2A7SU-S870Bone conduction headphones

跟着我 开启使用吧 售后卡 产品型号 姓名 电话 地址 名称 地址 日期 订单号 用户信息 销售信息 故障描述 请详尽填写此产品售后单，以确保我们能为您提供售后服务。寄回时请附带 需售后的产品、购买凭证、本说明书和产品包装。 合 格 证 Q.C.Passed 中国制造 Follow me Let's start using it Product model name telephone address name address date Order number User information Sales information Fault description Please fill out this product after-sales order to ensure that we can provide you withafter-sales service. Please enclose it when you return itProducts to be sold, purchasec ertificates, this manual and product packaging. After-sale card Q.C.Passed Made in China C E R T I F C A T E 83.89 px 110 px

CoveredEquipmentAttestationLetter ForCertificationServiceintheUSA FederalCommunicationsCommission EquipmentAuthorizationDivision,ApplicationProcessingBranch 7435OaklandMillsRoad Columbia,MD21048 Towhomitmayconcern PursuanttoSection2.911(d)(5)(i)-(ii)oftheCommission’sRules(47C.F.R.)weattestas followsfortheproductlistedbelow: FCCIDModelname 2A7SU-S870S870,S870-A,870-B,S870-C,S870-D,S870- E We, Applicant CompanyName:ShenzhenSantuoOriginalTechnologyCo., Ltd. Address:802,8thFloor,BuildingC10,Fuyuan IndustrialCity,ZhoushiRoad,Hangcheng Street,Bao'anDistrict, Shenzhen,518100,China Phone:13510969021 certifythattheequipmentforwhichauthorizationissoughtisnot“covered”equipment prohibitedfromreceivinganequipmentauthorizationpursuanttosection2.903oftheFCC rules.Thisincludesthecybersecurityandanti-virussoftwareproducedorprovidedby KasperskyLab,Inc.oranyofistsuccessorsandassignees. Wecertifythat,asofthedateofthefilingoftheapplication,theapplicantisnotidentified ontheCoveredListasanentityproducing“covered”equipment. Ifyouhaveanyquestions,pleasefeelfreetocontactusattheaddressshownbelow. Sincerely, 2025-08-14 SignatureDate PrintedNameofSignee:TonyChen Company:ShenzhenSantuoOriginal TechnologyCo.,Ltd. Phone:13510969021 Email:[email protected] Address:802,8thFloor,BuildingC10, FuyuanIndustrialCity,ZhoushiRoad, HangchengStreet,Bao'anDistrict, Shenzhen,518100,China Fax:N/A

ShenzhenSantuoOriginalTechnologyCo.,Ltd. 802,8thFloor,BuildingC10,FuyuanIndustrialCity,ZhoushiRoad,Hangcheng Street,Bao'anDistrict,Shenzhen,518100,China Date:2025-08-14 FCCID:2A7SU-S870 ModelNumber: S870,S870-A,870-B,S870-C,S870-D,S870-E To:FederalCommunicationCommission AuthorizationandEvaluationDivision7435OaklandMillsRoad Columbia,MD21048 ToWhomItMayConcern, We,ShenzhenSantuoOriginalTechnologyCo.,Ltd.herebydeclarethatourproduct (Boneconductionheadphones）ModelNumber:S870,S870-A,870-B,S870-C,S870-D, S870-E,theyare electricalidentical,theSchematic,PCBlayout,structureandsoftwarearesame, onlythedifferenceisthemodelnameformarketpurpose. Sincerely, (Signed) Name/Title:TonyChen/president Company:ShenzhenSantuoOriginalTechnologyCo.,Ltd. Address:802,8thFloor,BuildingC10,FuyuanIndustrialCity,ZhoushiRoad,Hangcheng Street,Bao'anDistrict,Shenzhen,518100,China Phone:13510969021 FaxNumber:N/A E-Mail:[email protected]

