2AKHJ-HB455Wireless Keyboard
Shenzhen Hangshi Electronic Technology Co.,LtdApplication Details
- Equipment Class
- DTS - Digital Transmission System
- Date of Grant
- Sep 22, 2026
- Application Purpose
- Original Equipment
- Equipment Note
- Wireless Keyboard
- Frequency Range
- 2402.00000000 - 2480.00000000
- Country
- China
Documents & Files
Document Text
Text extracted from the exhibit documents filed with the FCC. Open a document above to read the original.
Attestation Statements
2.911 (d)(7)USA Agent v1.2 Section 2.911(d)(7) USA Agent for Service of Process Company name: Shenzhen Hangshi Electronic Technology Co., Ltd Address: 2/F, G-A1 BLDG, Democracy West lndustry Park, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province, China FCC ID: 2AKHJ-HB455 Date: Sep. 14, 2026 2.911(d)(7) USA Designated Agent for Service of Process We, [Shenzhen Hangshi Electronic Technology Co., Ltd] (“the applicant”) designate [Wedo Group] NOTE1 for the purpose of accepting service of process on behalf of the applicant. Applicant consent: We Acknowledge our consent to accept service of process in the United States for matters related to the applicable equipment, and at the physical U.S. address and email address of the designated agent and acknowledge our acceptance of our obligation to maintain an agent for service of process in the United States for no less than one year after either the grantee has permanently terminated all marketing and importation of the applicable equipment within the U.S., or the conclusion of any Commission-related administrative or judicial proceeding involving the equipment, whichever is later. Agent obligation: We Acknowledge our obligation to accept service of process in the United States for matters related to the applicable equipment at our physical U.S. address and email address for no less than one year after either the grantee has permanently terminated all marketing and importation of the applicable equipment within the U.S., or the conclusion of any Commission-related administrative or judicial proceeding involving the equipment, whichever is later. USA Agent Company name: Wedo Group Address: 710 Arabian Ln Walnut, CA 91789, United States FRN：0037730611 Contact Name: Jeffrey Chen Telephone No: (323) 528-1888 Email: [email protected] Applicant Company name: Shenzhen Hangshi Electronic Technology Co., Ltd Address: 2/F, G-A1 BLDG, Democracy West lndustry Park, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province, China FRN: 0026070805 Contact Name: Bo Wang Telephone No: Manager Email: [email protected] Signature: Signature:
Attestation Statements
Shenzhen Hangshi Electronic Technology Co., Ltd 2/F, G-A1 BLDG, Democracy West lndustry Park, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province, China Attestation Statements Not Covered Entity Applicant & Not Covered Equipment To: Federal Communications Commission Date: Sep. 14, 2026 7435 Oakland Mills Road, Columbia, MD 21046, USA Ref: Information Required by Section 2.911(d)(5)(i) & (ii) FCC ID: 2AKHJ-HB455 Shenzhen Hangshi Eelectronic Technology Co., Ltd (“the applicant”) certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List, established pursuant to § 1.50002 of reference chapter, as an entity producing “covered” communication equipment. The equipment for which authorization is sought is not “covered” telecommunications equipment and video surveillance equipment produced by entities identified on the Commission’s Covered List that prohibited from receiving an equipment authorization pursuant to section § 2.903 of the FCC rules. Sincerely yours, Applicant Signature Printed Name: Bo Wang Title: Manager Address: 2/F, G-A1 BLDG, Democracy West lndustry Park, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province, China Tel.: 0755-81720169 Email: [email protected]
Attestation Statements
Shenzhen Hangshi Electronic Technology Co., Ltd 2/F, G-A1 BLDG, Democracy West lndustry Park, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province, China Attestation Statements Not Covered Entity Applicant & Not Covered Equipment To: Federal Communications Commission Date: Sep. 14, 2026 7435 Oakland Mills Road, Columbia, MD 21046, USA Ref: Information Required by Section 2.911(d)(5)(i) & (ii) FCC ID: 2AKHJ-HB455 Shenzhen Hangshi Eelectronic Technology Co., Ltd (“the applicant”) certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List, established pursuant to § 1.50002 of reference chapter, as an entity producing “covered” communication equipment. The equipment for which authorization is sought is not “covered” telecommunications equipment and video surveillance equipment produced by entities identified on the Commission’s Covered List that prohibited from receiving an equipment authorization pursuant to section § 2.903 of the FCC rules. Sincerely yours, Applicant Signature Printed Name: Bo Wang Title: Manager Address: 2/F, G-A1 BLDG, Democracy West lndustry Park, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province, China Tel.: 0755-81720169 Email: [email protected]
