2A5X4-TD-02SMART AUDIO SPORT SUNGLASSES GENERATION II

FCC ID LABEL: Ca. 8mm x 20mm Label Location FCC ID: 2A5X4‐TD‐02

FCC RF Exposure EUT Description: SMART AUDIO SPORT SUNGLASSES GENERATION II Model No.: TD-02 FCC ID: 2A5X4-TD-02 1. Limits According to KDB 447498 D01 General RF Exposure Guidance v06 The 1‐g and 10‐g SAR test exclusion thresholds for 100 MHz to 6 GHz at test separation distances ≤50 mm are determined by: [(max power of channel, including tune‐up tolerance, mW)/(min. test separation distance, mm)]·[√f(GHz)]≤3.0 for 1‐g SAR and ≤ 7.5 for 10‐g extremity SAR Where: Result=P/D*√F F= the RF channel transmit frequency in GHz P= Maximum turn‐up power in mw D= Min. test separation distance in mm 2. Test Result of RF Exposure Evaluation Frequency (MHz) Output power (dBm) Tune Up Power (dBm) Max Tune Up power (dBm/mW) Min test separation distance (mm) ResultLimit (mW/cm 2 ) SAR Test Exclusion 2402 -0.89 -1±1(0) 1.000 5 0.31 3.0 Pass Note: PK Output power= conducted power. Conducted power see the test report HK2407013521-E, antenna gain=2.36dBi Per KDB 447498 D01, when the minimum test separation distance is < 5 mm, a distance of 5 mm is applied to determine RF Exposure test exclusion. The test exclusion threshold is 0.31 which is ≤ 3, RF Exposure testing is not required. Note: Exclusion Thresholds Results=[(max. power of channel, including tune-up tolerance, mW)/(min. test separation distance, mm)] ·[√f (GHz)] f(GHz) is the RF channel transmit frequency in GHz Distance=5mm

