2BBBK-SPEED301wireless earbuds

成品尺寸：435x 92.5mm 材质：128双铜 方式：6折页 This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. The device has been evaluated to meet general RF exposure requirement. The device can be used in portable exposure condition without restriction. FCC warning:

Dongguan Aihu Electronics Technology Co., Ltd U.S. Agent Designation for Service of Process (Applicant and U.S. Agent are Separate Parties) TO: Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046, USA ATTENTION: FCC Certification – Section 2.911(d)(7) Information Designated U.S. Agent Company Name: Baihetian Innovative Solutions FRN: 0033401605 Contact Name: Kenneth Young Street Address: 6837 Chase Rd City/Province/Zip: Dearborn, MI 48126 Telephone No: 313-395-3113 Email: [email protected] This letter is to confirm that we (“the Designated U.S. Agent) have accepted the responsibility to act as the Designated U.S. Agent for Service of Process as required by section 47 CFR 2.911(d)(7) on behalf of the Applicant noted below. U.S. Agent Signature: Date: June 1, 2023 Signed by (Printed Name/Title): Kenneth Young/Manager The Applicant acknowledges that they must maintain an agent for no less than one year after terminating all marketing and importation OR the conclusion of any Commission-related proceeding involving the equipment. The applicant further acknowledges their responsibility to inform the FCC whenever the Designated U.S. Agent information above changes. Applicant Company name: Dongguan Aihu Electronics Technology Co., Ltd Grantee Code: 2BBBK FCC ID: 2BBBK-SPEED301 Contact Name: TIANWEN LI Address: Hongfu dong road2# nongshangyinhang dasha, Dongcheng district, Dongguan, Guangdong, China, 523123 Telephone No: +86 139292482893 Email: [email protected] Applicant Signature: Date: 2023-05-23 Signed by (Printed Name/Title): TIANWEN LI/ Manager

EUT EXTERNAL PHOTOGRAPHS EUT View 1 EUT View 2 EUT View 3 EUT View 4 Right EUT View 5 EUT View 6 EUT View 7 EUT View 8 EUT View 9 EUT View 10 Left EUT View 11 EUT View 12 EUT View 13 EUT View 14 EUT View 15 EUT View 16 ----------------The end----------------

Dimension：5.33*30mm FCC ID: 2BBBK-SPEED301

EUT INTERNAL PHOTOGRAPHS Left EUT Housing and Board View 1 EUT Housing and Board View 2 EUT Housing and Board View 3 EUT Housing and Board View 4 EUT Housing and Board View 5 EUT Housing and Board View 6 EUT Housing and Board View 7 Right EUT Housing and Board View 8 EUT Housing and Board View 9 EUT Housing and Board View 10 EUT Housing and Board View 11 EUT Housing and Board View 12 EUT Housing and Board View 13 EUT Housing and Board View 14 EUT Housing and Board View 15 EUT Housing and Board View 16 (right) Antenna EUT Housing and Board View 17 (left) ----------------The end---------------- Antenna

FCC ID: 2BBBK-SPEED301 RF exposure evaluation According to§15.247(i), §1.1307 (b) and KDB447498, systems operating under the provisions of this section shall be operated in a manner that ensures that the public is not exposed to radio frequency energy level in excess of the commission’s guidance. The SAR-based exemption formula of §1.1307(b)(3)(i)(B), repeated here as Formula (B.2), applies for single fixed, mobile, and portable RF sources with available maximum time-averaged power or effective radiated power (ERP), whichever is greater, of less than or equal to the threshold Pth (mW). This method shall only be used at separation distances from 0.5 cm to 40 cm and at frequencies from 0.3 GHz to 6 GHz (inclusive). Pth is given by Formula (B.2). F is in GHz, d is the separation distance (cm), and ERP20cm is per Formula (B.1). When the minimum test separation distance is < 5 mm, a distance of 5 mm is applied to determine SAR test exclusion.We use 5mm as separation distance to calculate Antenna gain: 2.39dBi Conducted Transmit Power Max: = 0.04dBm = 1 mW EIRP=0.04dBm +2.39dBi=2.43dBm ERP= 2.43-2.15dB= 0.28 dBm The maximun ERP power specified is 0.28 dBm = 1.06mW The source- based time-averaging conducted output power =1.06 * Duty factor mW (where Duty Factor≤1) = 1.06 mW The SAR Exclusion Threshold Level: 푃 th (mW) = ERP 20cm * (푑/20cm) 푥 (X= ) = 2.72 mW Since the source-based time-averaging conducted output power is well below the SAR low threshold level, so the EUT is considered to comply with SAR requirement without testing.