ConfidentialityRequestLetter ForCertificationServiceintheUSA FederalCommunicationCommission EquipmentAuthorizationDivision,ApplicationProcessingBranch 7435OaklandMillsRoad Columbia,MD21048 Towhomitmayconcern PursuanttoParagraphs§0.457and0.459oftheCommission’sRules(47C.F.R.)andSection §552(b)(4)oftheFreedomofInformationAct,werequestconfidentialityforthe documentationofthefollowingproducts: FCCIDModelname 2A7SU-S870S870,S870-A,870-B,S870-C,S870-D,S870-E Fortheproductslistedabove,werequestpermanentconfidentialityforallapplicable exhibitsasthereare:  theOperationalDescription  theBlockDiagram theSchematics Theabovelistedexhibitscontaintradesecretsandproprietaryinformationthatcouldbeof benefittoourcompetitors. Ifyouhaveanyquestions,pleasefeelfreetocontactusattheaddressshownbelow. Sincerely, 2025-08-14 SignatureDate PrintedNameofSignee/Title:TonyChen/president Company:ShenzhenSantuoOriginalTechnologyCo.,Ltd. Address:802,8thFloor,BuildingC10,FuyuanIndustrialCity,ZhoushiRoad,Hangcheng Street,Bao'anDistrict,Shenzhen,518100,China Phone:13510969021 Fax:N/A Email:[email protected]

ReportNo.:CISRR250730042A Page 43 of 62 7.EXTERNALANDINTERNALPHOTOS 7.1.ExternalPhotos ReportNo.:CISRR250730042A Page 44 of 62 ReportNo.:CISRR250730042A Page 45 of 62

FCCID:2A7SU-S870 Label Size:10mm*8mm FCCID:2A7SU-S870 LabelLocation

ReportNo.:CISRR250730042A Page 46 of 62 7.2.InternalPhotos ReportNo.:CISRR250730042A Page 47 of 62 ANT

