2A8MI-AAD06TX Dongle

LHDC ONE User Manual Step 1: Put Your Bluetooth Audio Playback Device in Pairing Mode. Step 2: Plug the LHDC ONE into a USB-C port on your PC or phone. For first-time use, LHDC ONE will automatically enter pairing mode, indicated by the LED flashing in BLUE/RED. Step 3: Wait for your device to connect to LHDC ONE. If connected, the LED closer to the button will turn BLUE. Proceed to Step 5. If not connected, the LED will be RED. Ensure your Bluetooth audio device is in pairing mode, then proceed to Step 4. Step 4: Double-click the button to put LHDC ONE into pairing mode, with the LED flashing in BLUE/RED. If connected, the LED closer to the button will turn BLUE. Proceed to Step 5. If not connected, the LED will be RED. Ensure your Bluetooth audio device is in pairing mode, then repeat Step 4. Step 5: After your Bluetooth audio device is connected, you can enjoy audio through your Bluetooth playback device. Regardless of Bluetooth connection status, you can always enjoy audio from the 3.5mm analog audio jack. LHDC ONE User Manual Paso 1: Ponga su dispositivo de reproducción de audio Bluetooth en modo de emparejamiento. Paso 2: Conecte el LHDC ONE al puerto USB-C de su PC o teléfono. Para el primer uso, el LHDC ONE entrará automáticamente en modo de emparejamiento, indicado por el LED parpadeando en AZUL/ROJO. Paso 3: Espere a que su dispositivo se conecte al LHDC ONE. Si está conectado, el LED más cercano al botón se volverá AZUL. Continúe con el Paso 5. Si no está conectado, el LED estará en ROJO. Asegúrese de que su dispositivo de audio Bluetooth esté en modo de emparejamiento y luego siga al Paso 4. Paso 4: Haga doble clic en el botón para poner el LHDC ONE en modo de emparejamiento con el LED parpadeando en AZUL/ROJO. Si está conectado, el LED más cercano al botón se volverá AZUL. Continúe con el Paso 5. Si no está conectado, el LED estará en ROJO. Asegúrese de que su dispositivo de audio Bluetooth esté en modo de emparejamiento y repita el Paso 4. Paso 5: Después de que su dispositivo de audio Bluetooth esté conectado, puede disfrutar del audio a través de su dispositivo de reproducción Bluetooth. Independientemente de la conexión Bluetooth, siempre puede disfrutar del audio desde la toma de audio analógica de 3.5 mm. User Manual FCC Warning: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/ TV technician for help. The device has been evaluated to meet general RF exposure requirement. The device can be used in portable exposure condition without restriction. Caution: Any changes or modifications to this device not explicitly approved by manufacturer could void your authority to operate this equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Sincerely, Name/Title： Xiangxu Zhu/Manager Company: Jiang Su Yisin Tech Co., Ltd Address: Rm. 103, Bldg. 1, No. 10, Wenzhou Rd., ETDZ, Shuyang County, Suqian, Jiangsu, China Phone: +86 13760257887 Fax: +86 13760257887 E-Mail: [email protected]

Shenzhen BANTEK Testing Co., Ltd. Page 1 of 4 Report No.: BTEK230822013AE Appendix EUT Photos for BTEK230822013AE Shenzhen BANTEK Testing Co., Ltd. Page 2 of 4 Report No.: BTEK230822013AE EUT Constructional Details (EUT External Photos) Shenzhen BANTEK Testing Co., Ltd. Page 3 of 4 Report No.: BTEK230822013AE Shenzhen BANTEK Testing Co., Ltd. Page 4 of 4 Report No.: BTEK230822013AE

Shenzhen BANTEK Testing Co., Ltd. Page 1 of 1 Report No.: BTEK230822013AE LABEL AND LOCATION (Size: L2.0cm*W1.0cm) TX Dongle FCC ID: 2A8MI-AAD06 Model No.: AAD06 FCC ID：2BCE6- AKSERIES

Shenzhen BANTEK Testing Co., Ltd. Page 1 of 3 Report No.: BTEK230822013AE Appendix EUT Photos for BTEK230822013AE Shenzhen BANTEK Testing Co., Ltd. Page 2 of 3 Report No.: BTEK230822013AE EUT Constructional Details (EUT Internal Photos) Antenna Shenzhen BANTEK Testing Co., Ltd. Page 3 of 3 Report No.: BTEK230822013AE