Cover Letter(s)
Shenzhen Hangshi Electronic Technology Co., Ltd 2/F, G-A1 BLDG, Democracy West lndustry Park, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province, China Sep. 14, 2026 Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 USA Subject: Explanation of differences between product types FCC ID: 2AKHJ-HB455 Models: HB455, HB456, HB457, HB458, HB459 To Whom It May Concern: We, The Shenzhen Hangshi Electronic Technology Co., Ltd hereby declare that the model : HB456, HB457, HB458, HB459 is identical with the model : HB455, except the model name and size. All the models are the same circuit and RF module, except for the model name and size. Sincerely, Shenzhen Hangshi Eelectronic Technology Co., Ltd Signature: [Bo Wang, General Manager]
Cover Letter(s)
Shenzhen Hangshi Electronic Technology Co., Ltd 2/F, G-A1 BLDG, Democracy West lndustry Park, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province, China Letter of Authorization Company: Shenzhen Hangshi Electronic Technology Co., Ltd Address: 2/F, G-A1 BLDG, Democracy West lndustry Park, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province, China Product Name: Wireless Keyboard Model Number(s): HB455, HB456, HB457, HB458, HB459 Product Description: Wireless Keyboard We authorize MiCOM Labs Inc., 575 Boulder Court, Pleasanton, California 94566, USA, to act on our behalf on all matters concerning the certification of above named equipment. We declare that MiCOM Labs Inc. is allowed to forward all information related to the approval and certification of equipment to the regulatory agencies as required and to discuss any issues concerning the approval application. Any and all acts carried out by MiCOM Labs on our behalf shall have the same effect as acts of our own. Signature: Date: Sep. 14, 2026 Name: Bo Wang Title: Manager Company: Shenzhen Hangshi Electronic Technology Co., Ltd
Cover Letter(s)
Shenzhen Hangshi Electronic Technology Co., Ltd 2/F, G-A1 BLDG, Democracy West lndustry Park, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province, China Responsibility Declaration Letter v1.0 Responsibility Declaration Letter Company name: Shenzhen Hangshi Electronic Technology Co., Ltd Address: 2/F, G-A1 BLDG, Democracy West lndustry Park, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province, China Product Name: FCC ID: 2AKHJ-HB455 Model(s): HB455, HB456, HB457, HB458, HB459 Model(s) Difference Description: All the same except for the model name. We, [Shenzhen Hangshi Electronic Technology Co., Ltd], hereby acknowledge that all the product information (including all original, drafted, or modified documents) provided to the TCB either by us or our agent or representative(s) for the purposes of FCC certification will meet FCC regulations and requirements; and that any modifications or changes made as a result of TCB review of the documents will be formally implemented into the manufacturing process and product documentation shipped with equipment. We also confirm that all information provided is legitimate and does not contain any false content such as forgery, fabrication, alteration, tampering and concealment. We assume all economic and legal responsibilities in matters that may arise as a result of disclosure on sample products and associated product documentation provided for product certification that may subsequently be found to be a mis-representation of the final product and accompanying documentation when produced, marketed, or sold in the United States, Canada, or anywhere in the world. Your sincerely, Name: Bo Wang Date: Sep. 14, 2026 Title and Company name: General Manager Signature of FCC grant holder (Include Title, Company name, date, and official company stamp):
Cover Letter(s)
Shenzhen Hangshi Electronic Technology Co., Ltd 2/F, G-A1 BLDG, Democracy West lndustry Park, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province, China Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 USA Date: Sep. 14, 2026 Subject; Request for Confidentiality FCC ID: 2AKHJ-HB455 To Whom It May Concern, Pursuant to the provisions of the Commission’s rules Title 47 Sections §0.457 and §0.459, we are requesting the Commission to withhold the following attachment(s) as confidential documents from public disclosure indefinitely. These documents contain detailed system and equipment descriptions and are considered as proprietary information in operation of the equipment. The public disclosure of these documents might be harmful to our company and would give competitors an unfair advantage in the market. Schematic Diagram Block Diagram Operational Description In