2ADZC-6303CWireless Microphone

[ShenzhenHollylandTechnologyCo.,Ltd] Rev1/26/2023 FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:3-Jun-26 Ref:AttestationStatementsPart2.911(d)(7)Filing FCCID:2ADZC-6303C FRN：0024211138 [ShenzhenHollylandTechnologyCo.,Ltd](“theapplicant”)certifiesthat,asofthedateofthefilingofthe application,HevotechnologyCo.,LtdisourdesignatedU.S.agentforserviceofprocessfortheabove referencedFCCID.[ShenzhenHollylandTechnologyCo.,Ltd]acceptstomaintainanagentfornoless thanoneyearafterthegranteehasterminatedallmarketingandimportationortheconclusionofany Commission-relatedproceedinginvolvingtheequipment.HevotechnologyCo.,Ltd HevotechnologyCo.,Ltdaccepts,asofthedateofthefilingoftheapplication,theobligationofthe designatedU.S.agentforserviceofprocessfortheabovereferencedFCCID. DesignatedU.S.AgentInformation: Name:HevotechnologyCo.,Ltd FRN：0033495417 Address:18008SkyParkCirlrvine,Irvine,CA92614UnitedStates ContactPerson:( vincent.ma ) Tel.:(949)-932-0648 Email: [email protected] Sincerely, [ShenzhenHollylandTechnologyCo.,Ltd]HevotechnologyCo.,Ltd (VincentMa)(vincent.ma) (Applicantsignature)(USAgentSignature)

ShenzhenHollylandTechnologyCo.,Ltd Date:2June2026 To:FederalCommunicationsCommission 7435OaklandMillsRoad Columbia,MD21046 USA Attestation Section2.911(d)(5)(i)andSection2.911(d)(5)(ii) (KDB986446D01CoveredEquipment) Section2.911(d)(5)(i) ShenzhenHollylandTechnologyCo.,Ltd(“theapplicant”)certifiesthatthe equipmentforwhichauthorizationissoughtisnot“covered”equipmentprohibited fromreceivinganequipmentauthorizationpursuanttosection2.903oftheFCC rules. Thesoftwaretobeloadedpriortomarketingoftheequipmentidentifiedbelowisnot "covered"softwaremanufacturedbyanyentityincludingpredecessors,successors, parents,subsidiaries,oraffiliatesoranyentitywhichhasrebrandedorrelabeledthe softwareproducedbytheentity(ies)identifiedonthe"CoveredList"DA24-886and KDB986446D01CoveredEquipmentGuidancesectionB(2a). ShenzhenHollylandTechnologyCo.,Ltd(“theapplicant”)furthercertifiesthatno Cybersecurityoranti-virussoftwareproducedorprovidedbyKasperskyLab,Inc.or anyofitssuccessorsandassignees,includingequipmentwithintegratedKaspersky Lab,Inc.(oranyofitssuccessorsandassignees)cybersecurityoranti-virussoftware isinstalledintheequipmentbeingcertified. Section2.911(d)(5)(ii) ShenzhenHollylandTechnologyCo.,Ltd(“theapplicant”)certifiesthat,asofthe dateofthefilingoftheapplication,theapplicant[isnot]identifiedontheCoveredList (asaspecificallynamedentityoranyofitssubsidiariesoraffiliates)asanentity producing“covered”equipment. TypeofEquipmentsubjecttoFCCCertification:FCCID:2ADZC-6303C Ifyouhaveanyquestions,pleasefeelfreetocontactme ContactPerson:VincentMa PositionintheCompany:SalesDirector DateofSignature:2026/6/2 ___________________________ Signatory (signatureoftheapplicant)

RF_160,Issue04 (ShenzhenHollylandTechnologyCo.,Ltd) DeclarationofAuthorization We Nameofmanufacturer:ShenzhenHollylandTechnologyCo.,Ltd Address: 8F,Building5D,SkyworthInnovationValley,TangtouRoad,Shiyan Street,BaoanDistrict, City:Shenzhen Country:China Declarethat: NameRepresentative ofagent: Wuxuewen AgentCompanyname: ShenzhenBalunTechnologyCo.,Ltd. Address: BlockB,1stFL,BaishaScienceandTechnologyPark,ShaheXiRoad, NanshanDistrict City: Shenzhen,Guangdong Country: China isauthorizedtoapplyforCertificationofthefollowingproduct(s): Productdescription: WirelessMicrophone Typedesignation(s): M33R2 Trademark: / onourbehalf. Date: 2026/6/2 City: Shenzhen Name: VincentMa Title: SalesDirector Signature:

Date:2June2026 ShenzhenHollylandTechnologyCo.,Ltd To:FederalCommunicationsCommission, Authorization&EvaluationDivision, 7435OaklandMillsRoad, Columbia,MD21046 ToWhomItMayConcern: TheShenzhenHollylandTechnologyCo.,Ltdtheundersigned,herebyauthorizesMr.Wu XuewenfromShenzhenBALUNTechnologyCo.,Ltd.,toactonthebehalfoftheShenzhen HollylandTechnologyCo.,LtdsolelyinmattersrelatingtotheapplicationforanFCCequipment authorizationforFCCID:2ADZC-6303Cincludingthesigningofdocumentsinconnectionwith thisApplication.NecessaryactscarriedoutbyShenzhenBALUNTechnologyCo.,Ltd.in connectionwiththeApplicationshallhavethesameeffectasactsoftheShenzhenHollyland TechnologyCo.,Ltd TheShenzhenHollylandTechnologyCo.,Ltdalsoherebycertifythatnopartytothisapplication issubjecttoadenialofbenefits,includingFCCbenefits,pursuanttoSection5301oftheAnti- DrugAbuseActof1988,21U.S.C.Section862. YoursSincerely, VincentMa

Date:2June2026 ShenzhenHollylandTechnologyCo.,Ltd To:FederalCommunicationsCommission, Authorization&EvaluationDivision, 7435OaklandMillsRoad, Columbia,MD21046 Re:ShenzhenHollylandTechnologyCo.,Ltd FCCID:2ADZC-6303C FCCCertificationConfidentialityRequest Gentlemen: Thisletteristocomplywith47CFR0.457and0.459pertainingtoconfidentiality material.ShenzhenHollylandTechnologyCo.,Ltdrequeststhatthefollowing documentsregardingthissubmissionforFCCID:2ADZC-6303Cbekept confidential: ExhibitTypeFileName BlockDiagramBlockDiagram.pdf SchematicsSchematics.pdf OperationalDescriptionOperationalDescription.pdf Tune-upTune-up.PDF Andbelowexhibitkeptshort-termconfidential(180days): ExternalphotosExternalphotos.pdf Testsetupphotostestphoto.pdf InternalphotosInternalphotos.pdf UsermanualUsermanual.pdf Thosedocumentscontaindetailedsystemandequipmentdescriptionandrelated informationabouttheproductwhichShenzhenHollylandTechnology Co.,Ltdconsiderstobeconfidentialproprietary,acustomdesignand,otherwise, notreleasabletothegeneralpublic.Sincethisdesignisabasisformwhichfuture technologicalproductswillevolve,ShenzhenHollylandTechnologyCo.,Ltd considersthisinformationwouldbeofbenefittoitscompetitors,andthatthe disclosureoftheinformationinthesedocumentswouldgivecompetitorsanunfair advantageinthemarket. YoursSincerely, VincentMa

V1.0 1 2 3 4 5 6 A B C D 1 2 3 4 5 6 A B C D 注：仅红色区域为镭雕信息 投影法 第三角投影法 深圳市昊一源科技有限公司 比例 1:1 材料 项目名称 A6303 设计 张哲 版本 零件名称 审核 姚立清 图幅 公制 图纸编号 批准 第 1 张 共 1 张 零件编号 标记 变更内容 版本 变更者 日期 V1.0 张哲 初版发行 简业成 / / 技术要求：镭雕 内容： 相机背夹（PC片）-镭雕认证 1.07MM 16.658MM 1.6MM 20260305 20260305 20260305 20260305 ±2° ±1° ±0.5° ±0.5 ±0.2 ±0.15 ±0.3 ±0.15 ±0.1 ±0.1 ±0.05 角度θ L≥30 6<L≤30 0<L≤6 c(粗糙级) m(中等级) f(精密级) 尺寸分段 未标注尺寸公差表 ±0.2 HY-PRT_PG_04_223 FCC ID: 2ADZC-6303C IC：29803-6303C KC:R-R-HoT-M33R2 MODEL：M33R2 MADE IN CHINA S/N：XXXXXXXXXXX 217-263150 FCC ID: 2ADZC-6303C IC：29803-6303C KC:R-R-HoT-M33R2 MODEL：M33R2 MADE IN CHINA S/N：XXXXXXXXXXX 217-263151 Label The back

