2A5TA-K50Wireless speaker

Wireless speaker FCC Caution: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -- Reorient or relocate the receiving antenna. -- Increase the separation between the equipment and receiver. -- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -- Consult the dealer or an experienced radio/TV technician for help. The device has been evaluated to meet general RF exposure requirement. The device can be used in portable exposure condition without restriction.

2.911(d)(5)(i)EquipmentTypeAttestationv1.2 ShenzhenZhengyunTechnologyCo.,LTD Section2.911(d)(5)(i)Certification–EquipmentType Companyname:ShenzhenZhengyunTechnologyCo.,LTD Address:Room202,Floor2,BuildingA,RongchengInternational,24HepingRoad,Qinghua Community,LonghuaDistrict,Shenzhen,China ProductName:Wirelessspeaker FCCID:2A5TA-K50 Model(s):K50 2.911(d)(5)(i)EquipmentType We,[ShenzhenZhengyunTechnologyCo.,LTD]certifythattheequipmentforwhichauthorization issoughtthroughcertificationisnot: Prohibitedfromreceivinganequipmentauthorizationpursuantto§2.903;oftheFCCrules. Identifiedasanequipmenttypeinthe“CoveredList” NOTE1 Yourssincerely, Name:WeiZengDate:07-03-2024 TitleandCompanyname:generalmanager/ShenzhenZhengyunTechnologyCo.,LTD NOTE1 “CoveredList”;istheListofEquipmentandServicesCoveredBySection2ofTheSecureNetworksAct,availableat https://www.fcc.gov/supplychain/coveredlist References; 1)986446D01CoveredEquipmentv01 https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?switch=P&id=325672 2)FederalRegisterdocument2022-28263publishedon02/06/23 https://www.federalregister.gov/documents/2023/02/06/2022-28263/protecting-against-national-security-threats-to-the-com munications-supply-chain-through-the

2.911(d)(5)(ii)ApplicantAttestationv1.3 ShenzhenZhengyunTechnologyCo.,LTD Section2.911(d)(5)(ii)Certification–Applicant(CoveredList) Companyname:ShenzhenZhengyunTechnologyCo.,LTD Address:Room202,Floor2,BuildingA,RongchengInternational,24HepingRoad,Qinghua Community,LonghuaDistrict,Shenzhen,China ProductName:Wirelessspeaker FCCID:2A5TA-K50 Model(s):K50 2.911(d)(5)(ii)Applicantfiling We,[ShenzhenZhengyunTechnologyCo.,LTD]certifythat,asofthedateofthefilingofthe application,theapplicantisnotidentified NOTE1 onthe“CoveredList” NOTE2 ,establishedpursuant to§1.50002ofthischapter,asanentityproducingcoveredcommunicationsequipment. Yourssincerely, Name:WeiZengDate:07-03-2024 TitleandCompanyname:generalmanager/ShenzhenZhengyunTechnologyCo.,LTD NOTE1 Deleteoptionnotapplicabletothisapplication. NOTE2 “CoveredList”;istheListofEquipmentandServicesCoveredBySection2ofTheSecureNetworksAct,availableat https://www.fcc.gov/supplychain/coveredlist References; 1)986446D01CoveredEquipmentv01 https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?switch=P&id=325672 2)FederalRegisterdocument2022-28263publishedon02/06/23 https://www.federalregister.gov/documents/2023/02/06/2022-28263/protecting-against-national-security-threats-to-the-com munications-supply-chain-through-the

