2AWP5WM84202.4GHz BLE Module

Proprietary & Confidential Information iotTech Corporation, Taiwan Doc. NO: iotTech ITM-8420 User Manual Bluetooth ® LE 5.0 Wireless Module Version 0.2 Proprietary & Confidential Information iotTech Corporation, Taiwan Doc. NO: Revision History Date Revision Content Revised By Version 2024/07/29 - Initial released (Preliminary) Issac Chen 0.1 2024/08/09 - Update measured data Issac Chen 0.2 - - - ITM-8420 User Manual Proprietary & Confidential Information iotTech Corporation, Taiwan Doc. NO: Contents Revision History ....................................................................................................... 1 Contents ................................................................................................................... 2 1. General Description ............................................................................................ 3 1-1 Block Diagram ............................................................................................. 3 2. Features ............................................................................................................... 4 3. General Specification ......................................................................................... 7 3.1 Voltages .......................................................................................................... 7 3.1.1 Absolute Maximum Ratings .................................................................... 7 3.1.2 Recommended Operating Ratings ......................................................... 7 3.2 RF Specification (RX) ..................................................................................... 7 3.3 RF Specification (TX) ...................................................................................... 8 3.4 Power Consumption ....................................................................................... 8 4. Pin Assignments ................................................................................................. 9 4.1 PCB Pin Outline (10.5mm x 15.5mm x 2.0mm) .............................................. 9 4.2 Pin Definition .................................................................................................. 9 5. Dimensions and Layout ................................................................................... 12 5.1 Module Dimension ........................................................................................ 12 5.2 Module Layout .............................................................................................. 12 6. Hardware Design Guidelines ........................................................................... 14 6-1 Reference Design ......................................................................................... 14 6.2 Layout Recommendation .............................................................................. 15 6-3 Recommended Reflow Profile ...................................................................... 17 7. Software Introduction ....................................................................................... 18 7-1 Getting Started.............................................................................................. 18 7-2 Setting Up Tool Chain ................................................................................... 19 7-3 Communicating with the Kit .......................................................................... 20 8. FCC Statement .................................................................................................. 22 ITM-8420 User Manual Proprietary & Confidential Information iotTech Corporation, Taiwan Doc. NO: 1. General Description iTM-8420 module features a fully integrated 2.4GHz radio transceiver and baseband processor for Bluetooth 5.0 applications. It can be used as a standalone application-specific communication processor or as a wireless data link in hosted MCU systems where ultra-low power is critical. It supports flexible memory architecture for storing profiles, stacks and custom application codes, and can be updated using Over-The-Air (OTA) technology. iTM-8420 module uses Nordic nRF52840 BLE chipset. It combines the excellent performance of a leading RF transceiver with a low-power ARM Cortex-M4 and rich powerful supporting features and peripherals. It also contains 256KB RAM, and 1MB flash memory. 1-1 Block Diagram ITM-8420 User Manual Proprietary & Confidential Information iotTech Corporation, Taiwan Doc. NO: 2. Features  Bluetooth® 5, 2.4 GHz transceiver  -95 dBm sensitivity in 1 Mbps Bluetooth® low energy mode  -103 dBm sensitivity in 125 kbps Bluetooth® low energy mode (long range)  Max. 13.9 dBm TX power (peak)  On-air compatible with nRF52, nRF51, nRF24L, and nRF24AP Series  Supported data rates:  Bluetooth® 5 – 2 Mbps, 1 Mbps, 500 kbps, and 125 kbps  Single-ended antenna output (on-chip balun)  128-bit AES/ECB/CCM/AAR co-processor (on-the-fly packet encryption)  4.8 mA peak current in TX (0 dBm)  4.6 mA peak current in RX  RSSI (1 dB resolution)  ARM® Cortex® -M4 32-bit processor with FPU, 64 MHz  212 EEMBC CoreMark® score running from flash memory  52 μA/MHz running CoreMark from flash memory  Watchpoint and trace debug modules (DWT, ETM, and ITM)  Serial wire debug (SWD)  Rich set of security features  ARM® TrustZone® Cryptocell 310 security subsystem  NIST SP800-90A and SP800-90B compliant random number generator  AES-128 – ECB, CBC, CMAC/CBC-MAC, CTR, CCM/CCM*  Chacha20/Poly1305 AEAD supporting 128- and 256-bit key size  SHA-1, SHA-2 up to 256 bits  Keyed-hash message authentication code (HMAC)  RSA up to 2048-bit key size  SRP up to 3072-bit key size  ECC support for most used curves, including P-256 (secp256r1) and Ed25519/Curve25519  Application key management using derived key model  Secure boot ready ITM-8420 User Manual Proprietary & Confidential Information iotTech Corporation, Taiwan Doc. NO:  Flash access control list (ACL)  Ro…