承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： KBAN3216D245H06 規格 DESCRIPTION ： Chip Antenna 3216 M-Ant 2.45G Type H06 版本 VERSION ： V1.1 日期 ISSUE DATE ： 2021/03/03 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ziv Alex Jerry 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112台北市北投區立功街151號1樓 1F, No. 151, Li Gong Street, Beitou District, Taipei City 112, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 ONEWAVE TECHNOLOGY CO., LTD. 2/11 3216 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 3.23 ± 0.20 W 1.66 ± 0.20 T 1.13 ± 0.20 P/N: KBAN3216D245H06 ONEWAVE TECHNOLOGY CO., LTD. 3/11 Part Number Information KBAN 3216 D 245 H 06 A B C D E F A Product Series Antenna B Dimension L x W 3.2X1.6mm (+-0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode Monopole & Single Feeding F Antenna type Type = 06 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number KBAN3216D245H06 Central Frequency 2450 MHz Bandwidth 100 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 2.39 dBi Impedance 50 Ohm Operating Temperature -40～+110 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) ONEWAVE TECHNOLOGY CO., LTD. 4/11 2. Recommended PCB Pattern Evaluation Board Dimension Unit : mm Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感±0.1~0.3nH、電容±0.1pF ONEWAVE TECHNOLOGY CO., LTD. 5/11 Layout Dimensions in Clearance area(Size=5.2*5.0mm) 50 ohm transmission Line Matching Circuit FootPrint (Unit : mm) ONEWAVE TECHNOLOGY CO., LTD. 6/11 3. Measurement Results Return Loss ONEWAVE TECHNOLOGY CO., LTD. 7/11 Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 45.61 % 1.13 dBi 4.54 dBi 2450MHz 55.65 % 2.39 dBi 4.93 dBi 2500MHz 47.63 % 1.65 dBi 4.87 dBi Chamber Coordinate System Z Y X ONEWAVE TECHNOLOGY CO., LTD. 8/11 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10 ± 0.5 sec. 60 sec . . T E M P ( °C ) 150 °C 2 6 0 °C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C ONEWAVE TECHNOLOGY CO., LTD. 9/11 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 ONEWAVE TECHNOLOGY CO., LTD. 10/11 6.Packaging Information ◆ Tape Specification: W Ao Bo Ko P F E D D1 Po P2 t 8.0 ±0.30 1.80 ±0.05 3.51 ±0.10 1.59 ±0.10 4.00 ±0.05 3.50 ±0.05 1.75 ±0.10 1.50 ±0.10 0.00 ±0.10 4.00 ±0.10 2.00 ±0.05 0.25 ±0.05 ◆ Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 13.5±0.5 178±2 3000 ONEWAVE TECHNOLOGY CO., LTD. 11/11 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes: 1. Temper…

