2BGGM-230HMY Bluetooth headset

FCC Caution: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -- Reorient or relocate the receiving antenna. -- Increase the separation between the equipment and receiver. -- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -- Consult the dealer or an experienced radio/TV technician for help. The device has been evaluated to meet general RF exposure requirement. The device can be used in portable exposure condition without restriction.

1/1 USA MEIHUATRADINGINC LETT ER OF ATTESTATION TO: Officeof EngineeringTechnology FederalCommunicationsCommission 7435 OaklandMills Road Columbia,MD 21046 USA MEIHUATRADINGINC for Serviceof Process: CompanyName:USA MEIHUATRADINGINC FRN: 0033406166 ContactName:HarleyQuinn Address:5379 Pine ValleyCt BoulderCO 80301UnitedStates TelephoneNo: 1-312-363-9424 Email:[email protected] Applicant: Companyname:ShenzhenHuamingYu TechnologyCo., LTD ProductDescription:HMY Bluetoothheadset Granteecode:2BGGM FCC ID: 2BGGM-230 FRN:0035434364 ContactName :MingpengGuo Email:[email protected] Address:2019,Floor2,Building409,SundaIndustrialZone,Licun Community,Futian District,Shenzhen,China [ShenzhenHuamingYu TechnologyCo., LTD ] certifiesthat, as of the date of this filing of the applicationwith the TCB, [USA MEIHUATRADINGINC] is our designatedUS agentfor service of processfor the abovereferencedFCC ID. [ShenzhenHuamingYu TechnologyCo., LTD ] acceptsto maintainan agentfor no less than one year after the granteehas terminatedall marketingand importationor the conclusionof any commissionrelatedproceedinginvolving equipment.[USA MEIHUATRADINGINC] accepts,as of the date of the filing of the application, the obligationof the designatedUS agentfor serviceof processfor the abovereferenceFCC ID. The USA MEIHUATRADINGINC for Serviceof Processis awareof and agreesto complywith the requirementsoutlinedin the FCC EquipmentAuthorizationProgram,Reportand OrderFCC 22-84,and clause§ 2.911. The Applicantis awareof and agreesto complywith the requirementsoutlinedin the FCC EquipmentAuthorizationProgram,Reportand OrderFCC 22-84,and clause§ 2.911. This Agreementis valid for permanment. Date: 11 /09 /2023 Applicant’s Name:MingpengGuoUS Agent ’s Name:HarleyQuinn Title: generalmanagerTitle: manager Signature Signature

Covered Equipment Identification Letter For Certification Service in the USA Federal Communication Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 To whom it may concern Pursuant to Section 2.911(d)(5)(ii) of the Commission’s Rules (47 C.F.R.) we attest as follows: We, applicant Company Name: Shenzhen Huaming Yu Technology Co., LTD Address: 2019, Floor 2, Building 409, Sunda Industrial Zone, Licun Community, Futian District, Shenzhen, China Phone: +86-15815143966 certify that, as of the date of the filing of the application, the applicant is not identified on the Covered List as an entity producing “covered” equipment. If you have any questions, please feel free to contact us at the address shown below. Sincerely, 2024-07-09 Signature Date Printed Name of Signee / Title: Mingpeng Guo / General Manager Company: Shenzhen Huaming Yu Technology Co., LTD Address: 2019, Floor 2, Building 409, Sunda Industrial Zone, Licun Community, Futian District, Shenzhen, China Phone: +86-15815143966 Fax: N/A Email: [email protected]

