2ADZC-6302AWireless Microphone

Shenzhen Hollyland Technology Co., Ltd. Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: 2024-09-04 FCC ID: 2ADZC-6302A Ref. #1: Attestation Statements Part 2.911(d)(5)(i) Filing Shenzhen Hollyland Technology Co., Ltd. certifies that the equipment for which authorization is sought is not “covered” equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Ref. #2: Attestation Statements Part 2.911(d)(5)(ii) Filing Shenzhen Hollyland Technology Co., Ltd. certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List as an entity producing “covered” equipment. Applicant: Shenzhen Hollyland Technology Co., Ltd. Address: 8F, Building 5D, Skyworth Innovation Valley, Tangtou Road, Shiyan Street, Baoan District, Shenzhen, 518055 China Tel.: +86-755-86000682 Email: [email protected] Sincerely, Signature:

1/1 US Agent for Service of Process LETTER OF ATTESTATION TO: Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 US Agent for Service of Process: Company Name: Hevo technology Co.,Ltd Address: 18008 Sky Park Cirirvine, CA 92614 FRN: 0033495417 Contact Name: vincent.ma Telephone No: (949)-932-0648 E-mail: [email protected] This letter is to confirm that the US Agent for Service of Process accepts responsibility to act as a local representative on behalf of Shenzhen Hollyland Technology Co., Ltd. The US Agent for Service of Process is aware of and agrees to comply with the requirements outlined in the FCC Equipment Authorization Program, Report and Order FCC 22-84, and clause § 2.911. Applicant: Company Name: Shenzhen Hollyland Technology Co., Ltd. Product Description: Wireless Microphone FRN: 0024211138 Grantee Code: 2ADZC FCC ID: 2ADZC-6302A Contact Name: Vincent Ma Address: 8F, Building 5D, Skyworth Innovation Valley, Tangtou Road, Shiyan Street, Baoan District, Shenzhen, 518055 China Telephone No: +86-755-86000682 E-mail: [email protected] The Applicant is aware of and agrees to comply with the requirements outlined in the FCC Equipment Authorization Program, Report and Order FCC 22-84, and clause § 2.911. This Agreement is valid until (Permanently valid). Date: 2024/09/04 Applicant’s Name: Vincent Ma US Agent for Service of Process’s Name: Vincent Ma Title: Sales Director Title: Sales Director Signature Signature

承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： WAN3216F245W36 規格 DESCRIPTION ： Chip Antenna 3216 M-Ant 2.45G Type 36 版本 VERSION ： V2.4 日期 ISSUE DATE ： 2020/02/04 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray Tennyson Snow 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112台北市北投區立功街151號1樓 1F, No. 151, Li Gong Street, Beitou District, Taipei City 112, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 ONEWAVE TECHNOLOGY CO., LTD. 2/11 3216 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 3.23 ± 0.20 W 1.66 ± 0.20 T 1.23 ± 0.20 P/N: WAN3216F245W36 ONEWAVE TECHNOLOGY CO., LTD. 3/11 Part Number Information WAN 3216 F 245 W 36 A B C D E F A Product Series Antenna B Dimension L x W 3.2X1.6mm (+-0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode Monopole & Single Feeding F Antenna type Type = 36 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN3216F245W36 Central Frequency 2450 MHz Bandwidth 100 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 2.71 dBi Impedance 50 Ohm Operating Temperature -40～+110 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) ONEWAVE TECHNOLOGY CO., LTD. 4/11 2. Recommended PCB Pattern 1.Evaluation Board Dimension 2.Evaluation Board Dimension (若淨空區夠大，建議使用此Layout，效能較佳) Unit : mm Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感±0.1~0.3nH、電容±0.1pF ONEWAVE TECHNOLOGY CO., LTD. 5/11 1.Layout Dimensions in Clearance area(Size=5.2*5.0mm) 50 ohm transmission Line Matching Circuit 2.Layout Dimensions in Clearance area(Size=8.2*5.0mm) (若淨空區夠大，建議使用此Layout，效能較佳) 50 ohm transmission Line Matching Circuit FootPrint (Unit : mm) ONEWAVE TECHNOLOGY CO., LTD. 6/11 3. Measurement Results Return Loss ONEWAVE TECHNOLOGY CO., LTD. 7/11 Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 55.21 % 1.45 dBi 5.32 dBi 2450MHz 66.45 % 2.71 dBi 5.21 dBi 2500MHz 57.53 % 1.98 dBi 5.29 dBi Chamber Coordinate System Y Z X ONEWAVE TECHNOLOGY CO., LTD. 8/11 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10 ± 0.5 sec. 60 sec . . T E M P ( °C ) 150 °C 2 6 0 °C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C ONEWAVE TECHNOLOGY CO., LTD. 9/11 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 ONEWAVE TECHNOLOGY CO., LTD. 10/11 6.Packaging Information ◆ Tape Specification: W Ao Bo Ko P F E D D1 Po P2 t 8.0 ±0.30 1.80 ±0.05 3.51 ±0.10 1.59 ±0.10 4.00 ±0.05 3.50 ±0.05 1.75 ±0.10 1.50 ±0.10 0.00 ±0.10 4.00 ±0.10 2.00 ±0.05 0.25 ±0.05 ◆ Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2…

