2A3NOSVHUBOmnidirectional conference microphone

ZHENGZHOUYSAIRTECHNOLOGYCO.,LTD Room2101,21stFloorofBBlock,SiliconValleyPlaza,82CultureStreet,Jinshui District,ZHENGZHOU,HENAN,450000,China Date:2025-11-17 FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 Ref:AttestationStatementsPart2.911(d)(5)(i)Filing FCCID:2A3NOSVHUB ToWhomItMayConcern: ZHENGZHOUYSAIRTECHNOLOGYCO.,LTDcertifiesthattheequipmentforwhichauthorizationissoughtis not“covered”equipmentprohibitedfromreceivinganequipmentauthorizationpursuanttosection2.903ofthe FCCrules. ZHENGZHOUYSAIRTECHNOLOGYCO.,LTDcertifiesthattheequipmentforwhichauthorizationissought doesnotincludecybersecurityoranti-virussoftwareproducedorprovidedbyKasperskyLab,Inc.oranyofits successorsandassignees,includingequipmentwithintegratedKasperskyLab,Inc.(oranyofitssuccessors andassignees)cybersecurityoranti-virussoftwarepursuanttoDA-24-886andKDB986446D01Covered EquipmentGuidancesectionB(2a). Deviceisinherentlycompliantbasedonhardwarelimitationsorsoftwarecontrols. or ASoftwareBillofMaterials(SBOM)isprovidedtotheTCBforreview,and Theend-userorthirdpartiescannotinstalladditionalsoftwareonthisdevice. Sincerely, Signatory [WeidongShen,GeneralManager]

ZHENGZHOUYSAIRTECHNOLOGYCO.,LTD Room2101,21stFloorofBBlock,SiliconValleyPlaza,82CultureStreet,Jinshui District,ZHENGZHOU,HENAN,450000,China Date:2025-11-17 FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Ref:AttestationStatementsPart2.911(d)(5)(ii)Filing FCCID:2A3NOSVHUB ToWhomItMayConcern: ZHENGZHOUYSAIRTECHNOLOGYCO.,LTDcertifiesthat,asofthedateofthefilingoftheapplication,the applicantisnotidentifiedontheCoveredList(asaspecificallynamedentityoranyofitssubsidiariesor affiliates)asanentityproducing“covered”equipment. Sincerely, Signatory [WeidongShen,GeneralManager]

ZHENGZHOUYSAIRTECHNOLOGYCO.,LTD Room2101,21thFloorofBBlock,SiliconValley,Plaza,82CultureStreet,JinshuiDistrict, ZHENGZHOU,HENAN450053,China Date:2025-11-24 FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA FCCID:2A3NOSVHUB ApplicantFRN:0031620636 USAgent–AttestationStatement/Part2.911(d)(7) ZHENGZHOUYSAIRTECHNOLOGYCO.,LTDcertifiesthat,asof2025-11-24,wehave designatedFCCUSAgent,LLCtoacceptserviceofprocessonourbehalfforFCCID: 2A3NOSVHUB. ZHENGZHOUYSAIRTECHNOLOGYCO.,LTD,acceptstomaintainanagentofserviceof processintheUnitedStatesfornolessthanoneyearaftereitherthegranteehaspermanently terminatedallmarketingandimportationoftheapplicableequipmentwithintheU.S.,orthe conclusionofanyCommission-relatedadministrativeorjudicialproceedinginvolvingthe equipment,whicheverislater. FCCUSAgent,LLC,acceptsasofthedateofthefilingofthisapplication,theobligationof beingthedesignatedagentforthepurposeofacceptingserviceofprocessonbehalfof ZHENGZHOUYSAIRTECHNOLOGYCO.,LTDforFCCID:2A3NOSVHUB. DesignatedAgentInformation: CompanyName:FCCUSAgent,LLC U.S.AgentFRN:0033402884 Address:3722IllinoisAvenue,SaintCharles,IL,60174,USA ContactPerson:TimPayne Phone:708-571-3148 Email:[email protected] Sincerely, Company:ZHENGZHOUYSAIR TECHNOLOGYCO.,LTD DesignatedAgent:FCCUSAgent,LLC CompanyRepresentative:WeidongShenDesignatedAgentRepresentative:TimPayne Signature: Signature:

ZHENGZHOUYSAIRTECHNOLOGYCO.,LTD Room2101,21stFloorofBBlock,SiliconValleyPlaza,82CultureStreet,Jinshui District,ZHENGZHOU,HENAN,450000,China Date:2025-11-17 FEDERALCOMMUNICATIONSCOMMISSION AUTHORIZATIONANDEVALUATIONDIVISION 7435OAKLANDMILLSROAD COLUMBIA,MD21046 SUBJECT:FCCApplicationforFCCID:2A3NOSVHUB ConfidentialityRequest Towhomitmayconcern, PursuanttotheprovisionsoftheCommission’srulesTitle47Sections§0.457and§0.459,wearerequestingthe Commissiontowithholdthefollowingattachment(s)asconfidentialdocumentsfrompublicdisclosureindefinitely. ☒ BlockDiagram ☐ Tune-UpInformation ☒ OperationalDescription,SBOM ☐ SecurityInformation ☒ Schematics ☐ SoftwareDefinedRadio(SDR)Information ☐ PartsList Theabovematerialscontaintradesecretsandproprietaryinformationnotcustomarilyreleasedtothepublic.The publicdisclosureofthesematerialsmaybeharmfultotheapplicantandprovideunjustifiedbenefitstoits competitors. Inadditionaltoabovementioneddocuments,inordertocomplywiththemarketingregulationsinTitle47CFR §2.803andtheimportationrulesinTitle47CFR§2.1204,whileensuringthatbusinesssensitiveinformation remainsconfidentialuntiltheactualmarketingofnewlyauthorizeddevices,werequestShortTermConfidentiality ofthefollowingattachment(s); ☒ ExternalPhotos ☒ TestSetupPhotos ☒ InternalPhotos ☒ UserManual ☐For45days,pursuanttoPublicNoticeDA04-1705. or ☒For180dayspursuanttoKDB726920D01. TheapplicantunderstandsthatpursuanttoSection0.457oftheRules,disclosureofthisapplicationandall accompanyingdocumentationwillnotbemadebeforethedateoftheGrantforthisapplication. Sincerely, Signatory [WeidongShen,GeneralManager]

ZHENGZHOUYSAIRTECHNOLOGYCO.,LTD Room2101,21stFloorofBBlock,SiliconValleyPlaza,82CultureStreet,Jinshui District,ZHENGZHOU,HENAN,450000,China Date:2025-11-17 FEDERALCOMMUNICATIONSCOMMISSION AUTHORIZATIONANDEVALUATIONDIVISION 7435OAKLANDMILLSROAD COLUMBIA,MD21046 SUBJECT:FCCID:2A3NOSVHUB ModelDeclarationLetter DearRegulatoryAuthority, Model(s):SVHubOmni2ParesametothemodelSVHubOmni2,thesemodelsaresamePCBLayout, Schematics,BOM.Onlyfordifferentmodelname,brandname,appearancecolorandshellshape (non-metallicanddoesnotaffecttheelectricalstructure)fordifferentmarketrequire. Sincerely, Signatory [WeidongShen,GeneralManager]

ZHENGZHOUYSAIRTECHNOLOGYCO.,LTD Room2101,21stFloorofBBlock,SiliconValleyPlaza,82CultureStreet,Jinshui District,ZHENGZHOU,HENAN,450000,China Date:2025-11-17 FEDERALCOMMUNICATIONSCOMMISSION AUTHORIZATIONANDEVALUATIONDIVISION 7435OAKLANDMILLSROAD COLUMBIA,MD21046 SUBJECT:FCCApplicationforFCCID:2A3NOSVHUB POWEROFATTORNEY ToWhomItMayConcern: We,theundersigned,herebyauthorizeWaltekTestingGroup(Shenzhen)Co.,Ltd.JandySoonourbehalf,to applytotheFederalCommunicationsCommissiononourequipment.AnyandallactscarriedoutbyWaltek TestingGroup(Shenzhen)Co.,Ltd.JandySoonourbehalfshallhavethesameeffectasactsofourown. ThisistoadvisethatweareinfullcompliancewiththeAnti-DrugAbuseAct.We,ZHENGZHOUYSAIR TECHNOLOGYCO.,LTDarenotsubjecttoadenialoffederalbenefitspursuanttoSection5301ofthe Anti-DrugActof1988,21USC853a,andnopartytotheapplicationissubjecttoadenialoffederalbenefits pursuanttothatsection. Sincerely, Signatory [WeidongShen,GeneralManager]

ReferenceNo.:WTX25X09245383W001/002Page1of14 WaltekTestingGroup(Shenzhen)Co.,Ltd. Http://www.waltek.com.cn ANNEX EXHIBIT1-PRODUCTLABELING ProposedFCCIDLabelFormat Specifications:Thelabelshallbesecurelyaffixedtoapermanentlyattachedpartofthedevice,inalocation whereitisvisibleoreasilyaccessibletotheuser,andshallnotbereadilydetachable.Thelabelshallbe sufficientlydurabletoremainfullylegibleandintactonthedeviceinallnormalconditionsofusethroughout thedevice’sexpectedlifetime. ProposedLabelLocationonEUT FCCIDLabel Location

1.RFExposureRequirements 1.1GeneralInformation ClientInformation Applicant:ZHENGZHOUYSAIRTECHNOLOGYCO.,LTD Addressofapplicant: Room2101,21thFloorofBBlock,SiliconValley,Plaza,82Culture Street,JinshuiDistrict,ZHENGZHOU,HENAN,China Manufacturer:HONGKONGSVBONYCO.,LIMITED Addressofmanufacturer:3A,42Smithfield,KennedyTown,HongKong GeneralDescriptionofEUT: ProductName:Omnidirectionalconferencemicrophone TradeNameSVBONY ModelNo.:SVHubOmni2 AddingModel(s):SVHubOmni2P RatedVoltage: Type-CDC5V2A BatteryDC3.7V BatteryCapacity:2000mAh AdapterModel:/ FCCID:2A3NOSVHUB EquipmentType:Mobiledevice TechnicalCharacteristicsofEUT: Bluetooth(BR/EDRmode) BluetoothVersion:V5.1(BR/EDRmode) FrequencyRange:2402-2480MHz RFOutputPower:0.56dBm(Conducted) DataRate:1Mbps,2Mbps,3Mbps Modulation:GFSK,π/4DQPSK,8DPSK QuantityofChannels:79 ChannelSeparation:1MHz TypeofAntenna:ChipAntenna AntennaGain:1.75dBi Bluetooth(LEmode) BluetoothVersion:V5.1(LEmode) FrequencyRange:2402-2480MHz RFOutputPower: 1Mbps:-0.82dBm(Conducted) 2Mbps:-0.66dBm(Conducted) DataRate:1Mbps,2Mbps Modulation:GFSK QuantityofChannels:40 ChannelSeparation:2MHz TypeofAntenna:ChipAntenna AntennaGain:1.75dBi 1.2RFExposureExemption Accordingto§1.1307(b)(3)andKDB447498D04InterimGeneralRFExposureGuidancev01,system operatingundertheprovisionsofthissectionshallbeoperatinginamannerthatthepublicisnotexposedto radiofrequencyenergylevelinexcesslimitformaximumpermissibleexposure. OptionA:FCCRulePart1.1307(b)(3)(i)(A):Theavailablemaximumtime-averagedpowerisnomorethan 1mW,regardlessofseparationdistance. OptionB:FCCRulePart1.1307(b)(3)(i)(B):Theavailablemaximumtime-averagedpoweroreffective radiatedpower(ERP),whicheverisgreater,islessthanorequaltothethresholdP th (mW)describedinthe followingformula.P th isgivenby: OptionC:FCCRulePart1.1307(b)(3)(i)(C):Theminimumseparationdistance(Rinmeters)fromthebodyof anearbypersonforthefrequency(finMHz)atwhichthesourceoperates,theERP(watts)isnomorethanthe calculatedvalueprescribedforthatfrequency.Rmustbeatleastλ/2π,whereλisthefree-spaceoperating wavelengthinmeters. SingleRFSourcesSubjecttoRoutineEnvironmentalEvaluation RFSourcefrequency(MHz)ThresholdERP(watts) 0.3-1.341,920R 2 1.34-303,450R 2 /f 2 30-3003.83R 2 300-1,5000.0128R 2 f 1,500-100,00019.2R 2 ForMultipleRFsources:FCCRulePart1.1307(b)(3)(ii): (A)Theavailablemaximumtime-averagedpowerofeachsourceisnomorethan1mWandthereisa separationdistanceoftwocentimetersbetweenanyportionofaradiatingstructureoperatingandthe nearestportionofanyotherradiatingstructureinthesamedevice,exceptifthesumofmultiplesourcesis lessthan1mWduringthetime-averagingperiod,inwhichcasetheymaybetreatedasasinglesource (separationisnotrequired). (B)InthecaseoffixedRFsourcesoperatinginthesametime-averagingperiod,orofmultiplemobileor portableRFsourceswithinadeviceoperatinginthesametimeaveragingperiod,ifthesumofthe fractionalcontributionstotheapplicablethresholdsislessthanorequalto1asindicatedinthefollowing equation. 1.3CalculatedResult Radio Access Technology Prediction Frequency Output Power Antenna Gain Duty Cycle Tune-Up Time-AveragedPower ERP (MHz)(dBm)(dBi)(%)(dBm)(dBm) Bluetooth24020.561.751001.000.60 Frequency Option Min.DistanceMax.PowerExposureLimit Ratio Result (MHz)(cm)(dBm)(mW)(mW)Pass/Fail 2402B0.51.001.262.7880.45 Pass Note:1.Time-AveragedPower=OutputPower*DutyCycle;ERP=Time-AveragedPower+Antenna gain-2.15dB 2.OptionA,BandCrefersasclause1.2. 3.ForoptionB,Max(time-averagedpower,effectiveradiatedpower(ERP))convertstoMax.Power.For optionC,ERPconvertstoMax.Power; 4.ForoptionB,P th (mW)convertstoExposureLimit(mW);ForoptionC,ERP(W)convertstoExposure Limit(mW). 5.Ratio=Tune-UpERP(mW)/ExposureLimit(mW) ModeforSimultaneousMulti-bandTransmission: RadioAccess Technology Ratio1Ratio2 Simultaneous Ratio Limit Result Pass/Fail ------------ Result:Pass

WaltekTestingGroup(Shenzhen)Co.,Ltd. Http://www.waltek.com.cnPage 1 of 65 TESTREPORT ReferenceNo.......................:WTX25X09245383W001 FCCID....................................:2A3NOSVHUB Applicant...............................:ZHENGZHOUYSAIRTECHNOLOGYCO.,LTD Address.................................: Room2101,21thFloorofBBlock,SiliconValley,Plaza,82CultureStreet, JinshuiDistrict,ZHENGZHOU,HENAN,China Manufacturer........................:HONGKONGSVBONYCO.,LIMITED Address.................................:3A,42Smithfield,KennedyTown,HongKong