2ADZC-6302CWireless Microphone

Shenzhen Hollyland Technology Co., Ltd. Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: 2024-09-04 FCC ID: 2ADZC-6302C Ref. #1: Attestation Statements Part 2.911(d)(5)(i) Filing Shenzhen Hollyland Technology Co., Ltd. certifies that the equipment for which authorization is sought is not “covered” equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Ref. #2: Attestation Statements Part 2.911(d)(5)(ii) Filing Shenzhen Hollyland Technology Co., Ltd. certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List as an entity producing “covered” equipment. Applicant: Shenzhen Hollyland Technology Co., Ltd. Address: 8F, Building 5D, Skyworth Innovation Valley, Tangtou Road, Shiyan Street, Baoan District, Shenzhen, 518055 China Tel.: +86-755-86000682 Email: [email protected] Sincerely, Signature:

1/1 US Agent for Service of Process LETTER OF ATTESTATION TO: Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 US Agent for Service of Process: Company Name: Hevo technology Co.,Ltd Address: 18008 Sky Park Cirirvine, CA 92614 FRN: 0033495417 Contact Name: vincent.ma Telephone No: (949)-932-0648 E-mail: [email protected] This letter is to confirm that the US Agent for Service of Process accepts responsibility to act as a local representative on behalf of Shenzhen Hollyland Technology Co., Ltd. The US Agent for Service of Process is aware of and agrees to comply with the requirements outlined in the FCC Equipment Authorization Program, Report and Order FCC 22-84, and clause § 2.911. Applicant: Company Name: Shenzhen Hollyland Technology Co., Ltd. Product Description: Wireless Microphone FRN: 0024211138 Grantee Code: 2ADZC FCC ID: 2ADZC-6302C Contact Name: Vincent Ma Address: 8F, Building 5D, Skyworth Innovation Valley, Tangtou Road, Shiyan Street, Baoan District, Shenzhen, 518055 China Telephone No: +86-755-86000682 E-mail: [email protected] The Applicant is aware of and agrees to comply with the requirements outlined in the FCC Equipment Authorization Program, Report and Order FCC 22-84, and clause § 2.911. This Agreement is valid until (Permanently valid). Date: 2024/09/04 Applicant’s Name: Vincent Ma US Agent for Service of Process’s Name: Vincent Ma Title: Sales Director Title: Manager Signature Signature

Effective Date: April 2, 2020 QSF 7.6.4-8 – Agent Authorization Letter Template Page 1 of 1 Revision Date: Revision: 0 Shenzhen Hollyland Technology Co., Ltd. Date ： Sept 04, 2024 Product Model Number: Wireless Microphone FCC ID: 2ADZC-6302C To whom it may concern, Re: Product Certification Representative Authorization Letter We authorize QAI Laboratories Ltd. 3980 North Fraser Way, Burnaby B.C. Canada V5J 5K5 to act on our behalf on all matters concerning the above named equipment. This shall include the following:  Testing  Approval applications and procedures We declare that QAI LABORATORIES LTD. is allowed to forward all information related to the approval project to the applied certification body and to the notification entities and to discuss any issues concerning the approval application. Any and all acts carried out by QAI LABORATORIES LTD. on our behalf shall have the same effect as acts of our own. By: Contact Listed on FCC Wesbite Title: Vincent Ma Email: [email protected] Telephone: +86-755-86000682 On behalf of: Shenzhen Hollyland Technology Co., Ltd.