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Effective Date: April 2, 2020 QSF 7.6.4-8 – Agent Authorization Letter Template Page 1 of 1 Revision Date: Revision: 0 Shenzhen Hollyland Technology Co., Ltd. Date ： Sept 04, 2024 Product Model Number: Wireless Microphone FCC ID: 2ADZC-6302A To whom it may concern, Re: Product Certification Representative Authorization Letter We authorize QAI Laboratories Ltd. 3980 North Fraser Way, Burnaby B.C. Canada V5J 5K5 to act on our behalf on all matters concerning the above named equipment. This shall include the following:  Testing  Approval applications and procedures We declare that QAI LABORATORIES LTD. is allowed to forward all information related to the approval project to the applied certification body and to the notification entities and to discuss any issues concerning the approval application. Any and all acts carried out by QAI LABORATORIES LTD. on our behalf shall have the same effect as acts of our own. By: Contact Listed on FCC Wesbite Title: Vincent Ma Email: [email protected] Telephone: +86-755-86000682 On behalf of: Shenzhen Hollyland Technology Co., Ltd.

Shenzhen Hollyland Technology Co., Ltd. Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 USA Date: September 13, 2024 Subject; Request for Confidentiality FCC ID: 2ADZC-6302A To Whom It May Concern, Pursuant to the provisions of the Commission’s rules Title 47 Sections §0.457 and §0.459, we are requesting the Commission to withhold the following attachment(s) as confidential documents from public disclosure indefinitely. These documents contain detailed system and equipment descriptions and are considered as proprietary information in operation of the equipment. The public disclosure of these documents might be harmful to our company and would give competitors an unfair advantage in the market. Schematic Diagram Block Diagram Parts List Operational Description Tune-up Procedure Software Security Requirements for UNII devices In additional to above mentioned documents, in order to comply with the marketing regulations in Title 47 CFR §2.803 and the importation rules in Title 47 CFR §2.1204, while ensuring that business sensitive information remains confidential until the actual marketing of newly authorized devices, we request Short Term Confidentiality of the following attachment(s); External Photos Test Setup Photos Internal Photos User Manual For 45 days, pursuant to Public Notice DA 04-1705. OR For 180 days pursuant to KDB 726920 D01. It is our understanding that all measurement test reports, FCC ID label format and correspondence during the certification review process cannot be granted as confidential documents and this information will be available for public review once the grant of equipment authorization is issued. Sincerely, Signature: Name: Vincent Ma Title: Sales Director

Shenzhen CTA Testing Technology Co., Ltd. Room 106, Building 1, Yibaolai Industrial Park, Qiaotou Community, Fuhai Street, Bao’an District, Shenzhen, China TEST REPORT Report Reference No. ..................... : FCC ID ........................................... : CTA24081601401 2ADZC-6302A Compiled by ( position+printed name+signature) .. : File administrators Jinghua Xiao Supervised by ( position+printed name+signature) .. : Project Engineer Xudong Zhang Approved by ( position+printed name+signature) .. : RF Manager Eric Wang Date of issue ..................................... : Aug. 24, 2024 Testing Laboratory Name .............. : Shenzhen CTA Testing Technology Co., Ltd. Address ............................................. : Room 106, Building 1, Yibaolai Industrial Park, Qiaotou Community, Fuhai Street, Bao‘an District, Shenzhen, China Applicant’s name ............................ : Shenzhen Hollyland Technology Co.,Ltd. Address ............................................. : 8F, Building 5D, Skyworth Innovation Valley, Tangtou Road, Shiyan Street,Baoan District, Shenzhen, 518055 China Test specification ........................... : Standard ........................................... : IEEE 1528:2013; FCC 47 CFR Part 2.1093; ANSI/IEEE C95.1:2005; Reference FCC KDB 447498 D01; KDB 447498 D02;KDB 865664 D01 ; KDB 865664 D02; KDB 248227 D01 Shenzhen CTA Testing Technology Co., Ltd. All rights reserved. This publication may be reproduced in whole or in part for non-commercial purposes as long as the Shenzhen CTA Testing Technology Co., Ltd. is acknowledged as copyright owner and source of the material. Shenzhen CTA Testing Technology Co., Ltd. takes no responsibility for and will not assume liability for damages resulting from the reader's interpretation of the reproduced material due to its placement and context. Test item description ..................... : Wireless Microphone Trade Mark ....................................... : Manufacturer ..................................... : Shenzhen Hollyland Technology Co.,Ltd. Model/Type reference ....................... : M32R1 Listed Models .................................. : N/A Rating ............................................... : DC 5V from USB supply Result ................................................ : PASS Report No.: CTA24081601401 Page 2 of 54 T E S T R E P O R T Equipment under Test : Wireless Microphone Model /Type : M32R1 Listed Models : N/A Applicant : Shenzhen Hollyland Technology Co.,Ltd. Address : 8F, Building 5D, Skyworth Innovation Valley, Tangtou Road, Shiyan Street, Baoan District, Shenzhen, 518055 China Manufacturer : Shenzhen Hollyland Technology Co.,Ltd. Address : 8F, Building 5D, Skyworth Innovation Valley, Tangtou Road, Shiyan Street, Baoan District, Shenzhen, 518055 China Test Result: PASS The test report merely corresponds to the test sample. It is not permitted to copy extracts of these test result without the written permission of the test laboratory. Report No.: CTA24081601401 Page 3 of 54 ※ ※ Revision History ※ ※ REV. ISSUED DATE DESCRIPTION Rev.1.0 Aug. 24, 2024 Initial Test Report Release Report No.: CTA24081601401 Page 4 of 54 Contents 1 Statement of Compliance ............................................................................................... 6 2 General Information ........................................................................................................ 7 General Remarks ............................................................................................................................................. 7 Description of Equipment Under Test (EUT) ..................................................................................................... 7 Device Category and SAR Limits ..................................................................................................................... 8 Applied Standard .............................................................................................................................................. 8 Test Facility ....................................................................................................................................................... 8 Environment of Test Site ................................................................................................................................... 9 Test Configuration ............................................................................................................................................. 9 3 Specific Absorption Rate (SAR) ................................................................................... 10 Introduction ..................................................................................................................................................... 10 SAR Definition ................................................................................................................................................ 10 4 SAR Measurement System .......................................................................................... 11 E-Field Probe ................................................................................................................................................... 11 Data Acquisition Electronics (DAE) ................................................................................................................. 12 Robot .............................................................................................................................................................. 13 Measurement Server ...................................................................................................................................... 13 Phantom ......................................................................................................................................................... 14 Device Holder ...............................................................…

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Report No.: CTA24081601401 Page 21 of 54 Photo of Dipole Setup  Validation Results Comparing to the original SAR value provided by SPEAG, the verification data should be within its specification of 10%. The table below shows the target SAR and measured SAR after normalized to 1W input power. It indicates that the system performance check can meet the variation criterion and the plots can be referred to Appendix A of this report. Date Frequency (MHz) Power fed onto reference dipole (mW) Targeted SAR 1g (W/kg) Measured SAR1g (W/kg) Normalized SAR (W/kg) Deviation (%) 08/12/2024 2450 250 52.7 12.65 51.60 -2.09% Report No.: CTA24081601401 Page 22 of 54 8 EUT Testing Position Devices with hinged or swivel antenna(s) This EUT tests shall be performed if applicable in both the horizontal and vertical positions relative to the phantom, and with the antenna oriented away from the body of the DUT (Figure1) and/or with the antenna extended and retracted such as to obtain the highest exposure condition. Figure 8.1 – Device with swivel antenna Report No.: CTA24081601401 Page 23 of 54 DONGLE TESTING PROCEDURES Test all USB orientations [see figure below: (A) Horizontal-Up, (B) Horizontal-Down, (C) Vertical-Front, and (D) Vertical-Back] with a device-to-phantom separation distance of 5 mm or less, according to KDB Publication 447498 D01 requirements. These test orientations are intended for the exposure conditions found in typical laptop/notebook/netbook or tablet computers with either horizontal or vertical USB connector configurations at various locations