Report No.: Ti-EE26030462-701 Tel: +86-755-66850100 E-mail: [email protected] Page No. 1 / 37 Web: www.titcgroup.com Template No.: TRP-FCC DASY-Body-1 (2026-04-30) Add: 601, Building 2, Intelligent Connected Vehicle Industrial Park, No.55, Xiangshan Road, Luotian Community, Yanluo Sub-district, Bao'an District, Shenzhen TEST REPORT Applicant: Shenzhen Hollyland Technology Co., Ltd Address: 8F, Building 5D, Skyworth Innovation Valley, Tangtou Road, Shiyan Street, Baoan District, Shenzhen, 518055 China Equipment Type: Wireless Microphone Model Name: M33R2 Brand Name: FCC ID: 2ADZC-6303C Test Standard: FCC 47 CFR Part 2.1093 (refer to section 3.1) Maximum SAR: Body 2.4GHz(1 g@0mm): 0.04 W/kg Sample Arrival Date: Mar.13, 2026 Test Date: Apr. 14, 2026 Date of Issue: May 29, 2026 ISSUED BY: Shenzhen BALUN Technology Co., Ltd. Tested by: Guo Guangwei Checked by: Xu Rui Approved by: Liao Jianming (Technical Director) _______________ _______________ _______________ Report No.: Ti-EE26030462-701 Tel: +86-755-66850100 E-mail: [email protected] Page No. 2 / 37 Web: www.titcgroup.com Template No.: TRP-FCC DASY-Body-1 (2026-04-30) Add: 601, Building 2, Intelligent Connected Vehicle Industrial Park, No.55, Xiangshan Road, Luotian Community, Yanluo Sub-district, Bao'an District, Shenzhen Revision History Version Issue Date Revisions Content Rev. 01 May 29, 2026 Initial Issue TABLE OF CONTENTS 1 GENERAL INFORMATION ........................................................................................................ 4 1.1 Test Laboratory ............................................................................................................ 4 1.2 Test Location ................................................................................................................ 4 1.3 Test Environment Condition .......................................................................................... 4 2 PRODUCT INFORMATION ....................................................................................................... 5 2.1 Applicant Information .................................................................................................... 5 2.2 Manufacturer Information .............................................................................................. 5 2.3 General Description for Equipment under Test (EUT) ................................................... 5 2.4 Ancillary Equipment ...................................................................................................... 5 2.5 Technical Information ................................................................................................... 6 3 SUMMARY OF TEST RESULT ................................................................................................. 7 3.1 Test Standards ............................................................................................................. 7 3.2 Device Category and SAR Limit ................................................................................... 8 3.3 Test Result Summary ................................................................................................... 9 3.4 Test Uncertainty ......................................................................................................... 10 4 MEASUREMENT SYSTEM ..................................................................................................... 11 4.1 Specific Absorption Rate (SAR) Definition .................................................................. 11 4.2 DASY SAR System .................................................................................................... 12 5 SYSTEM VERIFICATION ........................................................................................................ 19 5.1 Purpose of System Check .......................................................................................... 19 5.2 System Check Setup .................................................................................................. 19 6 TEST POSITION CONFIGURATIONS .................................................................................... 20 6.1 Body-worn Position Conditions ................................................................................... 20 7 MEASUREMENT PROCEDURE ............................................................................................. 21 Report No.: Ti-EE26030462-701 Tel: +86-755-66850100 E-mail: [email protected] Page No. 3 / 37 Web: www.titcgroup.com Template No.: TRP-FCC DASY-Body-1 (2026-04-30) Add: 601, Building 2, Intelligent Connected Vehicle Industrial Park, No.55, Xiangshan Road, Luotian Community, Yanluo Sub-district, Bao'an District, Shenzhen 7.1 Measurement Process Diagram ................................................................................. 21 7.2 SAR Scan General Requirement ................................................................................ 22 7.3 Measurement Procedure ............................................................................................ 23 7.4 Area & Zoom Scan Procedure .................................................................................... 23 8 CONDUCTED RF OUTPUT POWER ...................................................................................... 24 8.1 Bluetooth .................................................................................................................... 24 8.2 2.4G ISM Band ........................................................................................................... 25 9 TEST EXCLUSION CONSIDERATION ................................................................................... 26 9.1 Antenna location sketch .............................................................................................. 26 10 TEST RESULT ........................................................................................................................ 27 10.1 Bluetooth ............................…

