2BA4B-OPENPODSOPEN TWS EARPHONE

⯎歏➩䭷爙抧 ⯎歏〡

Shenzhen Daikang Technology Co., Ltd. U.S. Agent Designation for Service of Process (Applicant and U.S. Agent are Separate Parties) TO: Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046, USA ATTENTION: FCC Certification – Section 2.911(d)(7) Information Designated U.S. Agent Company Name: IQUA QUDIO LIMITED FRN: 0033790908 Contact Name: CHAUNGCHAO YANG Address: 5301 LIMESTONE ROAD #150 WILMINGTON,DE19808 Telephone No: （917）888-3788 Email: [email protected] This letter is to confirm that we (“the Designated U.S. Agent) have accepted the responsibility to act as the Designated U.S. Agent for Service of Process as required by section 47 CFR 2.911(d)(7) on behalf of the Applicant noted below. U.S. Agent Signature: Date:2023-06-25 Signed by (Printed Name/Title):CHAUNGCHAO YANG / Manager The Applicant acknowledges that they must maintain an agent for no less than one year after terminating all marketing and importation OR the conclusion of any Commission-related proceeding involving the equipment. The applicant further acknowledges their responsibility to inform the FCC whenever the Designated U.S. Agent information above changes. Applicant Company name: Shenzhen Daikang Technology Co., Ltd. FCC ID: 2BA4B-OPENPODS Contact Name: dongwen Zhong Address: Building i, No. 10, East District, Shangxue S&T Park,Bantian Street, Longgang District, Shenzhen Guangdong China 518000 Telephone No: 15016731314 Email: [email protected] Applicant Signature: Date: 2023-06-25 Signed by (Printed Name/Title): dongwen Zhong / Product Manager

Shenzhen Daikang Technology Co., Ltd. 2.911 (d)(5)(i) Equipment Type Attestation v1.2 Section 2.911(d)(5)(i) Certification – EquipmentType Company name:Shenzhen Daikang Technology Co., Ltd. Address:Building i, No. 10, East District, Shangxue S&T Park,Bantian Street, Longgang District, Shenzhen Guangdong China 518000 Product Name: OPEN TWS EARPHONE FCCID: 2BA4B-OPENPODS Model(s): OpenPods,OpenPods Lite,OpenPods Pro,OpenPods Plus,OpenPods Air,G86 2.911(d)(5)(i) EquipmentType We, [Shenzhen Daikang Technology Co., Ltd.] (“the applicant”) certify that the equipment for which authorization is sought through certification is not:  Prohibited from receiving an equipment authorization pursuant to § 2.903; of the FCC rules.  Identified as an equipment type in the “Covered List” NOTE 1 Yours sincerely, Name: dongwen Zhong Date: 2023/06/25 Title and Company name: Product Manager /Shenzhen Daikang Technology Co., Ltd. NOTE 1 “Covered List”; is the List of Equipment and Services Covered By Section 2 of The Secure Networks Act, available at https://www.fcc.gov/supplychain/coveredlist References; 1) 986446 D01 Covered Equipment v01 https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?switch=P&id=325672 2) Federal Register document 2022-28263 published on 02/06/23 https://www.federalregister.gov/documents/2023/02/06/2022-28263/protecting-against-national-security-threats-to-the-com munications-supply-chain-through-the

Shenzhen Daikang Technology Co., Ltd. 2.911 (d)(5)(ii) Applicant Attestation v1.2 Section 2.911(d)(5)(ii) Certification – Applicant (Covered List ) Company name:Shenzhen Daikang Technology Co., Ltd. Address:Building i, No. 10, East District, Shangxue S&T Park,Bantian Street, Longgang District, Shenzhen Guangdong China 518000 Product Name: OPEN TWS EARPHONE FCCID: 2BA4B-OPENPODS Model(s): OpenPods,OpenPods Lite,OpenPods Pro,OpenPods Plus,OpenPods Air,G86 2.911(d)(5)(ii) Applicant filing We, [Shenzhen Daikang Technology Co., Ltd.] (“the applicant”) certify that, as of the date of the filing of the application, the applicant is not identified NOTE 1 on the “Covered List” NOTE 2 ,established pursuant to §1.50002 of this chapter,as an entity producing coveredcommunications equipment. Yours sincerely, Name: dongwen Zhong Date: 2023/06/25 Title and Company name: Product Manager / Shenzhen Daikang Technology Co., Ltd. NOTE 1 Delete option not applicable to this application. NOTE 2 “Covered List”; is the List of Equipment and Services Covered By Section 2 of The Secure Networks Act, available at https://www.fcc.gov/supplychain/coveredlist References; 1) 986446 D01 Covered Equipment v01 https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?switch=P&id=325672 2) Federal Register document 2022-28263 published on 02/06/23 https://www.federalregister.gov/documents/2023/02/06/2022-28263/protecting-against-national-security-threats-to-the-com munications-supply-chain-through-the