ShenzhenZhengyunTechnologyCo.,LTD U.S.AgentLetterofAttestation To:FederalCommunicationsCommission 7435OaklandMillsRoad,Columbia,MD21046,USA Date:07-03-2024 Ref: AttestationStatement–Part 2.911(d)(7)filing FCCID:2A5TA-K50 ShenzhenZhengyunTechnologyCo.,LTDcertifiesthat,asofthedateofthefilingofthe application,THREESTONESMEDIALLCisourdesignatedU.S.agentforserviceofprocessfor theabovereferenceFCCID.Theapplicantacceptstomaintainanagentforserviceofprocessin theUnitedStatesfornolessthanoneyearaftereitherthegranteehaspermanentlyterminatedall marketingandimportationoftheapplicableequipmentwithintheU.S.,ortheconclusionofany Commission-relatedadministrativeorjudicialproceedinginvolvingtheequipment,whicheverislater. TheapplicantfurtheracknowledgesitisourresponsibilitytoinformtheFCCwhenevertheagent informationchanges. THREESTONESMEDIALLCunderstanditistheagent'sobligationtoacceptserviceofprocessin theUnitedStatesformattersrelatedtotheapplicableequipment,andatthephysicalU.S.address andemailaddress. DesignatedU.S.Agent CompanyName: THREESTONESMEDIALLC FRN:0033401761 GC:2A99E Address: 1200BroadwaySt.APT329,LosAngeles,CA90015 Signature: ContactPerson:SijieZhang Tel:+12679093692Email:[email protected] Applicant CompanyName:ShenzhenZhengyunTechnologyCo.,LTD Address: Room202,Floor2,BuildingA,Rongcheng International,24HepingRoad,Qinghua Community,LonghuaDistrict,Shenzhen,China Signature: Email: Contact Person: Wei Zeng FRN: 0032132292 GC: 2A5TA Tel: [email protected]

ShenzhenZhengyunTechnologyCo.,LTD OfficeofEngineeringTechnology FederalCommunicationsCommission 7435OaklandMillsRoad Columbia,MD21046 USA Date:07-03-2024 Subject;RequestforConfidentiality FCCID:2A5TA-K50 ToWhomItMayConcern, PursuanttotheprovisionsoftheCommission’srulesTitle47Sections§0.457and§0.459,we arerequestingtheCommissiontowithholdthefollowingattachment(s)asconfidential documentsfrompublicdisclosureindefinitely. Thesedocumentscontaindetailedsystemandequipmentdescriptionsandareconsideredas proprietaryinformationinoperationoftheequipment.Thepublicdisclosureofthesedocuments mightbeharmfultoourcompanyandwouldgivecompetitorsanunfairadvantageinthemarket. SchematicDiagram BlockDiagram PartsList OperationalDescription Tune-upProcedure Inadditionaltoabovementioneddocuments,inordertocomplywiththemarketingregulations inTitle47CFR§2.803andtheimportationrulesinTitle47CFR§2.1204,whileensuringthat businesssensitiveinformationremainsconfidentialuntiltheactualmarketingofnewly authorizeddevices,werequestShortTermConfidentialityofthefollowingattachment(s); ExternalPhotos TestSetupPhotos InternalPhotos UserManual For45days,pursuanttoPublicNoticeDA04-1705. OR For180dayspursuanttoKDB726920D01. Itisourunderstandingthatallmeasurementtestreports,FCCIDlabelformatand correspondenceduringthecertificationreviewprocesscannotbegrantedasconfidential documentsandthisinformationwillbeavailableforpublicreviewoncethegrantofequipment authorizationisissued. Sincerely, Signature: Name:WeiZeng Title:generalmanager

ShenzhenZhengyunTechnologyCo.,LTD LetterofAuthorization Company:ShenzhenZhengyunTechnologyCo.,LTD Address:Room202,Floor2,BuildingA,RongchengInternational,24 HepingRoad,QinghuaCommunity,LonghuaDistrict,Shenzhen,China ProductName:Wirelessspeaker ModelNumber(s):K50 ProductDescription:Wirelessspeaker WeauthorizeMiCOMLabsInc.,575BoulderCourt,Pleasanton,California94566,USA, toactonourbehalfonallmattersconcerningthecertificationofabovenamed equipment. WedeclarethatMiCOMLabsInc.isallowedtoforwardallinformationrelatedtothe approvalandcertificationofequipmenttotheregulatoryagenciesasrequiredandto discussanyissuesconcerningtheapprovalapplication.Anyandallactscarriedoutby MiCOMLabsonourbehalfshallhavethesameeffectasactsofourown. Signature:Date:07-03-2024 Name:WeiZeng Title:generalmanager Company:ShenzhenZhengyunTechnologyCo.,LTD

