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2BGE31DIM0225 - Door Interface Module (DIM) | Idneo Techn...
2BGE31DIM0225
Idneo Technologies, S.A.U.
Door Interface Module (DIM)
Application Details
Equipment Class
JAB - Part 15 Class B Digital Device
Date of Grant
Mar 09, 2026
Application Purpose
Original Equipment
Equipment Note
Door Interface Module (DIM)
Company
Idneo Technologies, S.A.U.
Country
Spain
Documents & Files
Select a file to view
Attestation Statements
📄
17-fcb045 01 Certifications Concerning Covered Equipment Dim 3.1 79462 26.02
📄
Fcb046 02 Certification Designating A U.s. Agent
Cover Letter(s)
📄
5-fcb011 02 Fcc Agent Letter 79462 Dim 3.1 Signed
📄
16-fcb012 05 Fcc Confidentiality Request 79462 Dim 3.1 Signed
ID Label/Location Info
📄
22-product Label Dim 3.1
RF Exposure Info
📄
0-79462ran.001s
Test Report
📄
2-79462rem.001s
📄
20-nfc Antenna Information
Contact Information
Applicant
David Ortiz Perez
(Product Compliance & Engineering Services Director)
[email protected]
Fax:
-
Technical Contact
FCC US Agent, LLC
Tim Payne
[email protected]
3722 Illinois Avenue · Saint Charles, 60174 · United States
Test Firm
DEKRA Testing and Certification, S.A.U.
Rafael Lopez Martin
[email protected]
Technical Specifications
#
Rule Parts
Frequency Range
Power Output
1
15B
-
-
Confidentiality
Long Term
Fax:
34-9562-61 91 13