Shenzhen BANTEK Testing Co., Ltd. Page 1 of 6 Report No.: BTEK230822013AE003 FCC ID: 2A8MI-AAD06 RF Exposure Evaluation Report Application No.: BTEK230822013AE Applicant: Jiang Su Yisin Tech Co., Ltd Address of Applicant: Rm.103, Bldg.1, No.10, Wenzhou Rd., ETDZ, Shuyang County, Suqian, Jiangsu, China Manufacturer: Jiang Su Yisin Tech Co., Ltd Address of Manufacturer: Rm.103, Bldg.1, No.10, Wenzhou Rd., ETDZ, Shuyang County, Suqian, Jiangsu, China Factory: Rayson Technology (SZ) Co., Ltd. Address of Factory: No.1, Tongfu 1st Road, The 2nd industrial Zone, Loucun, Guangming New District, Shenzhen, China Equipment Under Test (EUT): EUT Name: TX Dongle Model No.: AAD06 Trade Mark: LHDC ONE Standard(s) : 47 CFR Part 2 Subpart J Section 2.1093 Date of Receipt: 2023-09-15 Date of Test: 2023-09-18 to 2023-10-11 Date of Issue: 2023-10-11 Test Result: Pass* * In the configuration tested, the EUT complied with the standards specified above. Damon Su EMC Laboratory Manager Shenzhen BANTEK Testing Co., Ltd. Page 2 of 6 Report No.: BTEK230822013AE003 Revision Record Version Chapter Date Modifier Remark 01 2023-10-11 Original Authorized for issue by: Keven Tan /Project Engineer Carl Yang /Reviewer Shenzhen BANTEK Testing Co., Ltd. Page 3 of 6 Report No.: BTEK230822013AE003 2 Contents Page 1 COVER PAGE ............................................................................................................................................1 2 CONTENTS ................................................................................................................................................ 3 3 GENERAL INFORMATION ........................................................................................................................ 4 3.1 DETAILS OF E.U.T. ............................................................................................................................... 4 3.2 DESCRIPTION OF SUPPORT UNITS ......................................................................................................... 4 3.3 TEST LOCATION .................................................................................................................................... 5 3.4 DEVIATION FROM STANDARDS ............................................................................................................... 5 3.5 ABNORMALITIES FROM STANDARD CONDITIONS ..................................................................................... 5 4 TEST REQUIREMENT ............................................................................................................................... 6 4.1 Test Data and Test Result .................................................................................................................... 6 5 EUT CONSTRUCTIONAL DETAILS ......................................................................................................... 6 Shenzhen BANTEK Testing Co., Ltd. Page 4 of 6 Report No.: BTEK230822013AE003 3 General Information 3.1 Details of E.U.T. Power supply: DC 5V For Bluetooth: Operation Frequency: 2402MHz to 2480MHz Modulation Type: GFSK, π/4DQPSK, 8DPSK Channel Spacing: 1MHz Number of Channels: 79 Antenna Type: Chip Antenna Antenna Gain: 1.72dBi Hardware Version V1.2 Software and Firmware Version V0_0_0_80010 Sample No.: BTEK230822E013-1/1 For BLE: Operation Frequency: 2402MHz to 2480MHz Modulation Type: GFSK Channel Spacing: 2MHz Date Rate: 1Mbps Number of Channels: 40 Antenna Type: Chip Antenna Antenna Gain: 1.72dBi Hardware Version V1.2 Software and Firmware Version V0_0_0_80010 Sample No.: BTEK230822E013-1/1 Remark: The information in this section is provided by the applicant or manufacturer, BANTEK is not liable to the accuracy, suitability, reliability or/and integrity of the information. 