FCCID:2A5TA-K50 FCCID:2A5TA-K50 FCCID:2A5TA-K50 FCCID:2A5TA-K50

FCCID:2A5TA-K50 Label Size:10mm*8mm FCCID:2A5TA-K50 LabelLocation

FCCID:2A5TA-K50 FCCID:2A5TA-K50 FCCID:2A5TA-K50 FCCID:2A5TA-K50

RFExposureevaluation FCCID2A5TA-K50 ProductNameWirelessspeaker Model/TypereferenceK50 ExposurecategoryGeneralpopulation/uncontrolledenvironment EUTTypeProductionUnit DeviceTypePortableDevice 1.Reference ANSIC95.1–1999:IEEEStandardforSafetyLevelswithRespecttoHumanExposureto RadioFrequencyElectromagneticFields,3kHzto300GHz. FCCKDBpublication447498D01GeneralRFExposureGuidancev06:MobileandPortable DevicesRFExposureProceduresandEquipmentAuthorizationPolicies. FCCCFR47parEL-GT11.1310:Radiofrequencyradiationexposurelimits. FCCCFR47part22.1093:Radiofrequencyradiationexposureevaluation:portabledevices 2.Requirement AccordingtoKDB447498D01GeneralRFExposureGuidancev06Section4.3.1Standalone SARtestexclusionconsiderations:“UnlessspecificallyrequiredbythepublishedRFexposure KDBprocedures,standalone1-gheadorbodyand10-gextremitySARevaluationforgeneral populationexposureconditions,bymeasurementornumericalsimulation,isnotrequired whenthecorrespondingSARTestExclusionThresholdcondition,listedbelow,issatisfied. Thesetestexclusionconditionsarebasedonsource-basedtime-averagedmaximum conductedoutputpoweroftheRFchannelrequiringevaluation,adjustedfortune-uptolerance, andtheminimumtestseparationdistancerequiredfortheexposureconditions.22The minimumtestseparationdistanceisdeterminedbythesmallestdistancefromtheantenna andradiatingstructuresoroutersurfaceofthedevice,accordingtothehostformfactor, exposureconditionsandplatformrequirements,toanypartofthebodyorextremityofauser orbystander(see5)ofsection4.1).ToqualifyforSARtestexclusion,thetestseparation distancesappliedmustbefullyexplainedandjustifiedbytheoperatingconfigurationsand exposureconditionsofthetransmitterandapplicablehostplatformrequirements,typicallyin theSARmeasurementorSARanalysisreport,accordingtotherequiredpublishedRF exposureKDBprocedures.WhennootherRFexposuretestingorreportingisrequired,a statementofjustificationandcompliancemustbeincludedintheequipmentapproval,inlieuof theSARreport,toqualifyfortheSARtestexclusion.Whenrequired,thedevicespecific conditionsdescribedintheotherpublishedRFexposureKDBproceduresmustbesatisfied beforeapplyingtheseSARtestexclusionprovisions;forexample,handheldPTTtwo-way radios,handsets,laptops&tabletsetc.23” [(max.powerofchannel,includingtune-uptolerance,mW)/(min.testseparationdistance, mm)]·[√f(GHz)]≤3.0for1-gSARand≤7.5for10-gextremitySAR,where: •f(GHz)istheRFchanneltransmitfrequencyinGHz •PoweranddistanceareroundedtothenearestmWandmmbeforecalculation •Theresultisroundedtoonedecimalplaceforcomparison •3.0and7.5arereferredtoasthenumericthresholdsinthestep2below Thetestexclusionsareapplicableonlywhentheminimumtestseparationdistanceis≤50 mmandfortransmissionfrequenciesbetween100MHzand6GHz.Whentheminimumtest separationdistanceis<5mm,adistanceof5mmaccordingto5)insection4.1isappliedto determineSARtestexclusion. Whenoneofthefollowingtestexclusionconditionsissatisfiedforallcombinationsof simultaneoustransmissionconfigurations,furtherequipmentapprovalisnotrequiredto incorporatetransmittermodulesinhostdevicesthatoperateinthemixedmobileandportable hostplatformexposureconditions.Thegranteeisresponsiblefordocumentingthisaccording toClassIpermissivechangerequirements.AntennasthatqualifyforstandaloneSARtest exclusionmustapplytheestimatedstandaloneSARtodeterminesimultaneoustransmission testexclusion. a)The[∑of(thehighestmeasuredorestimatedSARforeachstandaloneantenna configuration,adjustedformaximumtune-uptolerance)/1.6W/kg]+[∑ofMPEratios]is≤ 1.0. b)TheSARtopeaklocationseparationratiosofallsimultaneouslytransmittingantennapairs operatinginportabledeviceexposureconditionsareall≤0.04,andthe[∑ofMPEratios]is ≤1.0. 3.ConductedPeakOutputPower ModulationPacketTypeChannel PeakOutputPower (dBm) PeakOutputPower (mW) GFSKDH5 0 -2.490.56 39 -3.250.47 78 -2.520.56 π/4DQPSK2-DH5 0 -2.210.60 39 -2.990.50 78-2.200.60 8DPSK3-DH5 0 -2.080.62 39 -2.920.51 78 -2.110.62 4.ManufacturingTolerance BR/EDR DH5 ChannelChannel0Channel39Channel78 Target(dBm)-2.0-3.0-2.0 Tolerance±(dB)1.01.01.0 2DH5 ChannelChannel0Channel39Channel78 Target(dBm)-2.0-2.0-2.0 Tolerance±(dB)1.01.01.0 3DH5 ChannelChannel0Channel39Channel78 Target(dBm)-2.0-2.0-2.0 Tolerance±(dB)1.01.01.0 5.EvaluationResult Band/Modef(GHz) Antenna Distance (mm) RFoutputpower SARTest Exclusion Threshold SARTest Exclusion dBmmW BR/EDR2.4805 -1 0.79 0.2502<3.0Yes Remark: 1.Outputpowerincludingtuneuptolerance; 2.Whentheminimumtestseparationdistanceis<5mm,adistanceof5mmaccordingtof)in section4.1isappliedtodetermineSARtestexclusion. 6.Conclusion ThemeasurementresultscomplywiththeFCCLimitper47CFR2.1093fortheuncontrolled RFExposureandSARExclusionThresholdperKDB447498v06. ------Endofthereport------

