2A9QK-EH006Bone Conduction Bluetooth Headphone

Zhongshiyuan Technology (Shenzhen) Co., LTD

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Application Details

Equipment Class: DTS - Digital Transmission System
Date of Grant: Feb 15, 2023
Application Purpose: Original Equipment
Date of Application: Feb 15, 2023
Equipment Note: Bone Conduction Bluetooth Headphone
Frequency Range: 2402.00000000 - 2480.00000000
Company: Zhongshiyuan Technology (Shenzhen) Co., LTD
Country: China

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Users Manual

EH006骨传导蓝牙耳机 s 使用指南 -------- 重要说明本款耳机骨传导耳机的正确佩戴位置为耳朵前方的面颊骨处,请勿将骨传导扬声器置于耳内；长时间听大音量的音乐可能会带来不适感, 请尽可能使用中等左右的音量, 避免长时间使用大音量；无论音量大小，使用耳机都将影响您对周围环境声音的感知,使用耳机时需多加注意；切勿抛扔、坐压耳机；耳机应远离火、水和高压设备；不适合三岁以下儿童使用，包含小零件:请勿将其归类为生活垃圾，可将其送往当地相应的电器电子设备回收站。我们听到的大部分声音,都是声波经过空气到达耳膜,然后声波使耳膜发生震动进而将声音传至内耳道; 另一种方式是,声波通过骨头震动直接传至内耳而不经过耳膜, 这也是人们听到自己声音的-种方式,这种声音的传播方式就是骨传导。断开连接连接自动关机(10分内可以自动回连最后记录或者被其他设备搜索连接) ; 暂停/播放:音乐播放状态下,单击多功能按键为暂停,再单击多功能按键为播放；接听/挂断: 来电状态下,单击多功能按键为接听,双击多功能按键为拒接电话；通话状态下:单击多功能按键为挂断；音量增加:单击音量增加键；音量减小:单击音量减小键；下一曲:长按音量加键；上一曲:长按音量减键； :提示Disconnected,手机端主动关闭蓝牙,10分钟后无型号 EHOO6 音乐播放时间标准状态: 6-8小时 -------- 充电时间 2小时蓝牙版本 5.3 防水等级 IP67 喇叭阻抗 8Ω 麦克风灵敏度 42 土2db 产品重量 24g 蓝牙连接距离 15-米充电电压 5V . 充电电流 100毫安协议 A2DP ,AVRCP,HSP,HFP ------ ------ ------ ------ ------ ------ ------ ------ ------ ------ 待机时间 20天 -------- 开机:耳机处于关机状态,长按开机键,保持3秒,LED蓝灯闪亮,提示音: power on; 关机:耳机处于开机状态,长按开机键,保持3秒, LED红灯闪一下关机, 提示音: poweroff; 控制说明低电提示电关机。充电:使用充电线时,将耳机插入U SB电源,充电状态下,LED指示灯为红灯长亮,充电充满则红灯灭(蓝灯常亮)。 :电池电压低于3.3V时红灯快闪0.2S间隔(有语音提示)，底恢复出厂设置:关机状态下音量加减键同时长按5秒清除配对信息复位复位后开机并进入配对模式) :插上充电线后,耳机将会复位并关机充电;(常按"+.- "”键5秒语音助手音助手，再双击退出；M P3/ 牙切按:在开机状态下三击开机切换蓝牙模式或者M P3模式。 :有滴提示音，蓝牙链接状态，双击多功能按键进入语蓝滴连接成功: Connected;1 耳机成功连接至设备时, LED蓝灯3秒闪-下,耳机提示音: 合格证本产品经检验合格规格：保质期：检验员：蓝牙连接蓝灯闪烁，耳机提示音:Pairing;设备(智能手机、平板电脑等)搜索到EH006或EH-006,点击连接;(备注: EH0O6为不带MP3功能; EH-006为带MP3功能) :关机状态，长按开机键3秒,进入配对状态, LED指示灯红产品服务保修卡产品型号: 购买日期: 维修内容: 维修人签名: 保修须知： 1、本公司提供的免费保修期,时间从购买之日起计算。 2、人为破坏,外观件磨损，以及外部条件异常所造成的损坏，不在免费保修范围内。 3、如遇产品质量问题，请立即与本公司联系,切勿自行拆卸。 4、保修时请携带此卡，到指定维修中心进行维修。一年 s U ser M anual Principles of bone conduction Most of the sounds we hear is the result of sound waves passing through our eardrum to make the vibrate so that the sound waves can be conducted to the innernal auditory ear canal; Another way is that sound waves are transmitted directly conducted to the innernal auditory ear canal through the vibration of the bone instead of eardrum. This is also a way for people to hear their own voice and this sound conduction is called bone conduction. How to wear 将耳机挂在颈后,两侧的扬声器贴在面颊骨,调整佩戴的舒适度 Hang the headphne behind your neck with both speaker clinging to your cheekbones, after that, adjust it until you feel comfortable. Product Specifications Model-------EH006 Music playing time - ------ Standard state: 6-8 hours Standby time-------20 days Charging time------2 hours Bluetooth version------5.3 Waterproof grade------IP8 Speaker Impedance------8Ω Microphone Sensitivity-----42 ± 2db P roduct weight-------24g Bluetooth connection distance------15 meters Charging voltage------5v Charging current------100mA