additional to above mentioned documents, in order to comply with the marketing regulations in Title 47 CFR §2.803 and the importation rules in Title 47 CFR §2.1204, while ensuring that business sensitive information remains confidential until the actual marketing of newly authorized devices, we request Short Term Confidentiality of the following attachment(s); External Photos Test Setup Photos Internal Photos User Manual For 45 days, pursuant to Public Notice DA 04-1705. OR For 180 days pursuant to KDB 726920 D01. It is our understanding that all measurement test reports, FCC ID label format and correspondence during the certification review process cannot be granted as confidential documents and this information will be available for public review once the grant of equipment authorization is issued. Sincerely, Signature: Name: Bo Wang Title: Manager
ID Label/Location Info
FCC ID Label Location 40mm*20mm FCC ID: 2AKHJ-HB455
RF Exposure Info
Page 1 of 10 RF Exposure Report Report No.: AGC00803260804FH01 FCC ID : 2AKHJ-HB455 APPLICATION PURPOSE : Original Equipment PRODUCT DESIGNATION : Wireless Keyboard BRAND NAME : B.O.W MODEL NAME : HB455, HB456, HB457, HB458, HB459 APPLICANT : Shenzhen Hangshi Electronic Technology Co., Ltd. DATE OF ISSUE : Sep. 14, 2026 STANDARD(S) : FCC Part 2 Subpart J §2.1093 FCC KDB 447498 D01 V06 REPORT VERSION : V1.0 Attestation of Global Compliance (Shenzhen) Co., Ltd Report No.: AGC00803260804FH01 Page 2 of 10 Report Revise Record Report Version Revise Time Issued Date Valid Version Notes V1.0 / Sep. 14, 2026 Valid Initial Release Report No.: AGC00803260804FH01 Page 3 of 10 Table of Contents 1. General Information ........................................................................................................................................ 4 2. Product Information ........................................................................................................................................ 5 2.1 Product Technical Description ................................................................................................................... 5 3. Test Environment ............................................................................................................................................ 6 3.1 Address Of The Test Laboratory ............................................................................................................... 6 3.2 Test Facility ................................................................................................................................................ 6 3.3 Environmental Conditions ......................................................................................................................... 7 4. Portable Device Evaluation Method and Limit ............................................................................................. 8 5. Measurement Results ..................................................................................................................................... 9 6. Measurement Evaluation ................................................................................................................................ 9 Report No.: AGC00803260804FH01 Page 4 of 10 1. General Information Applicant Shenzhen Hangshi Electronic Technology Co., Ltd. Address 2/F, G-A1 BLDG, Democracy West lndustry Park, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province, P. R. China Manufacturer Shenzhen Hangshi Electronic Technology Co., Ltd. Address 2/F, G-A1 BLDG, Democracy West lndustry Park, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province, P. R. China Factory Shenzhen Hangshi Electronic Technology Co., Ltd. Address 2/F, G-A1 BLDG, Democracy West lndustry Park, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province, P. R. China Product Designation Wireless Keyboard Brand Name B.O.W Test Model HB455 Series Model(s) HB456, HB457, HB458, HB459 Difference Description All the same except for the model name and size. Date of receipt of test item Aug. 13, 2026 Date of Test Aug. 13, 2026 to Sep. 14, 2026 Deviation from Standard No any deviation from the test method Condition of Test Sample Normal Test Result Pass Test Report Form No AGCER-FCC-RF Exposure-V1 Note: The test results of this report relate only to the tested sample identified in this report. Prepared By Jack Gui (Project Engineer) Sep. 14, 2026 Reviewed By Bibo Zhang (Reviewer) Sep. 14, 2026 Approved By Angela Li (Authorized Officer) Sep. 14, 2026 Report No.: AGC00803260804FH01 Page 5 of 10 2. Product Information 2.1 Product Technical Description Frequency Band (Operating) Bluetooth: 2.402GHz ~ 2.480GHz Other: Hardware Version V1.0 Software Version V1.0 Modulation Type BLE GFSK 1Mbps GFSK 2Mbps Maximum Transmitter Power -3.526dBm Device Category Portable (<20cm