RFExposureevaluation FCCID2A7SU-S870 ProductNameBoneconductionheadphones ModelNo.S870 ListedModel(s)S870-A,870-B,S870-CS870-D,S870-E ExposurecategoryGeneralpopulation/uncontrolledenvironment EUTTypeProductionUnit DeviceTypePortableDevice 1.Reference ANSIC95.1–3999:IEEEStandardforSafetyLevelswithRespecttoHumanExposureto RadioFrequencyElectromagneticFields,3kHzto300GHz. FCCKDBpublication447498D01GeneralRFExposureGuidancev06:MobileandPortable DevicesRFExposureProceduresandEquipmentAuthorizationPolicies. FCCCFR47part11.1310:Radiofrequencyradiationexposurelimits. FCCCFR47part22.1093:Radiofrequencyradiationexposureevaluation:portabledevices 2.Requirement AccordingtoKDB447498D01GeneralRFExposureGuidancev06Section4.3.1Standalone SARtestexclusionconsiderations:“UnlessspecificallyrequiredbythepublishedRFexposure KDBprocedures,standalone1-gheadorbodyand10-gextremitySARevaluationforgeneral populationexposureconditions,bymeasurementornumericalsimulation,isnotrequired whenthecorrespondingSARTestExclusionThresholdcondition,listedbelow,issatisfied. Thesetestexclusionconditionsarebasedonsource-basedtime-averagedmaximum conductedoutputpoweroftheRFchannelrequiringevaluation,adjustedfortune-uptolerance, andtheminimumtestseparationdistancerequiredfortheexposureconditions.22The minimumtestseparationdistanceisdeterminedbythesmallestdistancefromtheantenna andradiatingstructuresoroutersurfaceofthedevice,accordingtothehostformfactor, exposureconditionsandplatformrequirements,toanypartofthebodyorextremityofauser orbystander(see5)ofsection4.1).ToqualifyforSARtestexclusion,thetestseparation distancesappliedmustbefullyexplainedandjustifiedbytheoperatingconfigurationsand exposureconditionsofthetransmitterandapplicablehostplatformrequirements,typicallyin theSARmeasurementorSARanalysisreport,accordingtotherequiredpublishedRF exposureKDBprocedures.WhennootherRFexposuretestingorreportingisrequired,a statementofjustificationandcompliancemustbeincludedintheequipmentapproval,inlieuof theSARreport,toqualifyfortheSARtestexclusion.Whenrequired,thedevicespecific conditionsdescribedintheotherpublishedRFexposureKDBproceduresmustbesatisfied beforeapplyingtheseSARtestexclusionprovisions;forexample,handheldPTTtwo-way radios,handsets,laptops&tabletsetc.23” [(max.powerofchannel,includingtune-uptolerance,mW)/(min.testseparationdistance, mm)]·[√f(GHz)]≤3.0for1-gSARand≤7.5for10-gextremitySAR,where: •f(GHz)istheRFchanneltransmitfrequencyinGHz •PoweranddistanceareroundedtothenearestmWandmmbeforecalculation •Theresultisroundedtoonedecimalplaceforcomparison •3.0and7.5arereferredtoasthenumericthresholdsinthestep2below Thetestexclusionsareapplicableonlywhentheminimumtestseparationdistanceis≤50mm andfortransmissionfrequenciesbetween100MHzand6GHz.Whentheminimumtest separationdistanceis<5mm,adistanceof5mmaccordingto5)insection4.1isappliedto determineSARtestexclusion. Whenoneofthefollowingtestexclusionconditionsissatisfiedforallcombinationsof simultaneoustransmissionconfigurations,furtherequipmentapprovalisnotrequiredto incorporatetransmittermodulesinhostdevicesthatoperateinthemixedmobileandportable hostplatformexposureconditions.Thegranteeisresponsiblefordocumentingthisaccording toClassIpermissivechangerequirements.AntennasthatqualifyforstandaloneSARtest exclusionmustapplytheestimatedstandaloneSARtodeterminesimultaneoustransmission testexclusion. a)The[∑of(thehighestmeasuredorestimatedSARforeachstandaloneantenna configuration,adjustedformaximumtune-uptolerance)/1.6W/kg]+[∑ofMPEratios]is≤ 1.0. b)TheSARtopeaklocationseparationratiosofallsimultaneouslytransmittingantennapairs operatinginportabledeviceexposureconditionsareall≤0.04,andthe[∑ofMPEratios]is≤ 1.0. 3.ConductedPeakOutputPower ModulationPacketTypeChannel PeakOutput Power (dBm) PeakOutput Power (mW) GFSKDH5 00.811.21 39-0.560.88 78-0.890.81 π/4DQPSK2-DH5 02.861.93 391.571.44 781.001.26 8DPSK3-DH5 03.612.30 391.911.55 781.811.52 4.ManufacturingTolerance DH5 ChannelChannel0Channel39Channel78 Target(dBm)000 Tolerance±(dB)1.01.01.0 2-DH5 ChannelChannel0Channel39Channel78 Target(dBm)211 Tolerance±(dB)1.01.01.0 3-DH5 ChannelChannel0Channel39Channel78 Target(dBm)311 Tolerance±(dB)1.01.01.0 5.EvaluationResult Band/Modef(GHz) Antenna Distance (mm) RFoutputpower SARTest Exclusion Threshold SARTest Exclusion dBmmW BR/EDR2.402542.510.7786<3.0Yes Remark: 1.Outputpowerincludingtuneuptolerance; 2.Whentheminimumtestseparationdistanceis<5mm,adistanceof5mmaccordingtof)in section4.1isappliedtodetermineSARtestexclusion. 6.Conclusion ThemeasurementresultscomplywiththeFCCLimitper47CFR2.1093fortheuncontrolled RFExposureandSARExclusionThresholdperKDB447498D01V06. ------Endofthereport------

