2A4KN-FT800FT800 Thermal Printer

* Bluetooth: used to transmit the distribution network information to the printer. * RFID: used to identify genuine consumables.

Reference No.: WTX22X10199192W001/002/003 Page 2 of 13 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn EXHIBIT 2 - EUT EXTERNAL PHOTOGRAPHS EUT View 1 EUT View 2 Reference No.: WTX22X10199192W001/002/003 Page 3 of 13 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn EUT View 3 EUT View 4 Reference No.: WTX22X10199192W001/002/003 Page 4 of 13 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn EUT View 5 EUT View 6 Reference No.: WTX22X10199192W001/002/003 Page 5 of 13 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn EUT View 7

Reference No.: WTX22X10199192W001/002/003 Page 1 of 13 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn ANNEX EXHIBIT 1 - PRODUCT LABELING Proposed FCC ID Label Format Specifications: The label shall be securely affixed to a permanently attached part of the device, in a location where it is visible or easily accessible to the user, and shall not be readily detachable. The label shall be sufficiently durable to remain fully legible and intact on the device in all normal conditions of use throughout the device’s expected lifetime. Proposed Label Location on EUT FCC ID Label Location

Reference No.: WTX22X10199192W001/002/003 Page 6 of 14 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn EXHIBIT 3 - EUT INTERNAL PHOTOGRAPHS EUT Housing and Board View 1 Solder Board-Component View 1 Reference No.: WTX22X10199192W001/002/003 Page 7 of 14 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Solder Board-Component View 2 Solder Board-Component View 3 Reference No.: WTX22X10199192W001/002/003 Page 8 of 14 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Solder Board-Component View 4 Solder Board-Component View 5 Reference No.: WTX22X10199192W001/002/003 Page 9 of 14 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Solder Board-Component View 6 Solder Board-Component View 7 Reference No.: WTX22X10199192W001/002/003 Page 10 of 14 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Solder Board-Component View 8 Antenna View 1 Reference No.: WTX22X10199192W001/002/003 Page 11 of 14 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Antenna View 2 Antenna View 3

