2ACIJ71050-3Bluetooth LE Wireless Module

PEDK71050-03-06 Issue Date：Dec,15,2014 MK71050-03 Preliminary Bluetooth ® Low Energy wireless module 1/20 ■Overview MK71050-03 is a Bluetooth® Low Energy (here in after LE) wireless module which is integrating ML7105C-001 Bluetooth LE SoC, E2PROM, 26MHz crystal oscillator, 2.4GHz PCB pattern antenna and passive components. It has Bluetooth® LE compliant 2.4GHz band radio communication capability. MK71050-03 is suitable for applications such as Healthcare device, Remote Controller or PC peripherals. ■Features • Bluetooth® SIG Core Spec v4.0 compliant • Radio certification MIC JAPAN(certification no:006-000238） FCC（FCC ID:2ACIJ71050-3） CE（R&TTE） • Integrating ML7105C-001 Bluetooth ® LE single mode LSI • Integrating 26MHz xtal oscillator • Integrating 128kbit EEPROM • Single power supply 1.8V to 3.6V • Operating Temperature -20 deg.C to 70 deg.C • Current Consumptions Deep Sleep Mode 0.8uA（Typ.） (with external Low Power Clock) Idle Mode 3mA （Typ.） TX mode 9mA （Typ.） RX mode 9mA （Typ.） • Dimension 10.7mm(W) x 13.6mm (L) x 1.78mm (H) • Pb Free, RoHS compliant • Product Name MK71050-03 PEDK71050-03-06 MK71050-03 2/20 ■Schematics U1 ML7105C-001 VDDRF SWOUT SWRX SWTX PLLLPF XON XOPTMODE EFUSE A1A0 GPIO0 GPIO1 GPIO2 GPIO3 SPIDIN SPIDOUT SPIXCS SPICLK UART_TXD UART_RXD I2C_SDA I2C_SCL VDDBAT VDDIO REGOUT VDDCORE REGC RESETB LPCLKIN LPCLKBUS VDDBAT SCL SDA UART_RXD UART_TXD SPICLK SPIXCS SPIDOUT SPIDIN LPCLKBUS LPCLKIN RESETB GPIO3 GPIO2 GPIO1 GPIO0 A1A0 C1C2 C4 10uF C5 C6 L1 C7 C8 R1 C10C11 N.M. N.M. X1 26MHz C12C13 10uF R4 R5 0Ω GND (Package GND) VDDVCO VDDCORE C3 C9 ANT1 Outside module R7 Outside module R8 C16 L2 OUT_ANT OUT_MOD Outside module REGC EFUSE TMODE SD G Q1 NC ANT_GND FETGATE SDA (5)SCL (6)WP (7) A0 (1) A1 (2)A2 (3) (4) GND (8) VCC GND R6 C15 U2 EEPROM 128Kbit VDDBAT U1 ML7105C-001 VDDRF SWOUT SWRX SWTX PLLLPF XON XOPTMODE EFUSE A1A0 GPIO0 GPIO1 GPIO2 GPIO3 SPIDIN SPIDOUT SPIXCS SPICLK UART_TXD UART_RXD I2C_SDA I2C_SCL VDDBAT VDDIO REGOUT VDDCORE REGC RESETB LPCLKIN LPCLKBUS VDDBAT SCL SDA UART_RXD UART_TXD SPICLK SPIXCS SPIDOUT SPIDIN LPCLKBUS LPCLKIN RESETB GPIO3 GPIO2 GPIO1 GPIO0 A1A0 C1C2 C4 10uF C5 C6 L1 C7 C8 R1 C10C11 N.M. N.M. X1 26MHz C12C13 10uF R4 R5 0Ω GND (Package GND) VDDVCO VDDCORE C3 C9 ANT1 Outside module R7 Outside module R8 C16 L2 OUT_ANT OUT_MOD Outside module REGC EFUSE TMODE SD G Q1 NC ANT_GND FETGATE SDA (5)SCL (6)WP (7) A0 (1) A1 (2)A2 (3) (4) GND (8) VCC GND R6 C15 U2 EEPROM 128Kbit VDDBAT PEDK71050-03-06 MK71050-03 3/20 ■Pin assignment TOP VIEW 12 13 14 1 2 3 4 5 6 7 8 9 10 11 242322212019181716 15 37 36 35 34 33 32 31 30 29 28 27 26 25 ANT_GND NC ANT_GND ANT_GND OUT_ANT OUT_MOD GND VDDCORE VDDBAT LPCLKBUS LPCLKIN REGC EFUSE NC SPIDIN GPIO0/RF_ACTIVE GPIO1/WAKEUP GPIO2/IRQ FETGATE TMODE RESETB A0 A1 NC ANT_GND NC ANT_GND ANT_GND GPIO3/PS_CONTROL 39404142434445464748 38 ANT_GND 49 GND 50 GND 51 GND 52 GND PEDK71050-03-06 MK71050-03 4/20 ■Pin definitions No Pin Name I/O Ana/DigI/O typeFunction 1 ANT_GND --- --- --- Antenna GND（※Refer to PIN descriptions.） 