2.4GHz 3216 Chip Antenna: RANT3216F245X07 _ Application: WLAN,802.11b/g,Bluetooth,WLAN,etc... Features SMD,highreliability,ultraImpact,Omni-directional... PartnumberInformation RANT3216F24507 (A)(B)(C)(D)(F X (E)) ElectricalSpecification DimensionandTerminalConfiguration No.TerminalName 1Feeding/GNG 2GND/Feeding (A)ProductTypeChipAntenna (B)SizeCode 3.2x1.6mm( ± 0.2mm) (C)MaterialHighKmaterial (D)Frequency2.4~2.5GHz (E)FeedingmodePIFA&SingleFeeding (F)AntennatypeType=07 WorkingFrequencyRange2400~2500MHz Bandwidth120MHz(Min.) PeakGain1.7dBi(Typ.) Impedance50Ohm Returnloss10dB(Min) PolarizationLinear AzimuthBeamwidthOmni-directional OperationTemperature( °C )-40~85 °C ResistancetoSolderingHeats 10sec.(@280 °C ) TerminationNi/Au(Leadless) Dimension(mm) L 3.20±0.20 W 1.60±0.20 T 0.85±0.20 Manufacture:RAINInternationalTechnologyCo.,Ltd. Add:Building 709, Building F, Yuxing ScienceandTechnologyIndustrial Park, NanchangThirdIndustrial Zone, Xixiang Street, Bao'an District, Shenzhen 2.4GHz 3216 Chip Antenna: RANT3216F245X07 _ 1 EvaluationBoardReference PCBDimensionAntennaLayoutReference Unit:mm ElectricalCharacteristics ReturnLoss&Radiation ReturnLoss Frequency(MHz) S11(dB) 2400-10.50 2450-30.62 2500-11.47 Radiation 2400MHz2450MHz2500MHz Efficiency82.52%85.26%83.01% X Y Z 2.4GHz 3216 Chip Antenna: RANT3216F245X07 _ TapingSpecifications ReelandTapingSpecification ReelSpecification TYPESIZEABCD 32167”4K/Reel 9.0±0.5 60±213.5±0.5178±2 TappingSpecification PackagingTypeABWEFGHTψDP PaperType3216 1.90±0.203.50±0.208.0±0.201.75±0.103.5±0.054.0±0.102.0±0.050.75±0.10 1.50±0.10 4.0±0.1 _ 2.4GHz 3216 Chip Antenna: RANT3216F245X07 Reliability Table TestItemProcedure Requirements CeramicType Remark (Reference) Electrical Characterization Fulfilltheelectrical specification UserSpec. Thermal Shock 1.Preconditioning: 50±10°C/1hr,thenkeepfor24±1hrsatroomtemp. 2.Initialmeasure:Spec:referInitialspec. 3.Rapidchangeoftemperaturetest: -30°Cto+85°C;100cycles; 15minutesatLowercategorytemperature; 15minutesatUppercategorytemperature. NoVisibleDamage. Fulfilltheelectrical specification. MIL-STD-202 107 Temperature Cycling 1.Initialmeasure:Spec:referInitialspec. 2.100Cycles(-30°Cto+85°C),SoakMode=1(2Cycle/hours). 3.Measurementat24±2Hoursaftertestcondition. NoVisibleDamage. Fulfilltheelectrical specification. JESD22 JA104 HighTemperature Exposure 1.Initialmeasure:Spec:referInitialspec. 2.Unpowered;500hours@T=+85°C. 3.Measurementat24±2hoursaftertest. NoVisibleDamage. Fulfilltheelectrical specification. MIL-STD-202 108 LowTemperature Storage 1.Initialmeasure:Spec:referInitialspec. 2.Unpowered:500hours@T=-30°C. 3.Measurementat24±2hoursaftertest. NoVisibleDamage. Fulfilltheelectrical specification. MIL-STD-202 108 Solderability (SMDBottomSide) Dippingmethod: a.Temperature:235±5°C b.Dippingtime:3±0.5s Thesoldershouldcover over95%ofthecritical areaofbottomside. IEC60384-21/22 4.10 SolderingHeat Resistance (RSH) Preheatingtemperature:150±10°C. Preheatingtime:1~2min. Soldertemperature:260±5°C. Dippingtime:5±0.5s NoVisibleDamage.IEC60384-21/22 4.10 Vibration5g'sfor20min.,12cycleseachof3orientations Note:Use8"X5"PCB.031"thick7securepointson,onelong sideand2securepointsatcornersofoppositesides.Parts mountedwithin2"fromanysecurepoint.Testfrom10-2000 Hz. NoVisibleDamage.MIL-STD-202 Method204 Mechanical Shock Threeshocksineachdirectionshallbeappliedalongthethree mutuallyperpendicularaxesofthetestspecimen(18shocks) Peakvalue:1,500g’s Duration:0.5ms Velocitychange:15.4ft/s Waveform:Half-sine NoVisibleDamage.MIL-STD-202 Method213 Humidity Bias 1.Humidity:85%R.H.,Temperature:85±2°C. 2.Time:500±24hours. 3.Measurementat24±2hrsaftertestcondition. NoVisibleDamage. Fulfilltheelectrical specification. MIL-STD-202 Method106 2.4GHz 3216 Chip Antenna: RANT3216F245X07 _ Board Flex (SMD) 1.Mountingmethod: IR-Reflow.PCBSize(L:100×W:40×T:1.6mm) 2.Applytheloadindirectionofthearrowuntilbendingreaches 2mm. NoVisibleDamage.AEC-Q200 005 AdhesionForceof1.8Kgfor60seconds.NoVisibleDamage Magnificationof20Xor greatermaybeemployed forinspectionofthe mechanicalintegrityofthe devicebodyterminalsand body/terminaljunction. AEC-Q200 006 Physical Dimension Anyapplicablemethodusingx10magnification,micrometers, calipers,gauges,contourprojectors,orothermeasuring equipment,capableofdeterminingtheactualspecimen dimensions. Inaccordancewith specification. JESD22 JB100 RevisionHistory RevisionDateContent 12019/03/01NewDatasheet 2Add2Dradiationcharacteristi2022/02/22c