Protocol--------A2DP,AVRCP,HSP,HFP Safety w arning The correct wearing position of this earphone bone conduction earphone is the cheekbone in front of the ear. Do not put the bone conduction speaker in the ear; listening to loud music for a long time may cause discomfort, please use the medium or so as far as possible. volume, avoid using high volume for a long time; Regardless of the volume, using headphones will affect your perception of ambient sound, so you need to pay more attention when using headphones; Do not throw or sit on the earphones; Headphones should be kept away from fire, water and high pressure equipment; Not suitable for children under three years old, contains small parts; Do not classify it as household waste, but take it to the approp riate local recycling station for electrical and electronic equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. 产品中有毒有害物质或元素的名称及含量有害物质部件名称印刷线路板金属部件电池塑料部件线缆 X X X X 铅汞镉六价铬多溴联苯多溴二苯醚表示该有毒有害物质在该部件所有均质材料中的含量均在G B/T26572规定的限量要求下。表示该有毒有害物质至少在该部件的某一均质的含量超出规定的限量要求。GB/T26572 X （P b）（H g）（C d）（C r(VI)）（P BB）（P BDE） 10 本表格依据S J/T 11364的规定编制。按键功能概述骨传导原理佩戴说明产品规格 EH 006 BO N E CO N D U CTIO N HEA D PH O N E Controlling instructions Pow er on: When the headset is power off, press the power button for 3 seconds, the LED blue light flashes, Prompt tone “power on;” means power on; Pow er off: When the headset is power on, press and hold the power button for 3 seconds, the red LED flashes once to power off, Prompt tone “poweroff ” means power off; Bluetooth connection: When the headphone i s Power off state, press and hold the power button for 3 seconds to enter the pairing state, the LED indicator flashes red and blue, and the headset prompts: Pairing; the device (smartphone, tablet, etc.) searches for EH006 or EH-006, click to connect ; (N ote: EH 006 is w ithout M P3 function; EH-006 is w ith M P3 function) Successful connection: When the headset is successfully connected to the device, t he blue LED light flashes for 3 seconds - down, and the headset prompts: Connected; Disconnected: It prompts Disconnected, and the mobile phone automatically turns off the Bluetooth, and automatically shuts down after 10 minutes if there is no connection (it can automatically reconnect to the last record within 10 minutes or be searched for connection by other devices); Pause/Play: When the music is playing, click the multi-function button to pause, a nd then click the multi-function button to play; Answ er/hang up: In incom ing call status: click the multi-function button to answer, double-click the multi-function button to reject the call; In the call state: click the multi-function button to hang up; Volum e up: click the volume up key; Volum e dow n: click the volume down key; N ext song: long press the volume plus key; Previous song: long press the volume down key; Includes: Eh006, charge cable, and user guide Please read and follow this user guide thoroughly before using the Eh006. ① Magnetic charging port ② - Volume down button / Previous track ③ Multi-function button (Power ON/OFF, start/pause, accept/end phone calls) ④ + Volume u…