Shenzhen Hollyland Technology Co., Ltd. Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 USA Date: September 13, 2024 Subject; Request for Confidentiality FCC ID: 2ADZC-6302C To Whom It May Concern, Pursuant to the provisions of the Commission’s rules Title 47 Sections §0.457 and §0.459, we are requesting the Commission to withhold the following attachment(s) as confidential documents from public disclosure indefinitely. These documents contain detailed system and equipment descriptions and are considered as proprietary information in operation of the equipment. The public disclosure of these documents might be harmful to our company and would give competitors an unfair advantage in the market. Schematic Diagram Block Diagram Parts List Operational Description Tune-up Procedure Software Security Requirements for UNII devices In additional to above mentioned documents, in order to comply with the marketing regulations in Title 47 CFR §2.803 and the importation rules in Title 47 CFR §2.1204, while ensuring that business sensitive information remains confidential until the actual marketing of newly authorized devices, we request Short Term Confidentiality of the following attachment(s); External Photos Test Setup Photos Internal Photos User Manual For 45 days, pursuant to Public Notice DA 04-1705. OR For 180 days pursuant to KDB 726920 D01. It is our understanding that all measurement test reports, FCC ID label format and correspondence during the certification review process cannot be granted as confidential documents and this information will be available for public review once the grant of equipment authorization is issued. Sincerely, Signature: Name: Vincent Ma Title: Sales Director

SPECIFICATION FOR APPROVAL CUSTOMER ： CUSTOMER’S P/N ： PART NUMBER ： WAN3216F245W36 DESCRIPTION ： Chip Antenna 3216 M-Ant 2.45G Type 36 VERSION ： V 2.4 ISSUE DATE ： 2020/02/04 CUSTOMER APPROVED R&D CENTER APPROVAL CHECKED DRAWN Ray Tennyson Snow OneWave Electronic Co., Ltd. 1F, No. 151, Li Gong Street, Beitou District, Taipei City 112, Taiwan TEL: +886 2 2898-2220 FAX: +886 2 2898-5055 ONEWAVE TECHNOLOGY CO., LTD. 2/11 3216 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 3.23 ± 0.20 W 1.66 ± 0.20 T 1.23 ± 0.20 P/N: WAN3216F245W36 ONEWAVE TECHNOLOGY CO., LTD. 3/11 Part Number Information WAN 3216 F 245 W 36 A B C D E F A Product Series Antenna B Dimension L x W 3.2X1.6mm (+-0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode Monopole & Single Feeding F Antenna type Type = 36 1.Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN3216F245W36 Central Frequency 2450 MHz Bandwidth 100 (Min.) MHz Return Loss -6.5 (Max)dB Peak Gain 2.71 dBi Impedance 50 Ohm Operating Temperature -40～+110°C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) ONEWAVE TECHNOLOGY CO., LTD. 4/11 2.Recommended PCB Pattern 1.Evaluation Board Dimension 2.Evaluation Board Dimension (若淨空區夠大，建議使用此Layout，效能較佳) Unit : mm Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感±0.1~0.3nH、電容±0.1pF ONEWAVE TECHNOLOGY CO., LTD. 5/11 1.Layout Dimensions in Clearance area(Size=5.2*5.0mm) 50 ohm transmission Line Matching Circuit 2.Layout Dimensions in Clearance area(Size=8.2*5.0mm) (若淨空區夠大，建議使用此Layout，效能較佳) 50 ohm transmission Line Matching Circuit FootPrint (Unit : mm) ONEWAVE TECHNOLOGY CO., LTD. 6/11 3.Measurement Results Return Loss ONEWAVE TECHNOLOGY CO., LTD. 7/11 Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 55.21 % 1.45 dBi 5.32 dBi 2450MHz 66.45 % 2.71 dBi 5.21 dBi 2500MHz 57.53 % 1.98 dBi 5.29 dBi Chamber Coordinate System Y Z X ONEWAVE TECHNOLOGY CO., LTD. 8/11 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10 ± 0.5 sec. 60 sec . . T E M P ( °C ) 150 °C 2 6 0 °C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damageThe device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3.No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3.No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3.No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C ONEWAVE TECHNOLOGY CO., LTD. 9/11 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 ONEWAVE TECHNOLOGY CO., LTD. 10/11 6.Packaging Information ◆Tape Specification: W Ao Bo Ko P F E D D1 Po P2 t 8.0 ±0.30 1.80 ±0.05 3.51 ±0.10 1.59 ±0.10 4.00 ±0.05 3.50 ±0.05 1.75 ±0.10 1.50 ±0.10 0.00 ±0.10 4.00 ±0.10 2.00 ±0.05 0.25 ±0.05 ◆Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 13.5±0.5 178±2 3000 ONEWAVE TECHNOLOGY CO., LTD. 11/11 7.Storage and Transportation Information Storage Conditions To maintain the …