1. RF Exposure Requirements 1.1 General Information Client Information Applicant: Mapleprint Inc Address of applicant: 140 58TH STREET BLDG A DOCK 4A BROOKLYN, NY 11220 United states Manufacturer: Xiamen Hanin Electronic Technology Co.,Ltd. Address of manufacturer: Room 305A, Angye Building, Pioneering Park,Torch High-tech,Zone,Xiamen General Description of EUT: Product Name: FT800 Thermal Printer Trade Name POLONO Model No.: FT800 Adding Model(s): / Rated Voltage: DC 14V Power Adapter: AP091G-140300 Input: AC100-240V 50/60Hz 1.5A Output:DC14.0V3.0A FCC ID: 2A4KN-FT800 Equipment Type: Mobile device Technical Characteristics of EUT: Bluetooth Bluetooth Version: V4.0 (BLE mode) V4.0 (BR/EDR mode) Frequency Range: 2402-2480MHz 2402-2480MHz RF Output Power: 3.23dBm (Conducted) 3.43dBm (Conducted) Data Rate: 1Mbps 1Mbps, 2Mbps, 3Mbps Modulation: GFSK GFSK, π/4 DQPSK, 8DPSK Quantity of Channels: 40 79 Channel Separation: 2MHz 1MHz Type of Antenna: PCB Antenna PCB Antenna Antenna Gain: 2.69dBi 2.69dBi Wi-Fi Support Standards: 802.11b, 802.11g, 802.11n Frequency Range: 2412-2462MHz for 802.11b/g/n(HT20) RF Output Power: 15.84dBm (Conducted) Type of Modulation: CCK, OFDM, QPSK, BPSK, 16QAM, 64QAM Quantity of Channels: 11 for 802.11b/g/n(HT20) Channel Separation: 5MHz Type of Antenna: FPC Antenna Antenna Gain: 4.58dBi NFC Support Standards: NFC Frequency Range: 13.56MHz Max. Field Strength: 65.12dBuV/m (at 3m) Antenna Type: PCB Antenna Antenna Gain 0dBi 1.2 RF Exposure Exemption According to §1.1307(b)(3) and 447498 D04 Interim General RF Exposure Guidance v01, system operating under the provisions of this section shall be operating in a manner that the public is not exposed to radio frequency energy level in excess limit for maximum permissible exposure. Option A: FCC Rule Part 1.1307 (b)(3)(i)(A):The available maximum time-averaged power is no more than 1mW, regardless of separation distance. Option B: FCC Rule Part 1.1307 (b)(3)(i)(B): The available maximum time-averaged power or effective radiated power (ERP), whichever is greater, is less than or equal to the threshold P th (mW) described in the following formula. P th is given by: Option C: FCC Rule Part 1.1307 (b)(3)(i)(C): The minimum separation distance (R in meters) from the body of a nearby person for the frequency (f in MHz) at which the source operates, the ERP (watts) is no more than the calculated value prescribed for that frequency. R must be at least λ/2π, where λ is the free-space operating wavelength in meters. Single RF Sources Subject to Routine Environmental Evaluation RF Source frequency (MHz) Threshold ERP (watts) 0.3-1.34 1,920 R 2 1.34-30 3,450 R 2 /f 2 30-300 3.83 R 2 300-1,500 0.0128 R 2 f 1,500-100,000 19.2R 2 For Multiple RF sources: FCC Rule Part 1.1307(b)(3)(ii): (A) The available maximum time-averaged power of each source is no more than 1 mW and there is a separation distance of two centimeters between any portion of a radiating structure operating and the nearest portion of any other radiating structure in the same device, except if the sum of multiple sources is less than 1 mW during the time-averaging period, in which case they may be treated as a single source (separation is not required). (B) In the case of fixed RF sources operating in the same time-averaging period, or of multiple mobile or portable RF sources within a device operating in the same time averaging period, if the sum of the fractional contributions to the applicable thresholds is less than or equal to 1 as indicated in the following equation. 1.3 Calculated Result Radio Access Technology Min. Frequency Max. Output Power Max. Tune-Up Output Power Antenna Gain Duty Cycle Tune-Up EIRP (MHz) (dBm) (dBm) (dBi) (%) (dBm) Bluetooth 2402 3.43 4.0 2.69 100 6.69 Wi-Fi 2412 15.84 16.0 4.58 100 20.58 NFC 13.56 -30.14 / 0.00 / / Frequency Option Min. Distance Tune-Up ERP Exposure Limit Ratio Result (MHz) (cm) (dBm) (mW) (mW) Pass/Fail 2402 C 20.00 4.54 2.84 768.00 0.001 Pass 2412 C 20.00 18.43 69.66 768.00 0.090 Pass 13.56 C 20.00 -30.00 0.001 750.52 0.001 Pass Note: 1. ERP=EIRP-2.15dB; EIRP= Output Power + Antenna gain 2. Option A, B and C refers as clause 1.2. 3. For option B, Pth(mW) convert to Exposure Limit(mW); For option C, ERP(W) convert to Exposure Limit(mW). 4. Ratio= Tune-Up ERP(mW)/ Exposure Limit (mW) Mode for Simultaneous Multi-band Transmission: Radio Access Technology Ratio 1 Ratio 2 Ratio 3 Simultaneous Ratio Limit Result Pass/Fail Bluetooth+ Wi-Fi+ NFC 0.001 0.090 0.001 0.092 1 Pass Result: Pass

Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Page 1 of 27 TEST REPORT Reference No. .................... : WTX22X10199192W005 FCC ID ................................ : 2A4KN-FT800 Applicant ........................... : Mapleprint Inc Address ............................. : 140 58TH STREET BLDG A DOCK 4A BROOKLYN, NY 11220 United states Manufacturer ..................... : Xiamen Hanin Electronic Technology Co.,Ltd. Address ............................. : Room 305A, Angye Building, Pioneering Park,Torch High-tech,Zone,Xiamen Product Name ................... : FT800 Thermal Printer Model No... ......................... : FT800 Standards .......................... : FCC Part 15.225 Date of Receipt sample .... : 2022-10-08 Date of Test........................ : 2022-10-08 to 2022-11-04 Date of Issue ..................... : 2022-11-04 Test Report Form No. ....... : WTX_Part 15_225W Test Result ......................... : Pass Remarks: The results shown in this test report refer only to the sample(s) tested, this test report cannot be reproduced, except in full, without prior written permission of the company. The report would be invalid without specific stamp of test institute and the signatures of approver. Prepared By: Waltek Testing Group (Shenzhen) Co., Ltd. Address: 1/F., Room 101, Building 1, Hongwei Industrial Park, Liuxian 2nd Road, Block 70 Bao'an District, Shenzhen, Guangdong, China Tel.: +86-755-33663308 Fax.: +86-755-33663309 Email: [email protected] Tested by: Approved by: Dashan Chen Silin Chen Reference No.: WTX22X10199192W005 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Page 2 of 27 TABLE OF CONTENTS 1. GENERAL INFORMATION .................................................................................................................................... 4 1.1 PRODUCT DESCRIPTION FOR EQUIPMENT UNDER TEST (EUT) ......................................................................... 4 1.2 TEST STANDARDS ................................................................................................................................................. 5 1.3 TEST METHODOLOGY ........................................................................................................................................... 5 1.4 TEST FACILITY ...................................................................................................................................................... 5 1.5 EUT SETUP AND TEST MODE .............................................................................................................................. 6 1.6 MEASUREMENT UNCERTAINTY ............................................................................................................................. 7 1.7 TEST EQUIPMENT LIST AND DETAILS ................................................................................................................... 8 2. SUMMARY OF TEST RESULTS ......................................................................................................................... 11 3. ANTENNA REQUIREMENT ................................................................................................................................. 12 3.1 STANDARD APPLICABLE ..................................................................................................................................... 12 3.2 TEST RESULT ...................................................................................................................................................... 12 4. RADIATED EMISSIONS ....................................................................................................................................... 13 4.1 STANDARD APPLICABLE ..................................................................................................................................... 13 4.2 TEST PROCEDURE .............................................................................................................................................. 13 4.3 CORRECTED AMPLITUDE & MARGIN CALCULATION ........................................................................................... 15 4.4 SUMMARY OF TEST RESULTS/PLOTS ................................................................................................................. 16 5. OUT OF BAND EMISSIONS ................................................................................................................................ 19 5.1 STANDARD APPLICABLE ..................................................................................................................................... 19 5.2 TEST PROCEDURE .............................................................................................................................................. 19 5.3 SUMMARY OF TEST RESULTS/PLOTS ................................................................................................................. 19 6. FREQUENCY STABILITY .................................................................................................................................... 21 6.1 STANDARD APPLICABLE ..................................................................................................................................... 21 6.2 TEST PROCEDURE .............................................................................................................................................. 21 6.3 SUMMARY OF TEST RESULTS/PLOTS ................................................................................................................. 21 7. EMISSION BANDWIDTH ...................................................................................................................................... 22 7.1 APPLICABLE STANDARD ..................................................................................................................................... 22 7.2 TEST PROCEDURE ................................…

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Reference No.: WTX22X10199192W001/002/003 Page 11 of 13 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn EXHIBIT 4 - TEST SETUP PHOTOGRAPHS Conducted Emission Test Setup Conducted Emission Test Setup Reference No.: WTX22X10199192W001/002/003 Page 12 of 13 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Radiation Emission Test Setup (Below 30MHz) Radiation Emission Test Setup (30MHz to 1GHz) Reference No.: WTX22X10199192W001/002/003 Page 13 of 13 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Radiation Emission Test Setup (1GHz to 18GHz) Radiation Emission Test Setup (Above 18GHz) ***** END OF REPORT *****