FCCID.CO- FCC ID Database
HomeCompaniesEquipment ClassesSearch

© 2026 FCC ID Database. All rights reserved.

AboutContactData sourced from FCC public records
  1. Home/
  2. Shenzhen FY Technology Co., Ltd./
  3. 2BD2O-FY10

2BD2O-FY10Wireless lavalier microphone

Shenzhen FY Technology Co., Ltd.
Wireless lavalier microphone - FCC ID 2BD2O-FY10 - Shenzhen FY Technology Co., Ltd.
Click to zoom

Application Details

Equipment Class
DSS - Part 15 Spread Spectrum Transmitter
Date of Grant
Nov 23, 2025
Application Purpose
Original Equipment
Equipment Note
Wireless lavalier microphone
Frequency Range
2402.00000000 - 2480.00000000
Company
Shenzhen FY Technology Co., Ltd.
Country
China

Documents & Files

Select a file to view

Attestation Statements

↗
↗
↗

Cover Letter(s)

↗
↗

External Photos

↗

ID Label/Location Info

↗

Internal Photos

↗

RF Exposure Info

↗

Test Report

↗
↗

Test Setup Photos

↗

Document Text

Text extracted from the exhibit documents filed with the FCC. Open a document above to read the original.

Attestation Statements

Shenzhen FY Technology Co., Ltd. 2.911 (d)(5)(i) Equipment Type Attestation v1.2 Section 2.911(d)(5)(i) Certification – Equipment Type Company name: Shenzhen FY Technology Co., Ltd. Address: 2nd Floor, 11th Building, Tianfu'An Industrial Zone, Xixiang, Bao'an District, Shenzhen, Guangdong, 518126 China Product Name: Wireless lavalier microphone FCC ID: 2BD2O-FY10 Model(s): FY10 2.911(d)(5)(i) Equipment Type We, [Shenzhen FY Technology Co., Ltd.] (“the applicant”) certify that the equipment for which authorization is sought through certification is not:  Prohibited from receiving an equipment authorization pursuant to § 2.903; of the FCC rules.  Identified as an equipment type in the “Covered List” NOTE 1 Yours sincerely, Name: Ruifeng Wang Date: 2025.11.13 Title and Company name: CEO / Shenzhen FY Technology Co., Ltd. NOTE 1 “Covered List”; is the List of Equipment and Services Covered By Section 2 of The Secure Networks Act, available at https://www.fcc.gov/supplychain/coveredlist References; 1) 986446 D01 Covered Equipment v01 https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?switch=P&id=325672 2) Federal Register document 2022-28263 published on 02/06/23 https://www.federalregister.gov/documents/2023/02/06/2022-28263/protecting-against-national-security-threats-to-the-com munications-supply-chain-through-the

Attestation Statements

Shenzhen FY Technology Co., Ltd. 2.911 (d)(5)(ii) Applicant Attestation v1.2 Section 2.911(d)(5)(ii) Certification – Applicant (Covered List ) Company name: Shenzhen FY Technology Co., Ltd. Address: 2nd Floor, 11th Building, Tianfu'An Industrial Zone, Xixiang, Bao'an District, Shenzhen, Guangdong, 518126 China Product Name: Wireless lavalier microphone FCC ID: 2BD2O-FY10 Model(s): FY10 2.911(d)(5)(ii) Applicant filing We, [Shenzhen FY Technology Co., Ltd.] (“the applicant”) certify that, as of the date of the filing of the application, the applicant is not identified NOTE 1 on the “Covered List” NOTE 2 , established pursuant to § 1.50002 of this chapter, as an entity producing covered communications equipment. Yours sincerely, Name: Ruifeng Wang Date: 2025.11.13 Title and Company name: CEO / Shenzhen FY Technology Co., Ltd. NOTE 1 Delete option not applicable to this application. NOTE 2 “Covered List”; is the List of Equipment and Services Covered By Section 2 of The Secure Networks Act, available at https://www.fcc.gov/supplychain/coveredlist References; 1) 986446 D01 Covered Equipment v01 https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?switch=P&id=325672 2) Federal Register document 2022-28263 published on 02/06/23 https://www.federalregister.gov/documents/2023/02/06/2022-28263/protecting-against-national-security-threats-to-the-com munications-supply-chain-through-the