ProductName......................:Omnidirectionalconferencemicrophone ModelNo... ............................: SVHubOmni2 Standards..............................:FCCPart15.247 DateofReceiptsample.....:2025-09-11 DateofTest ...........................: 2025-09-15to2025-10-22 DateofIssue........................:2025-10-23 TestReportFormNo. ......... : WTX_Part15_247W TestResult ............................: Pass Remarks: Theresultsshowninthistestreportreferonlytothesample(s)tested,thistestreportcannotbe reproduced,exceptinfull,withoutpriorwrittenpermissionofthecompany.Thereportwouldbeinvalidwithout specificstampoftestinstituteandthesignaturesofapprover. PreparedBy: WaltekTestingGroup(Shenzhen)Co.,Ltd. Address:1/F.,Room101,Building1,HongweiIndustrialPark,Liuxian2ndRoad, Block70Bao'anDistrict,Shenzhen,Guangdong,China Tel.:+86-755-33663308Fax.:+86-755-33663309Email:[email protected] Testedby:Approvedby: GalaWang/ProjectEngineerSilinChen/Manager ReferenceNo.:WTX25X09245383W001 WaltekTestingGroup(Shenzhen)Co.,Ltd. Http://www.waltek.com.cnPage 2 of 65 TABLEOFCONTENTS 1.GENERALINFORMATION.....................................................................................................................................5 1.1PRODUCTDESCRIPTIONFOREQUIPMENTUNDERTEST(EUT)........................................................................5 1.2TESTSTANDARDS.................................................................................................................................................6 1.3TESTMETHODOLOGY...........................................................................................................................................6 1.4TESTFACILITY.......................................................................................................................................................6 1.5EUTSETUPANDTESTMODE..............................................................................................................................7 1.6MEASUREMENTUNCERTAINTY.............................................................................................................................9 1.7TESTEQUIPMENTLISTANDDETAILS................................................................................................................10 2.SUMMARYOFTESTRESULTS.........................................................................................................................14 3.ANTENNAREQUIREMENT.................................................................................................................................15 3.1STANDARDAPPLICABLE......................................................................................................................................15 3.2EVALUATIONINFORMATION................................................................................................................................15 4.FREQUENCYHOPPINGSYSTEMREQUIREMENTS....................................................................................16 4.1STANDARDAPPLICABLE......................................................................................................................................16 4.2FREQUENCYHOPPINGSYSTEM.........................................................................................................................16 4.3EUTPSEUDORANDOMFREQUENCYHOPPINGSEQUENCE..............................................................................17 5.QUANTITYOFHOPPINGCHANNELSANDCHANNELSEPARATION....................................................18 5.1STANDARDAPPLICABLE......................................................................................................................................18 