separation) Mobile (>20cm separation) Others: Antenna Diversity Single antenna Multiple antennas Tx diversity Rx diversity Tx/Rx diversity Antenna Designation Chip Antenna Antenna Gain 1.72dBi Minimum Assessment Distance 5mm Evaluation Applied MPE Evaluation SAR Evaluation Report No.: AGC00803260804FH01 Page 6 of 10 3. Test Environment 3.1 Address Of The Test Laboratory Laboratory: Attestation of Global Compliance (Shenzhen) Co., Ltd. Address: 101 & 201, Building 19(B5), Junfeng Industrial Park, Chongqing Road, P.R.C. 3.2 Test Facility The test facility is recognized, certified, or accredited by the following organizations: CNAS-Lab Code: L5488 Attestation of Global Compliance (Shenzhen) Co., Ltd. has been assessed and proved to follow CNAS-CL01 Accreditation Criteria for Testing and Calibration Laboratories (identical to ISO/IEC17025: 2017 General Requirements for the Competence of Testing and Calibration Laboratories.) A2LA-Lab Cert. No.: 5054.02 Attestation of Global Compliance (Shenzhen) Co., Ltd. EMC Laboratory has been accredited by A2LA for technical competence in the field of electrical testing, and proved to follow ISO/IEC 17025: 2017 General Requirements for the Competence of Testing and Calibration Laboratories and any additional program requirements in the identified field of testing. FCC-Registration No.: 975832 Attestation of Global Compliance (Shenzhen) Co., Ltd. EMC Laboratory has been registered and fully described in a report filed with the FCC (Federal Communications Commission). The acceptance letter from the FCC is maintained in our files with Registration 975832. IC-Registration No.: 24842(CAB identifier: CN0063) Attestation of Global Compliance (Shenzhen) Co., Ltd. EMC Laboratory has been registered and fully described in a report filed with the Certification and Engineering Bureau of Industry Canada. The acceptance letter from the IC is maintained in our files with Registration 24842. Report No.: AGC00803260804FH01 Page 7 of 10 3.3 Environmental Conditions NORMAL CONDITIONS Temperature range (°C) 15 - 35 Relative humidity range 2…
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Test Report
AcknowledgmentBook SPECIFICATIONFORAPPROVAL CustomerName CUSTOMER ： CustomerPartNumber CUSTOMER’SP/N ： MaterialNumber PARTNUMBER ： WAN2012F245C04 Specifications DESCRIPTION ： ChipAntenna2012LAnt2.45GType04 Version VERSION ： V2.0 Date ISSUEDATE ： 2024/10/15 CustomerAcknowledgment CUSTOMERAPPROVED EngineeringDepartmentR&DCenter Approval Confirmed CHECKED ProductionDrawn RayTennyson Snow WanchengTechnologyCo.,Ltd. OneWaveElectronicCo.,Ltd. 112No.151LigongStreet,BeitouDistrict,TaipeiCity,1stFloor1F,No.151,LiGongStreet,BeitouDistrict, TaipeiCity112,Taiwan Telephone:(02)2898-2220TEL:+88622898-2220 Tel:(02)2898-5055FAX:+88622898-5055 2/11 ONEWAVETECHNOLOGYCO.,LTD. 2012Chipantenna ForBluetooth/WLANApplications Dimension(mm) L2.05±0.20 W1.23±0.20 T 0.45±0.20 P/N:WAN2012F245C04 3/11 ONEWAVETECHNOLOGYCO.,LTD. PartNumberInformation WAN2012F245C04 ABCDEF A ProductSeries Antenna BDimensionLxW2.05X1.23mm(±0.2mm) C Material HighKmaterial DWorkingFrequency2.4~2.5GHz E FeedingmodePIFA&SingleFeeding FAntennatypeType=04 1.ElectricalSpecification Remark:Bandwidth&PeakGainwasmeasuredunderevaluationboardofnextpage Specification PartNumber WAN2012F245C04 CentralFrequency2450MHz Bandwidth 85(Min.)MHz ReturnLoss -6.5(Max)dB PeakGain 1.72 dBi Impedance 50 Ohm OperatingTemperature -40～+110°C MaximumPower 4W ResistancetoSolderingHeats 10(@260°C) sec. Polarization Linear AzimuthBeamwidth Omni-directional Termination Cu/Sn(Leadless) 4/11 ONEWAVETECHNOLOGYCO.,LTD. 2.RecommendedPCBPattern EvaluationBoardDimension(boardsize80x40mm) 2 nd EvaluationBoardDimension EvaluationBoardDimension(boardsize80x40mm) SuggestedMatchingCircuit ImportantInformation: Formatchingcomponents,itisrecommendedtouseinductorswithhighaccuracy(±0.1–0.3nH)andcapacitorswithhighaccuracy(±0.1pF). 1.0pF 5/11 ONEWAVETECHNOLOGYCO.,LTD. LayoutDimensionsinClearancearea(Size=3.0*5.0mm) FootPrint (Unit:mm) ◆2 nd LayoutDimensionsinClearancearea(Size=8.0*2.5mm) Matching Tuning Matching Tuning 6/11 ONEWAVETECHNOLOGYCO.,LTD. 3.MeasurementResults ReturnLoss 7/11 ONEWAVETECHNOLOGYCO.,LTD. 3DRadiationPattern 2DRadiationPattern Efficiency PeakGain Directivity 2400MHz63.12%1.62dBi3.61dBi 2450MHz 70.56%1.72dBi3.23dBi 2500MHz65.48%1.64dBi3.47dBi ChamberCoordinateSystem Z Y X 8/11 ONEWAVETECHNOLOGYCO.,LTD. 4.ReliabilityandTestCondictions ITEMREQUIREMENTSTESTCONDITION Solderability 1.Wettingshallexceed90%coverage 2.Novisiblemechanicaldamage Pre-heatingtemperature:150°C/60sec. Soldertemperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Fluxforleadfree:rosin Solderheat Resistance 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 10±0.5sec. 60sec TEMP(°C) 150°C 260°C