2BCSS-BUDSFREEITrue wireless stereo earbuds

The device has been evaluated to meet general RF exposure requirement. The device can be used in portable exposure condition without restriction

ChengduRose TechnicsCo., Ltd. Room1204, 12th Floor, Building7, 188 Jinhe West 1st Street,High-techZone,Chengdu,SichuanPilot Free TradeZone ,China FederalCommunicationsCommission Authorizationand EvaluationDivision EquipmentAuthorizationBranch 7435 OaklandMills Road Columbia,MD 21046 2024-6-28 U.S. AgentDesignation ChengduRose TechnicsCo., Ltd.acknowledgestheir consentfor the followingcontactlocatedin the United Statesto act as their agent for serviceof processfor the equipmentfor which authorizationis sought(FCC ID: 2BCSS-BUDSFREEI） Nameand companyof U.S. agent:Stone TradingLimited PhysicalU.S. addressof agent:6547 N AcademyBlvd #2266,ColoradoSprings,CO 80918,UnitedStates FRN of U.S. agent:0033401936 Email addressof U.S. agent:[email protected] TelephoneNo:+12134573118 StoneTradingLimitedacknowledgestheir obligationto acceptserviceof processon behalfofChengduRose TechnicsCo., Ltd. ChengduRose TechnicsCo., Ltd.with the FRN[0034212068]acceptsits obligationto maintainan agent for serviceof processin the UnitedStatesfor no less than one year after eitherthe granteehas permanently terminatedall marketingand importationof the applicableequipmentwithinthe U.S., or the conclusionof any Commission-relatedadministrativeor judicialproceedinginvolvingthe equipment,whicheveris later. By signingthis form, we confirmthe aboveand that we are awareof the applicationrequirementslisted under§ 2.911(d)(7). The informationprovidedin this letter is basedon the referencedrule parts of Title 47 of the CFR as well as KDB 986446D01. An expirationdate for this letter does not exist. In case the U.S. agent changes,the granteeis obligatedto notify the FCC within 30 days via the grantingTCB. Sincerely, Signature HenryChan GeneralManager ChengduRose TechnicsCo., Ltd. Signature DongmeiFang Manager 48_[model] US_Agent_2.911(d)(7)-U, V05

FCCID:2BCSS-BUDSFREEI EUTPhoto ProductName: Truewirelessstereoearbuds ModelNo.: BudsFreei Chargecase FCCID:2BCSS-BUDSFREEI FCCID:2BCSS-BUDSFREEI FCCID:2BCSS-BUDSFREEI Earbuds FCCID:2BCSS-BUDSFREEI FCCID:2BCSS-BUDSFREEI FCCID:2BCSS-BUDSFREEI ----END----

FCC ID LABEL: Label Location: FCC ID: 2B CSS-BUDSFREEI Model No.: BudsFreei

FCCID:2BCSS-BUDSFREEI EUTPhoto ProductName:Truewirelessstereoearbuds ModelNo.:BudsFreei FCCID:2BCSS-BUDSFREEI FCCID:2BCSS-BUDSFREEI ----END---- Integralantenna

FCCID:2BCSS-BUDSFREEI RFExposureEvaluation AccordingtoKDB447498andpart2.1093 ， Unlessspecificallyrequiredbythepublished RFexposureKDBprocedures,standalone1-gheadorbodyand10-gextremitySAR evaluationforgeneralpopulationexposureconditions,bymeasurementornumerical simulation,isnotrequiredwhenthecorrespondingSARTestExclusionThreshold condition(s),listedbelow,is(are)satisfied. For100MHzto6GHzandtestseparationdistances≤50mm,the1-gand10-gSARtest exclusionthresholdsaredeterminedbythefollowing: [(max.powerofchannel,includingtune-uptolerance,mW)/(min.testseparationdistance, mm)]·[√f (GHz) ]≤3.0for1-gSAR,and≤7.5for10-gextremitySAR,where f (GHz) istheRFchanneltransmitfrequencyinGHz PoweranddistanceareroundedtothenearestmWandmmbeforecalculation Theresultisroundedtoonedecimalplaceforcomparison Here, Min.Distance5mm SoaSARtestisnotrequired Frequency (MHz) Mode Output powerto antenna (dBm) Outputpower toantenna (mW) Target (dBm) Tune-up Power(dBm) ±1 Calculatio nValue limit 2402MHzGFSK1.441.393120.4913.0 2402MHzπ/4-DQPSK2.161.644230.6183.0 2402MHz8-DPSK0.921.235010.3903.0 BTBLE 2480MHz1M4.032.529450.9963.0