Attestation Statements

Shenzhen FY Technology Co., Ltd. Federal Communications Commission Authorization and Evaluation Division Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MD 21046 [November 19, 2025] U.S. Agent Designation [Shenzhen FY Technology Co., Ltd.] acknowledges their consent for the following contact located in the United States to act as their agent for service of process for the equipment for which authorization is sought FCC ID: 2BD2O-FY10 Name and company of U.S. agent: [GLOCERTS TECHNOLOGY INC] Physical U.S. address of agent: [19784 SUNKISSED RIDGE DR, RIVERSIDE, CA 92507] FRN of U.S. agent: [0036339737] Email address of U.S. agent: [[email protected]] Telephone of U.S.agent: (626) 588-8039 [GLOCERTS TECHNOLOGY INC] acknowledges their obligation to accept service of process on behalf of [Shenzhen FY Technology Co., Ltd.]. [Shenzhen FY Technology Co., Ltd.] with the FRN [0034603928] accepts its obligation to maintain an agent for service of process in the United States for no less than 1 year after either the grantee has permanently terminated all marketing and importation of the applicable equipment within the U.S., or the conclusion of any Commission- related administrative or judicial proceeding involving the equipment, whichever is later. By signing this form, we confirm the above and that we are aware of the application requirements listed under § 2.911(d)(7). The information provided in this letter is based on the referenced rule parts of Title 47 of the CFR as well as KDB 986446 D01. Sincerely, Signature Signature [Ruifeng Wang] [Huiying Fan] [CEO] [Director] [Shenzhen FY Technology Co., Ltd.] [GLOCERTS TECHNOLOGY INC]

Cover Letter(s)

Shenzhen FY Technology Co., Ltd. Agent Authorization Company: Shenzhen FY Technology Co., Ltd. Address: 2nd Floor, 11th Building, Tianfu'An Industrial Zone, Xixiang, Bao'an District, Shenzhen, Guangdong, 518126 China Product Name: Wireless lavalier microphone Model Number(s): FY10 Product Description: Wireless lavalier microphone We authorize MiCOM Labs Inc., 575 Boulder Court, Pleasanton, California 94566, USA, to act on our behalf on all matters concerning the certification of above named equipment. We declare that MiCOM Labs Inc. is allowed to forward all information related to the approval and certification of equipment to the regulatory agencies as required and to discuss any issues concerning the approval application. Any and all acts carried out by MiCOM Labs on our behalf shall have the same effect as acts of our own. Signature: Date: November 19, 2025 Name: Ruifeng Wang Title: CEO Company: Shenzhen FY Technology Co., Ltd.

Cover Letter(s)

Shenzhen FY Technology Co., Ltd. Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 USA Date: November 19, 2025 Subject; Request for Confidentiality FCC ID: 2BD2O-FY10 To Whom It May Concern, Pursuant to the provisions of the Commission’s rules Title 47 Sections §0.457 and §0.459, we are requesting the Commission to withhold the following attachment(s) as confidential documents from public disclosure indefinitely. These documents contain detailed system and equipment descriptions and are considered as proprietary information in operation of the equipment. The public disclosure of these documents might be harmful to our company and would give competitors an unfair advantage in the market. Schematic Diagram Block Diagram Operational Description In additional to above mentioned documents, in order to comply with the marketing regulations in Title 47 CFR §2.803 and the importation rules in Title 47 CFR §2.1204, while ensuring that business sensitive information remains confidential until the actual marketing of newly authorized devices, we request Short Term Confidentiality of the following attachment(s); User Manual For 45 days, pursuant to Public Notice DA 04-1705. OR For 180 days pursuantto KDB 726920 D01. It is our understanding that all measurement test reports, FCC ID label format and correspondence during the certification review process cannot be granted as confidential documents and this information will be available for public review once the grant of equipment authorization is issued. Sincerely, Signature: Name: Wang Ruifeng Title: CEO