5.2TESTSETUPBLOCKDIAGRAM...........................................................................................................................18 5.3TESTPROCEDURE..............................................................................................................................................18 5.4SUMMARYOFTESTRESULTS/PLOTS................................................................................................................19 6.DWELLTIMEOFHOPPINGCHANNEL............................................................................................................20 6.1STANDARDAPPLICABLE......................................................................................................................................20 6.2TESTSETUPBLOCKDIAGRAM...........................................................................................................................20 6.3TESTPROCEDURE..............................................................................................................................................20 6.4SUMMARYOFTESTRESULTS/PLOTS................................................................................................................21 7.20DBBANDWIDTH................................................................................................................................................22 7.1STANDARDAPPLICABLE......................................................................................................................................22 7.2TESTSETUPBLOCKDIAGRAM...........................................................................................................................22 7.3TESTPROCEDURE.............................................…

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承認書 SPECIFICATIONFORAPPROVAL 客戶名稱 CUSTOMER ：AlSpeechTechnologyCo.,Ltd 客戶料號 CUSTOMER’SP/N ：C021000010200 料號 PARTNUMBER ： WAN3216F245C04 規格 DESCRIPTION ： ChipAntenna3216LAnt2.45GType04 版本 VERSION ：V1.3 日期 ISSUEDATE ： 2020/03/13 客戶承認 CUSTOMERAPPROVED 工程部 R&DCENTER 承認 APPROVAL 確認 CHECKED 製作 DRAWN RayTennyson Snow 萬誠科技股份有限公司 11261台北市北投區立功街151號1樓 電話 : (02)2898-2220 傳真 : (02)2898-5055 OneWaveElectronicCo.,Ltd. 1F,No.151,LiGongStreet,BeitouDistrict, TaipeiCity11261,Taiwan TEL:+88622898-2220 FAX:+88622898-5055 3216Chipantenna ForBluetooth/WLANApplications P/N:WAN3216F245C04 Dimension(mm) L 3.23±0.20 W 1.66±0.20 T 0.45±0.20 ONEWAVETECHNOLOGYCO.,LTD. 2/11 ONEWAVETECHNOLOGYCO.,LTD. 3/11 PartNumberInformation WAN3216F245C04 ABCDEF AProductSeriesAntenna B DimensionLxW 3.2x1.6mm(±0.2mm) C MaterialHighKmaterial D WorkingFrequency2.4~2.5GHz E FeedingmodePIFA&SingleFeeding F AntennatypeType=04 1.ElectricalSpecification Specification PartNumber WAN3216F245C04 CentralFrequency 2450 MHz Bandwidth 120(Min.) MHz ReturnLoss -6.5(Max) dB PeakGain 1.75 dBi Impedance 50 Ohm OperatingTemperature -40～+110 °C MaximumPower 4 W ResistancetoSolderingHeats 10(@260°C) sec. Polarization Linear AzimuthBeamwidth Omni-directional Termination Ni/Au(Leadless) Remark:Bandwidth&PeakGainwasmeasuredunderevaluationboardofnextpage ONEWAVETECHNOLOGYCO.,LTD. 4/11 2.RecommendedPCBPattern EvaluationBoardDimension 2 nd EvaluationBoardDimension SuggestedMatchingCircuit ONEWAVETECHNOLOGYCO.,LTD. 5/11 LayoutDimensionsinClearancearea(Size=5.9*5.0mm) 50ohmtransmissionLine MatchingCircuit FootPrint(Unit:mm) 2 nd LayoutDimensionsinClearancearea(Size=8.0*3.0mm) ONEWAVETECHNOLOGYCO.,LTD. 6/11 3.MeasurementResults ReturnLoss ONEWAVETECHNOLOGYCO.,LTD. 7/11 RadiationPattern X Z Y Efficiency PeakGain Directivity 2400MHz 82.36% 1.69dBi2.53dBi 2450MHz 85.65% 1.75dBi2.42dBi 2500MHz 83.88% 1.71dBi2.47dBi ChamberCoordinateSystem ONEWAVETECHNOLOGYCO.,LTD. 8/11 4.ReliabilityandTestCondictions