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Attestation Statements

Zhongshiyuan Technology (Shenzhen) Co., LTD Room 201, Building 25, Xinye Village, Building 25-27, Zone 8, Xinanhu Community, Xin'an Street, Bao'an District, Shenzhen,China U.S. Agent Letter of Attestation To: Federal Communications Commission 7435 Oakland Mills Road, Columbia, MD 21046, USA Date: 02-15-2023 Ref: Attestation Statement – Part 2.911(d)(7) filing FCC ID: 2A9QK-EH006 Zhongshiyuan Technology (Shenzhen) Co., LTD (“the applicant”) certifies that, as of the date of the filing of the application, THREE STONES MEDIA LLC (“the agent”) is our designated U.S. agent for service of process for the above reference FCC ID. The applicant accepts to maintain an agent for service of process in the United States for no less than one year after either the grantee has permanently terminated all marketing and importation of the applicable equipment within the U.S., or the conclusion of any Commission-related administrative or judicial proceeding involving the equipment, whichever is later. The applicant further acknowledges it is our responsibility to inform the FCC whenever the agent information changes. THREE STONES MEDIA LLC ("the agent) understand it is the agent's obligation to accept service of process in the United States for matters related to the applicable equipment, and at the physical U.S. address and email address. Designated U.S. Agent Company Name: THREE STONES MEDIA LLC FRN: 0033401761 GC: 2A99E Address:1200 Broadway St. APT 329, Los Angeles, CA 90015, United States Signature: Contact Person: Sijie Zhang Tel: +1 267 909 3692 Email: [email protected] Applicant Company Name: Zhongshiyuan Technology (Shenzhen) Co., LTD Address: Room 201, Building 25, Xinye Village, Building 25-27, Zone 8, Xinanhu Community, Xin'an Street, Bao'an District, Shenzhen,China Signature: Contact Person: Meiyan Jiang Tel: +86-13425121197 Email: [email protected]

Cover Letter(s)

Zhongshiyuan Technology (Shenzhen) Co., LTD Jan.12, 2023 Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 USA Subject: Explanation of differences between product types FCC ID : 2A9QK-EH006 Model Number: EH006, EH-006, EH006PRO To Whom It May Concern: We, The Zhongshiyuan Technology (Shenzhen) Co., LTD hereby declare that the models are identical except the memory card, EH006PRO has 32G memory card, EH006 and EH-006 don't . Except for the different above, no other modification is performed. Sincerely, Signature: Zhongshiyuan Technology (Shenzhen) Co., LTD Contact person: Meiyan Jiang

Cover Letter(s)

Zhongshiyuan Technology (Shenzhen) Co., LTD Agent Authorization Company: Zhongshiyuan Technology (Shenzhen) Co., LTD Address: Room 201, Building 25, Xinye Village, Building 25-27, Zone 8, Xinanhu Community, Xin'an Street, Bao'an District, Shenzhen,China Product Name: Bone Conduction Bluetooth Headphone Model Number(s): EH006, EH-006, EH006PRO Product Description: Bone Conduction Bluetooth Headphone We authorize MiCOM Labs Inc., 575 Boulder Court, Pleasanton, California 94566, USA, to act on our behalf on all matters concerning the certification of above named equipment. We declare that MiCOM Labs Inc. is allowed to forward all information related to the approval and certification of equipment to the regulatory agencies as required and to discuss any issues concerning the approval application. Any and all acts carried out by MiCOM Labs on our behalf shall have the same effect as acts of our own. Signature: Date: 2023-01-12 Name: Meiyan Jiang Company: Zhongshiyuan Technology (Shenzhen) Co., LTD