in the keyboard section of the computer. Current generation portable host computers should be used to establish the required SAR measurement separation distance. The same test separation distance must be used to test all frequency bands and modes in each USB orientation. The typical Horizontal-Up USB connection (A), found in the majority of host computers, must be tested using an appropriate host computer. A host computer with either Vertical- Front (C) or Vertical Back (D) USB connection should be used to test one of the vertical USB orientations. If a suitable host computer is not available for testing the Horizontal-Down (B) or the remaining Vertical USB orientation, a high-quality USB cable, 12 inches or less, may be used for testing these other orientations. It must be documented that the USB cable does not influence the radiating characteristics and output power of the transmitter. Figure 8.2 – USB Connector Orientations implemented on Laptop Computer Test Distance for SAR Evaluation In this case the EUT(Equipment under Test) is set 5mm away from the phantom, the test distance is 5mm. Report No.: CTA24081601401 Page 24 of 54 9 Measurement Procedures The measurement procedures are as follows: (a) Use base station simulator (if applicable) or engineering software to transmit RF power continuously (continuous Tx) in the middle channel. (b) Keep EUT to radiate maximum output power or 100% duty factor (if applicable) (c) Measure output power through RF cable and power meter. (d) Place the EUT in the positions as setup photos demonstrates. (e) Set scan area, grid size and other setting on the DASY software. (f) Measure SAR transmitting at the middle channel for all applicable exposure positions. (g) Identify the exposure position and device configuration resulting the highest SAR (h) Measure SAR at the lowest and highest channels attheworst exposure position and device configuration if applicable. According to the test standard, the recommended procedure for assessing the peak spatial-average SAR value consists of the following steps: (a) Power reference measurement (b) Area scan (c) Zoom scan (d) Power drift measurement Spatial Peak SAR Evaluation The procedure for spatial peak SAR evaluation has been implemented according to the test standard. It can be conducted for 1g and 10g, as well as for user-specific masses. The DASY software includes all numerical procedures necessary to evaluate the spatial peak SAR value. The base for the evaluation is a "cube" measurement. The measured volume must include the 1g and 10g cubes with the highest averaged SAR values. For that purpose, the center of the measured volume is aligned to the interpolated peak SAR value of a previously performed area scan. The entire evaluation of the spatial peak values is performed within the post-processing engine (SEMCAD). The system always gives the maximum values for the 1g and 10g cubes. The algorithm to find the cube with highest averaged SAR is divided into the following stages: (a) Extraction of the measured data (grid and values) from the Zoom Scan (b) Calculation of the SAR value at every measurement point based on all stored data (A/D values and measurement parameters) (c) Generation of a high-resolution mesh within the measured volume (d) Interpolation of all measured values form the measurement grid to the high-resolution grid (e) Extrapolation of the entire 3-D field distribution to the phantom surface over the distance from sensor to surface (f) Calculation of the averaged SAR within masses of 1g and 10g Power Reference Measurement The Power Reference Measurement and Power Drift Measurements are for monitoring the power drift of the device under test in the batch process. The minimum distance of probe sensors to surface determines the closest measurement point to phantom surface. This distance cannot be smaller than the distance of sensor calibration points to probe tip as defined in the probe properties. Report No.: CTA24081601401 Page 25 of 54 Area Scan Procedures The area scan is used as a fast scan in two dimensions to find the area of high field values, before doing a fine measurement around the hot spot. The sophisticated interpolation routines implemented in DASY software can find the maximum found in the scanned area, within a range of the global maximum. The range (in dB0 is specified in the standards for compliance testing. For example, a 2 dB range is …

