandwindtogether. Terminalshallnotberemarkably damaged. 咏成國際科技有限公司 RAINInternationalTechnologyCo.,Ltd13530576606 2.4GHz3216ChipAntenna:3216F245M02 第 8 页共 10 页 Thermalshock 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% Phase Temperature( °C ) Time(min) 1 +85±5°C 30±3 2 RoomWithin Temperature3sec 3 -40±2 °C 30±3 4 RoomWithin Temperature3sec +85 °C =>30±3min -40 °C =>30±3min Testcycle:10cycles Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. Resistanceto High Temperature 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 3.Nodisconnectionorshortcircuit. Temperature:85±5 °C Duration:1000±12hrs Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. Resistanceto Low Temperature 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 3.Nodisconnectionorshortcircuit. Temperature:-40±5 °C Duration:1000±12hrs Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. Humidity 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 3.Nodisconnectionorshortcircuit. Temperature:40±2°C Humidity:90%to95%RH Duration:1000±12hrs Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. 5.SolderingandMounting Mildlyactivatedrosinfluxesarepreferred.Theminimumamountofsoldercan leadtodamagefromthestressescausedbythedifferenceincoefficientsof expansionbetweensolder,chipandsubstrate.Theterminationsaresuitable forallwaveandre-flowsolderingsystems.Ifhandsolderingcannotbe avoided,thepreferredtechniqueistheutilizationofhotairsolderingtools. ReflowSoldering PRE-HEATING 250~260 230 180 150 SOLDERING 10smax. NATURAL COOLING IronSoldering PRE-HEATINGSOLDERINGNATURAL COOLING 60~120s30~60s TIME(sec.) TIME(sec.) Recommendedtemperatureprofilesforre-flowsolderinginFigure1. Productsattachmentwithasolderingironisdiscouragedduetotheinherent processcontrollimitations.Intheeventthatasolderingironmustbe employedthefollowingprecautionsarerecommended. within3s 350 150 Over60s Gradualcooling 300 T E M P E R A T U R E ( ° C ) T E M P E R A T U R E ( ° C ) 咏成國際科技有限公司 RAINInternationalTechnologyCo.,Ltd13530576606 2.4GHz3216ChipAntenna:3216F245M02 第 9 页共 10 页 1.593.511.80 ‧Preheatcircuitandproductsto150°C ‧Nevercontacttheceramicwiththeirontip ‧Usea20wattsolderingironwithtipdiameterof1.0mm ‧280°Ctiptemperature(max) ‧1.0mmtipdiameter(max) ‧Limitsolderingtimeto3sec. 6.PackagingInformation TapeSpecification: ReelSpecification:(7’’,Φ180mm) 咏成國際科技有限公司 RAINInternationalTechnologyCo.,Ltd13530576606 2.4GHz3216ChipAntenna:3216F245M02 第 10 页共 10 页 TapeWidth(mm)A(mm)B(mm)C(mm)D(mm)Chip/Reel(pcs) 89.0±0.560±213.5±0.5178±25000 7.StorageandTransportationInformation StorageConditions Tomaintainthesolderabilityofterminalelectrodes: 1.Temperatureandhumidityconditions:-10~40°Cand30~70%RH. 2.Recommendedproductsshouldbeusedwithin6monthsfromthetimeof delivery. 3.Thepackagingmaterialshouldbekeptwherenochlorineorsulfurexists intheair. TransportationConditions 1.Productsshouldbehandledwithcaretoavoiddamageorcontamination fromperspirationandskinoils. 2.Theuseoftweezersorvacuumpickupisstronglyrecommendedfor individualcomponents. 3.Bulkhandlingshouldensurethatabrasionandmechanicalshockare minimized.

