2ANQ2BONDMINIBond Touch Bracelet

Applicant Declaration QSF27-14-04 Rev 1.4 April 25, 2025 Page 1 of 1 Original Issue: Jan. 4, 2021 SGS North America Inc. 620 Old Peachtree Road SUITE 100 Suwanee, Georgia 30024 United States Applicant Legal Business Name Bond Touch Inc. Address 4223 Glencoe Ave Suite c215-519, Marina Del Rey California 90292, United States FRN 0026834671 Grantee Code 2ANQ2 FCC ID: 2ANQ2BONDMINI Authorized Contact Name Zumbi Ferreira Contact Phone (218)307-775 Contact Email [email protected] I, the undersigned, certify that I am an authorized signatory for the Applicant and therefore declare; a) in accordance with 47CFR2.911(d), all of the statements herein and the exhibits attached hereto are true and correct to the best of my knowledge and belief. b) in accepting a Grant of Equipment Authorization issued by a TCB, under the authority of the FCC, as a result of the representations made in this application, the Applicant is responsible for: (1) labeling the equipment with the exact FCC ID as specified in this application, (2) compliance statement labeling pursuant to the applicable rules, (3) compliance of the equipment with the applicable technical rules, c) if the Applicant is not the actual manufacturer of the equipment, appropriate arrangements have been made with the manufacturer to ensure that production units of this equipment will continue to comply with the FCC’s technical requirements. d) in accordance with 47 CFR 2.909 and KDB394321, the Applicant has read, understood and agrees to accept that they are the responsible party and agree to abide by their responsibilities as specified under 47 CFR 2.909 and KDB394321. e) in accordance with ISO 17065, FCC KDB641163, FCC KDB610077, KDB394321 and RSP-100, the Applicant has read, understood, accepts and agrees to abide by the post market surveillance requirements. (1) the Applicant understands, accepts and agrees that a sample may be requested for surveillance testing. (2) the Applicant shall make provisions to always have a production sample available upon request by SGS, FCC and/or ISED. (3) the Applicant shall, upon request by SGS, at the Applicant’s expense, provide a production sample of the requested product to SGS, FCC and/or ISED as instructed. The sample shall include all support devices, cables, software, accessories or other hardware or software required for evaluation, review, certification and audit surveillance of products certified by SGS. f) neither the Applicant nor any party to the application is subject to a denial of Federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. §862 because of a conviction for possession or distribution of a controlled substance. See 47CFR 1.2002(b) for the definition of a “party” for these purposes. g) the Applicant has read, understood, accepts and agrees to abide by the SGS North America, Inc. terms and conditions as specified in the TCB Application Form 731 (QSF27-14-01). Link to CFRs: https://www.fcc.gov/wireless/bureau-divisions/technologies-systems-and-innovation-division/rules-regulations-title-47 Link to KDBs: https://apps.fcc.gov/oetcf/kdb/index.cfm Link to RSP-100: https://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf01130.html Link to the Covered List: Covered List Applicant Signature: Date: 01/12/2026 Print Name: Zumbi Ferreira Title: CFO *NOTE: This declaration cannot be signed by an Agent, it shall be signed by an authorized person listed in the FCC database

UNITED STATES DESIGNATED AGENT LETTER Date: 01/12/2026 TO: Federal Communication Commission Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MID 21046 Applicant U.S. designated agent Company Name: Bond Touch Inc. Company Name: Bond Touch Inc. FRN: 0026834671 FRN: 0026834671 Grantee Code: 2ANQ2 Contact Name: Zumbi Ferreira Contact Name: Address: 4223 Glencoe Ave Suite c215-519, Address: City/Province/Zip:Marina Del Rey , California 90292, United States City/Province/Zip: Telephone: (218)307-7759 Telephone: Fax: Fax: Email: 415-273-0675 [email protected] Email: Zumbi Ferreira 4223 Glencoe Ave Suite c215-519, Marina Del Rey , California 90292, United States (218)307-7759 415-273-0675 [email protected] Regarding: FCC ID: 2ANQ2BONDMINI We, < Bond Touch Inc. > understand and acknowledge the applicants consent and the designated agent’s obligation to accept service of process in the United States for matters related to the applicable equipment, and at the physical U.S. address and e-mail of the designated agent listed above. We, < Bond Touch Inc. > acknowledge the applicant’s acceptance of its obligation to maintain an agent for service of process in the United States for no less than one year after either the grantee has permanently terminated all marketing and importation of the applicable equipment within the U.S., or the conclusion of any Commission-related administrative or judicial proceeding involving the equipment, whichever is later. Name (Printed): Zumbi Ferreira Title: CFO Signature:

FCC COVERED LIST DECLARATION LETTER Page 1 of 1 Revision 1.0 SGS North America Inc. 620 Old Peachtree Road SUITE 100 Suwanee, Georgia 30024 United States Applicant Legal Business Name Bond Touch Inc. Address 4223 Glencoe Ave Suite c215-519, Marina Del ReyCalifornia90292, United States FRN 0026834671 Grantee Code 2ANQ2 FCC ID: 2ANQ2BONDMINI Authorized Contact Name Zumbi Ferreira Contact Phone (218)307-775 Contact Email [email protected] Bond Touch Inc. (“the applicant”) certifies: - the equipment for which authorization is sought is not “covered” equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. - as of the date of the filing of the application, the applicant [is not] identified on the Covered list, established pursuant to §1.50002, as an entity producing “covered” equipment. - the software to be loaded prior to marketing of the equipment identified above is not “covered” software manufactured by any entity including predecessors, successors, parents, subsidiaries, affiliates or any entity which has rebranded or relabeled the software produced by the entity(ies) identified on the “Covered List”. - the device is not capable of storing or running software listed on the covered list and therefore is inherently compliant. NOTE: Justification/evidence explaining how compliance is met must accompany this letter Link to the Covered List: Covered List Applicant Signature: Date: 01/12/2026 Print Name: Zumbi Ferreira Title: CFO *NOTE: This declaration cannot be signed by an Agent, it shall be signed by an authorized person listed in the FCC database

Bond Touch Inc. Date: 01/12/2026 TO: Federal Communication Commission Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MID 21046 Regarding: FCC ID: 2ANQ2BONDMINI To whom it may concern: We, the undersigned, hereby authorize SGS-CSTC Standards Technical Services Co., Ltd. (SGS) and Keny Xu in SGS-CSTC Standards Technical Services Co., Ltd. (SGS) to act on our behalf in all manners relating to application for equipment authorization with respect to the FCC ID above, including signing of all documents relating to these matters. Any and all acts carried out by the agent on our behalf shall have the same effect as acts of our own. We, the undersigned, hereby certify that we are not subject to a denial of federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. 853(a). Where our agent signs the application for certification on our behalf, I acknowledge that all responsibility for complying with the terms and conditions for Certification, as specified by SGS North America, Inc., still resides with Bond Touch Inc. This authorization is valid until further written notice from the applicant. Print Name: Zumbi Ferreira Title: CFO Signature: On behalf of Company: Bond Touch Inc. Telephone: (218)307-7759 E-mail: [email protected]

Bond Touch Inc. Date: 01/12/2026 TO: Federal Communication Commission Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MID 21046 Regarding: Confidentiality Request regarding application for FCC ID: 2ANQ2BONDMINI LONG TERM CONFIDENTIALITY Pursuant to 47 CFR Section 0.459 and 0.457 of the commission’s rules, the applicant hereby request confidential treatment of the documents listed below, associated with the certification application referenced above. Schematic(s) Block Diagrams Operational Descriptions The documents above contain proprietary information not released to the public. Public disclosure of this information may prove harmful to the business of the applicant. SHORT TERM CONFIDENTIALITY Additionally, the applicant requests the following documents be held confidential until the device is marketed or 180 days from the grant date, whichever is less. If the device is marketed within aforementioned days of the Grant Date, the applicant will notify the TCB per FCC KDB 726920 D01 Confidentiality Request Procedures. External Photos Internal Photos Test Setup Photos User manual(s) Sincerely, Print Name: Zumbi Ferreira Title: CFO Signature: On behalf of Company: Bond Touch Inc. Telephone: (218)307-7759 E-mail: [email protected]

Bond Touch, Inc. Product Name: Bond Touch Bracelet Model Number: BONDMINI Trademark: Bond Touch Made FCC ID: 2ANQ2BONDMINI IC : 25165-BONDMINI in China Input:5V 0.15mA This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. 4223 Glencoe Ave, STE C215-519, Marina del Rey, CA 90292-880, United States

