2A9CM-01Headphone

FCC Statement: This devicecomplieswithPart 15 of the FCC Rules.Operationis subjectto the followingtwo conditions: (1)This device may not cause harmful interference, and (2)This device must accept any interference received, including interference that may cause undesired operation. Warning: Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B Digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. The device has been evaluated to meet general RF exposure requirement. The device can be used in portable exposure condition without restriction.

DongguanAwuTechnologyCo.,Ltd. Declarationonmodeldifference Wetheundersignedherebyconfirmthatthesemodelsareidentical,andallmodelshavethe sameRFmoduleandantenna,PCBlayout,schematicsandcomponent.Onlythemodelsnameare different. ProductionnameTrademarkFCCIDModelno. HeadphoneiKF2A9CM-01iKFKing,iKF-King2,iKFK2,iKFShow, iKF-Play,iKF-Titan,iKF-Kids,iKFT1,iKF T2,iKFT3,iKFT4 Sincerely, OUYANGCHANGZHEN Manager DongguanAwuTechnologyCo.,Ltd. Room315-317,Building4,No.86,HongtuRoad,NanchengStreet,Dongguan City,GuangdongProvince

DongguanAwuTechnologyCo.,Ltd. 2022-11-18 EurofinsElectricalandElectronicTestingNA,Inc. 914WestPatapscoAvenue Baltimore,MD21230 RE:LETTEROFAGENTAUTHORIZATION ToWhomItMayConcern: We,theundersigned,herebyauthorizeDongGuanAnciElectronicTechnologyCo.,Ltd.toact onourbehalfinallmattersrelatingtoapplicationforequipmentauthorization,includingthe signingofalldocumentsrelatingtothesematters. Wealsoherebycertifythatnopartytotheapplicationauthorizedhereunderissubjecttothe denialofbenefits,includingFCCbenefits,pursuanttoSection5301oftheAnti-DrugAbuseAct of1988,21U.S.C.853(a). Thisagreementexpiresoneyearfromthecurrentdate. Sincerely, OUYANGCHANGZHEN Manager Room315-317,Building4,No.86,HongtuRoad,NanchengStreet, DongguanCity,GuangdongProvince

DongguanAwuTechnologyCo.,Ltd. 2022-11-18 EurofinsElectricalandElectronicTestingNA,Inc. 914WestPatapscoAvenue Baltimore,MD21230 RE:CONFIDENTIALITYREQUESTFOR(EUTName:Headphone/Model:iKFKing, iKF-King2,iKFK2,iKFShow,iKF-Play,iKF-Titan,iKF-Kids,iKFT1,iKFT2,iKFT3, iKFT4/FCCID:2A9CM-01) ToWhomItMayConcern: Thisletterservesasanofficialrequestforconfidentialityundersections0.457and0.459 ofCFR47.Wehaverequestedthatthe( BlockDiagram,OperationalDescription,Schematics ) requiredtobesubmittedwiththisapplicationbepermanentlywithheldfrompublic review. Theabovematerialscontaintradesecretsandproprietaryinformationnotcustomarilyreleasedto thepublic.Thepublicdisclosureofthesematerialsmaybeharmfultotheapplicantandprovide unjustifiedbenefitstoitscompetitors. Pleasecontactmeifthereisanyinformationyoumayneed. Sincerely, OUYANGCHANGZHEN Manager Room315-317,Building4,No.86,HongtuRoad,NanchengStreet, DongguanCity,GuangdongProvince