ProjectNo.:ZKT-230619L4630 Page 1 of 50 FCCTESTREPORT FCCID:2A3LS-KDTAG ReportNumber. .................................. :ZKT-230619L4630 DateofTest ........................................... :Jun8,2023toJun13,2023 Dateofissue.........................................:Jun13,2023 Totalnumberofpages........................:50 TestResult ............................................ : PASS TestingLaboratory. ........................... : ShenzhenZKTTechnologyCo.,Ltd. Address ............................................... : 1/F,No.101,BuildingB,No.6,TangweiCommunityIndustrial Avenue,FuhaiStreet,Bao'anDistrict,Shenzhen,China Applicant'sname.............................: KEYDIY Address...............................................: Room201,BuildingA,5#,ChuangweiInnovationValley,Tangtou No.1Road,ShiyanSubdistrict,Bao'anShenzhen Manufacturer'sname ...................... : SHENZHENYICHETECHNOLOGYCO.,LTD Address ............................................... : Room201,BuildingA,5#,ChuangweiInnovationValley,Tangtou No.1Road,ShiyanSubdistrict,Bao'anShenzhen Testspecification: Standard................................................:FCCCFRTitle47Part15SubpartCSection15.247 Testprocedure ..................................... : ANSIC63.10:2013 Non-standardtestmethod................:N/A TestReportFormNo........................: TRF-EL-110_V0 TestReportForm(s)Originator.....: ZKTTesting MasterTRF........................................: Dated:2020-01-06 ThisdevicedescribedabovehasbeentestedbyZKT,andthetestresultsshowthattheequipmentunder test(EUT)isincompliancewiththeFCCrequirements.Anditisapplicableonlytothetestedsample identifiedinthereport. Thisreportshallnotbereproducedexceptinfull,withoutthewrittenapprovalofZKT,thisdocumentmay bealteredorrevisedbyZKT,personalonly,andshallbenotedintherevisionofthedocument. Productname ..................................... : KDTag Trademark...........................................: keydiy Model/Typereference.........................: KDTag Ratings..................................................: DC:3V ProjectNo.:ZKT-230403L2336 Page 2 of 50 Testingprocedureandtestinglocation: TestingLaboratory.......................................:ShenzhenZKTTechnologyCo.,Ltd. Address............................................................:1/F,No.101,BuildingB,No.6,TangweiCommunity IndustrialAvenue,FuhaiStreet,Bao'anDistrict, Shenzhen,China AlenHe Testedby(name+signature).......................: JoeLiu Reviewer(name+signature) ....................... : LakeXie Approved(name+signature) ....................... : ProjectNo.:ZKT-230403L2336 Page 3 of 50 TableofContents Page 1.VERSION.....................................................................................................................5 2.SUMMARYOFTESTRESULTS..................................................................................6 2.1TESTFACILITY....................................................................................................................7 2.2MEASUREMENTUNCERTAINTY.......................................................................................7 3.GENERALINFORMATION..........................................................................................8 3.1GENERALDESCRIPTIONOFEUT....................................................................................8 3.2DESCRIPTIONOFTESTMODES......................................................................................9 3.3BLOCKDIGRAMSHOWINGTHECONFIGURATIONOFSYSTEMTESTED.................9 3.4DESCRIPTIONOFSUPPORTUNITS(CONDUCTEDMODE)...........................................9 3.5EQUIPMENTSLISTFORALLTESTITEMS.....................................................................10 4.EMCEMISSIONTEST...............................................................................................11 4.1CONDUCTEDEMISSIONS......................................................................................11 4.1.1POWERLINECONDUCTEDEMISSIONLIMITS..........................................................11 4.1.2TESTPROCEDURE........................................................................................................11 4.1.3DEVIATIONFROMTESTSTANDARD..........................................................................11 4.1.4TESTSETUP...................................................................................................................12 4.1.5EUTOPERATINGCONDITIONS...................................................................................12 4.1.6TESTRESULT................................................................................................................12 4.2RADIATEDEMISSIONMEASUREMENT................................................................13 4.2.1RadiatedEmissionLimits.......................................................................................13 4.2.2TESTPROCEDURE..................................................................................................13 4.2.3DEVIATIONFROMTESTSTANDARD.....................................................................14 4.2.4TESTSETUP.............................................................................................................14 4.2.5EUTOPERATINGCONDITIONS..............................................................................15 4.2.6TESTRESULTS.........................................................................................................16 5.RADIATEDBANDEMISSIONMEASUREMENT........................................................20 5.1TESTREQUIREMENT:......................................................................................................20 5.2TESTPROCEDURE..........................................................................................................20 5.3DEVIATIONFROMTESTSTANDARD.............................................................................20 5.4TESTSETUP.........................................................................................................…

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FCCID:2A3LS-KDTAG RADIATEDEMISSIONMEASUREMENT（below1G） RADIATEDEMISSIONMEASUREMENT（Above1G）