SMD
CERAMIC
ANTENNA
Data
Sheet CS -2450-21 -C For 2400-2483MH z 2.0x1.2mm [EIA2012] HZ2012WC02 Shenzhen Haizhe Technology Co., Ltd. 典型特征 T y p i cal Characterist i cs ■ 重量轻，结构紧凑 Light weight, compact ■ 宽带大，低成本 Wide bandwidth, low cost ■ 高增益内置天线 Built-in antenna with high gain ■ 工作温度 Operating Temp. : -40°C~+85°C 电气特性 Electrical Characteristics per line(TA=25°C) 2400~2483 MHz Lin ear dB i 72. 5% % 50 频带 Frequency Band 极 化 P o l a riz a t i o n * 峰 值 增 益 P eak Ga in * 峰 值 效 率 P ea k Effi c i e n c y 阻 抗 Im p e n da n ce 参数Parameter 规格Specification 单位Units 特征 Feature 应用 Application ■ 蓝牙,无线局域网,移动电视 Bluetooth, Wireless LAN, Mobile TV ■ 家用射频系统Home RF system, etc *测 试 条 件 ： 测 试 板 尺 寸 9 8 × 65 mm ； 匹 配 电 路 ： π 型 匹 配 电 路 。 T est co n d i t i o n : T est boa r d s iz e 9 8 * 65 m m ; M a t c hin g c ir cu i t: P i m a t c hin g c ir cu i t w il l be re q u ir ed Fi g .1 驻 波 比 V S WR W Chip Antenna CS-2450-21-C 2.36 3D模式 3D Gain Pattern (2400 MHz) 增益模式是在 暗 室 进 行 测 试 的 ， 被 测 件 放 在 桌 肩 位 置 ， 用 标 准 的 喇 叭 天 线 和 矢 量 网 络 分 析 仪 来 收 集 数 据 。 Th e Ga i n p a tt e rn i s measu r ed i n FAR - fi e l d c h a m be r . D U T i s p l aced o n e tab l e o f r o t a t o r , a s t a n da r d ho r n a n t e nn a a n d Vec t o r N e t w o rk t o co ll ect da t a . 辐射模式 Radiation Pattern Fig.2 暗室示意图 FAR-field Chamber Chip Antenna t h An a l y z e r i s uesd 3D模式 3D Gain Pattern (2450 MHz) 3D模式 3D Gain Pattern (2500 MHz) Chip Antenna 1. 30±3 minutes at -40°C±5°C, 2. Convert to +105°C (5 minutes) 3. 30±3 minutes at +105°C±5°C, 4. Convert to -40°C (5 minutes) 5. Total 100 continuous cycles 项目Item 环境Condition 规格Specification 热冲击 Thermal shock No apparent damage Fulfill the electrical spec. after test. 抗湿性 Humidity resistance No apparent damage Fulfill the electrical spec. after test. 1. Humidity: 85% R.H. 2. Temperature: 85±5°C 3. Time: 1000 hours. The dipped surface of the terminal shall be at least 95% covered with solder after dipped in solder bath of 245±5°C for 3±1 seconds. No apparent damage 焊锡性 Solderability 耐焊接热性 Soldering heat resistance No apparent damage 1. Solder bath temperature : 260±5°C 2. Bathing time: 10±1 seconds 低温电阻 Low temperature resistance No apparent damage Fulfill the electrical spec. after test. 1. Temperature: -40°C±5°C 2. Time: 1000 hours. No apparent damage Fulfill the electrical spec. after test. 1. Temperature: 150°C±5°C 2. Time: 1000 hours. 耐高温性 High temperature resistance 推荐回流焊接曲线Recommended Reflow Solder curve (2) 储存环境 Storage Condition (a)仓库：温度应在0～30°C之间，湿度应小于60%湿度，产品应在交货之日起1年内使用。 At warehouse: The temperature should be within 0 ~ 30°C and humidity should be less than 60% RH.The product should be used within 1 year from the time of elivery. (b)在板：温度应在40～85°C之间，湿度应小于85%湿度。On board: The temperature should be within -40~85°C and humidity should be less than 85% RH. (3) 工作环境温度 Operating Temperature Range 工作温度范围：-40°C to +85°C。 Operating temperature range : -40°C to +85°C. Chip Antenna 推荐焊&Evaluation Board Chip Antenna (1) 电烙铁的使用 Soldering Gun Procedure 以下注意事项仅针对使用电 烙铁进行个别器件更换。 Note the follows, in cas e of using solder gun for replacement. (a) 使用小于30W的电烙铁 ，温度不高于350°C，焊接时间小于3 秒。 The tip temperature m ust be less than 350°C for the period within 3 seconds by using soldering g un under 30 W. (b) 烙铁不可直接接触器件本 体。 The soldering gun tip s hall not touch this product dir ectly. (2) 焊锡量 Soldering Volume 注意焊接过程中过多的焊锡 量会损害器件本体。 N ote that exces s of soldering vo lume will easily g et crack the bod y of this product . 产 品尺寸 Product D imension 1 应用环境Application Guide 包装信息Package Information A B C D E F L W 8.00±0.3 3.50± 0.051.75±0.1 2.00±0.054.00±0.1 1.50±0.1 2.30± 0.1 1.55± 0.1 编码规则 Par t Number System CS - 2450 - 21-C External DimensionsL*W(mm)2.0*1.2 Central Frequency2450MHz Product Series: Chip Antenna 丝印 Marking Chip Antenna 订货信息Order Information 设备 Device Package 净重 Net Weight 运送式 Carrier 量 Quantity 认证 HSF Status CS-2450 -21-C 2012 Tape & Reel 5000pcs RoHS compliant 版本信息 Revision history 日期/Date 本/Revision 本描述/Description of changes First Version The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order. Chip Antenna 2021-11-5 0.0014g 1.0 2022-04-22.0 2023-12- Second Version 132.1 Modify PCB Layout

