2AYT6-SPR2SPRYNG 2.0

Reference No.: WTH22X12262717W001 Page 2 of 19 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn EXHIBIT 2 - EUT EXTERNAL PHOTOGRAPHS EUT View 1 EUT View 2 Reference No.: WTH22X12262717W001 Page 3 of 19 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn EUT View 3 EUT View 4 Reference No.: WTH22X12262717W001 Page 4 of 19 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn EUT View 5 EUT View 6 Reference No.: WTH22X12262717W001 Page 5 of 19 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn EUT View 7 EUT View 8 Reference No.: WTH22X12262717W001 Page 6 of 19 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn EUT View 9 EUT View 10 Reference No.: WTH22X12262717W001 Page 7 of 19 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn EUT View 11 EUT View 12 Reference No.: WTH22X12262717W001 Page 8 of 19 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn EUT View 13 EUT View 14

Reference No.: WTH22X12262717W001 Page 1 of 19 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn ANNEX EXHIBIT 1 - PRODUCT LABELING Proposed FCC ID Label Format Specifications: The label shall be securely affixed to a permanently attached part of the device, in a location where it is visible or easily accessible to the user, and shall not be readily detachable. The label shall be sufficiently durable to remain fully legible and intact on the device in all normal conditions of use throughout the device’s expected lifetime. Proposed Label Location on EUT FCC ID Label Location

Reference No.: WTH22X12262717W001 Page 9 of 19 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn EXHIBIT 3 - EUT INTERNAL PHOTOGRAPHS EUT Housing and Board View 1 EUT Housing and Board View 2 Reference No.: WTH22X12262717W001 Page 10 of 19 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Solder Board-Component View 1 Solder Board-Component View 2 Reference No.: WTH22X12262717W001 Page 11 of 19 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Solder Board-Component View 3 Solder Board-Component View 4 Reference No.: WTH22X12262717W001 Page 12 of 19 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Solder Board-Component View 5 Solder Board-Component View 6 Reference No.: WTH22X12262717W001 Page 13 of 19 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Solder Board-Component View 7 Solder Board-Component View 8

Reference No.: WTH22X12262717W001 Page 14 of 19 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Solder Board-Component View 9 Solder Board-Component View 10 Reference No.: WTH22X12262717W001 Page 15 of 19 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Solder Board-Component View 11 Solder Board-Component View 12 Reference No.: WTH22X12262717W001 Page 16 of 19 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Antenna View