ReportNo.:CISRR250730042A Thetestresultsrelateonlytothetestedsamples. ThetestreportshouldnotbereproducedexceptinfullwithoutthewrittenapprovalofShenzhenBangce TestingTechnologyCo.,Ltd. Page1of62 TESTREPORT ReportNo.CISRR250730042A ProjectNo.CISR250730042A FCCID2A7SU-S870 ApplicantShenzhenSantuoOriginalTechnologyCo.,Ltd. Address 802,8thFloor,BuildingC10,FuyuanIndustrialCity,Zhoushi Road.HangchengStreet,Bao'anDistrict,Shenzhen,518100,China ManufacturerShenzhenSantuoOriginalTechnologyCo.,Ltd. Address 802,8thFloor,BuildingC10,FuyuanIndustrialCity,Zhoushi Road.HangchengStreet,Bao'anDistrict,Shenzhen,518100,China ProductNameBoneconductionheadphones TrademarkN/A Model/TypereferenceS870 ListedModel(s)S870-A,870-B,S870-CS870-D,S870-E Standard 47CFRPart15.247 TestdateJuly31,2025toAugust4,2025 IssuedateAugust6,2025 TestresultComplied Preparedby:LucasHuangApprovedby:GenryLong ReportNo.:CISRR250730042A Page 2 of 62 Contents 1.REPORTVERSION..........................................................................................................................................3 2.TESTDESCRIPTION.......................................................................................................................................4 3.SUMMARY........................................................................................................................................................5 3.1.ProductDescription*..................................................................................................................................5 3.2.RadioSpecificationDescription*..............................................................................................................5 3.3.ModificationofEUT.....................................................................................................................................6 3.4.Deviationfromstandards...........................................................................................................................6 3.5.TestingSite...................................................................................................................................................6 4.TESTCONFIGURATION.................................................................................................................................7 4.1.Testfrequencylist.......................................................................................................................................7 4.2.Descriptionsoftestmode...........................................................................................................................7 4.3.Supportunitusedintestconfiguration....................................................................................................7 4.4.Testsampleinformation.............................................................................................................................7 4.5.Environmentalconditions...........................................................................................................................7 4.6.Statementofthemeasurementuncertainty.............................................................................................8 4.7.EquipmentUsedduringtheTest................................................................................................................8 5.TESTRESULTS.............................................................................................................................................10 5.1.EvaluationResults(Evaluation)...............................................................................................................10 5.1.1.AntennaRequirement............................................................................................................................10 5.2.RadioSpectrumMatterTestResults(RF)...............................................................................................11 5.2.1.ConductedEmissionatACpowerline.................................................................................................11 5.2.2.20dBBandwidth......................................................................................................................................14 5.2.3.MaximumConductedOutputPower.....................................................................................................16 5.2.4.ChannelSeparation................................................................................................................................17 5.2.5.NumberofHoppingFrequencies..........................................................................................................18 5.2.6.DwellTime...............................................................................................................................................19 5.2.7.Conductedbandedgeandspuriousemission...................................................................................21 5.2.8.Radiatedbandedgeemission...............................................................................................................23 5.2.9.RadiatedSpuriousEmission(below1GHz).........................................................................................29 5.2.10.RadiatedSpuriousEmission(Above1GHz)......................................................................................33 6.TESTSETUPPHOTOS..................................................................................................................................41 7.EXTERNALANDINTERNALPHOTOS........................................................................................................43 7.1.ExternalPhotos.........................................................................................................................................43 7.2.InternalPhotos...........................................................................................................................................46 8.APPENDIXREPORT....................…

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ReportNo.:CISRR250730042A Page 41 of 62 6.TESTSETUPPHOTOS ConductedEmissionatACpowerline Radiatedbandedgeemission RadiatedSpuriousEmission(Above1GHz) ReportNo.:CISRR250730042A Page 42 of 62 RadiatedSpuriousEmission(below1GHz)