承認書 SPECIFICATION FOR APPROVAL 料號 PART NUMBER ： WAN2012F245C0X 規格 DESCRIPTION ： Chip Antenna 2012 L Ant 2.45G Type 02,04,06 版本 VERSION ： V2.3 日期 ISSUE DATE ： 2018/01/30 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray James Thor 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112台北市北投區中央南路二段36號3樓 2F., No.163, Sec. 1, Xi'an St., Beitou Dist., Taipei City 112, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 2/11 ONEWAVE TECHNOLOGY CO., LTD. 2012 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 2.05 ± 0.20 W 1.23 ± 0.20 T 0.45 ± 0.20 P/N: WAN2012F245C02 WAN2012F245C04 WAN2012F245C06 3/11 ONEWAVE TECHNOLOGY CO., LTD. Part Number Information WAN 2012 F 245 C 0X A B C D E F A Product Series Antenna B Dimension L x W 2.05X1.23mm ( ± 0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode PIFA & Single Feeding F Antenna type 0X=02,04,06 / Type=02,04,06 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN2012F245C02 WAN2012F245C04 WAN2012F245C06 Central Frequency 2450 MHz Bandwidth 85 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 1.72 dBi Impedance 50 Ohm Operating Temperature -40～+85 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Ni / Au (Leadless) 4/11 ONEWAVE TECHNOLOGY CO., LTD. 2. Recommended PCB Pattern Evaluation Board Dimension (board size 80x40mm) 2 nd Evaluation Board Dimension Evaluation Board Dimension (board size 80x40mm) Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度±1%以下的電感、電容、電阻 1.0pF 5/11 ONEWAVE TECHNOLOGY CO., LTD. Layout Dimensions in Clearance area( Size=3.0*5.0mm) FootPrint (Unit : mm)  2 nd Layout Dimensions in Clearance area( Size=8.0*2.5mm) Matching circuit Tuning Component Matching circuit Tuning Component 6/11 ONEWAVE TECHNOLOGY CO., LTD. 3. Measurement Results Return Loss 7/11 ONEWAVE TECHNOLOGY CO., LTD. Radiation Pattern Efficiency Peak Gain Directivity 2450MHz 70.56 % 1.72dBi 2.26 dBi Chamber Coordinate System Z X Y 8/11 ONEWAVE TECHNOLOGY CO., LTD. 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10±0.5 sec. 60sec .. TEMP (°C) 150°C 260°C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +85±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +85°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 85±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C 9/11 ONEWAVE TECHNOLOGY CO., LTD. 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradualcooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 10/11 ONEWAVE TECHNOLOGY CO., LTD. 6.Packaging Information Tape Specification: Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 13.5±0.5 178±2 3000 11/11 ONEWAVE TECHNOLOGY CO., LTD. 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: -10~ 40°C and 30~70% RH. 2. Recomm…