SPECIFICATION FOR APPROVAL WAN3216F245H0 PART NUMBER ： 8 DESCRIPTION ： Chip Antenna 3216 L Ant 2.45G Type H08 K50 2020/05/ M0DEL： ISSUE DATE： 20 CUSTOMER APPROVED R&D CENTER APPROVAL CHECKED DRAWN Ray Tennyson Snow OneWave Electronic Co., Ltd. 1F, No. 151, Li Gong Street, Beitou District, Taipei City 11261, Taiwan TEL: +886 2 2898-2220 FAX: +886 2 2898-5055 APPLICANT： Shenzhen Zhengyun Technology Co., LTD Room 202, Floor 2, Building A, Rongcheng International, 24 HepingRoad, ADDRESS：Qinghua Community,Longhua District, Shenzhen, China 2/12 ONEWAVE TECHNOLOGY CO., LTD. 3216 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 3.23 ± 0.20 W 1.66 ± 0.20 T 0.45 ± 0.20 P/N: WAN3216F245H08 3/12 ONEWAVE TECHNOLOGY CO., LTD. Part Number Information WAN 3216 F 245 H 08 A B C D E F A Product Series Antenna B Dimension L x W 3.2 x 1.6mm (±0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode PIFA & Single Feeding F Antenna type Type = 08 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN3216F245H08 Central Frequency 2450 MHz Bandwidth 120 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 1.75 dBi Impedance 50 Ohm Operating Temperature -40～+110 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Ni / Au (Leadless) 4/12 ONEWAVE TECHNOLOGY CO., LTD. 2. Recommended PCB Pattern Evaluation Board Dimension 2 nd Evaluation Board Dimension Suggested Matching Circuit 5/12 ONEWAVE TECHNOLOGY CO., LTD. Layout Dimensions in Clearance area( Size=5.9*5.0mm) FootPrint (Unit : mm) ◆ 2 nd Layout Dimensions in Clearance area( Size=8.0*3.0mm) Matching Circuit 50 ohm transmission Line 6/12 ONEWAVE TECHNOLOGY CO., LTD. 3. Measurement Results Return Loss 7/12 ONEWAVE TECHNOLOGY CO., LTD. 3D Radiation Pattern 2D Radiation Pattern @2400MHz @2450MHz @2500MHz Z Y X 8/12 ONEWAVE TECHNOLOGY CO., LTD. Efficiency Peak Gain Directivity 2400MHz 81.46% 1.67 dBi 2.56 dBi 2450MHz 84.75% 1.75 dBi 2.46 dBi 2500MHz 82.68% 1.70 dBi 2.52 dBi Chamber Coordinate System 9/12 ONEWAVE TECHNOLOGY CO., LTD. 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10 ± 0.5 sec. 60 sec . . T E M P ( °C ) 150 °C 2 6 0 °C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C 10/12 ONEWAVE TECHNOLOGY CO., LTD. 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 11/12 ONEWAVE TECHNOLOGY CO., LTD. 6.Packaging Information Tape Specification: Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 13.5±0.5 178±2 3000 12/12 ONEWAVE TECHNOLOGY CO., LTD. 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidi…