External Photos

Shenzhen CTB Testing Technology Co., Ltd. Report Tel: 4008-707-283 Web: http://www.ctb-lab.net Page 1 of 4 Model: FY10 External Photos Shenzhen CTB Testing Technology Co., Ltd. Report Tel: 4008-707-283 Web: http://www.ctb-lab.net Page 2 of 4 Shenzhen CTB Testing Technology Co., Ltd. Report Tel: 4008-707-283 Web: http://www.ctb-lab.net Page 3 of 4 Shenzhen CTB Testing Technology Co., Ltd. Report Tel: 4008-707-283 Web: http://www.ctb-lab.net Page 4 of 4

ID Label/Location Info

FCC ID LABEL: Label Location: FCC ID: 2BD2O-FY10 Model No.: FY10

Internal Photos

Shenzhen CTB Testing Technology Co., Ltd. Report Tel: 4008-707-283 Web: http://www.ctb-lab.net Page 1 of 4 Model: FY10 Internal Photos Shenzhen CTB Testing Technology Co., Ltd. Report Tel: 4008-707-283 Web: http://www.ctb-lab.net Page 2 of 4 ANT Shenzhen CTB Testing Technology Co., Ltd. Report Tel: 4008-707-283 Web: http://www.ctb-lab.net Page 3 of 4 Shenzhen CTB Testing Technology Co., Ltd. Report Tel: 4008-707-283 Web: http://www.ctb-lab.net Page 4 of 4

RF Exposure Info

Shenzhen CTB Testing Co., Ltd. FCC ID:2BD2O-FY10 Portable device According to §15.247(e)(i) and §1.1307(b)(1), systems operating under the provisions of this section shall be operated in a manner that ensures that the public is not exposed to radio frequency energy level in excess of the Commission’s guidelines. According to KDB447498 D01 General RF Exposure Guidance V06 The 1-g SAR and 10-g SAR test exclusion thresholds for 100 MHz to 6 GHz at test separation distances ≤ 50 mm are determined by: [(max. power of channel, including tune-up tolerance, mW)/(min. test separation distance, mm)]·[√f(GHZ)] ≤ 3.0 for 1-g SAR and ≤ 7.5 for 10-g extremity SAR, where: • f(GHZ) is the RF channel transmit frequency in GHz • Power and distance are rounded to the nearest mW and mm before calculation • The result is rounded to one decimal place for comparison When the minimum test separation distance is < 5 mm, a distance of 5 mm is applied to determine SAR test exclusion. EDR: Modulation Channel Freq. (GHz) Conduct ed power (dBm) Conducte d power (mW) Tune-up power (dBm) Max tune-up power (dBm) Max tune-up power (mW) Distance (mm) Result calculatio n SAR Exclusion threshold SAR test exclusion 2.402 1.798 1.51 1±1 2.00 1.58 <5 0.49127 3.00 YES 2.441 2.031 1.60 2±1 3.00 2.00 <5 0.62347 3.00 YES 2.480 1.554 1.43 1±1 2.00 1.58 <5 0.49918 3.00 YES 2.402 2.521 1.79 2±1 3.00 2.00 <5 0.61847 3.00 YES 2.441 2.706 1.86 2±1 3.00 2.00 <5 0.62347 3.00 YES 2.480 2.172 1.65 2±1 3.00 2.00 <5 0.62843 3.00 YES 2.402 2.791 1.90 2±1 3.00 2.00 <5 0.61847 3.00 YES 2.441 2.979 1.99 2±1 3.00 2.00 <5 0.62347 3.00 YES 2.480 2.364 1.72 2±1 3.00 2.00 <5 0.62843 3.00 YES GFSK π /4DQPSK 8DQPSK Conclusion: For the max result : 0.62843≤ FCC Limit 3.0 for 1g SAR.