Pre-heatingtemperature:150°C/60sec. Soldertemperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Fluxforleadfree:rosin Component Adhesion (Pushtest) 1.Novisiblemechanicaldamage Thedeviceshouldbereflowsoldered(230±5°C for10sec.)toatinnedcoppersubstrateA dynometerforcegaugeshouldbeappliedthe sideofthecomponent.Thedevicemust with- ST-F0.5Kgwithoutfailureofthetermination attachedtocomponent. Component Adhesion (Pulltest) 1.Novisiblemechanicaldamage Insert10cmwireintotheremainingopeneye bend,theendsofevenwirelengthsupward andwindtogether. Terminalshallnotberemarkablydamaged. Thermalshock 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within3 sec 3 -40±2°C 30±3 4 Room Temperature Within3 sec +110°C=>30±3min -40°C=>30±3min Testcycle:10cycles Thechipshallbestabilizedatnormalcondition for2~3hoursbeforemeasuring. Resistanceto HighTemp- erature 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 3.Nodisconnectionorshortcircuit. Temperature:+110±5°C Duration:1000±12hrs Thechipshallbestabilizedatnormalcondition for2~3hoursbeforemeasuring. Resistanceto Low Temperature 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 3.Nodisconnectionorshortcircuit. Temperature:-40±5°C Duration:1000±12hrs Thechipshallbestabilizedatnormalcondition for2~3hoursbeforemeasuring. Humidity 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 3.Nodisconnectionorshortcircuit. Temperature:40±2°C Humidity:90%to95%RH Duration:1000±12hrs Thechipshallbestabilizedatnormalcondition for2~3hoursbeforemeasuring. 4±1sec. 60sec TEMP(°C) 150°C 230°C 9/11 ONEWAVETECHNOLOGYCO.,LTD. 5.SolderingandMounting Mildlyactivatedrosinfluxesarepreferred.Theminimumamountofsoldercan leadtodamagefromthestressescausedbythedifferenceincoefficientsof expansionbetweensolder,chipandsubstrate.Theterminationsaresuitable forallwaveandre-flowsolderingsystems.Ifhandsolderingcannotbe avoided,thepreferredtechniqueistheutilizationofhotairsolderingtools. Recommendedtemperatureprofilesforre-flowsolderinginFigure1. Productsattachmentwithasolderingironisdiscouragedduetotheinherent processcontrollimitations.Intheeventthatasolderingironmustbe employedthefollowingprecautionsarerecommended. ‧Preheatcircuitandproductsto150°C ‧Nevercontacttheceramicwiththeirontip ‧Usea20wattsolderingironwithtipdiameterof1.0mm ‧280°Ctiptemperature(max) ‧1.0mmtipdiameter(max) ‧Limitsolderingtimeto3sec. SOLDERING COOLING NATURAL PRE-HEATING T E M P E R A T U R E ( ° C ) 60~120s 10smax. 30~60s 250~260 230 180 150 TIME(sec.) ReflowSoldering SOLDERING COOLING NATURAL PRE-HEATING T E M P E R A T U R E ( ° C ) within3s Gradualcooling 150 TIME(sec.) IronSoldering Over60s 350 300 10/11 ONEWAVETECHNOLOGYCO.,LTD. 6.PackagingInformation TapeSpecification: ReelSpecification:(7’’,Φ180mm) TapeWidth(mm)A(mm)B(mm)C(mm)D(mm)Chip/Reel(pcs) 89.0±0.5 60±213.5±0.5178±25000 11/11 ONEWAVETECHNOLOGYCO.,LTD. 7.StorageandTransportationInformation StorageConditions Tomaintainthesolderabilityofterminalelectrodes: 1.Temperatureandhumidityconditions:-10~40°Cand30~70%RH. 2.Recommendedproductsshouldbeusedwithin6monthsfromthetimeof delivery. 3.Thepackagingmaterialshouldbekeptwherenochlorineorsulfurexists intheair. TransportationConditions 1.Productsshouldbehandledwithcaretoavoiddamageorcontamination fromperspirationandskinoils. 2.The…
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Test Report
Page 1 of 51 FCC Test Report Report No.: AGC00803260804FR01 FCC ID : 2AKHJ-HB455 APPLICATION PURPOSE : Original Equipment PRODUCT DESIGNATION : Wireless Keyboard BRAND NAME : B.O.W MODEL NAME : HB455, HB456, HB457, HB458, HB459 APPLICANT : Shenzhen Hangshi Electronic Technology Co., Ltd. DATE OF ISSUE : Sep. 14, 2026 STANDARD(S) : FCC Part 15 Subpart C §15.247 REPORT VERSION : V1.0 Attestation Of Global Compliance (Shenzhen) Co., Ltd Report No.: AGC00803260804FR01 Page 2 of 51 Report Revise Record Report Version Revise Time Issued Date Valid Version Notes V1.0 / Sep. 14, 2026 Valid Initial Release Report No.: AGC00803260804FR01 Page 3 of 51 Table of Contents 1. General Information ........................................................................................................................................ 5 2. Product Information ........................................................................................................................................ 6 2.1 Product Technical Description ................................................................................................................... 6 2.2 Test Frequency List ................................................................................................................................... 6 2.3 Related Submittal(S) / Grant (S) ............................................................................................................... 7 2.4 Test Methodology ...................................................................................................................................... 