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Report No.: Ti-EE26030462-AC 1 / 32 CALIBRATION REPORT F.1 E-Field Probe (EX3DV4 - SN:7664) Report No.: Ti-EE26030462-AC 2 / 32 Report No.: Ti-EE26030462-AC 3 / 32 Report No.: Ti-EE26030462-AC 4 / 32 Report No.: Ti-EE26030462-AC 5 / 32 Report No.: Ti-EE26030462-AC 6 / 32 Report No.: Ti-EE26030462-AC 7 / 32 Report No.: Ti-EE26030462-AC 8 / 32 Report No.: Ti-EE26030462-AC 9 / 32 Report No.: Ti-EE26030462-AC 10 / 32 Report No.: Ti-EE26030462-AC 11 / 32 Report No.: Ti-EE26030462-AC 12 / 32 Report No.: Ti-EE26030462-AC 13 / 32 Report No.: Ti-EE26030462-AC 14 / 32 Report No.: Ti-EE26030462-AC 15 / 32 Report No.: Ti-EE26030462-AC 16 / 32 Report No.: Ti-EE26030462-AC 17 / 32 Report No.: Ti-EE26030462-AC 18 / 32 Report No.: Ti-EE26030462-AC 19 / 32 Report No.: Ti-EE26030462-AC 20 / 32 Report No.: Ti-EE26030462-AC 21 / 32 Report No.: Ti-EE26030462-AC 22 / 32 Report No.: Ti-EE26030462-AC 23 / 32 F.2 Data Acquisition Electronics (DAE4 - SN:1710) Report No.: Ti-EE26030462-AC 24 / 32 Report No.: Ti-EE26030462-AC 25 / 32 Report No.: Ti-EE26030462-AC 26 / 32 F.3 2450 MHz Dipole Report No.: Ti-EE26030462-AC 27 / 32 Report No.: Ti-EE26030462-AC 28 / 32 Report No.: Ti-EE26030462-AC 29 / 32 Report No.: Ti-EE26030462-AC 30 / 32 Report No.: Ti-EE26030462-AC 31 / 32 Report No.: Ti-EE26030462-AC 32 / 32 D2450V2 Dipole impedance and return loss Validation Meas. Results Current Meas. Previous Meas. Max. Deviation Meas. Data 2025.05.06 2024.05.07 / Return Loss(dB) -27.271 -27.884 -2.20% Impedance 51.780 Ω + 5.716 jΩ 51.604 Ω + 3.776 jΩ 1.941Ω (Imaginary part) --END OF REPORT--