Test Report

2.4GHz 3216 Chip Antenna: RANT3216F245X02 _ Application: WLAN, 802.11b/g, Bluetooth, WLAN, etc... Features SMD, high reliability, ultra Impact, Omni-directional... Part number Information RANT3216F245X02 (A) (B) (C) (D)(E) (F) Electrical Specification The specification is defined on EVB. Dimension and Terminal Configuration No.Terminal Name 1Feeding/GNG 2GND/Feeding (A)Product TypeChip Antenna (B) Size Code 3.2x1.6mm( ± 0.2mm) (C) MaterialHigh K material (D) Frequency2.4 ~ 2.5GHz (E) Feeding modePIFA & Single Feeding (F) Antenna typeType=01 Working Frequency Range2400 ~2500 MHz Bandwidth120 MHz (Min.) Peak Gain 1.24 dBi (Typ.) Impedance50 Ohm Return loss10 dB ( Min) PolarizationLinear Azimuth BeamwidthOmni-directional Operation Temperature(°C)-40 ~85°C Resistance to Soldering Heats 10sec. ( @ 280°C) TerminationNi / Au (Leadless) Dimension (mm) L 3.20±0.20 W 1.60±0.20 T 0.45±0.20 咏成國際科技有限公司電話 :13530576606 RAIN International Technology Co., Ltd. TEL: 13530576606 2.4GHz 3216 Chip Antenna: RANT3216F245X02 _ 1 Ev aluati on BoardRefe rence PCB Dimens ionAntenna Layout Referenc e Unit :mm El ectr ical Characte ristics Retur n Los s & Radi ation Retur n Los s Frequency(MHz) S11(dB) 2400-10.50 2450-30.62 2500-11.47 Radi ation 2400MHz2450MHz 2500MHz Efficiency82.52%85.26%83.01% Peak Ga in1.15 dBi1.24 dBi1.19 dBi Directivity1.89 dBi1.97 dBi1.91 dBi X Y Z 2400MHz 2450MHz 2500MHz 2.4GHz 3216 Chip Antenna: RANT3216F245X02 _ Taping Sp ecifi cati ons Reel and Taping Specification Reel Spe cification TYPESIZ EABCD 32167”5K/R eel 9.0 ±0.5 60±213.5 ±0.5178±2 Ta ppi ng Spe cification PackagingTypeABWEFGHTψDP Paper Type 3216 1.90±0.20 3.50±0.20 8.0±0.20 1.75±0.10 3.5±0.05 4.0±0.10 2.0±0.05 0.75±0.10 1.50±0.10 4.0±0.1 2.4GHz 3216 Chip Antenna: RANT3216F245X02 Reliability Table _ Test ItemProcedure Requireme nts Cerami c Type Rema rk (Reference) Electrical Characterization Fulfill the electrical specification User Spec. Thermal Shock 1. Preconditioning: 50 ± 10°C/ 1 hr , then keep for 24 ± 1 hrs at room temp. 2. Initial measure: Spec: refer Initialspec. 3. Rapid change of temperature test: -30°Cto +85°C; 100 cycles; 15 minutes at Lower category temperature; 15 minutes at Upper category temperature. No Visible Damage. Fulfill the electrical specif ication. MIL-STD-202 107 Temperature Cycling 1. Initial measure: Spec: refer Initialspec. 2. 100 Cycles (-30°Cto +85°C), Soak Mode=1 (2 Cycle/hours). 