1. RF Exposure Requirements 1.1 General Information Client Information Applicant: MAS Innovation (Pvt) Ltd Address of applicant: Lot 14A, Zone 1, Biyagama Export Processing Zone, Biyagama, Sri Lanka Manufacturer: MAS Innovation (Pvt) Ltd Address of manufacturer: Lot 14A, Zone 1, Biyagama Export Processing Zone, Biyagama, Sri Lanka General Description of EUT: Product Name: SPRYNG 2.0 Trade Name / Model No.: SPR2 Adding Model(s): / Rated Voltage: DC3.7V Power Adapter: IVP0500-2000U Input:AC100-240 50/60Hz 0.5A Output:DC5V2.0A FCC ID: 2AYT6-SPR2 Equipment Type: Portable device Technical Characteristics of EUT: Bluetooth Bluetooth Version: V5.0(BLE mode) Frequency Range: 2402-2480MHz RF Output Power: -11.12dBm (Conducted) Data Rate: 1Mbps Modulation: GFSK Quantity of Channels: 40 Channel Separation: 2MHz Type of Antenna: Chip Antenna Antenna Gain: 2.4dBi 1.2 RF Exposure Exemption According to §1.1307(b)(3) and 447498 D04 Interim General RF Exposure Guidance v01, system operating under the provisions of this section shall be operating in a manner that the public is not exposed to radio frequency energy level in excess limit for maximum permissible exposure. Option A: FCC Rule Part 1.1307 (b)(3)(i)(A):The available maximum time-averaged power is no more than 1mW, regardless of separation distance. Option B: FCC Rule Part 1.1307 (b)(3)(i)(B): The available maximum time-averaged power or effective radiated power (ERP), whichever is greater, is less than or equal to the threshold P th (mW) described in the following formula. P th is given by: Option C: FCC Rule Part 1.1307 (b)(3)(i)(C): The minimum separation distance (R in meters) from the body of a nearby person for the frequency (f in MHz) at which the source operates, the ERP (watts) is no more than the calculated value prescribed for that frequency. R must be at least λ/2π, where λ is the free-space operating wavelength in meters. Single RF Sources Subject to Routine Environmental Evaluation RF Source frequency (MHz) Threshold ERP (watts) 0.3-1.34 1,920 R 2 1.34-30 3,450 R 2 /f 2 30-300 3.83 R 2 300-1,500 0.0128 R 2 f 1,500-100,000 19.2R 2 For Multiple RF sources: FCC Rule Part 1.1307(b)(3)(ii): (A) The available maximum time-averaged power of each source is no more than 1 mW and there is a separation distance of two centimeters between any portion of a radiating structure operating and the nearest portion of any other radiating structure in the same device, except if the sum of multiple sources is less than 1 mW during the time-averaging period, in which case they may be treated as a single source (separation is not required). (B) In the case of fixed RF sources operating in the same time-averaging period, or of multiple mobile or portable RF sources within a device operating in the same time averaging period, if the sum of the fractional contributions to the applicable thresholds is less than or equal to 1 as indicated in the following equation. 1.3 Calculated Result Radio Access Technology Prediction Frequency Output Power Antenna Gain Duty Cycle Tune-Up Time-Averaged Power ERP (MHz) (dBm) (dBi) (%) (dBm) (dBm) Bluetooth 2402 -11.12 2.4 100 -11.0 -10.75 Frequency Option Min. Distance Max. Power Exposure Limit Ratio Result (MHz) (cm) (dBm) (mW) (mW) Pass/Fail 2402 B 0.5 -10.75 0.08 2.788 0.03 Pass Note: 1. Time-Averaged Power=Output Power * Duty Cycle; ERP= Time-Averaged Power+ Antenna gain-2.15dB 2. Option A, B and C refers as clause 1.2. 3. For option B, Max (time-averaged power, effective radiated power (ERP)) converts to Max. Power. For option C, ERP converts to Max. Power; 4. For option B, P th (mW) converts to Exposure Limit (mW); For option C, ERP (W) converts to Exposure Limit (mW). 5. Ratio= Tune-Up ERP (mW)/ Exposure Limit (mW) Mode for Simultaneous Multi-band Transmission: Radio Access Technology Ratio 1 Ratio 2 Simultaneous Ratio Limit Result Pass/Fail -- -- -- -- -- -- Result: Pass