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Shenzhen CTA Testing Technology Co., Ltd. Room 106, Building 1, Yibaolai Industrial Park, Qiaotou Community, Fuhai Street, Bao’an District, Shenzhen, China TEST REPORT Report Reference No. ..................... : FCCID ............................................ : CTA24081601801 2ADZC-6302C Compiled by ( position+printed name+signature) .. : File administrators Jinghua Xiao Supervised by ( position+printed name+signature) .. : Project Engineer Xudong Zhang Approved by ( position+printed name+signature) .. : RF Manager Eric Wang Date of issue ..................................... : Aug. 24, 2024 Testing Laboratory Name .............. : Shenzhen CTA Testing Technology Co., Ltd. Address ............................................. : Room 106, Building 1, Yibaolai Industrial Park, Qiaotou Community, Fuhai Street, Bao‘an District, Shenzhen, China Applicant’s name ............................ : Shenzhen Hollyland Technology Co.,Ltd. Address ............................................. : 8F, Building 5D, Skyworth Innovation Valley, Tangtou Road, Shiyan Street, Baoan District, Shenzhen, 518055 China Test specification ........................... : Standard ........................................... : IEEE 1528:2013; FCC 47 CFR Part 2.1093; ANSI/IEEE C95.1:2005; Reference FCC KDB 447498 D01; KDB 865664 D01 ; KDB 865664 D02; KDB 248227 D01 Shenzhen CTA Testing Technology Co., Ltd. All rights reserved. This publication may be reproduced in whole or in part for non-commercial purposes as long as the Shenzhen CTA Testing Technology Co., Ltd. is acknowledged as copyright owner and source of the material. Shenzhen CTA Testing Technology Co., Ltd. takes no responsibility for and will not assume liability for damages resulting from the reader's interpretation of the reproduced material due to its placement and context. Test item description ..................... : Wireless Microphone Trade Mark ....................................... : Manufacturer ..................................... : Shenzhen Hollyland Technology Co.,Ltd. Model/Type reference ....................... : M32R2 Listed Models .................................. : N/A Rating ............................................... : DC 5V from adapter AC 120V/60Hz or DC 3.87V from battery or DC from Wireless Microphone Charging Box Result ................................................ : PASS Report No.: CTA24081601801 Page 2 of 53 T E S T R E P O R T Equipment under Test : Wireless Microphone Model /Type : M32R2 Listed Models : N/A Applicant : Shenzhen Hollyland Technology Co.,Ltd. Address : 8F, Building 5D, Skyworth Innovation Valley, Tangtou Road, Shiyan Street, Baoan District, Shenzhen, 518055 China Manufacturer : Shenzhen Hollyland Technology Co.,Ltd. Address : 8F, Building 5D, Skyworth Innovation Valley, Tangtou Road, Shiyan Street, Baoan District, Shenzhen, 518055 China Test Result: PASS The test report merely corresponds to the test sample. It is not permitted to copy extracts of these test result without the written permission of the test laboratory. Report No.: CTA24081601801 Page 3 of 53 ※ ※ Revision History ※ ※ REV. ISSUED DATE DESCRIPTION Rev.1.0 Aug. 24, 2024 Initial Test Report Release Report No.: CTA24081601801 Page 4 of 53 Contents 1 Statement of Compliance ............................................................................................... 6 2 General Information ........................................................................................................ 7 General Remarks ............................................................................................................................................. 7 Description of Equipment Under Test (EUT) ..................................................................................................... 7 Device Category and SAR Limits ..................................................................................................................... 8 Applied Standard .............................................................................................................................................. 8 Test Facility ....................................................................................................................................................... 8 Environment of Test Site ................................................................................................................................... 9 Test Configuration ............................................................................................................................................. 9 3 Specific Absorption Rate (SAR) ................................................................................... 10 Introduction ..................................................................................................................................................... 10 SAR Definition ................................................................................................................................................ 10 4 SAR Measurement System .......................................................................................... 11 E-Field Probe ................................................................................................................................................... 11 Data Acquisition Electronics (DAE) ................................................................................................................. 12 Robot .............................................................................................................................................................. 13 Measurement Server ...................................................................................................................................... 13 Phantom ......................................................................................................................................................... 14 Device Holde…

