2A8LL-CRYSTALWII8K Dongle

扫描全能王 创建

扫描全能王 创建

扫描全能王 创建

扫描全能王 创建

Reference No.: WTX26X06163104W001 Page 1 of 11 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn ANNEX EXHIBIT 1 - PRODUCT LABELING Proposed FCC ID Label Format FCC ID: 2A8LL-CRYSTALWII Specifications: The label shall be securely affixed to a permanently attached part of the device, in a location where it is visible or easily accessible to the user, and shall not be readily detachable. The label shall be sufficiently durable to remain fully legible and intact on the device in all normal conditions of use throughout the device’s expected lifetime. Proposed Label Location on EUT FCC ID Label Location

Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn RF EXPOSURE REPORT Reference No. .................... : WTX26X06163104W003 FCC ID ................................ : 2A8LL-CRYSTALWII Applicant ........................... : Shenzhen Lamzu Electronic Technology Co.,Ltd Address ............................. : Building 301, Lushi Industrial Building, Zone 28, Dalang Community, Xin’an Street, Bao’an District, Shenzhen Manufacturer ..................... : The same as Applicant Address ............................. : The same as Applicant Product Name ................... : 8K Dongle Model No... ......................... : Crystal wireless II Standards .......................... : FCC Rule Part 1.1307 KDB 447498 D04 Date of Receipt sample .... : 2026-06-08 Date of Test ........................ : 2026-06-10 to 2026-07-06 Date of Issue ..................... : 2026-07-22 Report Form No. ............... : WTX_Part 1_1307W Result ................................. : Pass Remarks: The results shown in this test report refer only to the sample(s) tested, this test report cannot be reproduced, except in full, without prior written permission of the company. The report would be invalid without specific stamp of test institute and the signatures of approver. Prepared By: Waltek Testing Group (Shenzhen) Co., Ltd. Address: 1/F., Room 101, Building 1, Hongwei Industrial Park, Liuxian 2nd Road, Block 70 Bao'an District, Shenzhen, Guangdong, China Tel.: +86-755-33663308 Fax.: +86-755-33663309 Email: [email protected] Tested by: Approved by: Gala Wang/Project Engineer Jason Su/Manager Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn 1 General Information General Description of EUT: Product Name: 8K Dongle Trade Name: LAMZU Model No.: Crystal wireless II Adding Model(s): / Rated Voltage: DC 5V Battery Capacity / Power Adapter Model: / Equipment Type: Portable device Technical Characteristics of EUT: Frequency Range: 2402-2478MHz Max. Field Strength: 92.15dBuV/m Modulation: GFSK Quantity of Channels: 77 Channel Separation: 1MHz Antenna Type: PCB Antenna Antenna Gain: 2.51dBi 2 Test Facility Address of the test laboratory Laboratory: Waltek Testing Group (Shenzhen) Co., Ltd. Address: 1/F., Room 101, Building 1, Hongwei Industrial Park, Liuxian 2nd Road, Block 70 Bao'an District, Shenzhen, Guangdong, China FCC – Registration No.: 125990 Waltek Testing Group (Shenzhen) Co., Ltd. EMC Laboratory has been registered and fully described in a report filed with the FCC (Federal Communications Commission). The acceptance letter from the FCC is main tained in our files. The Designation Number is CN5010, and Test Firm Registration Number is 125990. Industry Canada (IC) Registration No.: 11464A The 3m Semi-anechoic chamber of Waltek Testing Group (Shenzhen) Co., Ltd. has been registered by Certification and Engineering Bureau of Industry Canada for radio equipment testing with Registration No.: 11464A and the CAB identifier is CN0057. Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn 3 RF Exposure Exemption According to §1.1307(b)(3) and KDB 447498 D04 Interim General RF Exposure Guidance v01, system operating under the provisions of this section shall be operating in a manner that the public is not exposed to radio frequency energy level in excess limit for maximum permissible exposure. Option A: FCC Rule Part 1.1307 (b)(3)(i)(A):The available maximum time-averaged power is no more than 1mW, regardless of separation distance. Option B: FCC Rule Part 1.1307 (b)(3)(i)(B): The available maximum time-averaged power or effective radiated power (ERP), whichever is greater, is less than or equal to the threshold P th (mW) described in the following formula. P th is given by: Option C: FCC Rule Part 1.1307 (b)(3)(i)(C): The minimum separation distance (R in meters) from the body of a nearby person for the frequency (f in MHz) at which the source operates, the ERP (watts) is no more than the calculated value prescribed for that frequency. R must be at least λ/2π, where λ is the free-space operating wavelength in meters. Single RF Sources Subject to Routine Environmental Evaluation RF Source frequency (MHz) Threshold ERP (watts) 0.3-1.34 1,920 R 2 1.34-30 3,450 R 2 /f 2 30-300 3.83 R 2 300-1,500 0.0128 R 2 f 1,500-100,000 19.2R 2 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn For Multiple RF sources: FCC Rule Part 1.1307(b)(3)(ii): (A) The available maximum time-averaged power of each source is no more than 1 mW and there is a separation distance of two centimeters between any portion of a radiating structure operating and the nearest portion of any other radiating structure in the same device, except if the sum of multiple sources is less than 1 mW during the time-averaging period, in which case they may be treated as a single source (separation is not required). (B) In the case of fixed RF sources operating in the same time-averaging period, or of multiple mobile or portable RF sources within a device operating in the same time averaging period, if the sum of the fractional contributions to the applicable thresholds is less than or equal to 1 as indicated in the following equation. 4 Calculated Result Radio Access Technology Prediction Frequency Max. Field Strength Antenna Gain Output Power Tune-Up Power ERP (MHz) (dBuV/m) (dBi) (dBm) (dBm) (dBm) SRD 2402 92.15 2.51 -5.62 -5.00 -4.64 Frequency Option Min. Distance Max. Power Exposure Limit Ratio Result (MHz) (cm) (dBm) (mW) (mW) Pass/Fail 2402 B 0.5 -4.64 0.34 2.788 0.12 Pass Note: 1. EIRP= E-104.8+20logD; Output Power=EIRP- Antenna Gain; ERP=EIRP-2.15dB 2. Option A, B and C refers as clause 1.2. 3. For option B, Max (time-averaged power, effective radiated power (ERP)) converts to Max. Power. For option C, ERP converts to Max. Power; 4. For option B, P th (mW) converts to Exposure Limit (mW); For option C, ERP (W) converts to Exposure Limit (mW). 5. Ratio= Tune-Up ERP (mW)/ Exposure Limit (mW) Mode for Simultan…