3.2 Description of Support Units The EUT has been tested as an independent unit. Shenzhen BANTEK Testing Co., Ltd. Page 5 of 6 Report No.: BTEK230822013AE003 3.3 Test Location All tests were performed at: Shenzhen BANTEK Testing Co., Ltd. A5&A6, Building B1&B2, No.45 Gangtou Road, Bogang Community, Shajing Street, Bao'an District, Shenzhen, Guangdong, China 518104 Tel:0755-2334 4200 Fax: 0755-2334 4200 FCC Registration Number: 264293 Designation Number: CN1356 No tests were sub-contracted. 3.4 Deviation from Standards None 3.5 Abnormalities from Standard Conditions None Shenzhen BANTEK Testing Co., Ltd. Page 6 of 6 Report No.: BTEK230822013AE003 4 Test Requirement KDB447498 D01 General RF Exposure Guidance v06, Clause 4.3.1(a) [(max. power of channel, including tune-up tolerance, mW) / (min. test separation distance, mm)] • [√ f(GHz)] ≤ 3.0 Where -f(GHz) is the RF channel transmit frequency in GHz -Power and distance are rounded to the nearest mW and mm before calculation -The test exclusions are applicable only when the minimum test separation distance is ≤ 50 mm, and for transmission frequencies between 100 MHz and 6 GHz. When the minimum test separation distance is < 5 mm, a distance of 5 mm according to 4.1 f) is applied to determine SAR test exclusion. 4. 4.1 Test Data and Test Result 20 Type Frequency (MHz) Conducted Power (dBm) Maximum Tune-up (dBm) Calculating data Limit Result BT 2480 1.69 2 0.46 3.0 Pass BT-BLE 2480 -1.11 0 0.24 3.0 Pass Note: The exposure evaluation safety distance is 5mm. 5 EUT Constructional Details Refer to Appendix - External and Internal Appendix EUT Photos.

SPECIFICATION FOR APPROVAL CUSTOMER CUSTOMERS P/N PART NUMBER WAN2012F245C04 DESCRIPTION Chip Antenna 2012 L Ant 2.45G Type 04 VERSION V1.9 ISSUE DATE 2023/06/15 CUSTOMER APPROVED R&D CENTER APPROVAL CHECKED DRAWN Ray Tennyson Snow OneWave Electronic Co., Ltd. 1121511 1F, No. 151, Li Gong Street, Beitou District, Taipei City 112, Taiwan : (02) 2898-2220 TEL: +886 2 2898-2220 : (02) 2898-5055 FAX: +886 2 2898-5055 2/11 ONEWAVE TECHNOLOGY CO., LTD. 2012 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 2.05 ± 0.20 W 1.23 ± 0.20 T 0.45 ± 0.20 P/N: WAN2012F245C04 3/11 ONEWAVE TECHNOLOGY CO., LTD. Part Number Information WAN 2012 F 245 C 04 A B C D E F A Product Series Antenna B Dimension L x W 2.05X1.23mm ( ± 0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode PIFA & Single Feeding F Antenna type Type = 04 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN2012F245C04 Central Frequency 2450 MHz Bandwidth 85 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 1.72 dBi Impedance 50 Ohm Operating Temperature -40+110 Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) 4/11 ONEWAVE TECHNOLOGY CO., LTD. 2. Recommended PCB Pattern Evaluation Board Dimension (board size 80x40mm) 2 nd Evaluation Board Dimension Evaluation Board Dimension (board size 80x40mm) Suggested Matching Circuit : ±0.1~0.3nH±0.1pF 1.0pF 5/11 ONEWAVE TECHNOLOGY CO., LTD. Layout Dimensions in Clearance area ( Size=3.0*5.0mm) FootPrint (Unit : mm) 2 nd Layout Dimensions in Clearance area ( Size=8.0*2.5mm) Matching Tuning Matching Tuning 6/11 ONEWAVE TECHNOLOGY CO., LTD. 3. Measurement Results Return Loss 7/11 ONEWAVE TECHNOLOGY CO., LTD. 3D Radiation Pattern 2D Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 63.12 % 1.62 dBi 3.61 dBi 2450MHz 70.56 % 1.72 dBi 3.23 dBi 2500MHz 65.48 % 1.64 dBi 3.47 dBi Chamber Coordinate System Z Y X 8/11 ONEWAVE TECHNOLOGY CO., LTD. 