3. Measurement at 24 ± 2Hours after testcondition. No Visible Damage. Fulfill the electrical specification. JESD22 JA104 High Temperature Exposure 1. Initial measure: Spec: refer Initialspec. 2. Unpowered; 500hours @ T=+85°C. 3. Measurement at 24 ± 2 hours aftertest. No Visible Damage. Fulfill the electrical specific ation. MIL-STD-202 108 Low Temperature Storage 1. Initial measure: Spec: refer Initialspec. 2. Unpowered: 500hours @ T=-30°C. 3. Measurement at 24 ± 2 hours aftertest. No Visible Damage. Fulfill the electrical specification. MIL-STD-202 108 Solderability (SMD Bottom Side) Dipping method: a. Temperature: 235 ±5°C b. Dipping time: 3 ±0.5s The solder should cover over 95% of the critical area of bottom side. IEC 60384-21/22 4.10 Soldering Heat Resistance (RSH) Preheati ng temperature: 150 ± 10°C. Preheating time: 1~2 min. Solder temperature: 260 ± 5°C. Dipping time: 5 ± 0.5s No Visible Damage.IEC 60384-21/22 4.10 Vibration5g's for 20 min., 12 cycles each of 3 orientations Note: Use 8"X5" PCB .031" thick 7 secure points on, one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10-2000 Hz. No Visible Damage.MIL-STD-202 Method 204 Mechanical Shock Three shocks in each direction shall be applied along the three mutually perpendicular axes of the test specimen (18 shocks) Peak value: 1,500g’s Duration: 0.5ms Velocity change: 15.4 ft/s Waveform: Half-sine No Visible Damage.MIL-STD-202 Method 213 Humidity Bias 1. Humidity: 85% R.H., Temperature:85 ± 2 °C. 2. Time: 500 ± 24hours. 3. Measurement at 24 ± 2hrs after testcondition. No Visible Damage. Fulfill the electrical specification. MIL-STD-202 Method 106 2.4GHz 3216 Chip Antenna: RANT3216F245X02 _ Board Flex (SMD) 1. Mounting method: IR-Reflow. PCB Size (L:100 × W:40 × T:1.6mm) 2. Apply the load in direction of the arrow until bending reaches 2 mm. No Visible Damage.AEC-Q200 005 AdhesionForce of 1.8Kg for 60 seconds.No Visible Damage Magnification of 20X or greater may be employed for inspection of the mechanical integrity of the device body terminals and body/terminal junction. AEC-Q200 006 Physical Dimension Any applicable method using x10 magnification, micrometers, calipers, gauges, contour projectors, or other measuring equipment, capable of determining the actual specimen dimensions. In accordance with specification. JESD22 JB100 Revision History RevisionDateContent 12019/03/01 New Datasheet 22021/02/22Add 2D radiation characteristic