2 NC --- --- --- No connection（※Refer to PIN descriptions.） 3-4 ANT_GND --- --- --- Antenna GND（※Refer to PIN descriptions.） 5 NC --- --- --- No connection（※Refer to PIN descriptions.） 6 OUT_ANT INOUT ANA --- Output from Antenna (to be connected to OUT_MOD by user's PCB) 7 OUT_MOD INOUT ANA --- Output from Module (to be connected to OUT_ANT by user's PCB) 8 GND --- GND GND GND 9 VDDCORE --- PWR VCC Internally generated power supply, 10 VDDBAT --- PWR VCC Power supply 1.8 to 3.6V, require 10uF capacitor. 11 LPCLKBUS INOUT ANA DIRIO Please use this pin open. 12 LPCLKIN INOUT ANA DIRIO Low Power clock input 13 REGC OUT ANA DIRIO REGOUT, require 10uF capacitor. 14 EFUSE --- DIG DIRIO Control signal for EFUSE programming, fix to GND for normal usage 15 SPIDIN IN DIG CMOS, IN Data input for SPI slave 16 SPIDOUT INOUT DIG CMOS, BiDIR Data output for SPI slave 17 SPIXCS IN DIG CMOS, IN Chip select for SPI slave 18 SPICLK IN DIG CMOS, IN Clock input for SPI slave 19 GND --- GND GND GND 20 UART_TXD OUT DIG CMOS, OUT Data TX port for UART 21 UART_RXD IN DIG CMOS, IN Data RX port for UART 22 GND --- GND GND GND 23 SDA INOUT DIG CMOS, BiDIR SDA data port for I2C 24 SCL INOUT DIG CMOS, BiDIR SCL clock port for I2C 25 GPIO0/RF_ACTIVEINOUT DIG CMOS, BiDIR GPIO inout/RF_Active 26 GPIO1/WAKEUP INOUT DIG CMOS, BiDIR GPIO inout/WAKEUP 27 GPIO2/IRQ INOUT DIG CMOS, BiDIR GPIO inout/IRQ 28 GPIO3/PS_CONTR OL INOUT DIG CMOS, BiDIR GPIO inout/external switch control (Q1) (To be connected to FETGATE by user's PCB.) 29 FETGATE IN DIG --- Gate control Pin of internal FET (To be connected to PS_CONTROL by user's PCB.) 30 TMODE IN DIG CMOS, IN Test mode control, fix to GND for normal usage 31 RESETB IN DIG CMOS, IN Reset, low active 32 A0 IN ANA DIRIO Analog Test Pin0 33 A1 IN ANA DIRIO Analog Test Pin1 34 NC --- --- --- No connection（※Refer to PIN descriptions.） 35 ANT_GND --- --- --- Antenna GND（※Refer to PIN descriptions.） PEDK71050-03-06 MK71050-03 5/20 36 NC --- --- --- No connection（※Refer to PIN descriptions.） 37-48 ANT_GND --- --- --- Antenna GND（※Refer to PIN descriptions.） 49-52 GND --- GND GND GND ■PIN descriptions I/O symbol I RF ： RF input output pin I ： Digital input pin Ipd ： Digital input with pull-down resistor I AH ： Analog High voltage input pin I SH ： Low power clock input pin X SH ： Low power clock oscillator pin O 2 ： Digital output pin with 2mA load capability B 2 ： Digital bidirectional pin with 2mA load capability B 2PU ： Digital bidirectional pin with 2mA load capability and pull-up resistor ●RF, Analog signals # Pin Name Status/Value at reset I/O Active Level Function 6 OUT_ANT I RF --- Output from Antenna (to be connected to OUT_MOD by user's PCB) 7 OUT_MOD I RF --- Output from Module (to be connected to OUT_ANT by user's PCB) 32 A0 Hi-Z I AH --- Analog test pin0 33 A1 Hi-Z I AH, --- Analog test pin1 ●XO、LPX O signals # Pin Name Status/Value at reset I/O Active Level Function 11 LPCLKBUS 0V X SH --- Please use th…