WIFI/Bluetooth PCB Chip Antenna HCA3216A2450YF11 Revision 23/2025 1 www.honant.com.cn Description The HCA3216A2450YF11 chip antenna is designed for WIFI /Bluetooth applications. This chip antenna has excellent stability consistently provide high signal reception efficiency. Features • Dimensions 3.2 x 1.6 x 1.2 (mm) • Stable and reliable in performances • Low temperature coefficient of frequency • Low profile, compact size • RoHS compliance • SMT processes compatible Dimensions /Recommended Pattern Applications • Bluetooth earphone systems • Hand-held devices when WIFI/Bluetooth functions are needed, e.g. • Multiple-band Mobile phone antenna • PHS • FM, etc • WLAN Dimensions in mm NO. Terminal Name [1] Input [2] NC TYPE L W D T HCA3216A2450YF11 3..2±0.2 1.6±0.2 0.2±0.1 1.2±0.1 L T Side w D TOP Bottom WIFI/Bluetooth PCB Chip Antenna HCA3216A2450YF11 2 www.honant.com.cn Electrical Characteristics Working Frequency Range 2400 ~ 2500 MHz Peak Gain 0.52dBi Impedance 50 Ohm V.S.W.R ≤2.0 Polarization Linear Azimuth Beamwidth Omni-directional Efficiency 72%(Typical) Matching Circuit With the following recommended values of matching and tuning components, the center frequencies will be about 2450 MHZ at our standard 40x40 mm2 evaluation board. However, these are reference values, may need to be changed when the circuit boards or part vendors are different. Dimensions and Recommended PC Board pattern PCB Dimension Antenna Layout Reference 0Ω NA 3.3uH 1.5pF Revision 23/2025 WIFI/Bluetooth PCB Chip Antenna HCA3216A2450YF11 3 www.honant.com.cn Return Loss & Radiation 3D Radiation Frequency (MHz) Return Loss (dB) 2400 11.4 2450 22.4 2524 11.8 Frequency 2450 MHz Peak Gain 0.52dBi Average Gain -0.36 dBi Efficiency 72.2 % Revision 23/2025 WIFI/Bluetooth PCB Chip Antenna HCA3216A2450YF11 4 www.honant.com.cn 2D Radiation Frequency: 2475 MHz Peak Gain & Efficiency Pattern Test Plane Peak Gain (dBi) Peak Gain Angle 1 Blue X-Y 0.233 304° 2 Green X-Z 0.520 260° 3 Red Y-Z 0.245 220° Frequency (MHz) Gain (dBi) Efficiency (%) 2400 0.13 69.8 2450 72 0.16 .0 2480 76 0.52 .34 Revision 23/2025 WIFI/Bluetooth PCB Chip Antenna HCA3216A2450YF11 5 www.honant.com.cn ability Test and Requirement Item Test Methods Specifications Solder Ability Solder: Sn/3.0Ag/0.5Cu Temperature:240°C±2°C Flux:25% Resin and 75% ethanol in weight Duration: 3±0.5s No visible mechanical damage. More than 95% of termination should be covered with new solder. Leaching Resistance Solder: Sn/3.0Ag/0.5Cu Temperature:260°C±3°C Flux: 25% Resin and 75% ethanol in weight Duration: 5±0.5s The chip shall be stabilized at normal condition for 1~2 hours before measuring No visible mechanical damage. More than 95% of termination should be covered with new solder. Inductance change: Within ±20%. Terminal Strength The device should not be broken after tensile force of 1.0kg is slowly applied to pull a lead pin of the fixed device in the lead axis direction for 10±1 seconds. The terminal and body should be no damage. Bending Strength Weld the product to the center part of the PCB with the thickness 1.6±0.2mm as the illustration shows, and keep exerting force arrow ward on it at speed of 0.5mm/sec, and hold for 5±1S at the position of 2mm bending distance. No visible mechanical damage. Drop Drop 10 times on a concrete floor from a height of 1m. No visible mechanical damage. Inductance change: Within ±20% Vibration Frequency: 10 to 55 Hz Amplitude: 1.5mm Direction and time: X, Y and Z directions for 2 hours each. Humidity Test condition:1) temperature, 60°C±2°C, 2) humidity ,90%-95%RH;3) test time, 96±2h. Measurement method: the component should be stabilized at normal condition for (24±2) hours before test. High temperature Exposure Test condition:1) temperature, 125°C±2°C, 2) test time, 96±2h. Measurement method: the component should be stabilized at normal condition for (24±2) hours before test. Low Temperature Storage Test condition:1) temperature, -40°C±2°C, 2) test time, 96±2h. Measurement method: the component should be stabilized at normal condition for (24±2) hours before test. Thermal shock Test condition:1)-40°C±2°Cfor 30±3min; 2) 85°C±2°Cfor 30±3min; 3) 50 cycles. Measurement method: the component should be stabilized at normal condition for (24±2) hours before test. Revision 23/2025 WIFI/Bluetooth PCB Chip Antenna HCA3216A2450YF11 6 www.honant.com.cn Recommendable Reflow Soldering Packaging Specifications TYPE Tape Dimensions (mm) A0 B0 T E W P P0 P2 F K0 Reel Dimensions (mm) A B C D Quantity Pcs/Reel HCA3216A2450YF11 1.9 3.50 0.22 1.75 8 4 4 2 3.5 1.30 178 60 8.4 14.4 3000 Revision 23/2025