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ReportNo.:CISRR240617132 —1— AppendixA ReportNo.:CISRR240617132 FCCID:2A5TA-K50 ProductName:Wirelessspeaker ModelNo.:K50 TestEngineer:LucasHuang Supervisedby:RoryHuang ReportNo.:CISRR240617132 —2— ConductedPeakOutputPower TestResult ModulationPacketTypeChannel PeakOutput Power (dBm) PeakOutput Power (mW) Limit (dBm) Result GFSKDH5 0-2.490.56 30 PASS 39-3.250.47PASS 78-2.520.56PASS π/4DQPSK2-DH5 0-2.210.60 20.97 PASS 39-2.990.50PASS 78-2.200.60PASS 8DPSK3-DH5 0-2.080.62PASS 39-2.920.51PASS 78-2.110.62PASS TestGraphs PeakOutputPower GFSK_Channel0 PeakOutputPower GFSK_Channel39 PeakOutputPower GFSK_Channel78 PeakOutputPower π/4DQPSK_Channel0 ReportNo.:CISRR240617132 —3— PeakOutputPower π/4DQPSK_Channel39 PeakOutputPower π/4DQPSK_Channel78 PeakOutputPower 8DPSK_Channel0 PeakOutputPower 8DPSK_Channel39 PeakOutputPower 8DPSK_Channel78 ReportNo.:CISRR240617132 —4— 99%Bandwidth TestResult ModulationChannelCenterFrequency(MHz)99%BW(MHz) GFSK 024020.9068 3924410.9216 7824800.8964 π/4DQPSK 024021.2600 3924411.2326 7824801.2264 8DPSK 024021.2440 3924411.2302 7824801.2188 TestGraphs GFSK_DH5_Channel0π/4DQPSK_2-DH5_Channel0 GFSK_DH5_Channel39π/4DQPSK_2-DH5_Channel39 ReportNo.:CISRR240617132 —5— GFSK_DH5_Channel78π/4DQPSK_2-DH5_Channel78 8DPSK_3-DH5_Channel08DPSK_3-DH5_Channel39 8DPSK_3-DH5_Channel78 ReportNo.:CISRR240617132 —6— 20dBBandwidth TestResult ModulationChannelCenterFrequency(MHz)20dBBandwidth(MHz) GFSK 02402MHz1.010 392441MHz1.030 782480MHz1.030 π/4DQPSK 02402MHz1.350 392441MHz1.330 782480MHz1.310 8DPSK 02402MHz1.290 392441MHz1.310 782480MHz1.310 TestGraphs GFSK_DH5_Channel0GFSK_DH5_Channel39 GFSK_DH5_Channel78π/4DQPSK_2-DH5_Channel0 ReportNo.:CISRR240617132 —7— π/4DQPSK_2-DH5_Channel39π/4DQPSK_2-DH5_Channel78 8DPSK_3-DH5_Channel08DPSK_3-DH5_Channel39 8DPSK_3-DH5_Channel78 ReportNo.:CISRR240617132 —8— CarrierFrequenciesSeparation TestResult ModulationPacket LeftCenter frequency (MHz) RightCenter frequency (MHz) Hopping Frequency Separation (MHz) Limit(MHz)Result GFSKDH52440.02732441.16531.13791.03PASS π/4DQPSK2-DH52440.03492440.99630.96150.9PASS 8DPSK3-DH52440.0192441.02151.00260.86PASS TestGraphs GFSKπ/4DQPSK 8DPSK ReportNo.:CISRR240617132 —9— ConductedOutOfBandEmission TestResult Non-Hopping ModulationPacketChannel OOB Emission Frequency (MHz) OOB Emission Level (dBm) Limit (dBm) OverLimit (dB) Result GFSKDH5 0 2398.08-51.643-22.59-29.053PASS 2400.00-52.086-22.59-29.496PASS 7206.00-39.237-22.59-16.647PASS 399920.20-39.749-23.37-16.379PASS 78 2483.50-53.452-22.74-30.712PASS 9920.20-39.465-22.74-16.725PASS π/4DQPSK2-DH5 0 2400.00-43.442-22.69-20.752PASS 7205.96-39.280-22.69-16.590PASS 399920.20-40.126-23.54-16.586PASS 78 2483.50-52.173-22.86-29.313PASS 9920.20-39.862-22.86-17.002PASS 8DPSK3-DH5 0 2400.00-42.645-22.61-20.035PASS 9920.20-40.641-22.61-18.031PASS 399920.20-39.637-23.61-16.027PASS 78 2483.50-52.243-23.02-29.223PASS 9920.20-40.253-23.02-17.233PASS Hopping ModulationPacketChannel OOB Emission Frequency (MHz) OOB