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ProjectNo.:ZKT-240628L7406E-2 Page 1 of 48 FCCTESTREPORT FCCID:2BCSS-BUDSFREEI ReportNumber.....................................: ZKT-240628L7406E-2 DateofTest.......................................................: Jun.06,2024toJun.17,2024 Dateofissue.........................................: Jun.18,2024 Totalnumberofpages .......................... 48 TestResult .......................................... : PASS TestingLaboratory. ........................... : ShenzhenZKTTechnologyCo.,Ltd. Address...............................................: No.201-203,BlockB3,FuhaiB3IndustrialZone,FuhaiAve,FuyongSt .,Bao’an,Shenzhen,China Applicant'sname ............................. : ChengduRoseTechnicsCo.,Ltd. Address ............................................... : No.1204,12thFloor,Building7,188JinheWest1stStreet, High-techZone,Chengdu,China(Sichuan)PilotFreeTradeZone Manufacturer'sname ...................... : ChengduRoseTechnicsCo.,Ltd. Address...............................................: No.1204,12thFloor,Building7,188JinheWest1stStreet, High-techZone,Chengdu,China(Sichuan)PilotFreeTradeZone Testspecification: Standard................................................: FCCCFRTitle47Part15SubpartCSection15.247 ANSIC63.10:2013 Testprocedure.....................................: / Non-standardtestmethod ................ :N/A TestReportFormNo. ....................... : TRF-EL-111_V0 TestReportForm(s)Originator ..... : ZKTTesting MasterTRF........................................: Dated:2020-01-06 ThisdevicedescribedabovehasbeentestedbyZKT,andthetestresultsshowthattheequipmentunder test(EUT)isincompliancewiththeFCCrequirements.Anditisapplicableonlytothetestedsample identifiedinthereport. Thisreportshallnotbereproducedexceptinfull,withoutthewrittenapprovalofZKT,thisdocumentmay bealteredorrevisedbyZKT,personalonly,andshallbenotedintherevisionofthedocument. Productname ..................................... :Truewirelessstereoearbuds Trademark...........................................: ROSETECHNICS Model/Typereference......................: BudsFreei,BudsFreei3,BudsFreei5,BudsFreeix,BudsFreeiS Ratings .................................................. : CheragingVoltage:DC5Vbyadapter ChargecaseBattery:DC3.7V350mAh Headsetbattery:DC3.7V,30mAh ProjectNo.:ZKT-240628L7406E-2 Page 2 of 48 Testingprocedureandtestinglocation: TestingLaboratory.......................................:ShenzhenZKTTechnologyCo.,Ltd. Address............................................................:No.201-203,BlockB3,FuhaiB3IndustrialZone,FuhaiAve ,FuyongSt.,Bao’an,Shenzhen,China JimLiu Testedby(name+signature).......................: JacksonFang Reviewer(name+signature) ....................... : LakeXie Approved(name+signature) ....................... : ProjectNo.:ZKT-240628L7406E-2 Page 3 of 48 TableofContents Page 1.VERSION....................................................................................................................5 2.SUMMARYOFTESTRESULTS...............................................................................6 2.1TESTFACILITY.................................................................................................................7 2.2MEASUREMENTUNCERTAINTY....................................................................................7 3.GENERALINFORMATION........................................................................................8 3.1GENERALDESCRIPTIONOFEUT.................................................................................8 3.2DESCRIPTIONOFTESTMODES....................................................................................9 3.3BLOCKDIGRAMSHOWINGTHECONFIGURATIONOFSYSTEMTESTED..............9 3.4DESCRIPTIONOFSUPPORTUNITS(CONDUCTEDMODE)........................................9 3.5EQUIPMENTSLISTFORALLTESTITEMS.................................................................10 4.EMCEMISSIONTEST.............................................................................................12 4.1CONDUCTEDEMISSIONMEASUREMENT..................................................................12 4.1.1POWERLINECONDUCTEDEMISSIONLimits...................................................12 4.1.2TESTPROCEDURE...............................................................................................12 4.1.3DEVIATIONFROMTESTSTANDARD..................................................................12 4.1.4TESTSETUP...........................................................................................................13 4.1.5EUTOPERATINGCONDITIONS...........................................................................13 4.2.1RADIATEDEMISSIONLIMITS...............................................................................16 4.2.2TESTPROCEDURE...............................................................................................17 4.2.3DEVIATIONFROMTESTSTANDARD..................................................................17 4.2.4TESTSETUP...........................................................................................................17 4.2.5EUTOPERATINGCONDITIONS...........................................................................18 5.RADIATEDBANDEMISSIONMEASUREMENT.....................................................23 5.1TESTREQUIREMENT:..............................................................................................23 5.2TESTPROCEDURE..................................................................................................23 5.3DEVIATIONFROMTESTSTANDARD.....................................................................23 5.4TESTSETUP..............................................................................................................24 5.5EUTOPERATINGCONDITIONS..............................................................................24 5.6TESTRESULT...........................................................................................................25 6.POWERSPECTRALDENSITYTEST..............…

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FCCID:2BCSS-BUDSFREEI EUTTESTPHOTO FCCID:2BCSS-BUDSFREEI