7 2.5 Special Accessories .................................................................................................................................. 7 2.6 Equipment Modifications ........................................................................................................................... 7 2.7 Antenna Requirement................................................................................................................................ 7 3. Test Environment ............................................................................................................................................ 8 3.1 Address of the Test Laboratory ................................................................................................................. 8 3.2 Test Facility ................................................................................................................................................ 8 3.3 Environmental Conditions ......................................................................................................................... 9 3.4 Measurement Uncertainty ......................................................................................................................... 9 3.5 List of Equipment Use ............................................................................................................................. 10 4. System Test Configuration ........................................................................................................................... 12 4.1 EUT Configuration ................................................................................................................................... 12 4.2 EUT Exercise ........................................................................................................................................... 12 4.3 Configuration of Tested System .............................................................................................................. 12 4.4 Equipment Used In Tested System ........................................................................................................ 13 4.5 Summary of Test Results ........................................................................................................................ 14 5. Description of Test Modes ........................................................................................................................... 15 6. Duty Cycle Measurement ............................................................................................................................. 16 7. RF Output Power Measurement .................................................................................................................. 17 7.1 Provisions Applicable .............................................................................................................................. 17 7.2 Measurement Procedure ......................................................................................................................... 17 7.3 Measurement Setup (Block Diagram of Configuration) .......................................................................... 17 7.4 Measurement Result ............................................................................................................................... 18 8. 6dB Bandwidth Measurement ...................................................................................................................... 21 8.1 Provisions Applicable .............................................................................................................................. 21 8.2 Measurement Procedure ......................................................................................................................... 21 8.3 Measurement Setup (Block Diagram of Configuration) .......................................................................... 21 8.4 Measurement Results ............................................................................................................................. 22 9. Power Spectral Density Measurement ........................................................................................................ 26 9.1 Provisions Applicable ..................................................................................................…
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Contact Information
Applicant
Bo Wang
[email protected]Fax: 0755-29542665
Technical Contact
Test Firm
Attestation of Global Compliance (Shenzhen) Co., LDoris Li
Technical Specifications
| # | Rule Parts | Frequency Range | Power Output |
|---|---|---|---|
| 1 | 15C | 2.40 GHz - 2.48 GHz | 400.00 µW |
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