Cover Letter(s)

ZhongshiyuanTechnology(Shenzhen)Co.,LTD OfficeofEngineeringTechnology FederalCommunicationsCommission 7435OaklandMillsRoad Columbia,MD21046 USA Date: 2022-12-30 Subject;RequestforConfidentiality FCCID:2A9QK-EH006 ToWhomItMayConcern, PursuanttotheprovisionsoftheCommission’srulesTitle47Sections§0.457and§0.459,we arerequestingtheCommissiontowithholdthefollowingattachment(s)asconfidential documentsfrompublicdisclosureindefinitely. Thesedocumentscontaindetailedsystemandequipmentdescriptionsandareconsideredas proprietaryinformationinoperationoftheequipment.Thepublicdisclosureofthesedocuments mightbeharmfultoourcompanyandwouldgivecompetitorsanunfairadvantageinthemarket. SchematicDiagram BlockDiagram PartsList OperationalDescription Tune-upProcedure Inadditionaltoabovementioneddocuments,inordertocomplywiththemarketingregulations inTitle47CFR§2.803andtheimportationrulesinTitle47CFR§2.1204,whileensuringthat businesssensitiveinformationremainsconfidentialuntiltheactualmarketingofnewly authorizeddevices,werequestShortTermConfidentialityofthefollowingattachment(s); ExternalPhotos TestSetupPhotos InternalPhotos UserManual For45days,pursuanttoPublicNoticeDA04-1705. OR For180dayspursuanttoKDB726920D01. Itisourunderstandingthatallmeasurementtestreports,FCCIDlabelformatand correspondenceduringthecertificationreviewprocesscannotbegrantedasconfidential documentsandthisinformationwillbeavailableforpublicreviewoncethegrantofequipment authorizationisissued. Sincerely ZhongshiyuanTechnology(Shenzhen)Co.,LTD Contactperson:MeiyanJiang

External Photos

Report No.: AGC15268221201AP03 Page 1 of 4 EXTERNAL PHOTOS ALL VIEW OF EUT TOP VIEW OF EUT Report No.: AGC15268221201AP03 Page 2 of 4 BOTTOM VIEW OF EUT FRONT VIEW OF EUT Report No.: AGC15268221201AP03 Page 3 of 4 BACK VIEW OF EUT LEFT VIEW OF EUT Report No.: AGC15268221201AP03 Page 4 of 4 RIGHT VIEW OF EUT PORT VIEW OF EUT ****************************************End of Report****************************************

ID Label/Location Info

FCC ID Label Location 10mm&15mm FCC ID: 2A9QK-EH006

Internal Photos

Report No.: AGC15268221201AP03 Page 1 of 3 INTERNAL PHOTOS OPEN VIEW OF EUT BATTERY VIEW OF EUT Report No.: AGC15268221201AP03 Page 2 of 3 INTERNAL VIEW OF EUT (FIGURE 1) INTERNAL VIEW OF EUT (FIGURE 2) Report No.: AGC15268221201AP03 Page 3 of 3 ANTENNA CLOSE-UP PHOTO-1 ****************************************End of Report**************************************** BT Antenna