Shenzhen Daikang Technology Co., Ltd. Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 USA Date: 2023/06/25 Subject; Request for Confidentiality FCC ID: 2BA4B-OPENPODS To Whom It May Concern, Pursuant to the provisions of the Commission’s rules Title 47 Sections §0.457 and §0.459, we are requesting the Commission to withhold the following attachment(s) as confidential documents from public disclosure indefinitely. These documents contain detailed system and equipment descriptions and are considered as proprietary information in operation of the equipment. The public disclosure of these documents might be harmful to our company and would give competitors an unfair advantage in the market. Schematic Diagram Block Diagram Operational Description In additional to above mentioned documents, in order to comply with the marketing regulations in Title 47 CFR §2.803 and the importation rules in Title 47 CFR §2.1204, while ensuring that business sensitive information remains confidential until the actual marketing of newly authorized devices, we request Short Term Confidentiality of the following attachment(s); User Manual For 45 days, pursuant to Public Notice DA 04-1705. OR For 180 dayspursuantto KDB 726920 D01. It is our understanding that all measurement test reports, FCC ID label format and correspondence during the certification review process cannot be granted as confidential documents and this information will be available for public review once the grant of equipment authorization is issued. Sincerely, Signature: Name: dongwen Zhong Title: Product Manager Company name: Shenzhen Daikang Technology Co., Ltd.

Shenzhen Daikang Technology Co., Ltd. Authorization Company:Shenzhen Daikang Technology Co., Ltd. Address:Building i, No. 10, East District, Shangxue S&T Park,Bantian Street, Longgang District, Shenzhen Guangdong China 518000 Product Name: OPEN TWS EARPHONE Model Number(s): OpenPods,OpenPods Lite,OpenPods Pro,OpenPods Plus,OpenPods Air,G86 We authorize MiCOM Labs Inc., 575 Boulder Court, Pleasanton, California 94566, USA, to act on our behalf on all matters concerning the certification of above named equipment. We declare that MiCOM Labs Inc. is allowed to forward all information related to the approval and certification of equipment to the regulatory agencies as required and to discuss any issues concerning the approval application. Any and all acts carried out by MiCOM Labs on our behalf shall have the same effect as acts of our own. Signature: Date: 2023/06/25 Name: dongwen Zhong Title: Product Manager Company: Shenzhen Daikang Technology Co., Ltd.

Declaration on model difference We the undersigned hereby confirm that any of our production units bearing the following model numbers are identical in circuitry and electrical, mechanical and physical construction; The difference is only in model names. FCC ID: 2BA4B-OPENPODS Production name Trade name Model no. OPEN TWS EARPHONE N/A OpenPods,OpenPods Lite,OpenPods Pro,OpenPods Plus,OpenPods Air,G86 Confirmed by：Shenzhen Daikang Technology Co., Ltd. Signature : Date: 2023/06/25 Name: dongwen Zhong Title: Product Manager Company: Shenzhen Daikang Technology Co., Ltd.

EUT EXTERNAL PHOTOGRAPHS EUT View 1 EUT View 2 EUT View 3 EUT View 4 Right EUT View 5 EUT View 6 EUT View 7 EUT View 8 EUT View 9 Left EUT View 10 EUT View 11 EUT View 12 EUT View 13 EUT View 14 ----------------The end----------------

Dimension：4.26*20mm FCC ID: 2BA4B-OPENPODS

EUT INTERNAL PHOTOGRAPHS EUT Housing and Board View 1 EUT Housing and Board View 2 EUT Housing and Board View 3 EUT Housing and Board View 4 EUT Housing and Board View 5 EUT Housing and Board View 6 EUT Housing and Board View 7 EUT Housing and Board View 8 EUT Housing and Board View 9 EUT Housing and Board View 10 EUT Housing and Board View 11 Left EUT Housing and Board View 12 EUT Housing and Board View 13 EUT Housing and Board View 14 EUT Housing and Board View 15 EUT Housing and Board View 16 EUT Housing and Board View 17 Right EUT Housing and Board View 18 EUT Housing and Board View 19 EUT Housing and Board View 20 EUT Housing and Board View 21 EUT Housing and Board View 22 EUT Housing and Board View 23 EUT Housing and Board View 24 ----------------The end---------------- Antenna