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ANT

RFEXPOSUREEVALUATION EUTSpecification EUTHeadphone ModelNumberiKFKing FCCID2A9CM-01 Antennagain(Max)2.39dBi OperationFrequency2402-2480MHz InputRatingDC5Vfromadapterandbattery3.7V ClassificationPer StipulatedTestStandard §15.247(i),§2.1093 KindofDevice:BluetoothVer.5.3BLE ModulationGFSK,π/4-DQPSK Max.outputpower0.34dBm(0.0011W) TestRequirement: Accordingto§15.247(i)and§1.1307(b)(1),systemsoperatingunderthe provisionsofthissectionshallbeoperatedinamannerthatensuresthatthe publicisnotexposedtoradiofrequencyenergylevelinexcessofthe Commission’sguidelines. RoutineSARevaluationreferstothatspecificallyrequiredby§2.1093,using measurementsorcomputersimulation.WhenroutineSARevaluationisnot required,portabletransmitterswithoutputpowergreaterthantheapplicable lowthresholdrequireSARevaluationtoqualityforTCBapproval. OneantennaisavailablefortheEUT.Theminimumseparationdistanceis 5mm. BTDSS: Transmit Frequency (MHz) Mode Measured Power (dBm) Tuneup Power (dBm) Maxtuneup power(dBm) Calculation Result 1-g SAR 2402GFSK0.340±110.3902263 2441GFSK0.220±110.3933813 2480GFSK-0.270±110.3965123 2402 Π/4-DQ PSK -0.10±110.3902263 2441 Π/4-DQ PSK -0.290±110.3933813 2480 Π/4-DQ PSK -0.83-1±100.3149603 BLE: Transmit Frequency (MHz) Mode Measured Power (dBm) Tuneup Power (dBm) Maxtuneup power(dBm) Calculation Result 1-g SAR 2402GFSK0.340±110.3902263 2440GFSK0.220±110.3933013 2480GFSK-0.270±110.3965123 AccordingtoKDB447498,nostand-alonerequiredforBTantenna,andno simultaneousSARmeasurementisrequired. Signature: TigerXu Date:2022-11-17

TRF No.: 01-R001-3A-LE TRF Originator: GTG TRF Date: 2022-06-29 Web: www.gtggroup.com E-mail: [email protected] Tel.: 86-400 755 8988 ELECTROMAGNETIC EMISSIONS COMPLIANCE REPORT FCC PART 15 SUBPART C REQUIREMENT OF Headphone Model No.: iKF King, iKF-King 2, iKF K2, iKF Show, iKF-Play, iKF-Titan, iKF-Kids, iKF T1, iKF T2, iKF T3, iKF T4 Trademark: N/A FCC ID: 2A9CM-01 Report No.: E01A22110261F00102 Issue Date: November 17, 2022 Prepared for Dongguan Awu Technology Co., Ltd. Room 315-317, Building 4, No. 86, Hongtu Road, Nancheng Street, Dongguan City, Guangdong Province Prepared by Dong Guan Anci Electronic Technology Co., Ltd. 1-2 Floor, Building A, No.11, Headquarters 2 Road, Songshan, Lake Hi-tech Industrial Development Zone, Dongguan City, Guangdong Pr., China.. This report shall not be reproduced, except in full, without the written approval of Dong Guan Anci Electronic Technology Co., Ltd. Page 2 of 66 Report No.: E01A22110261F00102 TRF No.: 01-R001-3A-LE Global Testing , Great Quality. VERIFICATION OF COMPLIANCE Applicant: Dongguan Awu Technology Co., Ltd. Room 315-317, Building 4, No. 86, Hongtu Road, Nancheng Street, Dongguan City, Guangdong Province Manufacturer: Dongguan Oumu Technology Co., Ltd. Room 312-314, Building D, Nanxin Industry International, Nancheng District, Dongguan City,Guangdong Province Product Description: Headphone Trade Mark: iKF Model Number: iKF King, iKF-King 2, iKF K2, iKF Show, iKF-Play, iKF-Titan, iKF-Kids, iKF T1, iKF T2, iKF T3, iKF T4 (All models are identical except model name, We choose model iKF King to do all tests.) We hereby certify that: The above equipment was tested by Dong Guan Anci Electronic Technology Co., Ltd. The test data, data evaluation, test procedures, and equipment configurations shown in this report were made in accordance with the procedures given in ANSI C63.10-2013 and the energy emitted by the sample EUT tested as described in this report is in compliance with conducted and radiated emission limits of FCC Rules Part 15.247(2022). Date of Test : November 09, 2022 to November 15, 2022 Prepared by : Duke Liu/Editor Reviewer & Authorized Signer : Tiger Xu/ Supervisor Page 3 of 66 Report No.: E01A22110261F00102 TRF No.: 01-R001-3A-LE Global Testing , Great Quality. Modified Information Version Summary Revision Date Report No. Ver.1.0 Original Report / E01A22110261F00102 Page 4 of 66 Report No.: E01A22110261F00102 TRF No.: 01-R001-3A-LE Global Testing , Great Quality. Table of Contents 1. GENERAL INFORMATION .................................................................................................. 6 1.1 PRODUCT DESCRIPTION .......................................................................................................... 6 1.2 TEST METHODOLOGY .............................................................................................................. 6 2. TEST FACILITY ...................................................................................................................... 7 3. DESCRIPTION OF TEST MODES ...................................................................................... 8 4. SUMMARY OF TEST RESULTS ....................................................................................... 10 6DB BANDWIDTH MEASUREMENT ............................................................................................. 10 5. TEST SYSTEM UNCERTAINTY ........................................................................................ 11 6. CONDUCTED EMISSIONS TEST ..................................................................................... 12 6.1 MEASUREMENT PROCEDURE: ................................................................................................ 12 6.2 TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) ............................................................ 12 6.3 MEASUREMENT EQUIPMENT USED: ........................................................................................ 12 6.4 CONDUCTED EMISSION LIMIT ..................................................................................................... 12 6.5 MEASUREMENT RESULT: ....................................................................................................... 13 6.5 CONDUCTED MEASUREMENT PHOTOS: ...................................................................................... 15 7. RADIATED EMISSION TEST ............................................................................................. 16 7.1 MEASUREMENT PROCEDURE ................................................................................................. 16 7.2 TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) ............................................................ 18 7.3 MEASUREMENT EQUIPMENT USED: ........................................................................................ 19 7.4 RADIATED EMISSION LIMIT ......................................................................................................... 20 7.5 MEASUREMENT RESULT .......................................................................................................... 21 7.6 RADIATED MEASUREMENT PHOTOS: .......................................................................................... 27 8. 6DB BANDWIDTH MEASUREMENT ............................................................................... 28 8.1 MEASUREMENT PROCEDURE ................................................................................................. 28 8.2 TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) ............................................................ 28 8.3 MEASUREMENT EQUIPMENT USED: ............................................................................................ 28 8.4 LIMIT ........................................................................................................................................ 28 8.5 MEASUREMENT RESULTS: ................................................................................................…