Page 1 of 48 Report No.: HK2407013521-E FCC Test Report Test Report On Behalf of WENZHOU TIDE-OPTICAL CO., LTD For SMART AUDIO SPORT SUNGLASSES GENERATION II Model No.: TD-02 FCC ID: 2A5X4-TD-02 Prepared For: WENZHOU TIDE-OPTICAL CO., LTD Floor2-3, Building2, No.13 Gaoxiang Road, Xinqiao Street, High-Tech Zone, Ouhai District, Wenzhou City, Zhejiang Province, China Prepared By: Shenzhen HUAK Testing Technology Co., Ltd. 1-2/F., Building B2, Junfeng Zhongcheng Zhizao Innovation Park, Heping, Fuhai Street, Bao’an District, Shenzhen, Guangdong, China Date of Test: Jul. 01, 2024 ~ Jul. 11, 2024 Date of Report: Jul. 11, 2024 Report Number: HK2407013521-E Page 2 of 48 Report No.: HK2407013521-E Test Result Certification Applicant’s Name .................. : WENZHOU TIDE-OPTICAL CO., LTD Address .................................. : Floor2-3, Building2, No.13 Gaoxiang Road, Xinqiao S treet, High-Tech Zone, Ouhai District, Wenzhou City, Zhejiang Province, China Manufacturer's Name ........... : WENZHOU TIDE-OPTICAL CO., LTD Address .................................. : Floor2-3, Building2, No.13 Gaoxiang Road, Xinqiao Street, High-Tech Zone, Ouhai District, Wenzhou City, Zhejiang Province, China Product Description Trade Mark ............................. : N/A Product Name ........................... : SMART AUDIO SPORT SUNGLASSES GENERATION II Model and/or Type Reference...: TD-02 Standards .............................. : 47 CFR FCC Part 15 Subpart C 15.247 This publication may be reproduced in whole or in part for non-commercial purposes as long as the Shenzhen HUAK Testing Technology Co., Ltd. is acknowledged as copyright owner and source of the material. Shenzhen HUAK Testing Technology Co., Ltd. takes no responsibility for and will not assume liability for damages resulting from the reader's interpretation of the reproduced material due to its placement and context. Date of Test .................................... . Date (s) of Performance of Tests .... . Jul. 01, 2024 ~ Jul. 11, 2024 Date of Issue .................................... Jul. 11, 2024 Test Result ........................................ Pass Testing Engineer Len Liao Technical Manager Sliver Wan Authorized Signatory Jason Zhou Page 3 of 48 Report No.: HK2407013521-E Table of Contents Page 1. Summary .............................................................................................................................................................. 5 1.1. Test Standards ......................................................................................................................................................... 5 1.2. Test Description ....................................................................................................................................................... 5 1.3. Information of the Test Laboratory ......................................................................................................................... 6 1.4. Statement of the Measurement Uncertainty .......................................................................................................... 6 2. General Information ............................................................................................................................................. 7 2.1. Environmental Conditions ....................................................................................................................................... 7 2.2. General Description of EUT ..................................................................................................................................... 7 2.3. Description of Test Modes and Test Frequency ....................................................................................................... 8 2.4. Equipments Used during the Test ............................................................................................................................ 9 2.5. Related Submittal(s) / Grant (s) ............................................................................................................................. 10 2.6. Modifications ........................................................................................................................................................ 10 2.7. Description of Test Setup ....................................................................................................................................... 10 2.8. Description of Support Units ................................................................................................................................. 11 3. Test Conditions and Results ................................................................................................................................. 12 3.1. Conducted Emissions Test ..................................................................................................................................... 12 3.2. Radiated Emissions and Band Edge ....................................................................................................................... 15 3.3. Maximum Peak Conducted Output Power ............................................................................................................ 26 3.4. 20dB Bandwidth .................................................................................................................................................... 27 3.5. Frequency Separation ........................................................................................................................................... 30 3.6. Number of Hopping Frequency ............................................................................................................................. 32 3.7. Time of Occupancy (Dwell Time) .......................................................................................................................... 34 3.8. Out‐of‐Band Emissions ...........................…

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