Report No.: Ti-EE26030462-602 Tel: +86-755-66850100 E-mail: [email protected] Page No. 1 / 68 Web: www.titcgroup.com Template No.: TRP-FCC&ISED 247 (2022-01-12) Add: 601, Building 2, Intelligent Connected Vehicle Industrial Park, No.55, Xiangshan Road, Luotian Community, Yanluo Sub-district, Bao'an District, Shenzhen TEST REPORT Applicant: Shenzhen Hollyland Technology Co., Ltd Address: 8F, Building 5D, Skyworth Innovation Valley, Tangtou Road, Shiyan Street, Baoan District, Shenzhen, 518055 China Equipment Type: Wireless Microphone Model Name: M33R2 Brand Name: FCC ID: 2ADZC-6303C ISED Number: 29803-6303C Test Standard: 47 CFR Part 15 Subpart C RSS-Gen Issue 5 RSS-247 Issue 4 (refer to section 3.1) Sample Arrival Date: Mar. 11, 2026 Test Date: Mar. 26, 2026 - May 23, 2026 Date of Issue: May 29, 2026 ISSUED BY: Shenzhen BALUN Technology Co., Ltd. Tested by: Li Renyu Checked by: Li Ganming Approved by: Tolan Tu (Testing Director) _______________ _______________ _______________ Report No.: Ti-EE26030462-602 Tel: +86-755-66850100 E-mail: [email protected] Page No. 2 / 68 Web: www.titcgroup.com Template No.: TRP-FCC&ISED 247 (2022-01-12) Add: 601, Building 2, Intelligent Connected Vehicle Industrial Park, No.55, Xiangshan Road, Luotian Community, Yanluo Sub-district, Bao'an District, Shenzhen Revision History Version Issue Date Revisions Rev. 01 May 29, 2026 Initial Issue TABLE OF CONTENTS 1 GENERAL INFORMATION ........................................................................................................ 4 1.1 Test Laboratory ............................................................................................................ 4 1.2 Test Location ................................................................................................................ 4 2 PRODUCT INFORMATION ....................................................................................................... 5 2.1 Applicant Information .................................................................................................... 5 2.2 Manufacturer Information .............................................................................................. 5 2.3 General Description for Equipment under Test (EUT) ................................................... 5 2.4 Technical Information ................................................................................................... 6 3 SUMMARY OF TEST RESULTS ............................................................................................... 8 3.1 Test Standards ............................................................................................................. 8 3.2 Verdict .......................................................................................................................... 9 4 GENERAL TEST CONFIGURATIONS .................................................................................... 10 4.1 Test Environments ...................................................................................................... 10 4.2 Test Equipment List .................................................................................................... 10 4.3 Test Software List ....................................................................................................... 10 4.4 Measurement Uncertainty ........................................................................................... 11 4.5 Description of Test Setup ........................................................................................... 11 4.6 Measurement Results Explanation Example ............................................................... 14 5 TEST ITEMS ........................................................................................................................... 15 5.1 Antenna Requirements ............................................................................................... 15 5.2 Output Power and E.I.R.P .......................................................................................... 16 5.3 Occupied Bandwidth ................................................................................................... 18 5.4 Conducted Spurious Emission .................................................................................... 19 5.5 Band Edge (Authorized-band band-edge) ................................................................... 21 Report No.: Ti-EE26030462-602 Tel: +86-755-66850100 E-mail: [email protected] Page No. 3 / 68 Web: www.titcgroup.com Template No.: TRP-FCC&ISED 247 (2022-01-12) Add: 601, Building 2, Intelligent Connected Vehicle Industrial Park, No.55, Xiangshan Road, Luotian Community, Yanluo Sub-district, Bao'an District, Shenzhen 5.6 Conducted Emission ................................................................................................... 23 5.7 Radiated Spurious Emission ....................................................................................... 24 5.8 Band Edge (Restricted-band band-edge) .................................................................... 29 5.9 Power Spectral density (PSD) .................................................................................... 30 ANNEX A TEST RESULT ........................................................................................................... 31 A.1 Output Power and E.I.R.P .......................................................................................... 31 A.2 Occupied Bandwidth ................................................................................................... 32 A.3 Conducted Spurious Emissions .................................................................................. 36 A.4 Band Edge (Authorized-band band-edge) ................................................................... 41 A.5 Conducted Emissions ................................................................................................. 44 A.6 Radiated Spurious Emission .............…

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