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  3. 2A5PM-CRX

2A5PM-CRXHEARING PROTECTION AND ENHANCEMENT

Axil and Associated Brands

Application Details

Equipment Class
DSS - Part 15 Spread Spectrum Transmitter
Date of Grant
Apr 28, 2026
Application Purpose
Original Equipment
Equipment Note
HEARING PROTECTION AND ENHANCEMENT
Frequency Range
2402.00000000 - 2480.00000000
Company
Axil and Associated Brands
Country
United States

Documents & Files

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Attestation Statements

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Cover Letter(s)

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ID Label/Location Info

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RF Exposure Info

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Test Report

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Document Text

Text extracted from the exhibit documents filed with the FCC. Open a document above to read the original.

Attestation Statements

(AxilandAssociatedBrands) FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:24-02-2026 Ref:AttestationStatementsPart2.911(d)(5)(i)Filing FCCID:2A5PM-CRX AxilandAssociatedBrandscertifiesthattheequipmentforwhichauthorizationissoughtisnot“covered” equipmentprohibitedfromreceivinganequipmentauthorizationpursuanttosection2.903oftheFCC rules. AxilandAssociatedBrandscertifiesthattheequipmentforwhichauthorizationissoughtdoesnot includecybersecurityoranti-virussoftwareproducedorprovidedbyKasperskyLab,Inc.oranyofits successorsandassignees,includingequipmentwithintegratedKasperskyLab,Inc.(oranyofits successorsandassignees)cybersecurityoranti-virussoftwarepursuanttoDA-24-886andKDB986446 D01CoveredEquipmentGuidancesectionB(2a). Deviceisinherentlycompliantbasedonhardwarelimitationsorsoftwarecontrols. or ASoftwareBillofMaterials(SBOM)isprovidedtotheTCBforreview,and Theend-userorthirdpartiescannotinstalladditionalsoftwareonthisdevice. Sincerely, KenWilliams/Manager AxilandAssociatedBrands (AxilandAssociatedBrands) FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:24-02-2026 Ref:AttestationStatementsPart2.911(d)(5)(ii)Filing FCCID:2A5PM-CRX AxilandAssociatedBrandscertifiesthat,asofthedateofthefilingoftheapplication,theapplicantis notidentifiedontheCoveredList(asaspecificallynamedentityoranyofitssubsidiariesoraffiliates)as anentityproducing“covered”equipment. Sincerely, KenWilliams/Manager AxilandAssociatedBrands

Attestation Statements

AxilandAssociatedBrands U.S.AgentDesignationforServiceofProcess- CertificationAttestationLetter 24/02/2026 FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Ref:AttestationStatementsPart2.911(d)(7)Filing FCCID:2A5PM-CRX ApplicantFRN:0032100380 AxilandAssociatedBrands certifiesthat,asofthedateofthefilingoftheapplication, AxilandAssociatedBrandsisourdesignatedU.S.agentforserviceofprocessforthe abovereferencedFCCID. AxilandAssociatedBrandsacceptstomaintainanagentfornolessthanoneyear afterthegranteehasterminatedallmarketingandimportationortheconclusionofany Commission-relatedproceedinginvolvingtheequipment. AxilandAssociatedBrandsaccepts,asofthedateofthefilingoftheapplication,the obligationofthedesignatedU.S.agentforserviceofprocessfortheabovereferenced FCCID. DesignatedU.S.AgentInformation: CompanyName:AxilandAssociatedBrands FCCRegistrationNumber(FRN):0032100380 PhysicalU.S.CompanyAddress:13065South120East,Draper,Utah,84020,UnitedStates ContactPerson:KenWilliams AgentEmailAddress:[email protected] Sincerely, Company:AxilandAssociatedBrandsCompany:AxilandAssociatedBrands CompanyRepresentative:KenWilliamsCompanyRepresentative:KenWilliams Title:Manager Signature: Title:Manager Signature:

Cover Letter(s)

(AxilandAssociatedBrands) FederalCommunicationsCommission AuthorizationandEvaluationDivision ConfidentialityRequestregardingapplicationforcertificationof FCCID:2A5PM-CRX PursuanttoSections0.457and0.459oftheCommission’sRules,weherebyrequestconfidential treatmentofinformationaccompanyingthisapplicationasoutlinedbelow: ExhibitTypeFileName Blockdiagram, Schematic, OperationalDescription Blockdiagram.pdf, Schematic.pdf, OperationalDescription.pdf Theabovematerialscontaintradesecretsandproprietaryinformationnotcustomarilyreleasedto thepublic.Thepublicdisclosureofthesematerialsmaybeharmfultotheapplicantandprovide unjustifiedbenefitstoitscompetitors. TheapplicantunderstandsthatpursuanttoSection0.457oftheRules,disclosureofthis applicationandallaccompanyingdocumentationwillnotbemadebeforethedateoftheGrant forthisapplication. PursuanttoDA04-1705June15,2004oftheCommission’spublicnotice,wealsorequest temporaryconfidentialtreatmentofinformationaccompanyingthisapplicationasoutlinedbelow: Short-termconfidentialityrequested:180days ExhibitTypeFileName Internalphotos, Externalphotos, Testsetupphotos, UserManual Internalphotos.pdf, Externalphotos.pdf, Testsetupphotos.pdf, UserManual.pdf Sincerely, KenWilliams/Manager2026.02.24 AxilandAssociatedBrands