ITEMREQUIREMENTSTESTCONDITION Solderability 1.Wettingshallexceed90%coverage 2.Novisiblemechanicaldamage TEMP(°C) 230°C 150 °C Pre-heatingtemperature:150°C/60sec. Soldertemperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Fluxforleadfree:rosin Solderheat Resistance 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% TEMP( °C ) 260°C 60sec Pre-heatingtemperature:150°C/60sec. Soldertemperature:260 ± 5 °C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Fluxforleadfree:rosin Component Adhesion (Pushtest) 1.Novisiblemechanicaldamage Thedeviceshouldbereflow soldered(230 ± 5 °C for10sec.)toatinned coppersubstrateAdynometerforce gaugeshouldbeappliedthesideofthe component.Thedevicemustwith-ST-F 0.5Kgwithoutfailureofthetermination attachedtocomponent. Component Adhesion (Pulltest) 1.Novisiblemechanicaldamage Insert10cmwireintotheremainingopen eyebend,theendsofevenwirelengths upwardandwindtogether. Terminalshallnotberemarkably damaged. Thermalshock 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% +110°C=>30±3min -40°C=>30±3min Testcycle:10cycles Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. Phase Temperature(°C) Time(min) 1 +110±5 °C 30±3 2 Room Temperature Within 3sec 3 -40±2 °C 30±3 4 Room Temperature Within 3sec Resistanceto High Temperature 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 3.Nodisconnectionorshortcircuit. Temperature:+110±5 °C Duration:1000 ± 12hrs Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. Resistanceto Low Temperature 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 3.Nodisconnectionorshortcircuit. Temperature:-40±5 °C Duration:1000 ± 12hrs Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. Humidity 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 3.Nodisconnectionorshortcircuit. Temperature:40±2 °C Humidity:90%to95%RH Duration:1000 ± 12hrs Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. 150°C 10±0.5sec. 4±1sec. 60sec ONEWAVETECHNOLOGYCO.,LTD. 9/11 5.SolderingandMounting Mildlyactivatedrosinfluxesarepreferred.Theminimumamountofsoldercan leadtodamagefromthestressescausedbythedifferenceincoefficientsof expansionbetweensolder,chipandsubstrate.Theterminationsaresuitable forallwaveandre-flowsolderingsystems.Ifhandsolderingcannotbe avoided,thepreferredtechniqueistheutilizationofhotairsolderingtools. ReflowSoldering PRE-HEATINGSOLDERING 10smax. 250~260 230 180 150 60~120s30~60s TIME(sec.) IronSoldering PRE-HEATINGSOLDERING within3s 350 300 150 Over60sGradualcooling TIME(sec.) Recommendedtemperatureprofilesforre-flowsolderinginFigure1. Productsattachmentwithasolderingironisdiscouragedduetotheinherent processcontrollimitations.Intheeventthatasolderingironmustbe employedthefollowingprecautionsarerecommended. .Preheatcircuitandproductsto150°C .Nevercontacttheceramicwiththeirontip .Usea20wattsolderingironwithtipdiameterof1.0mm .280°Ctiptemperature(max) .1.0mmtipdiameter(max) .Limitsolderingtimeto3sec. NATURAL COOLING NATURAL COOLING ONEWAVETECHNOLOGYCO.,LTD. 10/11 6.PackagingInformation TapeSpecification: ReelSpecification:(7,,,Φ180mm) A- 7x8mm TapeWidth(mm)A(mm)B(mm)C(mm)D(mm) Chip/Reel(pcs) 89.0±0.560±213.5±0.5178±23000 ONEWAVETECHNOLOGYCO.,LTD. 11/11 7.StorageandTransportationInformation StorageConditions Tomaintainthesolderabilityofterminalelectrodes: 1.Temperatureandhumidityconditions:-10~40°Cand30~70%RH. 2.Recommendedproductsshouldbeusedwithin6monthsfromthetimeof delivery. 3.Thepackagingmaterialshouldbekeptwherenochlorineorsulfurexists intheair. TransportationConditions 1.Productsshouldbehandledwithcaretoavoiddamageorcontamination fromperspirationandskinoils. 2.Theuseoftweezersorvacuumpickupisstronglyrecommendedfor individualcomponents. 3.Bulkhandlingshouldensurethatabrasionandmechanicalshockare minimized.