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© 2014 LAPIS Semiconductor Co ., Ltd. All Rights Reserved 5 5．Block Diagrams ML7105C-002 Bluetooth Low Energy IC Pattern Antenna2402 ～ 2480MHz RX pathControl path TX path HCI （ UART ） BR24T128NUX-W EEPROM Crystal 26MHz X1 U1U2 Bluetooth LE Single ModuleMK71050-03 Proprietary stack- application interface （ SPI ） VDD （ 1.8V ～ 3.6V ）

© 2014 LAPIS Semiconductor Co ., Ltd. All Rights Reserved 8 8. External Photos(1/2) Top Bottom Side-(B) ※ Side-(R) ※ ※ Refer to the external photos of next page. updated © 2014 LAPIS Semiconductor Co ., Ltd. All Rights Reserved 9 8. External Photos(2/2) Side- （ R ） Side-(B) updated

© 2014 LAPIS Semiconductor Co ., Ltd. All Rights Reserved 10 9. Internal Photos Top Bottom updated

© 2014 LAPIS Semiconductor Co ., Ltd. All Rights Reserved 2 2．Operational Description ■ Overview MK71050-03 is a Bluetooth® Low Ener gy (here in after LE) wirele ss module which is integrating ML7105C-001 Bluetooth LE SoC, E2PR OM, 26MHz crystal oscillator, 2.4GHz PCB pattern antenna and passive components.It has Bluetooth® LE compliant 2.4GHz band radio communication capability. MK71050-03 is suitable for applicat ions such as Healthcare devi ce, Remote Controller or PC peripherals. ■ Features • Bluetooth® SIG Core Spec v4.0 compliant• Integrating ML7105C-001 Bluetooth® LE single mode LSI• Integrating 26MHz xtal oscillator• Integrating 128kbit EEPROM• Single power supply 1.8V to 3.6V• Operating Temperature -20 deg.C to 70 deg.C• Current Consumptions Deep Sleep Mode 0.8uA （ Typ. ） (with external Low Power Clock) Idle Mode 3mA （ Typ. ） TX mode 9mA （ Typ. ） RX mode 9mA （ Typ. ） • Dimension 10.6mm(W) x 13.7mm (L) x 1.78mm (H)• Pb Free, RoHS compliant• Product Name MK71050-03

Technical Comments/response

SGS RF Technologies Inc. Page 1 of 1 472, Nippa-cho, Kohoku-ku, Yokohama, 223-0057, Japan Telephone: +81+(0)45- 534-0645, FAX: +81+(0)45- 534-0646, Web: http://www.rf-test.jp RF Exposure Statement Product description Test item : Bluetooth Low Energy Wireless Module Manufacturer : LAPIS Semiconductor Co., Ltd. Address : 2-4-8 Shinyokohama, Kouhoku-ku, Yokohama 222-8575, Japan Model : MK71050-03 FCC ID : 2ACIJ71050-3 Operating frequency range : 2402 - 2480 MHz TX output power (Cond) : 0.15dBm @2.402GHz, 0.22dBm @2.440GHz, -0.11dBm @2.480GHz Antenna Type : Pattern antenna Maximum Antenna Gain : 2.14dBi Analysis for portable use Standalone SAR test exclusion considerations are defined in the KDB 447498 Chapter 4.3.1. 1-g head or body SAR exclusion threshold is defined with formula. [(Max. power of channel, mW) / (Min. test separation distance, mm)] *[ √f (GHz)] ≤ 3.0 for 1-g SAR The maximum Conducted Peak Output Power is 0.22dBm (2.440GHz). The best case gain of the antenna is 2.14 dBi. EIRP = (0.22dBm) + (2.14 dBi) = 2.36 dBm 2.36dBm logarithmic terms covert to numeric result is nearby 1.72mW General RF Exposure = (1.72mW / 5mm) * √2.440GHz = 0.537 ≤ 3.0 Other frequency results are General RF Exposure = (1.69mW / 5mm) * √2.402GHz = 0.524 ≤ 3.0 General RF Exposure = (1.60mW / 5mm) * √2.480GHz = 0.504 ≤ 3.0 Bluetooth Low Energy Wireless Module MK71050-03 meets the SAR exclusion. So SAR evaluation is not needed.