Cover Letter(s)

DeclarationDifferences 1.CRXisapairofheadphones. TheCRXdoesnothaveBluetoothfunctionality. Itonlyhasthefunctionofnoisereduction. 2.CRX-BT-LANYARDisaBluetoothconnectioncable. CanusethecableoftheCRXheadphonesasaBluetooth headsetafterwards. So,CRXandCRX-BT-LANYARDaresoldtogether. Sincerely, KenWilliams/Manager2026.02.24 AxilandAssociatedBrands

Cover Letter(s)

(AxilandAssociatedBrands) FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 Date:February24,2026 SUBJECT:FCCApplicationforFCCID:2A5PM-CRX ToWhomItMayConcern: We,theundersigned,herebyauthorizeJoeXiaatEMTEK(SHENZHEN)CO.,LTD.on ourbehalf,toapplytotheFederalCommunicationsCommissiononourequipment.Any andallactscarriedoutbyEMTEK(SHENZHEN)CO.,LTD.onourbehalfshallhavethe sameeffectasactsofourown. ThisistoadvisethatweareinfullcompliancewiththeAnti-DrugAbuseAct.We,the applicant,arenotsubjecttoadenialoffederalbenefitspursuanttoSection5301ofthe Anti-DrugActof1988,21USC853a,andnopartytotheapplicationissubjecttoadenial offederalbenefitspursuanttothatsection. Regards, KenWilliams/Manager AxilandAssociatedBrands

RF Exposure Info

FCCID:2A5PM-CRX RFEXPOSUREEVALUATION FollowingFCCKDB447498D01“GeneralSARtestexclusionguidance”The correspondingSARExclusionThresholdcondition,listedbelow: The1-gand10-gSARtestexclusionthresholdsfor100MHzto6GHzat testseparationdistances ≤ 50mmaredeterminedby: [(max.powerofchannel,includingtune-uptolerance,mW)/(min.test separationdistance,mm)][√f(GHz)]≤3.0for1-gSAR,and≤7.5 for10-gextremitySAR,where f(GHz)istheRFchanneltransmitfrequencyinGHz. PoweranddistanceareroundedtothenearestmWandmmbefore calculation. TheresultisroundedtoonedecimalplaceforcomparisonThetest exclusionsareapplicableonlywhentheminimumtestseparation distanceis≤50mmandfortransmissionfrequenciesbetween100 MHzand6GHz.Whentheminimumtestseparationdistanceis<5 mm,adistanceof5mmisappliedtodetermineSARtestexclusion. At100MHzto6GHzandfortestseparationdistances>50mm,theSAR testexclusionthresholdisdeterminedaccordingtothefollowing: [Thresholdat50mminstep1)+(testseparationdistance-50mm) (f(MHz)/150)]mW,at100MHzto1500MHz; [Thresholdat50mminstep1)+(testseparationdistance-50mm)-10] mWat>1500MHzand ≤ 6GHz; Atfrequenciesbelow100MHz,thefollowingmaybeconsideredforSAR testexclusion. Thethresholdatthecorrespondingtestseparationdistanceat100 MHzinstep2)ismultipliedby[1+log(100/f(MHz))]fortestseparation distances>50mmand<200mm. Thethresholddeterminedbytheequationina)for50mmand100 MHzismultipliedby1/2fortestseparationdistances≤50mm. SARmeasurementproceduresarenotestablishedbelow100MHz. WhenSARtestexclusioncannotbeapplied,aKDBinquiryis requiredtodetermineSARevaluationrequirementsforanytest resultstobeacceptable. MobileDeviceEvaluationMethodandLimit HumanexposuretoRFemissionsfrommobiledevices(47CFR§2.1091) maybeevaluatedbasedontheMPElimitsadoptedbytheFCCforelectric andmagneticfieldstrengthand/orpowerdensity,asappropriate,since exposuresareassumedtooccuratdistancesof20cmormorefrompersons. LimitsForGeneralPopulation/UncontrolledExposure Frequency Range (MHz) E-field Strength(E) (V/m) Magnetic Field Strength(H) (A/m) Power Density (S) (mW/cm 2 ) Averaging Time |E| 2 ,|H| 2 orS (Minutes) 0.3--1.346141.63(100)*30 1.34--30824/f2.19/f(180/f 2 )*30 30--30027.50.0730.230 300--1500----f/150030 1500-- 100,000 ----1.030 *Note: 1.f=FrequencyinMHz*Plane-waveEquivalentPowerDensity 2.TheaveragingtimeforGeneralPopulation/Uncontrolledexposuretofixed transmittersisnotapplicableformobileandportabletransmitters.See47 CFR§§2.1091and2.1093onsource-basedtime-averagingrequirementfor mobileandportabletransmitters. 11.1Friistransmissionformula:Pd=(Pout*G)\(4*pi*R2) Where Pd=PowerdensityinmW/cm 2 Pout=outputpowertoantennainmW G=Numericgainoftheantennarelativetoisotropicantenna Pi=3.1416 R=distancebetweenobservationpointandcenteroftheradiatorincm PdthelimitofMPE,1mW/cm 2 ,Ifweknowthemaximumgainofthendtotal powerinputtotheantenna,throughthecalculation,wewillknowthedistance wheretheMPElimitisreached. RFExposureInformation:Theradiatedoutputpowerofthisdevicemeetsthe limitsofFCC/ICradiofrequencyexposurelimits.Thisdeviceshouldbe operatedwithaminimumseparationdistanceof20cm(8inches)betweenthe equipmentandaperson'sbody. 11.2MeasurementResult MaxRFExposureevaluation. Mode Max Conducted Power (dBm) Max Conducted Power(mw) Antenna gain (dBi) Min.test separation distance (mm) √ f(GHz) ResultLimits BT2.131.632.715.02.4020.7830523 Note:Afterassessment,itwasdeterminedthatthisequipmentdoesnot requireSARtesting. -----TheEnd-----