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- Page 1 of 45 - Report No.: HB20240807014E-01 Add:Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen,China Tel: (86-755) 29989321 Fax: (86-755) 29985110 Web:www.sz-hongbiao.com Test Report Product: Wireless Microphone Trade Mark: Model Number: M32R1 FCC ID: 2ADZC-6302A Prepared for Shenzhen Hollyland Technology Co., Ltd. 8F, Building 5D, Skyworth Innovation Valley, Tangtou Road, Shiyan Street, Baoan District, Shenzhen, 518055 China Prepared by Shenzhen HongBiao Certification& Testing Co., Ltd Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen, China Tel.: +86-755-2998 9321 Fax.: +86-755-2998 5110 Website: http://www.sz-hongbiao.com - Page 2 of 45 - Report No.: HB20240807014E-01 Add:Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen,China Tel: (86-755) 29989321 Fax: (86-755) 29985110 Web:www.sz-hongbiao.com Table of Contents 1 GENERAL DESCRIPTION ................................................................................................................................... 6 1.1 DESCRIPTION OF EUT ................................................................................................................................................ 6 1.2 TEST MODE .............................................................................................................................................................. 6 1.3 OPERATION CHANNEL LIST ........................................................................................................................................... 7 1.4 TEST SETUP .............................................................................................................................................................. 7 1.5 ANCILLARY EQUIPMENT .............................................................................................................................................. 7 2 SUMMARY OF TEST RESULT ............................................................................................................................. 8 3 TEST FACILITIES AND ACCREDITATIONS ............................................................................................................ 9 3.1 TEST LABORATORY ..................................................................................................................................................... 9 3.2 ENVIRONMENTAL CONDITIONS ..................................................................................................................................... 9 3.3 MEASUREMENT UNCERTAINTY ..................................................................................................................................... 9 3.4 TEST SOFTWARE ...................................................................................................................................................... 10 4 LIST OF TEST EQUIPMENT .............................................................................................................................. 11 5 TEST ITEM AND RESULTS ............................................................................................................................... 13 5.1 ANTENNA REQUIREMENT .......................................................................................................................................... 13 5.1.1 Standard Requirement ............................................................................................................................. 13 5.1.2 Test Result ................................................................................................................................................. 13 5.2 CONDUCTED EMISSION ............................................................................................................................................. 14 5.2.1 Limits ........................................................................................................................................................ 14 5.2.2 Test Procedures ......................................................................................................................................... 14 5.2.3 Test Setup.................................................................................................................................................. 15 5.2.4 Test Result ................................................................................................................................................. 15 5.3 RADIATED EMISSION ................................................................................................................................................ 18 5.3.1 Limits ........................................................................................................................................................ 18 5.3.2 Test Procedures ......................................................................................................................................... 18 5.3.3 Test Setup.................................................................................................................................................. 18 5.3.4 Test Result ................................................................................................................................................. 19 5.3.5 Band Edge - Radiated ............................................................................................................................... 23 5.3.6 Spurious emission in restricted band 1000MHz-25000MHz .................................................................... 24 5.4 PEAK OUTPUT POWER 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