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- Page 1 of 45 - Report No.: HB20240806045E-01 Add:Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen,China Tel: (86-755) 29989321 Fax: (86-755) 29985110 Web:www.sz-hongbiao.com Test Report Product: Wireless Microphone Trade Mark: Model Number: M32R2 FCC ID: 2ADZC-6302C Prepared for Shenzhen Hollyland Technology Co., Ltd. 8F, Building 5D, Skyworth Innovation Valley, Tangtou Road, Shiyan Street, Baoan District, Shenzhen, 518055 China Prepared by Shenzhen HongBiao Certification& Testing Co., Ltd Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen, China Tel.: +86-755-2998 9321 Fax.: +86-755-2998 5110 Website: http://www.sz-hongbiao.com - Page 2 of 45 - Report No.: HB20240806045E-01 Add:Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen,China Tel: (86-755) 29989321 Fax: (86-755) 29985110 Web:www.sz-hongbiao.com Table of Contents 1 GENERAL DESCRIPTION ..................................................................................................................................... 6 1.1 DESCRIPTION OF EUT ................................................................................................................................................ 6 1.2 TEST MODE .............................................................................................................................................................. 6 1.3 OPERATION CHANNEL LIST ........................................................................................................................................... 7 1.4 TEST SETUP .............................................................................................................................................................. 7 1.5 ANCILLARY EQUIPMENT .............................................................................................................................................. 7 2 SUMMARY OF TEST RESULT ............................................................................................................................... 8 3 TEST FACILITIES AND ACCREDITATIONS .............................................................................................................. 9 3.1 TEST LABORATORY ..................................................................................................................................................... 9 3.2 ENVIRONMENTAL CONDITIONS ..................................................................................................................................... 9 3.3 MEASUREMENT UNCERTAINTY ..................................................................................................................................... 9 3.4 TEST SOFTWARE ...................................................................................................................................................... 10 4 LIST OF TEST EQUIPMENT .................................................................................................................................11 5 TEST ITEM AND RESULTS ...................................................................................................................................13 5.1 ANTENNA REQUIREMENT .......................................................................................................................................... 13 5.1.1 Standard Requirement ............................................................................................................................. 13 5.1.2 Test Result ................................................................................................................................................. 13 5.2 CONDUCTED EMISSION ............................................................................................................................................. 14 5.2.1 Limits ........................................................................................................................................................ 14 5.2.2 Test Procedures ......................................................................................................................................... 14 5.2.3 Test Setup .................................................................................................................................................. 15 5.2.4 Test Result ................................................................................................................................................. 15 5.3 RADIATED EMISSION ................................................................................................................................................ 18 5.3.1 Limits ........................................................................................................................................................ 18 5.3.2 Test Procedures ......................................................................................................................................... 18 5.3.3 Test Setup .................................................................................................................................................. 18 5.3.4 Test Result ................................................................................................................................................. 19 5.3.5 Band Edge - Radiated ............................................................................................................................... 23 5.3.6 Spurious emission in restricted band 1000MHz-25000MHz .................................................................... 24 5.4 PEAK OUTPUT POWER ......................................................................................................................…

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