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ONEWAVE TECHNOLOGY CO., LTD. 2/11 3216 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 3.23 ± 0.20 W 1.66 ± 0.20 T 1.13 ± 0.20 P/N: KBAN3216D245H06 ONEWAVE TECHNOLOGY CO., LTD. 3/11 Part Number Information KBAN 3216 D 245 H 06 A B C D E F A Product Series Antenna B Dimension L x W 3.2X1.6mm (+-0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode Monopole & Single Feeding F Antenna type Type = 06 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number KBAN3216D245H06 Central Frequency 2450 MHz Bandwidth 100 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 2.39 dBi Impedance 50 Ohm Operating Temperature -40～+110 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) ONEWAVE TECHNOLOGY CO., LTD. 4/11 2. Recommended PCB Pattern Evaluation Board Dimension Unit : mm Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感±0.1~0.3nH、電容±0.1pF ONEWAVE TECHNOLOGY CO., LTD. 5/11 Layout Dimensions in Clearance area(Size=5.2*5.0mm) 50 ohm transmission Line Matching Circuit FootPrint (Unit : mm) ONEWAVE TECHNOLOGY CO., LTD. 6/11 3. Measurement Results Return Loss ONEWAVE TECHNOLOGY CO., LTD. 7/11 Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 45.61 % 1.13 dBi 4.54 dBi 2450MHz 55.65 % 2.39 dBi 4.93 dBi 2500MHz 47.63 % 1.65 dBi 4.87 dBi Chamber Coordinate System Z Y X ONEWAVE TECHNOLOGY CO., LTD. 8/11 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10 ± 0.5 sec. 60 sec . . T E M P ( °C ) 150 °C 2 6 0 °C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C ONEWAVE TECHNOLOGY CO., LTD. 9/11 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 ONEWAVE TECHNOLOGY CO., LTD. 10/11 6.Packaging Information ◆ Tape Specification: W Ao Bo Ko P F E D D1 Po P2 t 8.0 ±0.30 1.80 ±0.05 3.51 ±0.10 1.59 ±0.10 4.00 ±0.05 3.50 ±0.05 1.75 ±0.10 1.50 ±0.10 0.00 ±0.10 4.00 ±0.10 2.00 ±0.05 0.25 ±0.05 ◆ Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 13.5±0.5 178±2 3000 ONEWAVE TECHNOLOGY CO., LTD. 11/11 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: -10~ 40°C and 30~70% RH. 2. Recommended products should be used within 6 months from the time of delivery. 3. The packaging material should be kept where no chlorine or sulfur exists in the air. Transportation Conditions 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical…

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