© 2014 LAPIS Semiconductor Co ., Ltd. All Rights Reserved 6 6．Schematics U1 ML7105C-002 VDDRFSWOUSWRXSWTXPLLLPF XON XOP TMODE EFUSE A1 A0 GPIO0 GPIO1 GPIO2 GPIO3 SPIDIN SPIDOUT SPIXCS SPICLK UART_TXD UART_RXD I2C_SDA I2C_SCL VDDBAT VDDIO REGOUT VDDCORE REGC RESETB LPCLKIN LPCLKBUS VDDBAT SCLSDA UART_RXDUART_TXDSPICLKSPIXCSSPIDOUTSPIDIN LPCLKBUS LPCLKIN RESETB GPIO3 GPIO2 GPIO1 GPIO0 A1 A0 C1 C2 C4 10pF 100nF 100nF 10uF C5 C6 100nF 2.5nH L1 C7C8 R1 C10 C11 18nHN.M.N.M. 680pF 1.2k Ω 3300pF X1 26MHz C12 C13 6pF 7pF 10uF R4 R5 4.7k Ω 4.7k Ω 0 Ω GND (Package GND) VDDVCO VDDCORE C3 2.2uF C9 1.8pF ANT1 Outside module R7 10 Ω Outside module R8 10pF C16 0.8nH L2 0.5pF OUT_ANT OUT_MOD Outside module REGC EFUSE TMODE RZM002P02 SD G Q1 NC ANT_GND FETGATE SDA (5) SCL (6) WP (7) A0 (1) A1 (2) A2 (3) (4) GND (8) VCC GND R6 10k Ω C15 100nF U2 BR24T128NUX-WVSON008X2030 2.0x3.0mm VDDBAT U1 ML7105C-002 VDDRFSWOUSWRXSWTXPLLLPF XON XOP TMODE EFUSE A1 A0 GPIO0 GPIO1 GPIO2 GPIO3 SPIDIN SPIDOUT SPIXCS SPICLK UART_TXD UART_RXD I2C_SDA I2C_SCL VDDBAT VDDIO REGOUT VDDCORE REGC RESETB LPCLKIN LPCLKBUS VDDBAT SCLSDA UART_RXDUART_TXDSPICLKSPIXCSSPIDOUTSPIDIN LPCLKBUS LPCLKIN RESETB GPIO3 GPIO2 GPIO1 GPIO0 A1 A0 C1 C2 C4 10pF 100nF 100nF 10uF C5 C6 100nF 2.5nH L1 C7C8 R1 C10 C11 18nHN.M.N.M. 680pF 1.2k Ω 3300pF X1 26MHz C12 C13 6pF 7pF 10uF R4 R5 4.7k Ω 4.7k Ω 0 Ω GND (Package GND) VDDVCO VDDCORE C3 2.2uF C9 1.8pF ANT1 Outside module R7 10 Ω Outside module R8 10pF C16 0.8nH L2 0.5pF OUT_ANT OUT_MOD Outside module REGC EFUSE TMODE RZM002P02 SD G Q1 NC ANT_GND FETGATE SDA (5) SCL (6) WP (7) A0 (1) A1 (2) A2 (3) (4) GND (8) VCC GND R6 10k Ω C15 100nF U2 BR24T128NUX-WVSON008X2030 2.0x3.0mm VDDBAT SDA (5) SCL (6) WP (7) A0 (1) A1 (2) A2 (3) (4) GND (8) VCC GND R6 10k Ω C15 100nF U2 BR24T128NUX-WVSON008X2030 2.0x3.0mm VDDBAT