RF Exposure Info

RF EXPOSURE EVALUATION 1. PRODUCT INFORMATION Product Description Bone Conduction Bluetooth Headphone Model Name EH006 Series Model EH-006, EH006PRO FCC ID 2A9QK-EH006 2. EVALUATION METHOD According to 447498 D01 General RF Exposure Guidance v06 The 1-g and 10-g SAR test exclusion thresholds for 100 MHz to 6 GHz at test separation distances ≤ 50 mm are determined by: [(max. power of channel, including tune-up tolerance, mW)/(min. test separation distance, mm)] ·[√f(GHz)] ≤ 3.0 for 1-g SAR and ≤ 7.5 for 10-g extremity SAR. Where f(GHz) is the RF channel transmit frequency in GHz Power and distance are rounded to the nearest mW and mm before calculation 3. CALCULATION BR/EDR: P t =0.092dBm=1.02mW The value of the Maximum output power P t is referred to the test report of the CFR47 §15.247. The result for RF exposure evaluation SAR=(1.02mW /5mm) .[√2.402GHz)]=0.32<3.0 for 1-g SAR and ≤ 7.5 for 10-g extremity SAR. BLE: P t = -2.695dBm=0.54mW The value of the Maximum output power P t is referred to the test report of the CFR47 §15.247. The result for RF exposure evaluation SAR=(0.54mW /5mm) .[√2.402GHz)]=0.17<3.0 for 1-g SAR and ≤ 7.5 for 10-g extremity SAR. 4. CONCLUSION The SAR evaluation is not required.

Test Report

Page 1 of 42 FCC Test Report Report No.: AGC15268221201FE02 FCC ID : 2A9QK-EH006 APPLICATION PURPOSE : Original Equipment PRODUCT DESIGNATION : Bone Conduction Bluetooth Headphone BRAND NAME : elfhunter MODEL NAME : EH006, EH-006, EH006PRO APPLICANT : Zhongshiyuan Technology (Shenzhen) Co., LTD DATE OF ISSUE : Dec. 29, 2022 STANDARD(S) : FCC Part 15.247 REPORT VERSION : V1.0 Attestation of Global Compliance (Shenzhen) Co., Ltd Report No.: AGC15268221201FE02 Page 2 of 42 REPORT REVISE RECORD Report Version Revise Time Issued Date Valid Version Notes V1.0 / Dec. 29, 2022 Valid Initial Release Report No.: AGC15268221201FE02 Page 3 of 42 TABLE OF CONTENTS 1. VERIFICATION OF COMPLIANCE .................................................................................................................. 5 2. GENERAL INFORMATION .............................................................................................................................. 6 2.1. PRODUCT DESCRIPTION ........................................................................................................................ 6 2.2. TABLE OF CARRIER FREQUENCYS ....................................................................................................... 6 2.3. RELATED SUBMITTAL(S)/GRANT(S) ....................................................................................................... 7 2.4. TEST METHODOLOGY ............................................................................................................................. 7 2.5. SPECIAL ACCESSORIES .......................................................................................................................... 7 2.6. EQUIPMENT MODIFICATIONS ................................................................................................................. 7 2.7. ANTENNA REQUIREMENT ....................................................................................................................... 7 3. MEASUREMENT UNCERTAINTY ................................................................................................................... 8 4. DESCRIPTION OF TEST MODES ................................................................................................................... 9 5. SYSTEM TEST CONFIGURATION ................................................................................................................ 10 5.1. CONFIGURATION OF TESTED SYSTEM ............................................................................................... 10 5.2. EQUIPMENT USED IN TESTED SYSTEM .............................................................................................. 10 5.3. SUMMARY OF TEST RESULTS .............................................................................................................. 10 6. TEST FACILITY ............................................................................................................................................... 11 7. PEAK OUTPUT POWER ................................................................................................................................ 12 7.1. MEASUREMENT PROCEDURE .............................................................................................................. 12 7.2. TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) .................................................................... 12 7.3. LIMITS AND MEASUREMENT RESULT .................................................................................................. 13 8. BANDWIDTH .................................................................................................................................................. 15 8.1. MEASUREMENT PROCEDURE .............................................................................................................. 15 8.2. TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) .................................................................... 15 8.3. LIMITS AND MEASUREMENT RESULTS ............................................................................................... 15 9. CONDUCTED SPURIOUS EMISSION........................................................................................................... 19 9.1. MEASUREMENT PROCEDURE .............................................................................................................. 19 9.2. TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) .................................................................... 19 9.3. MEASUREMENT EQUIPMENT USED .................................................................................................... 19 9.4. LIMITS AND MEASUREMENT RESULT .................................................................................................. 19 10. MAXIMUM CONDUCTED OUTPUT POWER SPECTRAL DENSITY ........................................................ 26 Report No.: AGC15268221201FE02 Page 4 of 42 10.1. MEASUREMENT PROCEDURE ............................................................................................................ 26 10.2. TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) .................................................................. 26 10.3. MEASUREMENT EQUIPMENT USED .................................................................................................. 26 10.4. LIMITS AND MEASUREMENT RESULT................................................................................................ 26 11. RADIATED EMISSION ................................................................................................................................. 28 11.1. MEASUREMENT PROCEDURE ............................................................................................................ 28 11.2. TEST SETUP .......................................................................................................................................... 29 11.3. LIMITS AND MEASUREMENT RESULT........................................…

