2ADGF-PJ2500ProJet MJP 2500

User Guide Original Instructions ProJet ® 2500 3D Printer System CONTENTS 1 INTRODUCTION TO THE PROJET 2500 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 2 IMPORTANT SAFETY INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Safety Symbols and Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Safety Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Electrical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Ultraviolet (UV) Light . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Part Material Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Disposal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 Health Hazards/Irritant . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 Irritant . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 Inhalation/Injestion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 Handling Finished Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 Hygienic Practices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 Material Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Emergency (GHS/SDS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Packaging Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Part Building . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Flammability and Combustibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Regulatory Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Spilled Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Waste Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Part Material Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Storing a Partially Used Material Cartridge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Chemical Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Material Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Material Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Material Disposal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Material Spill Containment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 First Aid and Protective Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Skin Contact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Eye Contact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Contact Lenses . . . . . . …

Text truncated - open the document above for the full version.

External Photographs of ProJet® MJP 2500 Front, top, and right side view of ProJet® MJP 2500 Rear and left side view of ProJet® MJP 2500

ProJet® MJP 2500 Data Plate Mounting Location ProJet® MJP 2500 Data Plate Label

Internal Photographs of ProJet® MJP 2500 RFID Antennas and Controller Antennas: The four antenna boards are mounted on a grounded sheet metal plate with metal removed beneath the antenna as to not interfere with the RF operation. This sheet metal plate is then enclosed within a grounded sheet metal material drawer assembly. The antennas are exposed to the tag locations on the consumable material bottles as the material bottle lowers with bottle insertion. Material Distribution Module (MDM) with material bottles installed: Antenna locations are shown using arrows Material Distribution Module (MDM) with material bottles removed: Antenna locations are shown using arrows Material Distribution Module (MDM) with material bottles removed: Close-up view of antenna locations RFID Controller: The RFID controller circuitry is located on the DMC circuit board. It is permanently mounted inside a metal electronics enclosure that is screwed shut. The metal electronics enclosure is accessible by removing the rear door. Top view of RFID circuitry and antenna ports on the DMC board Bottom view of RFID circuitry and antenna ports on the DMC board Front view of ProJet® MJP 2500 with doors open Rear view of ProJet® MJP 2500 with rear access door removed Cover removed from electronics enclosure; DMC board mounted vertically inside of ProJet® MJP 2500 Left side view of ProJet® MJP 2500 with cover removed

ProJet® MJP 2500 Antenna Info • Describe compliance of the device with the antenna requirements of paragraph 15.203 of the FCC rules: The 3D Systems designed antenna boards are securely mounted on a grounded s heet metal plate inside of the Material Delivery Mo dule (MDM) drawer. An area of metal is removed beneath the antenna as to not i nterfere with the RF operation. Antenna replacemen t must be performed by a qualified 3D Systems technician and requires extens ive disassembly of the MDM drawer. Specifically, r emove 6 screws on back of drawer and remove the sheet metal to access coaxial SMB connectors. Then remove front drawer cover wi th 4 screws and remove the bottle bucket heater assembly to access the antenna board which is very involved and precise. The ant ennas are exposed to the tag locations on the consumable material bottles as the material bottle lowers with bottle insertion. Consumable Material Drawer Assembly • A list of antennas to be used with the transmitter. Include manufacturer, model number, gain (dBi), an d description: 3D Systems: DASH RFID Board, Number 3100084-02, 5 t urn loop antenna with Q of 9.9, antenna impedance i s 50 ohms • Drawing or photograph unless clear photos appear in the external photos exhibit:

This report must not be used to claim product certification, approval, or endorsement by NVLAP, NIST, or any agency of the federal government of the United States of America. This Report may only be duplicated in its entirety 3D Systems Corporation ProJet® MJP 2500 FCC 15.207:2015 FCC 15.225:2015 13.56MHz Radio Report # 3DSY0030 NVLAP Lab Code: 200630-0 CERTIFICATE OF TEST 2014-12-10 Product compliance is the responsibility of the client; therefore, the tests and equipment modes of operation represented in this report were agreed upon by the client, prior to testing. The results of this test pertain only to the sample(s) tested. The specific description is noted in each of the individual sections of the test report supporting this certificate of test. This report reflects only those tests from the referenced standards shown in the certificate of test. It does not include inspection or verification of labels, identification, marking or user information. Last Date of Test: August 10, 2015 3D Systems Corporation Model: ProJet® MJP 2500 Radio Equipment Testing Standards Specification Method FCC 15.207:2015 ANSI C63.10:2013 FCC 15.225:2015 ANSI C63.10:2013 Results Method Clause Test Description Applied Results Comments 6.2 Powerline Conducted Emissions Yes Pass 6.4 Field Strength of Fundamental Yes Pass 6.4 Field Strength of Spurious Emissions Less Than 30 MHz Yes Pass 6.5 Field Strength of Spurious Emissions Greater Than 30 MHz Yes Pass 6.8 Frequency Stability Yes Pass Deviations From Test Standards None Approved By: Kyle Holgate, Operations Manager Report No. 3DSY00302/28 REVISION HISTORY REV 2014.10.14 Revision Number Description Date Page Number 00 None Report No. 3DSY00303/28 ACCREDITATIONS AND AUTHORIZATIONS REV 2015.2.19 United States FCC - Designated by the FCC as a Telecommunications Certification Body (TCB). Certification chambers, Open Area Test Sites, and conducted measurement facilities are listed with the FCC. A2LA - Accredited by A2LA to ISO / IEC 17065 as a product certifier. This allows Northwest EMC to certify transmitters to FCC and IC specifications. NVLAP - Each laboratory is accredited by NVLAP to ISO 17025 Canada IC - Recognized by Industry Canada as a Certification Body (CB). Certification chambers and Open Area Test Sites are filed with IC. European Union European Commission – Validated by the European Commission as a Conformity Assessment Body (CAB) under the EMC directive and as a Notified Body under the R&TTE Directive. Australia/New Zealand ACMA - Recognized by ACMA as a CAB for the acceptance of test data. Korea MSIP / RRA - Recognized by KCC’s RRA as a CAB for the acceptance of test data. Japan VCCI - Associate Member of the VCCI. Conducted and radiated measurement facilities are registered. Taiwan BSMI – Recognized by BSMI as a CAB for the acceptance of test data. NCC - Recognized by NCC as a CAB for the acceptance of test data. Singapore IDA – Recognized by IDA as a CAB for the acceptance of test data. Israel MOC – Recognized by MOC as a CAB for the acceptance of test data. Hong Kong OFCA – Recognized by OFCA as a CAB for the acceptance of test data. Vietnam MIC – Recognized by MIC as a CAB for the acceptance of test data. SCOPE For details on the Scopes of our Accreditations, please visit: http://www.nwemc.com/accreditations/ http://gsi.nist.gov/global/docs/cabs/designations.html Report No. 3DSY00304/28 MEASUREMENT UNCERTAINTY TMU.2015.07.10 Measurement Uncertainty When a measurement is made, the result will be different from the true or theoretically correct value. The difference is the result of tolerances in the measurement system that cannot be completely eliminated. To the extent that technology allows us, it has been our aim to minimize this error. Measurement uncertainty is a statistical expression of measurement error qualified by a probability distribution. A measurement uncertainty estimation has been performed for each test per our internal quality document WP 342. The estimation is used to compare the measured result with its "true" or theoretically correct value. The expanded measurement uncertainty (K=2) for each test is on each data sheet. Our measurement data meets or exceeds the measurement uncertainty requirements of the applicable specification; therefore, the test data can be compared directly to the specification limit to determine compliance. The calculations for estimating measurement uncertainty are based upon ETSI TR 100 028 (or CISPR 16-4-2 as applicable), and are available upon request. The following table represents the Measurement Uncertainty (MU) budgets for each of the tests that may be contained in this report. Test + MU - MU Frequency Accuracy (Hz) 0.0007% -0.0007% Amplitude Accuracy (dB) 1.2 dB -1.2 dB Conducted Power (dB) 0.3 dB -0.3 dB Radiated Power via Substitution (dB) 0.7 dB -0.7 dB Temperature (degrees C) 0.7°C -0.7°C Humidity (% RH) 2.5% RH -2.5% RH Voltage (AC) 1.0% -1.0% Voltage (DC) 0.7% -0.7% Field Strength (dB) 5.2 dB -5.2 dB AC Powerline Conducted Emissions (dB) 2.4 dB -2.4 dB Report No. 3DSY00305/28 FACILITIES REV 2015.2.19 California Labs OC01-13 41 Tesla Irvine, CA 92618 (949) 861-8918 Minnesota Labs MN01-08, MN10 9349 W Broadway Ave. Brooklyn Park, MN 55445 (612)-638-5136 New York Labs NY01-04 4939 Jordan Rd. Elbridge, NY 13060 (315) 554-8214 Oregon Labs EV01-12 22975 NW Evergreen Pkwy Hillsboro, OR 97124 (503) 844-4066 Texas Labs TX01-09 3801 E Plano Pkwy Plano, TX 75074 (469) 304-5255 Washington Labs NC01-05 19201 120 th Ave NE Bothell, WA 9801 (425)984-6600 NVLAP NVLAP Lab Code: 200676-0 NVLAP Lab Code: 200881-0 NVLAP Lab Code: 200761-0 NVLAP Lab Code: 200630-0 NVLAP Lab Code:201049-0 NVLAP Lab Code: 200629-0 Industry Canada 2834B-1, 2834B-3 2834E-1 N/A 2834D-1, 2834D-2 2834G-1 2834F-1 BSMI SL2-IN-E-1154R SL2-IN-E-1152R N/A SL2-IN-E-1017 SL2-IN-E-1158R SL2-IN-E-1153R VCCI A-0029 A-0109 N/A A-0108 A-0201 A-0110 Recognized Phase I CAB for ACMA, BSMI, IDA, KCC/RRA, MIC, MOC, NCC, OFCA US0158 US0175 N/A US001…

Text truncated - open the document above for the full version.

AC POWERLINE CONDUCTED EMISSIONS WTD.2015.05.26 PSA-ESCI 2015.03.03, EmiR5 2015.03.19.1 AC POWERLINE CONDUCTED EMISSIONS WTD.2015.05.26 PSA-ESCI 2015.03.03, EmiR5 2015.03.19.1 photo EV11 001.JPG EV11 002.JPG FIELD STRENGTH OF FUNDAMENTAL PSA-ESCI 2015.03.03 photo EV11 001.JPG EV11 002.JPG FIELD STRENGTH OF SPURIOUS EMISSIONS LESS THAN 30 MHz PSA-ESCI 2015.03.03 photo EV01 SRE 3m 001.JPG EV01 SRE 3m 002.JPG FIELD STRENGTH OF SPURIOUS EMISSIONS GREATER THAN 30 MHz PSA-ESCI 2015.03.03 XMit 2015.01.14 EV06 FS 001.JPG EV06 FS 002.JPG FREQUENCY STABILITY XMit 2015.01.14 EV06 FS 003.JPG FREQUENCY STABILITY