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150/60sec. Solder temperature:2305 Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% Pre-heating temperature:150/60sec. Solder temperature:2605 Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(2305 for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature() Time(min) 1 +110 ±5 30±3 2 Room Temperature Within 3sec 3 -40±2 30±3 4 Room Temperature Within 3sec +110=>30±3min -40=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5 Duration: 100012hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5 Duration: 100012hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2 Humidity: 90% to 95% RH Duration: 100012hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 41 sec. 60sec TEMP () 150 230 9/11 ONEWAVE TECHNOLOGY CO., LTD. 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Preheat circuit and products to 150 Never contact the ceramic with the iron tip Use a 20 watt soldering iron with tip diameter of 1.0mm 280 tip temperature (max) 1.0mm tip diameter (max) Limit soldering time to 3 sec. 10/11 ONEWAVE TECHNOLOGY CO., LTD. 6.Packaging Information Tape Specification: Reel Specification: (7,180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 13.5±0.5 178±2 3000 11/11 ONEWAVE TECHNOLOGY CO., LTD. 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: -10~ 40 and 30~70% RH. 2. Recommended products should be used within 6 months from the time of delivery. 3. The packaging material should be kept where no chlorine or sulfur exists in the air. Transportation Conditions 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure th…

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Shenzhen BANTEK Testing Co., Ltd. Report No.: BTEK230822013AE002 Page: 1 of 95 FCC ID: 2A8MI-AAD06 TEST REPORT Application No.: BTEK230822013AE Applicant: Jiang Su Yisin Tech Co., Ltd Address of Applicant: Rm.103, Bldg.1, No.10, Wenzhou Rd., ETDZ, Shuyang County, Suqian, Jiangsu, China Manufacturer: Jiang Su Yisin Tech Co., Ltd Address of Manufacturer: Rm.103, Bldg.1, No.10, Wenzhou Rd., ETDZ, Shuyang County, Suqian, Jiangsu, China Factory: Rayson Technology (SZ) Co., Ltd. Address of Factory: No.1, Tongfu 1st Road, The 2nd industrial Zone, Loucun, Guangming New District, Shenzhen, China Equipment Under Test (EUT): EUT Name: TX Dongle Model No.: AAD06 Trade Mark: LHDC ONE Standard(s) : 47 CFR Part 15, Subpart C 15.247 Date of Receipt: 2023-09-15 Date of Test: 2023-09-18 to 2023-10-11 Date of Issue: 2023-10-11 Test Result: Pass* * In the configuration tested, the EUT complied with the standards specified above. Damon Su EMC Laboratory Manager Shenzhen BANTEK Testing Co., Ltd. Report No.: BTEK230822013AE002 Page: 2 of 95 Revision Record Version Chapter Date Modifier Remark 01 2023-10-11 Original Authorized for issue by: Keven Tan/Project Engineer Carl Yang/Reviewer Shenzhen BANTEK Testing Co., Ltd. Report No.: BTEK230822013AE002 Page: 3 of 95 2 Test Summary Radio Spectrum Technical Requirement Item Standard Method Requirement Result Antenna Requirement 47 CFR Part 15, Subpart C 15.247 N/A 47 CFR Part 15, Subpart C 15.203 & 15.247(b)(4) Pass Other requirements Frequency Hopping Spread Spectrum System Hopping Sequence N/A 47 CFR Part 15, Subpart C 15.247(a)(1),(g),(h) Pass Radio Spectrum Matter Part Item Standard Method Requirement Result Conducted Peak Output Power 47 CFR Part 15, Su bpart C 15.247 ANSI C63.10 (2013) Section 7.8.5 47 CFR Part 15, Subpart C 15.247(b)(1) Pass 20dB Bandwidth ANSI C63.10 (2013) Section 7.8.7 47 CFR Part 15, Subpart C 15.247(a)(1) Pass Carrier Frequencies Separation ANSI C63.10 (2013) Section 7.8.2 47 CFR Part 15, Subpart C 15.247a(1) Pass Hopping Channel Number ANSI C63.10 (2013) Section 7.8.3 47 CFR Part 15, Subpart C 15.247a(1)(iii) Pass Dwell Time ANSI C63.10 (2013) Section 7.8.4 47 CFR Part 15, Subpart C 15.247a(1)(iii) Pass Conducted Band Edges Measurement ANSI C63.10 (2013) Section 7.8.6 47 CFR Part 15, Subpart C 15.247(d) Pass Conducted Spurious Emissions ANSI C63.10 (2013) Section 7.8.8 47 CFR Part 15, Subpart C 15.247(d) Pass Radiated Emissions which fall in the restricted bands ANSI C63.10 (2013) Section 6.10.5 