FCC ID: 2BA4B- OPENPODS RF exposure evaluation According to§15.247(i), §1.1307 (b) and KDB447498, systems operating under the provisions of this section shall be operated in a manner that ensures that the public is not exposed to radio frequency energy level in excess of the commission’s guidance. The SAR-based exemption formula of §1.1307(b)(3)(i)(B), repeated here as Formula (B.2), applies for single fixed, mobile, and portable RF sources with available maximum time-averaged power or effective radiated power (ERP), whichever is greater, of less than or equal to the threshold Pth (mW). This method shall only be used at separation distances from 0.5 cm to 40 cm and at frequencies from 0.3 GHz to 6 GHz (inclusive). Pth is given by Formula (B.2). F is in GHz, d is the separation distance (cm), and ERP20cm is per Formula (B.1). When the minimum test separation distance is < 5 mm, a distance of 5 mm is applied to determine SAR test exclusion.We use 5mm as separation distance to calculate Antenna gain: 2.39dBi Conducted Transmit Power Max: = 3.19dBm = 2.08 mW EIRP=3.19dBm + 2.39 dBi=5.58dBm ERP= 5.58-2.15dB= 3.43 dBm The maximun ERP power specified is 3.43 dBm = 2.20mW The source- based time-averaging conducted output power =2.20 * Duty factor mW (where Duty Factor≤1) = 2.20 mW The SAR Exclusion Threshold Level: 푃 th (mW) = ERP 20cm * (푑/20cm) 푥 (X= ) = 2.72 mW Since the source-based time-averaging conducted output power is well below the SAR low threshold level, so the EUT is considered to comply with SAR requirement without testing.

承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： KBAN3216D245H06 規格 DESCRIPTION ： Chip Antenna 3216 M-Ant 2.45G Type H06 版本 VERSION ： V1.1 日期 ISSUE DATE ： 2021/03/03 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ziv Alex Jerry 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112台北市北投區立功街151號1樓 1F, No. 151, Li Gong Street, Beitou District, Taipei City 112, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 ONEWAVE TECHNOLOGY CO., LTD. 2/11 3216 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 3.23 ± 0.20 W 1.66 ± 0.20 T 1.13 ± 0.20 P/N: KBAN3216D245H06 ONEWAVE TECHNOLOGY CO., LTD. 3/11 Part Number Information KBAN 3216 D 245 H 06 A B C D E F A Product Series Antenna B Dimension L x W 3.2X1.6mm (+-0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode Monopole & Single Feeding F Antenna type Type = 06 1.Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number KBAN3216D245H06 Central Frequency 2450 MHz Bandwidth 100 (Min.) MHz Return Loss -6.5 (Max)dB Peak Gain 2.39 dBi Impedance 50 Ohm Operating Temperature -40～+110°C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) ONEWAVE TECHNOLOGY CO., LTD. 4/11 2.Recommended PCB Pattern Evaluation Board Dimension Unit : mm Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感±0.1~0.3nH、電容±0.1pF ONEWAVE TECHNOLOGY CO., LTD. 5/11 Layout Dimensions in Clearance area(Size=5.2*5.0mm) 50 ohm transmission Line Matching Circuit FootPrint (Unit : mm) ONEWAVE TECHNOLOGY CO., LTD. 6/11 3. Measurement Results Return Loss ONEWAVE TECHNOLOGY CO., LTD. 7/11 Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 45.61 % 1.13 dBi 4.54 dBi 2450MHz 55.65 % 2.39 dBi 4.93 dBi 2500MHz 47.63 % 1.65 dBi 4.87 dBi Chamber Coordinate System Z Y X ONEWAVE TECHNOLOGY CO., LTD. 8/11 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10 ± 0.5 sec. 60 sec . . T E M P ( °C ) 150 °C 2 6 0 °C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C ONEWAVE TECHNOLOGY CO., LTD. 9/11 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 ONEWAVE TECHNOLOGY CO., LTD. 10/11 6.Packaging Information ◆ Tape Specification: W Ao Bo Ko P F E D D1 Po P2 t 8.0 ±0.30 1.80 ±0.05 3.51 ±0.10 1.59 ±0.10 4.00 ±0.05 3.50 ±0.05 1.75 ±0.10 1.50 ±0.10 0.00 ±0.10 4.00 ±0.10 2.00 ±0.05 0.25 ±0.05 ◆ Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 13.5±0.5 178±2 3000 ONEWAVE TECHNOLOGY CO., LTD. 11/11 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperatur…