SGS-CSTC Standards Technical Services Co., Ltd. Shenzhen Branch SZEMC-TRF-01 Rev. A/2 Report No.: SZCR260100014103 Page: 1 of 10 Keny Xu EMC Laboratory Manager RF Exposure Report Application No.: SZCR2601000141AT Applicant: Bond Touch Inc. Address of Applicant: 4223 Glencoe Ave, STE C215-519, Marina del Rey, CA 90292-880, United States Manufacturer: Joint Chinese Ltd Address of Manufacturer: Building 6, Huafeng Tech Park, Guangtian Road, Luotian lndustrial Area, Songgan.Ban'an Shenzhen, Guangdong, China Factory: Joint Chinese Ltd Address of Factory: Building 6, Huafeng Tech Park, Guangtian Road, Luotian lndustrial Area, Songgan.Ban'an Shenzhen, Guangdong, China Equipment Under Test (EUT): EUT Name: Bond Touch Bracelet Model No.: BONDMINI FCC ID: 2ANQ2BONDMINI Standard(s) : FCC Rules 47 CFR §2.1093 KDB 447498 D04 interim General RF Exposure Guidance v01 Date of Receipt: 2026-01-09 Date of Test: 2026-01-24 to 2026-01-29 Date of Issue: 2026-02-08 Test Result: Pass* * In the configuration tested, the EUT complied with the standards specified above. SGS-CSTC Standards Technical Services Co., Ltd. Shenzhen Branch SZEMC-TRF-01 Rev. A/2 Report No.: SZCR260100014103 Page: 2 of 10 Revision Record Version Chapter Date Modifier Remark 01 2026-02-08 Original Authorized for issue by: Martin Tang/Project Engineer Eric Fu/Reviewer SGS-CSTC Standards Technical Services Co., Ltd. Shenzhen Branch SZEMC-TRF-01 Rev. A/2 Report No.: SZCR260100014103 Page: 3 of 10 1 Contents Page 1 Contents ............................................................................................................................................ 3 2 General Information .......................................................................................................................... 4 2.1 General Description of E.U.T. .................................................................................................... 4 2.2 Details of E.U.T. ......................................................................................................................... 4 2.3 Test Location .............................................................................................................................. 5 2.4 Test Facility ................................................................................................................................ 5 2.5 Deviation from Standards ........................................................................................................... 5 2.6 Abnormalities from Standard Conditions ................................................................................... 5 3 FCC Radiofrequency radiation exposure limits ............................................................................ 6 3.1 Blanket 1 mW Blanket Exemption .............................................................................................. 6 3.2 MPE-based Exemption .............................................................................................................. 6 3.3 SAR-based Exemption ............................................................................................................... 7 4 Measurement and Calculation ....................................................................................................... 10 4.1 Maximum transmit power ......................................................................................................... 10 4.2 RF Exposure Calculation ......................................................................................................... 10 5 EUT Constructional Details (EUT Photos) ................................................................................... 10 SGS-CSTC Standards Technical Services Co., Ltd. Shenzhen Branch SZEMC-TRF-01 Rev. A/2 Report No.: SZCR260100014103 Page: 4 of 10 2 General Information 2.1 General Description of E.U.T. Product Type: Portable device Mobile device Fixed device 2.2 Details of E.U.T. Power supply: Rechargeable battery DC 3.6V,25mAh,Charged by DC 5V Cable(s): USB cable:about 60cm unshielded For BLE: Bluetooth Version: V5.0 LE Operation Frequency: 2402MHz to 2480MHz Modulation Type: GFSK Channel Spacing: 2MHz Number of Channels: 40 Data Rate: 1Mbps Antenna Type: Chip Antenna Antenna Gain: 2.28 dBi Remark:The information in this section is provided by the applicant or manufacturer, SGS is not liable to the accuracy, suitability, reliability or/and integrity of the information. Separation Distance Minimum test separation distance: 5mm Remark: This minimum test separation distance is determined by the smallest distance from the antenna and radiating structures or outer surface of the device, according to the host form factor, exposure conditions and platform requirements, to any part of the body or extremity of a user or bystander. SGS-CSTC Standards Technical Services Co., Ltd. Shenzhen Branch SZEMC-TRF-01 Rev. A/2 Report No.: SZCR260100014103 Page: 5 of 10 2.3 Test Location All tests were performed at: SGS-CSTC Standards Technical Services Co., Ltd., Shenzhen Branch No. 1 Workshop, M-10, Middle Section, Science & Technology Park, Nanshan District, Shenzhen, Guangdong, China. 518057. Tel: +86 755 2601 2053 Fax: +86 755 2671 0594 No tests were sub-contracted. 2.4 Test Facility • A2LA (Certificate No. 3816.01) SGS-CSTC Standards Technical Services Co., Ltd., Shenzhen EMC Laboratory is accredited by the American Association for Laboratory Accreditation(A2LA). Certificate No. 3816.01. • VCCI (Member No. 1937) The 3m Fully-anechoic chamber for above 1GHz, 10m Semi-anechoic chamber for below 1GHz, Shielded Room for Mains Port Conducted Interference Measurement and Telecommunication Port Conducted Interference Measurement of SGS-CSTC Standards Technical Services Co., Ltd. Shenzhen EMC laboratory have been registered in accordance with the Regulations for Voluntary Control Measures with Registration No.: G-20026, R-14188, C-12383 and T-11153 respectively. • FCC –Designation Number: CN1336 S…