NANO mXTEND TM : MINIATURE AND HIGH EFFICIENCY BLUETOOTH/WI-FI ANTENNA USER MANUAL NANO mXTEND TM (NN02-101) 2 Last Update: May 2022 USER MANUAL NANO mXTEND TM (NN02-101) NANO mXTEND TM MINIATURE AND HIGH-EFFICIENCY BLUETOOTH/WI-FI ANTENNA NN02-101 NANO mXTEND TM | Bluetooth & Wi-Fi Operating range: 2400 – 10600 MHz Best for: 2400 – 2500 MHz Dimensions : 3.0 mm x 2.0 mm x 0.8 mm 3 Last Update: May 2022 USER MANUAL NANO mXTEND TM (NN02-101) What is the NANO mXTEND TM ? The NANO mXTEND TM is the smallest Virtual Antenna ® chip to date. Featuring a size of only 3 mm x 2 mm x 0.8 mm, this off-the-shelf chip antenna has been designed to fit almost every IoT device from entry-level to high-end products. The NANO mXTEND TM is enabled by Virtual Antenna ® technology, thus featuring the unique properties of this class of products: easy to use; versatile, and broadly tunable. The NANO mXTEND TM is available for Bluetooth, Wi-Fi, Wi-SUN, and any wireless connectivity protocol operating in the 2.4 - 2.5 GHz band. Due to Ignion’s proprietary Virtual Antenna ® technology, this chip antenna is non-resonant and therefore broadly tunable, enabling additional frequency bands to be supported by the same antenna part and released in the future. As with every other Virtual Antenna ® chip, the NANO mXTEND TM is available through Ignion’s Antenna Intelligence Cloud tool, enabling predictable design and performance throughout the entire product development cycle. Moreover, the NANO mXTEND TM is built on a glass epoxy substrate, making its manufacturing broadly available and therefore resilient against shortage. Material: The NANO mXTEND TM antenna booster is built on a glass epoxy substrate. What is the NANO mXTEND TM used for? The NANO mXTEND TM is suitable for embedding an antenna into any wireless device requiring optimum performance in a small, cost-effective package for operating in the Bluetooth/Wi-Fi/Wi- SUN ISM 2.4 GHz frequency bands, including:  Asset Trackers  Smart Tags  Earphones and Headsets  Wearables  Logistic Trackers  Health sensors  Animal Trackers  Security Sensors  Service Buttons  Environmental Sensors  IoT Developer Kits  Wireless Sniffing Sensors 4 Last Update: May 2022 USER MANUAL NANO mXTEND TM (NN02-101) What differentiates the NANO mXTEND TM from other chip antennas? Like every other Virtual Antenna ® product, the NANO mXTEND TM is frequency neutral, meaning that its frequency response is not determined by the antenna component but designed by the electronics engineer. Virtual Antenna ® technology provides the broadest range of connectivity options with desired antenna performance in the smallest ever form factor. This unique technology enables the whole mXTEND TM range of components to become tiny, off-the-shelf, surface-mount (SMD) electronic chips while still providing connectivity with multiple frequency bands and meeting the requirements of most wireless devices’ architectures and form factors. Being non-resonant, the whole antenna performance can be customized through a shorter and easier design cycle by means of a matching circuit, while benefiting at the same time from a robust, reliable, and cost-effective manufacturing process because of the chip, SMD form factor. Also, the NANO mXTEND TM ‘s architecture is not using ceramic materials to achieve miniaturization, which ensures a pervasive availability of raw materials thus making the supply chain resilient to shortage and price fluctuations. 5 Last Update: May 2022 USER MANUAL NANO mXTEND TM (NN02-101) Click to view other useful NANO mXTEND TM guidelines: HOW TO EMBED A VIRTUAL ANTENNA ® MECHANICAL SPECIFICATIONS ASSEMBLY AND MANUFACTURING PACKAGING 6 Last Update: May 2022 USER MANUAL NANO mXTEND TM (NN02-101) Chapter Index The NANO mXTEND TM for Bluetooth/Wi-Fi 9 CORNER MOUNTING CONFIGURATION 9 MATCHING NETWORK 11 VSWR AND TOTAL EFFICIENCY 12 RADIATION PATTERNS, GAIN, AND EFFICIENCY 13 EDGE MOUNTING CONFIGURATION 14 MATCHING NETWORK 15 VSWR AND TOTAL EFFICIENCY 16 RADIATION PATTERNS, GAIN, AND EFFICIENCY 17 MECHANICAL SPECIFICATIONS 18 DIMENSIONS, TOLERANCES, AND RoHS 18 INK COLOR RANGE 18 RECOMMENDED FOOTPRINT FOR THE NN02-101 19 ASSEMBLY AND MANUFACTURING 21 PACKAGING 23 7 Last Update: May 2022 USER MANUAL NANO mXTEND TM (NN02-101) How to embed Virtual Antenna ® Design with Virtual Antenna ® in 1-2-3 https://ignion.io/design-center/tutorials-webinars/ STEP 1: Place the antenna component 1. Select one corner of your PCB 2. Ensure your ground plane meets the NANO mXTEND™ clearance area restrictions 3. Respect a keep out space around the booster. Keep at least 5mm distance from metallic objects Look here for an example of antenna placement STEP 2: Design your matching network 1. Through a combination of inductors & capacitors obtain 50 Ohms of antenna impedance to optimize the transfer of energy to your antenna 2. It is critical to fine-tune your MN throughout the entirety the design process to achieve your desired frequency response Look here for an example of a matching network for a Virtual Antenna ® product application via simulation STEP 3: Test your device 1. Perform a field test in which your antenna is placed in its final housing. Fine-tune the MN if needed. 2. Use a network analyzer to adjust mismatch 3. Test the antenna ’s efficiency with an anechoic chamber Look here for a short video tutorial on how to test your antenna. Scan this QR code to see our videos highlighting these three easy steps 8 Last Update: May 2022 USER MANUAL NANO mXTEND TM (NN02-101) Need further help? Easy start with Antenna Intelligence Cloud Do you need more help with your antenna for your device? Use our Antenna Intelligence Cloud service and get your ready-to-test, proof-of-concept antenna design especially simulated for your platform free of charge 1 , and in 24 hours. https://www.ignion.io/antenna-intelligence/ 1 Subject to terms and conditions here. Scan QR code to be taken to our Antenna Intelligence Cloud page 9 Last Updat…

Text truncated - open the document above for the full version.

Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Page 1 of 38 TEST REPORT Reference No. .................... : WTH22X12262717W001 FCC ID ................................ : 2AYT6-SPR2 Applicant ........................... : MAS Innovation (Pvt) Ltd Address.............................. : Lot 14A, Zone 1, Biyagama Export Processing Zone, Biyagama, Sri Lanka Manufacturer ..................... : The same as Applicant Address.............................. : The same as Applicant Product Name ................... : SPRYNG 2.0 Model No.. .......................... : SPR2 Standards .......................... : FCC Part 15.247 Date of Receipt sample .... : 2022-12-30 Date of Test........................ : 2022-12-30 to 2023-02-13 Date of Issue ..................... : 2023-02-13 Test Report Form No. ....... : WTX_Part 15_247W Test Result ......................... : Pass Remarks: The results shown in this test report refer only to the sample(s) tested, this test report cannot be reproduced, except in full, without prior written permission of the company. The report would be invalid without specific stamp of test institute and the signatures of approver. Prepared By: Waltek Testing Group (Shenzhen) Co., Ltd. Address: 1/F., Room 101, Building 1, Hongwei Industrial Park, Liuxian 2nd Road, Block 70 Bao'an District, Shenzhen, Guangdong, China Tel.: +86-755-33663308 Fax.: +86-755-33663309 Email: [email protected] Tested by: Approved by: Dashan Chen Silin Chen Reference No.: WTH22X12262717W001 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Page 2 of 38 TABLE OF CONTENTS 1. GENERAL INFORMATION ....................................................................................................................................4 1.1 PRODUCT DESCRIPTION FOR EQUIPMENT UNDER TEST (EUT) .........................................................................4 1.2 TEST STANDARDS .................................................................................................................................................5 1.3 TEST METHODOLOGY ...........................................................................................................................................5 1.4 TEST FACILITY ......................................................................................................................................................5 1.5 EUT SETUP AND TEST MODE ..............................................................................................................................6 1.6 MEASUREMENT UNCERTAINTY .............................................................................................................................7 1.7 TEST EQUIPMENT LIST AND DETAILS ...................................................................................................................8 2. SUMMARY OF TEST RESULTS ......................................................................................................................... 11 3. ANTENNA REQUIREMENT ................................................................................................................................. 12 3.1 STANDARD APPLICABLE ..................................................................................................................................... 12 3.2 EVALUATION INFORMATION ................................................................................................................................ 12 4. POWER SPECTRAL DENSITY ........................................................................................................................... 13 4.1 STANDARD APPLICABLE ..................................................................................................................................... 13 4.2 TEST SETUP BLOCK DIAGRAM ........................................................................................................................... 13 4.3 TEST PROCEDURE .............................................................................................................................................. 13 4.4 SUMMARY OF TEST RESULTS/PLOTS ................................................................................................................. 13 5. DTS BANDWIDTH ................................................................................................................................................. 14 5.1 STANDARD APPLICABLE ..................................................................................................................................... 14 5.2 TEST SETUP BLOCK DIAGRAM ........................................................................................................................... 14 5.3 TEST PROCEDURE .............................................................................................................................................. 14 5.4 SUMMARY OF TEST RESULTS/PLOTS ................................................................................................................. 14 6. RF OUTPUT POWER ............................................................................................................................................ 15 6.1 STANDARD APPLICABLE ..................................................................................................................................... 15 6.2 TEST SETUP BLOCK DIAGRAM ........................................................................................................................... 15 6.3 TEST PROCEDURE .............................................................................................................................................. 15 6.4 SUMMARY OF TEST RESULTS/PLOTS ................................................................................................................. 15 7. FIELD STRENGTH OF SPURIOUS EMISSIONS ......................................................................................…

Text truncated - open the document above for the full version.

Reference No.: WTH22X12262717W001 Page 17 of 19 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn EXHIBIT 4 - TEST SETUP PHOTOGRAPHS Conducted Emission Test Setup Radiation Emission Test Setup (Below 30MHz) Reference No.: WTH22X12262717W001 Page 18 of 19 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Radiation Emission Test Setup (30MHz to 1GHz) Radiation Emission Test Setup (1GHz to 18GHz) Reference No.: WTH22X12262717W001 Page 19 of 19 Waltek Testing Group (Shenzhen) Co., Ltd. Http://www.waltek.com.cn Radiation Emission Test Setup (Above 18GHz) ***** END OF REPORT *****