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No.：BCTC/RF-EMC-007 Page: 1 of 80 Edition：A.4 TEST REPORT Shenzhen BCTC Testing Co., Ltd. Report No.: BCTC2306445189E Applicant: Shenzhen Daikang Technology Co., Ltd. Product Name: OPEN TWS EARPHONE Model/Type Reference: OpenPods Tested Date: 2023-06-13 to 2023-06-19 Issued Date: 2023-07-13 Report No.: BCTC2306445189E No.：BCTC/RF-EMC-007 Page: 2 of 80 Edition：A.4 FCC ID: 2BA4B-OPENPODS The test report is effective only with both signature and specialized stamp. This result(s) shown in this report refer only to the sample(s) tested. Without written approval of Shenzhen BCTC Testing Co., Ltd, this report can’t be reproduced except in full. The tested sample(s) and the sample information are provided by the client. Product Name: OPEN TWS EARPHONE Trademark: Dacom Model/Type Reference: OpenPods,OpenPods Lite,OpenPods Pro,OpenPods Plus,OpenPods Air,G86 Prepared For: Shenzhen Daikang Technology Co., Ltd. Address: Building i, No. 10, East District, Shangxue S&T Park,Bantian Street, Longgang District, Shenzhen Guangdong China 518000 Manufacturer: Shenzhen Sande Dacom Electronics Co.,Ltd. Address: Building i, No. 10, East District, Shangxue S&T Park,Bantian Street, Longgang District, Shenzhen Guangdong China 518000 Prepared By: Shenzhen BCTC Testing Co., Ltd Address: 1-2/F., Building B, Pengzhou Industrial Park, No.158, Fuyuan 1st Road, Tangwei, Fuhai Subdistrict, Bao'an District, Shenzhen, Guangdong, China Sample Received Date: 2023-06-13 Sample Tested Date: 2023-06-13 to 2023-06-19 Report No.: BCTC2306445189E Test Standards FCC Part15.247 ANSI C63.10-2013 Test Results PASS Remark: This is Bluetooth Classic radio test report. Tested by: Approved by: Lei Chen/Project Handler Zero Zhou/Reviewer Report No.: BCTC2306445189E No.：BCTC/RF-EMC-007 Page: 3 of 80 Edition：A.4 Table of Content Test Report Declaration Page 1. Version .................................................................................................................. 5 2. Test Summary ....................................................................................................... 6 3. Measurement Uncertainty ..................................................................................... 7 4. Product Information and Test Setup ...................................................................... 8 4.1 Product Information ............................................................................................... 8 4.2 Test Setup Configuration ...................................................................................... 8 4.3 Support Equipment ............................................................................................... 9 4.4 Channel List .......................................................................................................... 9 4.5 Test Mode ........................................................................................................... 10 4.6 Table Of Parameters Of Text Software Setting ................................................... 10 5. Test Facility And Test Instrument Used ............................................................... 11 5.1 Test Facility ......................................................................................................... 11 5.2 Test Instrument Used .......................................................................................... 11 6. Conducted Emissions .......................................................................................... 13 6.1 Block Diagram Of Test Setup .............................................................................. 13 6.2 Limit .................................................................................................................... 13 6.3 Test procedure .................................................................................................... 13 6.4 EUT operating Conditions ................................................................................... 13 6.5 Test Result .......................................................................................................... 14 7. Radiated emissions ............................................................................................. 16 7.1 Block Diagram Of Test Setup .............................................................................. 16 7.2 Limit .................................................................................................................... 17 7.3 Test procedure .................................................................................................... 18 7.4 EUT operating Conditions ................................................................................... 19 7.5 Test Result .......................................................................................................... 20 8. Radiated Band Emission Measurement and Restricted Bands of Operation ...... 24 8.1 Block Diagram Of Test Setup .............................................................................. 24 8.2 Limit .................................................................................................................... 24 8.3 Test procedure .................................................................................................... 25 8.4 EUT operating Conditions ................................................................................... 25 8.5 Test Result .......................................................................................................... 26 9. Spurious RF Conducted Emissions ..................................................................... 27 9.1 Block Diagram Of Test Setup .............................................................................. 27 9.2 Limit .................................................................................................................... 27 9.3 Test procedure .................................................................................................... 27 …

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TEST SETUP PHOTOGRAPHS 1.1. Photos of Radiation Emission Measurement Conducted emissions Spurious Emission Test Setup (Below 1GHz) Spurious Emission Test Setup (Above 1GHz) ----------------The end----------------