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SGS-CSTC Standards Technical Services Co., Ltd. Shenzhen Branch SZEMC-TRF-01 Rev. A/2 Report No.: SZCR260100014102 Page: 1 of 56 Keny Xu EMC Laboratory Manager TEST REPORT Application No.: SZCR2601000141AT Applicant: Bond Touch Inc. Address of Applicant: 4223 Glencoe Ave, STE C215-519, Marina del Rey, CA 90292-880, United States Manufacturer: Joint Chinese Ltd Address of Manufacturer: Building 6, Huafeng Tech Park, Guangtian Road, Luotian lndustrial Area, Songgan.Ban'an Shenzhen, Guangdong, China Factory: Joint Chinese Ltd Address of Factory: Building 6, Huafeng Tech Park, Guangtian Road, Luotian lndustrial Area, Songgan.Ban'an Shenzhen, Guangdong, China Equipment Under Test (EUT): EUT Name: Bond Touch Bracelet Model No.: BONDMINI FCC ID: 2ANQ2BONDMINI Standard(s) : 47 CFR Part 15, Subpart C 15.247 Date of Receipt: 2026-01-09 Date of Test: 2026-01-24 to 2026-01-29 Date of Issue: 2026-02-08 Test Result: Pass* * In the configuration tested, the EUT complied with the standards specified above. SGS-CSTC Standards Technical Services Co., Ltd. Shenzhen Branch SZEMC-TRF-01 Rev. A/2 Report No.: SZCR260100014102 Page: 2 of 56 Revision Record Version Chapter Date Modifier Remark 01 2026-02-08 Original Authorized for issue by: Martin Tang/Project Engineer Eric Fu/Reviewer SGS-CSTC Standards Technical Services Co., Ltd. Shenzhen Branch SZEMC-TRF-01 Rev. A/2 Report No.: SZCR260100014102 Page: 3 of 56 2 Test Summary Radio Spectrum Technical Requirement Item Standard Method Requirement Result Antenna Requirement 47 CFR Part 15, Subpart C 15.247 N/A 47 CFR Part 15, Subpart C 15.203 & 15.247(b)(4) Pass Radio Spectrum Matter Part Item Standard Method Requirement Result Radiated Emissions which fall in the restricted bands 47 CFR Part 15, Subpart C 15.247 ANSI C63.10 (2020) Section 6.10.5 47 CFR Part 15, Subpart C 15.205 & 15.209 Pass Radiated Spurious Emissions Below 1GHz ANSI C63.10 (2020) Section 6.4,6.5 47 CFR Part 15, Subpart C 15.205 & 15.209 Pass Radiated Spurious Emissions Above 1GHz ANSI C63.10 (2020) Section 6.6 47 CFR Part 15, Subpart C 15.205 & 15.209 Pass Conducted Peak Output Power ANSI C63.10 (2020) Section 11.9.1 47 CFR Part 15, Subpart C 15.247(b)(3) Pass Minimum 6dB Bandwidth ANSI C63.10 (2020) Section 11.8.1 47 CFR Part 15, Subpart C 15.247a(2) Pass Power Spectrum Density ANSI C63.10 (2020) Section 11.10.2 47 CFR Part 15, Subpart C 15.247(e) Pass Conducted Band Edges Measurement ANSI C63.10 (2020) Section 6.10.4 47 CFR Part 15, Subpart C 15.247(d) Pass Conducted Spurious Emissions ANSI C63.10 (2020) Section 11.11 47 CFR Part 15, Subpart C 15.247(d) Pass SGS-CSTC Standards Technical Services Co., Ltd. Shenzhen Branch SZEMC-TRF-01 Rev. A/2 Report No.: SZCR260100014102 Page: 4 of 56 3 Contents Page 1 Cover Page ................................................................................................................................................ 1 2 Test Summary ........................................................................................................................................... 3 3 Contents .................................................................................................................................................... 4 4 General Information .................................................................................................................................. 6 4.1 Details of E.U.T. ................................................................................................................................. 6 4.2 Description of Support Units .............................................................................................................. 6 4.3 Measurement Uncertainty .................................................................................................................. 6 4.4 Test Location ...................................................................................................................................... 7 4.5 Test Facility ........................................................................................................................................ 7 4.6 Deviation from Standards ................................................................................................................... 7 4.7 Abnormalities from Standard Conditions ........................................................................................... 7 5 Equipment List .......................................................................................................................................... 8 6 Radio Spectrum Technical Requirement ............................................................................................. 10 6.1 Antenna Requirement ...................................................................................................................... 10 6.1.1 Test Requirement: ....................................................................................................................... 10 6.1.2 Conclusion ................................................................................................................................... 10 7 Radio Spectrum Matter Test Results .................................................................................................... 11 7.1 Radiated Emissions which fall in the restricted bands ..................................................................... 11 7.1.1 E.U.T. Operation .......................................................................................................................... 11 7.1.2 Test Mode Description ................................................................................................................. 11 7.1.3 Test Setup Diagram ..................................................................................................................... 12 7.1.4 Measurement Procedure and Data.............................................................................................…