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No.：BCTC/RF-EMC-007 Page: 1 of 81 Edition：A.4 TEST REPORT Shenzhen BCTC Testing Co., Ltd. Report No.: BCTC2305581901E Applicant: Dongguan Aihu Electronics Technology Co., Ltd Product Name: wireless earbuds Model/Type Reference: Speed 301 Tested Date: 2023-05-19 to 2023-05-23 Issued Date: 2023-06-05 Report No.: BCTC2305581901E No.：BCTC/RF-EMC-007 Page: 2 of 81 Edition：A.4 FCC ID: 2BBBK-SPEED301 The test report is effective only with both signature and specialized stamp. This result(s) shown in this report refer only to the sample(s) tested. Without written approval of Shenzhen BCTC Testing Co., Ltd, this report can’t be reproduced except in full. The tested sample(s) and the sample information are provided by the client. Product Name: wireless earbuds Trademark: Audiovance Model/Type Reference: Speed 301, SP301, Prepared For: Dongguan Aihu Electronics Technology Co., Ltd Address: Hongfu dong road2# nongshangyinhang dasha, Dongcheng district, Dongguan, Guangdong, China, 523123 Manufacturer: Shenzhen Sande Dacom Electronics Co., Ltd Address: Building I, NO.10 East Area of ShangXue Science & Technology Industrial Park,BanTian street, LongGang District, Shenzhen, China Prepared By: Shenzhen BCTC Testing Co., Ltd . Address: 1-2/F., Building B, Pengzhou Industrial Park, No.158, Fuyuan 1st Road, Tangwei, Fuhai Subdistrict, Bao'an District, Shenzhen, Guangdong, China Sample Received Date: 2023-05-19 Sample Tested Date: 2023-05-19 to 2023-05-23 Report No.: BCTC2305581901E Test Standards FCC Part15.247 ANSI C63.10-2013 Test Results PASS Remark: This is Bluetooth Classic radio test report. Tested by: Approved by: Lei Chen/Project Handler Zero Zhou/Reviewer Report No.: BCTC2305581901E No.：BCTC/RF-EMC-007 Page: 3 of 81 Edition：A.4 Table of Content Test Report Declaration Page 1. Version .................................................................................................................. 5 2. Test Summary ....................................................................................................... 6 3. Measurement Uncertainty ..................................................................................... 7 4. Product Information and Test Setup ...................................................................... 8 4.1 Product Information ............................................................................................... 8 4.2 Test Setup Configuration ...................................................................................... 8 4.3 Support Equipment ............................................................................................... 9 4.4 Channel List .......................................................................................................... 9 4.5 Test Mode ........................................................................................................... 10 4.6 Table Of Parameters Of Text Software Setting ................................................... 10 5. Test Facility And Test Instrument Used ............................................................... 11 5.1 Test Facility ......................................................................................................... 11 5.2 Test Instrument Used .......................................................................................... 11 6. Conducted Emissions .......................................................................................... 13 6.1 Block Diagram Of Test Setup .............................................................................. 13 6.2 Limit .................................................................................................................... 13 6.3 Test procedure .................................................................................................... 13 6.4 EUT operating Conditions ................................................................................... 13 6.5 Test Result .......................................................................................................... 14 7. Radiated emissions ............................................................................................. 16 7.1 Block Diagram Of Test Setup .............................................................................. 16 7.2 Limit .................................................................................................................... 17 7.3 Test procedure .................................................................................................... 18 7.4 EUT operating Conditions ................................................................................... 19 7.5 Test Result .......................................................................................................... 20 8. Radiated Band Emission Measurement and Restricted Bands of Operation ...... 24 8.1 Block Diagram Of Test Setup .............................................................................. 24 8.2 Limit .................................................................................................................... 24 8.3 Test procedure .................................................................................................... 25 8.4 EUT operating Conditions ................................................................................... 25 8.5 Test Result .......................................................................................................... 26 9. Spurious RF Conducted Emissions ..................................................................... 28 9.1 Block Diagram Of Test Setup .............................................................................. 28 9.2 Limit .................................................................................................................... 28 9.3 Test procedure .................................................................................................... 28 9.4 Test Result .........................…

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TEST SETUP PHOTOGRAPHS 1.1. Photos of Radiation Emission Measurement Conducted emissions Spurious Emission Test Setup (Below 1GHz) Spurious Emission Test Setup (Above 1GHz) ----------------The end----------------