Emission Level (dBm) Limit (dBm) OverLimit (dB) Result GFSKDH5 Hopping 2396.87-50.442-22.61-27.832PASS 2400.00-52.532-22.61-29.922PASS 2483.50-52.366-22.93-29.436PASS 2396.09-51.085-23.0-28.085PASS 2400.00-52.057-23.0-29.057PASS 2483.50-51.570-22.76-28.810PASS π/4DQPSK2-DH5 2400.00-47.092-22.73-24.362PASS 2483.50-51.863-23.13-28.733PASS 2400.00-45.307-22.71-22.597PASS 2483.50-52.384-22.87-29.514PASS 8DPSK3-DH5 2400.00-44.295-22.61-21.685PASS 2483.50-51.467-22.93-28.537PASS 2400.00-42.942-22.68-20.262PASS 2483.50-50.839-23.27-27.569PASS TestGraphs ReportNo.:CISRR240617132 —10— 30.0MHz-25000.0MHz GFSK_DH5_Channel0 30.0MHz-25000.0MHz π/4DQPSK_2-DH5_Channel0 OutOfBandEmission GFSK_DH5_Channel0 OutOfBandEmission π/4DQPSK_2-DH5_Channel0 30.0MHz-25000.0MHz GFSK_DH5_Channel39 30.0MHz-25000.0MHz π/4DQPSK_2-DH5_Channel39 ReportNo.:CISRR240617132 —11— OutOfBandEmission GFSK_DH5_Channel39 OutOfBandEmission π/4DQPSK_2-DH5_Channel39 30.0MHz-25000.0MHz GFSK_DH5_Channel78 30.0MHz-25000.0MHz π/4DQPSK_2-DH5_Channel78 OutOfBandEmission GFSK_DH5_Channel78 OutOfBandEmission π/4DQPSK_2-DH5_Channel78 ReportNo.:CISRR240617132 —12— 30.0MHz-25000.0MHz 8DPSK_3-DH5_Channel0 OutOfBandEmission 8DPSK_3-DH5_Channel0 30.0MHz-25000.0MHz 8DPSK_3-DH5_Channel39 OutOfBandEmission 8DPSK_3-DH5_Channel39 30.0MHz-25000.0MHz 8DPSK_3-DH5_Channel78 OutOfBandEmission 8DPSK_3-DH5_Channel78 ReportNo.:CISRR240617132 —13— OutOfBandEmission(Left) GFSK_DH5_ChannelHopping OutOfBandEmission(Left) π/4DQPSK_2-DH5_ChannelHopping OutOfBandEmission(Right) GFSK_DH5_ChannelHopping OutOfBandEmission(Right) π/4DQPSK_2-DH5_ChannelHopping OutOfBandEmission(Left) GFSK_DH5_ChannelHopping OutOfBandEmission(Left) π/4DQPSK_2-DH5_ChannelHopping ReportNo.:CISRR240617132 —14— OutOfBandEmission(Right) GFSK_DH5_ChannelHopping OutOfBandEmission(Right) π/4DQPSK_2-DH5_ChannelHopping OutOfBandEmission(Left) 8DPSK_3-DH5_ChannelHopping OutOfBandEmission(Right) 8DPSK_3-DH5_ChannelHopping OutOfBandEmission(Left) 8DPSK_3-DH5_ChannelHopping OutOfBandEmission(Right) 8DPSK_3-DH5_ChannelHopping ReportNo.:CISRR240617132 —15— DutyCycle TestResult ModulationPacketsChannel OnTime (ms) Period (ms) Duty Cycle(%) Duty Cycle (linear) Duty Cycle Factor (dB) 1/T GFSKDH5 02.8883.74877.050.77051.13230.35 392.8863.74877.000.77001.13510.35 782.8863.74877.000.77001.13510.35 π/4DQPSK2-DH5 02.8923.74877.160.77161.12610.35 392.8903.74877.110.77111.12890.35 782.8903.74877.110.77111.12890.35 8DPSK3-DH5 02.8943.74877.210.77211.12330.35 392.8943.74877.210.77211.12330.35 782.8943.74877.210.77211.12330.35 TestGraphs GFSK(DH5)_Channel0 ReportNo.:CISRR240617132 —16— GFSK(DH5)_Channel39 GFSK(DH5)_Channel78 ReportNo.:CISRR240617132 —17— π/4DQPSK(2-DH5)_Channel0 π/4DQPSK(2-DH5)_Channel39 ReportNo.:CISRR240617132 —18— π/4DQPSK(2-DH5)_Channel78 8DPSK(3-DH5)_Channel0 ReportNo.:CISRR240617132 —19— 8DPSK(3-DH5)_Channel39 8DPSK(3-DH5)_Channel78 ReportNo.:CISRR240617132 —20— DwellTime TestResult ModulationPacketChannel PulseWidth (ms) Numberof Pulsesin 31.6 seconds DwellTime (ms) Limit(ms)Result…