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IOTTECH CORPORATION No.10-1,Shijian Rd.,Hukou,Hsinchu,Taiwan Tel: 886-3-598-2022 RF Declaration Letter 2024-09-03 FEDERAL COMMUNICATIONS COMMISSION Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 To whom it may concern: The RF Chip/module (nRF52840) supports the following functions: 2.4 GHz Transceiver, Long Range Bluetooth Low Energy, Bluetooth mesh,ANT, 802.15.4, Thread, Zigbee Now installed in the 2.4GHz BLE Module (FCC ID: 2AWP5WM8420), only BLE 1M/2M/125k/500k are used, other functions will be disabled by software. We, IOTTECH CORPORATION assumes the liability against any problems or damages that might occur in relation to this issue. Sincerely Yours, Issac Chen/General Manager TEL: 886-3-598-2022Extension:134 Email: [email protected]

Bay Area Compliance Laboratories Corp. (New Taipei Laboratory) Project No.: RXZ240711038 Page 1 of 1 External Photographs ***** END *****

Bay Area Compliance Laboratories Corp. (New Taipei Laboratory) Project No.: RXZ240711038 Page 1 of 3 Internal Photographs Bay Area Compliance Laboratories Corp. (New Taipei Laboratory) Project No.: RXZ240711038 Page 2 of 3 RF Chip Bay Area Compliance Laboratories Corp. (New Taipei Laboratory) Project No.: RXZ240711038 Page 3 of 3 Antenna ***** END *****

Bay Area Compliance Laboratories Corp. (New Taipei Laboratory) No.: RXZ240711038RF02 Note: It may not be duplicated or used in part without prior written consent from Bay Area Compliance Laboratories Corp. (New Taipei Laboratory) Page 16 of 63 5 FCC §15.247(i), §1.1307(b)(3) – RF Exposure 5.1 Applicable Standard According to subpart 15.247(i) and subpart §1.1307(b)(3), systems operating under the provisions of this section shall be operated in a manner that ensures that the public is not exposed to radio frequency energy level in excess of the Commission’s guidelines. For single RF sources (i.e., any single fixed RF source, mobile device, or portable device, as defined in paragraph (b)(2) of this section): A single RF source is exempt if: (A) The available maximum time-averaged power is no more than 1 mW, regardless of separation distance. This exemption may not be used in conjunction with other exemption criteria other than those in paragraph (b)(3)(ii)(A) of this section. Medical implant devices may only use this exemption and that in paragraph (b)(3)(ii)(A); (B) Or the available maximum time-averaged power or effective radiated power (ERP), whichever is greater, is less than or equal to the threshold Pth (mW) described in the following formula. This method shall only be used at separation distances (cm) from 0.5 centimeters to 40 centimeters and at frequencies from 0.3 GHz to 6 GHz (inclusive). Pth is given by: (C) Or using Table 1 and the minimum separation distance (R in meters) from the body of a nearby person for the frequency (f in MHz) at which the source operates, the ERP (watts) is no more than the calculated value prescribed for that frequency. For the exemption in Table 1 to apply, R must be at least λ/2π, where λ is the free-space operating wavelength in meters. If the ERP of a single RF source is not easily obtained, then the available maximum time-averaged power may be used in lieu of ERP if the physical dimensions of the radiating structure(s) do not exceed the electrical length of λ/4 or if the antenna gain is less than that of a half- wave dipole (1.64 linear value). Bay Area Compliance Laboratories Corp. (New Taipei Laboratory) No.: RXZ240711038RF02 Note: It may not be duplicated or used in part without prior written consent from Bay Area Compliance Laboratories Corp. (New Taipei Laboratory) Page 17 of 63 5.2 RF Exposure Evaluation Result Project info § 1.1307(b)(3)(i)(A) method is not applicable. § 1.1307(b)(3)(i)(C) The minimum separation distance (R in meters) from the body of a nearby person for the frequency (f in MHz) at which the source operates ERP (watts) is no more than the calculated value prescribed for that frequency R must be at leastλ/2π λ is the free-space operating wavelength in meters Note: The Tune-up output power was declared by the Applicant. Result: The device compliant the MPE-Based Exemption at 20cm distances. Band Freq (MHz) Tune‐up Power (dBm) Ant Gain (dBi) Distances (mm) Tune‐up Power (mW) ERP (dBm) ERP (mW) BLE240213.93.5320024.5515.28 33.73