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Test Report

承認書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ：客戶料號 CUSTOMER’S P/N ：料號 PART NUMBER ： WAN2012F245C04 規格 DESCRIPTION ： Chip Antenna 2012 L Ant 2.45G Type 04 版本 VERSION ： V1.3 日期 ISSUE DATE ： 2020/02/17 客戶承認 CUSTOMER APPROVED 工程部 R&D CENTER 承認 APPROVAL 確認 CHECKED 製作 DRAWN Ray Tennyson Snow 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112台北市北投區立功街151號1樓 1F, No. 151, Li Gong Street, Beitou District, Taipei City 112, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 2/11 ONEWAVE TECHNOLOGY CO., LTD. 2012 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 2.05 ± 0.20 W 1.23 ± 0.20 T 0.45 ± 0.20 P/N: WAN2012F245C04 3/11 ONEWAVE TECHNOLOGY CO., LTD. Part Number Information WAN 2012 F 245 C 04 A B C D E F A Product Series Antenna B Dimension L x W 2.05X1.23mm ( ± 0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode PIFA & Single Feeding F Antenna type Type = 04 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN2012F245C04 Central Frequency 2450 MHz Bandwidth 85 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 1.72 dBi Impedance 50 Ohm Operating Temperature -40～+110 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Ni / Au (Leadless) 4/11 ONEWAVE TECHNOLOGY CO., LTD. 2. Recommended PCB Pattern Evaluation Board Dimension (board size 80x40mm) 2 nd Evaluation Board Dimension Evaluation Board Dimension (board size 80x40mm) Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感±0.1~0.3nH、電容±0.1pF 1.0pF 5/11 ONEWAVE TECHNOLOGY CO., LTD. Layout Dimensions in Clearance area( Size=3.0*5.0mm) FootPrint (Unit : mm) ◆ 2 nd Layout Dimensions in Clearance area( Size=8.0*2.5mm) Matching circuit Tuning Component Matching circuit Tuning Component 6/11 ONEWAVE TECHNOLOGY CO., LTD. 3. Measurement Results Return Loss 7/11 ONEWAVE TECHNOLOGY CO., LTD. Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 63.12 % 1.62 dBi 3.61 dBi 2450MHz 70.56 % 1.72 dBi 3.23 dBi 2500MHz 65.48 % 1.64 dBi 3.47 dBi Chamber Coordinate System Z Y X 8/11 ONEWAVE TECHNOLOGY CO., LTD. 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10 ± 0.5 sec. 60 sec . . T E M P ( °C ) 150 °C 2 6 0 °C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30± 3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40± 2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C 9/11 ONEWAVE TECHNOLOGY CO., LTD. 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 10/11 ONEWAVE TECHNOLOGY CO., LTD. 6.Packaging Information Tape Specification: Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 13.5±0.5 178±2 4000 11/11 ONEWAVE TECHNOLOGY CO., LTD. 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal elec…

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Test Setup Photos

Report No.: AGC15268221201AP02 Page 1 of 2 TEST SETUP PHOTOS RADIATED EMISSION TEST SETUP BELOW 1GHz RADIATED EMISSION TEST SETUP ABOVE 1GHz Report No.: AGC15268221201AP02 Page 2 of 2 RF CONDUCTED TES SETUP ****************************************End of Report*************************************