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承 認 書 SPECIFICATION FOR APPROVAL 料號 PART NUMBER ： WAN1608H245H08 規格 DESCRIPTION ： Chip Antenna 1608 MH-Ant 2.45G Type H08 版本 VERSION ： V1.0 日期 ISSUE DATE ： 2021/03/03 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray Tennyson Snow 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112台北市北投區立功街151號1樓 1F, No. 151, Li Gong Street, Beitou District, Taipei City 112, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 ONEWAVE TECHNOLOGY CO., LTD. 2/12 1608 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 1.70 ± 0.20 W 0.93 ± 0.20 T 0.75 ± 0.20 P/N: WAN1608H245H08 ONEWAVE TECHNOLOGY CO., LTD. 3/12 Part Number Information WAN 1608 H 245 H 08 A B C D E F A Product Series Antenna B Dimension L x W 1.6X0.8mm (+-0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode Monopole & Single Feeding F Antenna type Type = 08 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN1608H245H08 Central Frequency 2450 MHz Bandwidth 120 (Min.) MHz Return Loss -10(Max) dB Peak Gain 2.28 dBi Impedance 50 Ohm Operating Temperature -40～+110 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) ONEWAVE TECHNOLOGY CO., LTD. 4/12 2. Recommended PCB Pattern 1. Evaluation Board Dimension (若淨空區夠大，建議在天線尾段加Trace，效能更佳) Unit : mm 2. Evaluation Board Dimension (若淨空區夠大，建議在天線尾段加Trace，效能更佳) 3. Evaluation Board Dimension ONEWAVE TECHNOLOGY CO., LTD. 5/12 Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感±0.1~0.3nH、電容±0.1pF 1. Layout Dimensions in Clearance area(Size=5.5*4mm) 50 ohm transmission Line Matching Circuit 2. Layout Dimensions in Clearance area(Size=5.5*4mm) 50 ohm transmission Line Matching Circuit 1～10nH None 0Ω 1.5pF ONEWAVE TECHNOLOGY CO., LTD. 6/12 3. Layout Dimensions in Clearance area(Size=5*3mm) 50 ohm transmission Line Matching Circuit FootPrint (Unit : mm) ONEWAVE TECHNOLOGY CO., LTD. 7/12 3. Measurement Results Return Loss ONEWAVE TECHNOLOGY CO., LTD. 8/12 Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 50.65 % 1.80 dBi 3.95 dBi 2450MHz 53.27 % 2.28 dBi 4.42 dBi 2500MHz 50.32 % 1.77 dBi 4.15 dBi Chamber Coordinate System Y Z X ONEWAVE TECHNOLOGY CO., LTD. 9/12 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10 ± 0.5 sec. 60 sec . . T E M P ( °C ) 150 °C 2 6 0 °C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C ONEWAVE TECHNOLOGY CO., LTD. 10/12 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 ONEWAVE TECHNOLOGY CO., LTD. 11/12 6.Packaging Information ◆ Tape Specification: W Ao Bo Ko P F E D D1 Po P2 t 8.0 ±0.30 1.10± 0.05 1.90 ±0.10 1.10± 0.10 4.00 ±0.05 3.50 ±0.05 1.75 ±0.10 1.50 ±0.10 0.00…

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