Test Report

CUSTOMER : CUSTOMER’S P/N : PART NUMBER : KH-3216F245W36 DESCRIPTION : Chip Antenna 3216 M-Ant 2.45G Type 36 VERSION : V2.2 ISSUE DATE : 2018/01/30 CUSTOMER APPROVED R&D CENTER APPROVAL CHECKED DRAWN Ray James Thor Shenzhen Kinghelm Elcetron Co, Ltd Shenzhen Kinghelm Elcetron Co, Ltd 2/11 3216 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 3.23 ± 0.20 W 1.66 ± 0.20 T 1.23 ± 0.20 P/N: KH3216F245W36 Shenzhen Kinghelm Elcetron Co, Ltd 3/11 Part Number Information KH 3216 F 245 W 36 A B C D E F A Product Series Antenna B Dimension L x W 3.2X1.6mm (+-0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode Monopole & Single Feeding F Antenna type Type=36 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number KH3216F245W36 Central Frequency 2450 MHz Bandwidth 100 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 2.71 dBi Impedance 50 Ohm Operating Temperature -40~+85 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) Shenzhen Kinghelm Elcetron Co, Ltd 4/11 2. Recommended PCB Pattern 1.Evaluation Board Dimension 2.Evaluation Board Dimension Unit : mm Suggested Matching Circuit Shenzhen Kinghelm Elcetron Co, Ltd 5/11 1.Layout Dimensions in Clearance area(Size=5.2*5.0mm) 50 ohm transmission Line Matching Circuit 2.Layout Dimensions in Clearance area(Size=8.2*5.0mm) 50 ohm transmission Line Matching Circuit FootPrint (Unit : mm) Shenzhen Kinghelm Elcetron Co, Ltd 6/11 3. Measurement Results Return Loss Shenzhen Kinghelm Elcetron Co, Ltd 7/11 Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 55.21 % 1.45 dBi 5.32 dBi 2450MHz 66.45 % 2.71 dBi 5.21 dBi 2500MHz 57.53 % 1.98 dBi 5.29 dBi Chamber Coordinate System Y Z X Shenzhen Kinghelm Elcetron Co, Ltd 8/11 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10±0.5 sec. 60sec .. TEMP (°C) 150°C 260°C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +85±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +85°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 85±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C Shenzhen Kinghelm Elcetron Co, Ltd 9/11 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradualcooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 Shenzhen Kinghelm Elcetron Co, Ltd 10/11 6.Packaging Information  Tape Specification: W Ao Bo Ko P F E D D1 Po P2 t 8.0 ±0.30 1.80 ±0.05 3.51 ±0.10 1.59 ±0.10 4.00 ±0.05 3.50 ±0.05 1.75 ±0.10 1.50 ±0.10 0.00 ±0.10 4.00 ±0.10 2.00 ±0.05 0.25 ±0.05  Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 13.5±0.5 178±2 3000 Shenzhen Kinghelm Elcetron Co, Ltd 11/11 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: -10~ 40°C and 30~70% RH. 2. Recommended products should be used within 6 months from the time of delivery. 3…