2022/9/6 Spec No. Approved Customer P/N： A Checked Chip Antenna 8010 M-Ant 2.4~2.5G Type H05 To： WCA1-ZZ-0601 UDE P/N： Description： Prepared RevisionUpdate Date 2/11 www.ude-corp.com 8010 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 8.01 ± 0.20 W 1.03 ± 0.20 T 1.25 ± 0.20 W L T P/N: WCA1-ZZ-0601 3/11 www.ude-corp.com Part Number Information WCA1 - ZZ - 0 6 0 1 A B C D E F A Product Series Antenna B Dimension L x W 8.0X1.0mm (+-0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode Monopole & Single Feeding F Antenna type Type = 05 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WCA1-ZZ-0601 Central Frequency 2450 MHz Bandwidth 100 (Min.) MHz Return Loss -10 (Max) dB Peak Gain 3.53 dBi Impedance 50 Ohm Operating Temperature -40～+110 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) 4/11 www.ude-corp.com 2. Recommended PCB Pattern Evaluation Board Dimension Unit : mm Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感±0.1~0.3nH、電容±0.1pF  Layout Dimensions in Clearance area( Size=10.0*5.0mm ) 5/11 www.ude-corp.com 50 ohm transmission Line Matching Circuit  Layout Dimensions in Clearance area( Size=10.0*3.0mm ) 50 ohm transmission Line Matching Circuit FootPrint (Unit : mm) 6/11 www.ude-corp.com 3. Measurement Results Return Loss 7/11 www.ude-corp.com Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 69.25 % 3.41 dBi 5.42 dBi 2450MHz 75.82 % 3.53 dBi 5.38 dBi 2500MHz 68.55 % 3.26 dBi 5.17 dBi Chamber Coordinate System Y Z X 8/11 www.ude-corp.com 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10±0.5 sec. 60sec .. TEMP (°C) 150°C 260°C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C 9/11 www.ude-corp.com 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradualcooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 10/11 www.ude-corp.com 6.Packaging Information  Tape Specification: W Ao Bo Ko P F E D D1 Po P2 t 16.0 ±0.30 1.30 ±0.10 8.30 ±0.10 1.40 ±0.10 4.00 ±0.10 7.50 ±0.10 1.75 ±0.10 1.50 ±0.10 0.00 ±0.10 4.00 ±0.10 2.00 ±0.10 0.30 ±0.05  Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 16 16±1.0 60±2 13.5±0.5 178±2 3000 11/11 www.ude-corp.com 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: -10~ 40°C and 30~70% RH. 2. Recommended products should be used within 6 months from the time of delivery. 3. The packaging material should be kept where no chlorine or sulfur exists in the air. Transportation Conditions 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezer…