Issue Date: 10 Oct. 2014 Report No.: ERY1410P10R9 Model: MK71050-03 SGS RF Technologies Inc. Page 1 of 29 472, Nippa-cho, Kohoku-ku, Yokohama, 223-0057, Japan Telephone: +81+(0)45- 534-0645, FAX: +81+(0)45- 534-0646, Web: http://www.rf-test.jp TEST REPORT For Bluetooth Low Energy Wireless Module In conformity with FCC CFR 47 Part15 Subpart C Model : MK71050-03 FCC ID : 2ACIJ71050-3 Report No. : ERY1410P10R9 Issue Date : 10 Oct. 2014 Prepared for LAPIS Semiconductor Co., Ltd. 2-4-8 Shinyokohama, Kouhoku-ku, Yokohama 222-8575 Japan Telephone: +81 - (0)45 - 476 - 9295 Prepared by SGS RF Technologies Inc. 472, Nippa-cho, Kohoku-ku, Yokohama, 223-0057, Japan Telephone: +81+(0)45- 534-0645 FAX: +81 - (0)45 - 534 - 0646 Issue Date: 10 Oct. 2014 Report No.: ERY1410P10R9 Model: MK71050-03 SGS RF Technologies Inc. Page 2 of 29 472, Nippa-cho, Kohoku-ku, Yokohama, 223-0057, Japan Telephone: +81+(0)45- 534-0645, FAX: +81+(0)45- 534-0646, Web: http://www.rf-test.jp This document is issued by the Company subject to its General Conditions of Service printed overleaf, available on request or accessible at www.sgs.com/terms_and_conditions.htm and, for electronic format documents, subject to Terms and Conditions for Electronic Documents at www.sgs.com/terms_e-document.htm. Attention is drawn to the limitation of liability, indemnification and jurisdiction issues defined therein. Any holder of this document is advised that information contained hereon reflects the Company’s findings at the time of its intervention only and within the limits of Client’s instructions, if any. The Company’s sole responsibility is to its Client and this document does not exonerate parties to a transaction from exercising all their rights and obligations under the transaction documents. This document cannot be reproduced except in full, without prior written approval of the Company. Any unauthorized alteration, forgery or falsification of the content or appearance of this document is unlawful and offenders may be prosecuted to the fullest extent of the law. SGS RF Technologies Inc. is managed to ISO17025 and has the necessary knowledge and test facilities for testing according to the referenced standards. The test results in this report apply only to the sample(s) tested. Issue Date: 10 Oct. 2014 Report No.: ERY1410P10R9 Model: MK71050-03 SGS RF Technologies Inc. Page 3 of 29 472, Nippa-cho, Kohoku-ku, Yokohama, 223-0057, Japan Telephone: +81+(0)45- 534-0645, FAX: +81+(0)45- 534-0646, Web: http://www.rf-test.jp Table of contents 1 General information ...................................................................................................................... 4 1.1 Product description ................................................................................................................................................ 4 1.2 Test(s) performed/ Summary of test result ............................................................................................................ 4 1.3 Test facility ............................................................................................................................................................ 5 1.4 Measurement uncertainty ....................................................................................................................................... 5 1.5 Summary of test results .......................................................................................................................................... 6 1.6 Setup of equipment under test (EUT) .................................................................................................................... 6 1.6.1 Test configuration of EUT ............................................................................................................................. 6 1.6.2 Operating condition: ...................................................................................................................................... 6 1.6.3 Setup diagram of tested system ...................................................................................................................... 7 1.7 Equipment modifications ....................................................................................................................................... 7 1.8 Deviation from the standard .................................................................................................................................. 7 2 Test procedure and test data ........................................................................................................ 8 2.1 Occupied Bandwidth (99%) ................................................................................................................................... 8 2.2 6dB Bandwidth .................................................................................................................................................... 10 2.3 Peak Output Power .............................................................................................................................................. 12 2.4 Conducted Spurious Emissions ............................................................................................................................ 14 2.5 Power Spectral density ......................................................................................................................................... 18 2.6 Radiated emissions .............................................................................................................................................. 20 2.7 AC power line conducted emissions .................................................................................................................... 25 3 Test setup photographs ............................................................................................................... 28 3.1 Radiated emissions .....................................................…

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Issue Date: 10 Oct. 2014 Report No.: ERY1410P10R9 Model: MK71050-03 SGS RF Technologies Inc. Page 28 of 29 472, Nippa-cho, Kohoku-ku, Yokohama, 223-0057, Japan Telephone: +81+(0)45- 534-0645, FAX: +81+(0)45- 534-0646, Web: http://www.rf-test.jp 3 Test setup photographs 3.1 Radiated emissions X-plane Y-plane Z-plane 3.2 AC power line conducted emissions