47 CFR Part 15, Subpart C 15.205 & 15.209 Pass Radiated Spurious Emissions (Below 1GHz) ANSI C63.10 (2013) Section 6.4,6.5,6.6 47 CFR Part 15, Subpart C 15.205 & 15.209 Pass Radiated Spurious Emissions (Above 1GHz) ANSI C63.10 (2013) Section 6.4,6.5,6.6 47 CFR Part 15, Subpart C 15.205 & 15.209 Pass Note: E.U.T./EUT means Equipment Under Test. Pass means the test result passed the test standard requirement, please find the detailed decision rule in the report relative section. Shenzhen BANTEK Testing Co., Ltd. Report No.: BTEK230822013AE002 Page: 4 of 95 3 Contents Page 1 Cover Page ................................................................................................................................................ 1 2 Test Summary ........................................................................................................................................... 3 3 Contents .................................................................................................................................................... 4 4 General Information .................................................................................................................................. 6 4.1 Details of E.U.T. ................................................................................................................................. 6 4.2 Description of Support Units .............................................................................................................. 6 4.3 Measurement Uncertainty .................................................................................................................. 7 4.4 Test Location ...................................................................................................................................... 7 4.5 Deviation from Standards ................................................................................................................... 7 4.6 Abnormalities from Standard Conditions ........................................................................................... 7 5 Equipment List .......................................................................................................................................... 8 6 Radio Spectrum Technical Requirement ............................................................................................. 10 6.1 Antenna Requirement ...................................................................................................................... 10 6.1.1 Test Requirement: ....................................................................................................................... 10 6.1.2 Conclusion ................................................................................................................................... 10 6.2 Other requirements Frequency Hopping Spread Spectrum System Hopping Sequence................ 11 6.2.1 Test Requirement: ....................................................................................................................... 11 6.2.2 Conclusion ................................................................................................................................... 12 7 Radio Spectrum Matter Test Results .................................................................................................... 14 7.1 Conducted Peak Output Power........................................................................................................…

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Shenzhen BANTEK Testing Co., Ltd. Page 1 of 2 Report No.: BTEK230822013AE Appendix Setup Photos for BTEK230822013AE Shenzhen BANTEK Testing Co., Ltd. Page 2 of 2 Report No.: BTEK230822013AE Radiated Emissions (30MHz-1GHz) Radiated Spurious Emissions (Above 1GHz)