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Note: It may not be duplicated or used in part without prior written consent from Bay Area Compliance Laboratories Corp. (New Taipei Laboratory) Page 1 of 63 FCC Part 15.247 TEST REPORT For IOTTECH CORPORATION No. 10-1, Shijian Rd., Hukou Township, Hsinchu County 303, Taiwan (R.O.C.) FCC ID: 2AWP5WM8420 Report Type: Original Report Product Type: 2.4GHz BLE Module Report Producer : Coco Lin Report Number : RXZ240711038RF02 Report Date : 2024-08-29 Reviewed By: Andy Shih Prepared By: Bay Area Compliance Laboratories Corp. (New Taipei Laboratory) 70, Lane 169, Sec. 2, Datong Road, Xizhi Dist., New Taipei City 221, Taiwan, R.O.C. Tel: +886 (2) 2647 6898 Fax: +886 (2) 2647 6895 www.bacl.com.tw Bay Area Compliance Laboratories Corp. (New Taipei Laboratory) No.: RXZ240711038RF02 Note: It may not be duplicated or used in part without prior written consent from Bay Area Compliance Laboratories Corp. (New Taipei Laboratory) Page 2 of 63 Revision History Revision No. Report Number Issue Date Description Author/ Revised by 0.0 RXZ240711038 RXZ240711038RF02 2024-08-29 Original Report Coco Lin Bay Area Compliance Laboratories Corp. (New Taipei Laboratory) No.: RXZ240711038RF02 Note: It may not be duplicated or used in part without prior written consent from Bay Area Compliance Laboratories Corp. (New Taipei Laboratory) Page 3 of 63 TABLE OF CONTENTS 1 General Information ....................................................................................................... 5 1.1 Product Description for Equipment under Test (EUT) ......................................................... 5 1.2 Objective ............................................................................................................................... 6 1.3 Test Methodology .................................................................................................................. 6 1.4 Statement ............................................................................................................................... 6 1.5 Measurement Uncertainty ..................................................................................................... 7 1.6 Environmental Conditions ..................................................................................................... 7 1.7 Test Facility ........................................................................................................................... 7 2 System Test Configuration ............................................................................................. 8 2.1 Description of Test Configuration ......................................................................................... 8 2.2 Equipment Modifications ...................................................................................................... 8 2.3 EUT Exercise Software ......................................................................................................... 8 2.4 Support Equipment List and Details ...................................................................................... 8 2.5 External Cable List and Details ............................................................................................. 9 2.6 Test Mode .............................................................................................................................. 9 2.7 Block Diagram of Test Setup ................................................................................................ 9 2.8 Duty Cycle ........................................................................................................................... 11 3 Summary of Test Results .............................................................................................. 14 4 Test Equipment List and Details ................................................................................. 15 5 FCC §15.247(i), §1.1307(b)(3) – RF Exposure............................................................ 16 5.1 Applicable Standard ............................................................................................................ 16 5.2 RF Exposure Evaluation Result ........................................................................................... 17 6 FCC §15.203 – Antenna Requirements ....................................................................... 18 6.1 Applicable Standard ............................................................................................................ 18 6.2 Antenna Information ........................................................................................................... 18 7 FCC §15.207(a) – AC Line Conducted Emissions ..................................................... 19 7.1 Applicable Standard ............................................................................................................ 19 7.2 EUT Setup ........................................................................................................................... 19 7.3 EMI Test Receiver Setup .................................................................................................... 20 7.4 Test Procedure ..................................................................................................................... 20 7.5 Corrected Factor & Over Limit Calculation ........................................................................ 20 7.6 Test Results ......................................................................................................................... 21 8 FCC §15.209, §15.205 , §15.247(d) – Spurious Emissions ......................................... 23 8.1 Applicable Standard ............................................................................................................ 23 8.2 EUT Setup ........................................................................................................................... 24 8.3 EMI Test Receiver & Spectrum Analyzer Setup........................…

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Bay Area Compliance Laboratories Corp. (New Taipei Laboratory) Project No.: RXZ240711038 Page 1 of 5 EUT Setup Photographs Conduction： Bay Area Compliance Laboratories Corp. (New Taipei Laboratory) Project No.: RXZ240711038 Page 2 of 5 Radiated Emission (Below 1GHz)： Bay Area Compliance Laboratories Corp. (New Taipei Laboratory) Project No.: RXZ240711038 Page 3 of 5 Radiated Emission (1GHz~18GHz)： Bay Area Compliance Laboratories Corp. (New Taipei Laboratory) Project No.: RXZ240711038 Page 4 of 5 Radiated Emission (Above 18GHz)： Bay Area Compliance Laboratories Corp. (New Taipei Laboratory) Project No.: RXZ240711038 Page 5 of 5 LOOP ***** END *****