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AntennaSpecification Specifications Summary ITEMSPEC. ModelNameTI2.4GHz CenterFrequency2402MHz2.32dBi 2440MHz2.51dBi 2478MHz2.51dBi MAX.GAIN2.51dBi PolarizationHorizontal AzimuthBeamPatternOmni-directional Impedance50Ω AntennaPhoto&Length(mm) 1.MainAntennaChannel:2402MHz 2.MainAntennaChannel:2440MHz 3.MainAntennaChannel:2478MHz

Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Page 1 of 36 TEST REPORT Reference No. ....................: WTX26X06163104W001 FCC ID ............................... .: 2A8LL-CRYSTALWII Applicant .......................... .: Shenzhen Lamzu Electronic Technology Co.,Ltd Address ............................ .: Building 301, Lushi Industrial Building, Zone 28, Dalang Community, Xin’an Street, Bao’an District, Shenzhen Manufacturer .................... .: The same as Applicant Address ............................ .: The same as Applicant Product Name .................. .: 8K Dongle Model No... ........................ .: Crystal wireless II Standards ......................... .: FCC Part 15.249 Date of Receipt sample ... .: 2026-06-08 Date of Test....................... .: 2026-06-10 to 2026-07-06 Date of Issue .................... .: 2026-07-22 Test Report Form No. ...... . : WTX_Part 15_249W Test Result ........................ .: Pass Remarks: The results shown in this test report refer only to the sample(s) tested, this test report cannot be reproduced, except in full, without prior written permission of the company. The report would be invalid without specific stamp of test institute and the signatures of approver. Prepared By: Waltek Testing Group (Shenzhen) Co., Ltd. Address: 1/F., Room 101, Building 1, Hongwei Industrial Park, Liuxian 2nd Road, Block 70 Bao'an District, Shenzhen, Guangdong, China Tel.: +86-755-33663308 Fax.: +86-755-33663309 Email: [email protected] Tested by: Approved by: Gala Wang/Project Engineer Jason Su/Manager Reference No.: WTX26X06163104W001 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Page 2 of 36 TABLE OF CONTENTS 1. GENERAL INFORMATION .................................................................................................................................... 4 1.1 PRODUCT DESCRIPTION FOR EQUIPMENT UNDER TEST (EUT) ......................................................................... 4 1.2 TEST STANDARDS ................................................................................................................................................. 5 1.3 TEST METHODOLOGY ........................................................................................................................................... 5 1.4 TEST FACILITY ...................................................................................................................................................... 5 1.5 EUT SETUP AND TEST MODE .............................................................................................................................. 6 1.6 MEASUREMENT UNCERTAINTY ............................................................................................................................. 7 1.7 TEST EQUIPMENT LIST AND DETAILS ................................................................................................................... 8 2. SUMMARY OF TEST RESULTS ......................................................................................................................... 12 3. ANTENNA REQUIREMENTS .............................................................................................................................. 13 3.1 STANDARD APPLICABLE ..................................................................................................................................... 13 3.2 TEST RESULT ...................................................................................................................................................... 13 4. RADIATED EMISSIONS ....................................................................................................................................... 14 4.1 STANDARD APPLICABLE ..................................................................................................................................... 14 4.2 TEST PROCEDURE .............................................................................................................................................. 14 4.3 CORRECTED AMPLITUDE & MARGIN CALCULATION ........................................................................................... 17 4.4 SUMMARY OF TEST RESULTS/PLOTS ................................................................................................................. 17 5. OUT OF BAND EMISSIONS ................................................................................................................................ 26 5.1 STANDARD APPLICABLE ..................................................................................................................................... 26 5.2 TEST PROCEDURE .............................................................................................................................................. 26 5.3 SUMMARY OF TEST RESULTS/PLOTS ................................................................................................................. 26 6. EMISSION BANDWIDTH ...................................................................................................................................... 31 6.1 STANDARD APPLICABLE ..................................................................................................................................... 31 6.2 TEST PROCEDURE .............................................................................................................................................. 31 6.3 SUMMARY OF TEST RESULTS/PLOTS ................................................................................................................. 31 7. CONDUCTED EMISSIONS .................................................................................................................................. 33 7.1 TEST PROCEDURE .............................................................................................................................................. 33 7.2 BASIC TEST SETU…

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