Test Report

Report Tel: 4008-707-283 Web: http://www.ctb-lab.net Page 1 of 58 TEST REPORT Compiled by: Reviewed by: Approved by: Zhou Kui Arron Liu Bin Mei / Director Note: If there is any objection to the inspection results in this report, please submit a written report to the company within 15 days from the date of receiving the report. The test report is effective only with both signature and specialized stamp. This result(s) shown in this report refer only to the sample(s) tested. Without written approval of Shenzhen CTB Testing Technology Co., Ltd. this report can’t be reproduced except in full. The tested sample(s) and the sample information are provided by the client. “*” indicates the testing items were fulfilled by subcontracted lab. “#” indicates the items are not in CNAS accreditation scope. Product Name: Wireless lavalier microphone FCC ID: 2BD2O-FY10 Trademark: N/A Model Number: FY10 Prepared For: Shenzhen FY Technology Co., Ltd. Address: 2nd Floor, 11th Building, Tianfu'An Industrial Zone, Xixiang, Bao'an District, Shenzhen, Guangdong, 518126 China Manufacturer: Shenzhen FY Technology Co., Ltd. Address: 2nd Floor, 11th Building, Tianfu'An Industrial Zone, Xixiang, Bao'an District, Shenzhen, Guangdong, 518126 China Prepared By: Shenzhen CTB Testing Technology Co., Ltd. Address: 1&2/F., Building A, No.26, Xinhe Road, Xinqiao, Xinqiao Street, Bao'an District, Shenzhen, Guangdong, China Sample Received Date: Oct. 20, 2025 Sample tested Date: Oct. 20, 2025 to Nov.18, 2025 Issue Date: Nov.18, 2025 Report No.: CTB25102016701RF01 Test Standards FCC CFR Title 47 Part 15 Subpart C Section 15.247 ANSI C63.10:2020 Test Results PASS Remark: This is Bluetooth radio test report. Shenzhen CTB Testing Technology Co., Ltd. Report No.: CTB25102016701RF01 Report Tel: 4008-707-283 Web: http://www.ctb-lab.net Page 2 of 58 TABLE OF CONTENT Test Report Declaration Page 1. VERSION .......................................................................... 4 2. TEST SUMMARY ................................................................... 5 3. MEASUREMENT UNCERTAINTY ..................................................... 6 4. PRODUCT INFORMATION AND TEST SETUP .......................................... 7 4.1 Product Information .................................................................... 7 4.2 Test Setup Configuration ............................................................... 7 4.3 Support Equipment .................................................................... 7 4.4 Channel List .......................................................................... 8 4.5 Test Mode ............................................................................ 8 4.6 Test Environment ...................................................................... 8 5. TEST FACILITY AND TEST INSTRUMENT USED ....................................... 9 5.1 Test Facility ........................................................................... 9 5.2 Test Instrument Used .................................................................. 9 6. AC POWER LINE CONDUCTED EMISSION ............................................ 12 6.1 Block Diagram Of Test Setup .......................................................... 12 6.2 Limit ................................................................................ 12 6.3 Test procedure ....................................................................... 12 6.4 Test Result .......................................................................... 14 7. RADIATED SPURIOUS EMISSION ................................................... 16 7.1 Block Diagram Of Test Setup .......................................................... 16 7.2 Limit ................................................................................ 16 7.3 Test procedure ....................................................................... 17 7.4 Test Result .......................................................................... 18 8. BAND EDGE AND RF COUNDUCTED SPURIOUS EMISSIONS .......................... 27 8.1 Block Diagram Of Test Setup .......................................................... 27 8.2 Limit ................................................................................ 27 8.3 Test procedure ....................................................................... 27 8.4 Test Result .......................................................................... 28 9. COUDUCTED PEAK OUTPUT POWER ............................................... 35 9.1 Block Diagram Of Test Setup .......................................................... 35 9.2 Limit ................................................................................ 35 9.3 Test procedure ....................................................................... 35 9.4 Test Result .......................................................................... 35 10. 20DB OCCUPIED BANDWIDTH...................................................... 39 10.1 Block Diagram Of Test Setup ......................................................... 39 10.2 Limit ............................................................................... 39 10.3 Test procedure ...................................................................... 39 10.4 Test Result ......................................................................... 39 11. CARRIER FREQUENCIES SEPARATION ............................................. 43 11.1 Block Diagram Of Test Setup ......................................................... 43 11.2 Limit ............................................................................... 43 11.3 Test procedure ...................................................................... 43 11.4 Test Result ......................................................................... 43 12. HOPPING CHANNEL NUMBER ...................................................... 49 12.1 Block Diagram Of Test Setup ......................................................... 49 12.2 Li…

Text truncated - open the document above for the full version.

Test Setup Photos

Shenzhen CTB Testing Technology Co., Ltd. Report Tel: 4008-707-283 Web: http://www.ctb-lab.net Page 1 of 2 Model: FY10 Radiated Emission Below 1G Above 1G Shenzhen CTB Testing Technology Co., Ltd. Report Tel: 4008-707-283 Web: http://www.ctb-lab.net Page 2 of 2 Conducted emissions RF Conducted

Contact Information

Applicant

Ruifeng Wang
[email protected]Fax: /

Test Firm

Shenzhen CTB Testing Technology Co., Ltd.Rita Xiao
[email protected]

Technical Specifications

#Rule PartsFrequency RangePower Output
115C2.40 GHz - 2.48 GHz1.99 mW
Confidentiality
Long Term
Grant Notes
Power listed is the maximum conducted output power.