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Test Report

ReportNo.ENS2512290203W02001RPage1of73Ver.1.0 TESTREPORT ProductName:HEARINGPROTECTIONANDENHANCEMENT ModelNumber:CRX,CRX-BT-LANYARD FCCID:2A5PM-CRX IC:28343-CRX Preparedfor:AxilandAssociatedBrands Address:13065South120East,Draper,Utah,84020,UnitedStates Preparedby:EMTEK(SHENZHEN)CO.,LTD. Address:Building69,MajialongIndustryZone,NanshanDistrict, Shenzhen,Guangdong,China Tel:(0755)26954280 Fax:(0755)26954282 ReportNumber:ENS2512290203W02001R Date(s)ofTests:February01,2026toFebruary03,2026 Dateofissue:February04,2026 $二维码$ ReportNo.ENS2512290203W02001RPage2of73Ver.1.0 TableofContents 1TESTRESULTCERTIFICATION..........................................................................................................................................3 2EUTTECHNICALDESCRIPTION.......................................................................................................................................5 3SUMMARYOFTESTRESULT.............................................................................................................................................6 4TESTMETHODOLOGY........................................................................................................................................................7 4.1GENERALDESCRIPTIONOFAPPLIEDSTANDARDS.............................................................................................7 4.2MEASUREMENTEQUIPMENTUSED.........................................................................................................................7 4.3DESCRIPTIONOFTESTMODES.................................................................................................................................8 5FACILITIESANDACCREDITATIONS................................................................................................................................9 5.1FACILITIES.....................................................................................................................................................................9 5.2EQUIPMENT...................................................................................................................................................................9 5.3LABORATORYACCREDITATIONSANDLISTINGS.................................................................................................9 6TESTSYSTEMUNCERTAINTY.........................................................................................................................................10 7SETUPOFEQUIPMENTUNDERTEST............................................................................................................................11 7.1RADIOFREQUENCYTESTSETUP1.........................................................................................................................11 7.2RADIOFREQUENCYTESTSETUP2.........................................................................................................................11 7.3CONDUCTEDEMISSIONTESTSETUP....................................................................................................................13 7.4BLOCKDIAGRAMCONFIGURATIONOFTESTSYSTEM....................................................................................14 7.5SUPPORTEQUIPMENT...............................................................................................................................................14 8FREQUENCYHOPPINGSYSTEMREQUIREMENTS.....................................................................................................15 8.1StandardApplicable........................................................................................................................................................15 8.2EUTPseudorandomFrequencyHoppingSequence.......................................................................................................15 8.3EqualHoppingFrequencyUse.......................................................................................................................................16 8.4FrequencyHoppingSystem............................................................................................................................................16 9TESTREQUIREMENTS......................................................................................................................................................17 9.120DB&99%BANDWIDTH............................................................................................................................................17 9.2CARRIERFREQUENCYSEPARATION.....................................................................................................................26 9.3NUMBEROFHOPPINGFREQUENCIES...................................................................................................................28 9.4AVERAGETIMEOFOCCUPANCY(DWELLTIME)................................................................................................30 9.5MAXIMUMPEAKCONDUCTEDOUTPUTPOWER...............................................................................................32 9.6CONDUCTEDSUPRIOUSEMISSION........................................................................................................................36 9.7RADIATEDSPURIOUSEMISSION............................................................................................................................51 9.8CONDUCTEDEMISSIONTEST.................................................................................................................................72 9.9ANTENNAAPPLICATION...........................................................................................................................................73 ReportNo.ENS2512290203W02001RPage3of73Ver.1.0 1TESTRESULTCERTIFICATION Applicant: AxilandAssociatedBrands Address: 13065South120East,Draper,Utah,84020,UnitedStates Manufacturer:NINGBOHONGSHUOELECTRONICS&APPLIANCECO.,LTD Address: FLOOR11,NO.1BUILDING,DEHAOGUANHAIWEIINDUSTRY,CIXI,NINGBO, ZH…

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Contact Information

Applicant

Ken Williams
[email protected]Fax: 801 566 0240

Technical Contact

Axil and Associated BrandsKen Williams
[email protected]

13065 South 120 East Draper Utah · Beverly Hills, California, 90212 · United States

Test Firm

EMTEK (Shenzhen) Co., Ltd.Lisa Wang
[email protected]

Technical Specifications

#Rule PartsFrequency RangePower Output
115C2.40 GHz - 2.48 GHz1.63 mW
Confidentiality
Long Term
Grant Notes
Output Power listed is the maximum conducted output power. This device must not be co-located or operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi-transmitter product procedures, or as evaluated in this filing. Device meets SAR Exemption for Portable use.

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