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ReportNo.:CISRR240617132 Page:1of30 TESTREPORT ReportNo.:CISRR240617132 ProjectNo.CISR240617132 FCCID2A5TA-K50 Applicant:ShenzhenZhengyunTechnologyCo.,LTD Address:Room202,Floor2,BuildingA,RongchengInternational,24 HepingRoad,QinghuaCommunity,LonghuaDistrict,Shenzhen,China ManufacturerShenzhenZhengyunTechnologyCo.,LTD AddressRoom202,Floor2,BuildingA,RongchengInternational,24 HepingRoad,QinghuaCommunity,LonghuaDistrict,Shenzhen,China ProductName:Wirelessspeaker TradeMark:-- Model/Typereference:K50 ListedModel(s):-- Standard:Part15SubpartCSection15.247 Testdate:June17,2023~July05,2024 IssuedateJuly05,2024 Testresult:Complied Preparedby:RoryHuangApprovedby:GenryLong Thetestresultsrelateonlytothetestedsamples. ThetestreportshouldnotbereproducedexceptinfullwithoutthewrittenapprovalofShenzhenBangce TestingTechnologyCo.,Ltd. ReportNo.:CISRR240617132 Page:2of30 Contents 1.REPORTVERSION.........................................................................................................................................3 2.SUMMARYOFTESTRESULT.......................................................................................................................4 3.SUMMARY.....................................................................................................................................................5 3.1.ProductDescription....................................................................................................................................5 3.2.RadioSpecificationDescription................................................................................................................5 3.3.ModificationofEUT.....................................................................................................................................6 3.4.TestingSite...................................................................................................................................................6 3.5.FieldStrengthCalculation..........................................................................................................................6 3.6.DISTURBANCECalculation........................................................................................................................6 4.TESTCONFIGURATION.............................................................................................................................7 4.1.Testfrequencylist.......................................................................................................................................7 4.2.Testmode.....................................................................................................................................................7 4.3.Supportunitusedintestconfigurationandsystem...............................................................................8 4.4.Testsampleinformation.............................................................................................................................8 4.5.Testingenvironmentalcondition...............................................................................................................8 4.6.Statementofthemeasurementuncertainty.............................................................................................8 4.7.EquipmentUsedduringtheTest...............................................................................................................9 5.TESTCONDITIONSANDRESULTS.....................................................................................................10 5.1.AntennaRequirement...............................................................................................................................10 5.2.ACConductedEmission...........................................................................................................................11 5.3.PeakOutputPower....................................................................................................................................14 5.4.20dBBandwidth........................................................................................................................................15 5.5.99%OccupiedBandwidth.........................................................................................................................16 5.6.CarrierFrequenciesSeparation...............................................................................................................17 5.7.HoppingChannelNumber........................................................................................................................18 5.8.DwellTime..................................................................................................................................................19 5.9.DutyCycleCorrectionFactor(DCCF).....................................................................................................20 5.10.PseudorandomFrequencyHoppingSequence...................................................................................21 5.11.ConductedBandedgeandSpuriousEmission...................................................................................22 …

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