Covered Equipment Attestation Letter For Certification Service in the USA Federal Communication Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 To whom it may concern Pursuant to Section 2.911(d)(5)(i)-(ii) of the Commission’s Rules (47 C.F.R.) we attest as follows for the product listed below: FCC ID Model name 2BGGM-230 230, 220, 260 We, applicant Company Name: Shenzhen Huaming Yu Technology Co., LTD Address: 2019, Floor 2, Building 409, Sunda Industrial Zone, Licun Community, Futian District, Shenzhen, China Phone: +86-15815143966 certify that the equipment for which authorization is sought is not “covered” equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. If you have any questions, please feel free to contact us at the address shown below. Sincerely, 2024-07-09 Signature Date Printed Name of Signee / Title: Mingpeng Guo / General Manager Company: Shenzhen Huaming Yu Technology Co., LTD Address: 2019, Floor 2, Building 409, Sunda Industrial Zone, Licun Community, Futian District, Shenzhen, China Phone: +86-15815143966 Fax: N/A Email: [email protected]

Confidentiality Request Letter For Certification Service in the USA Federal Communication Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 To whom it may concern Pursuant to Paragraphs §0.457 and 0.459 of the Commission’s Rules (47 C.F.R.) and Section §552(b)(4) of the Freedom of Information Act, we request confidentiality for the documentation of the following products: FCC ID Model name 2BGGM-230 230, 220, 260 For the products listed above, we request permanent confidentiality for all applicable exhibits as there are: • the Operational Description • the Block Diagram • the Schematics • the Parts Lists • the Tune Up Information The above listed exhibits contain trade secrets and proprietary information that could be of benefit to our competitors. If you have any questions, please feel free to contact us at the address shown below. Sincerely, 2024-07-09 Signature Date Printed Name of Signee / Title: Mingpeng Guo / General Manager Company: Shenzhen Huaming Yu Technology Co., LTD Address: 2019, Floor 2, Building 409, Sunda Industrial Zone, Licun Community, Futian District, Shenzhen, China Phone: +86-15815143966 Fax: N/A Email: [email protected]

Shenzhen Huaming Yu Technology Co., LTD 2019, Floor 2, Building 409, Sunda Industrial Zone, Licun Community, Futian District, Shenzhen, China Date: July 9, 2024 FCC ID: 2BGGM-230 Model Number: 230, 220, 260 To: Federal Communication Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21048 To Whom It May Concern, We, Shenzhen Huaming Yu Technology Co., LTD hereby declare that our product (HMY Bluetooth headset) Model Number: 230, 220, 260 board, Schematic, Hardware version, Software version, structure and internal photos are same, named and appearance differently due to marketing purposes. Should you have any questions or comments regarding this matter, please have my best attention. Sincerely, (Signed) Name / Title: Mingpeng Guo/ General Manager Company: Shenzhen Huaming Yu Technology Co., LTD Address: 2019, Floor 2, Building 409, Sunda Industrial Zone, Licun Community, Futian District, Shenzhen, China Phone: +86-15815143966 Fax Number: N/A E-Mail: [email protected]

FCCID:2BGGM-230 FCCID:2BGGM-230 FCCID:2BGGM-230 FCCID:2BGGM-230

FCCID:2BGGM-230 Label Size:10mm*8mm FCCID:2BGGM-230 LabelLocation

FCCID:2BGGM-230 FCCID:2BGGM-230 ANT FCCID:2BGGM-230 FCCID:2BGGM-230 FCCID:2BGGM-230

RFExposureevaluation FCCID2BGGM-230 ProductNameHMYBluetoothheadset Model/Typereference230 ExposurecategoryGeneralpopulation/uncontrolledenvironment EUTTypeProductionUnit DeviceTypePortableDevice 1.Reference ANSIC95.1–1999:IEEEStandardforSafetyLevelswithRespecttoHumanExposureto RadioFrequencyElectromagneticFields,3kHzto300GHz. FCCKDBpublication447498D01GeneralRFExposureGuidancev06:MobileandPortable DevicesRFExposureProceduresandEquipmentAuthorizationPolicies. FCCCFR47part11.1310:Radiofrequencyradiationexposurelimits. FCCCFR47part22.1093:Radiofrequencyradiationexposureevaluation:portabledevices 2.Requirement AccordingtoKDB447498D01GeneralRFExposureGuidancev06Section4.3.1Standalone SARtestexclusionconsiderations:“UnlessspecificallyrequiredbythepublishedRFexposure KDBprocedures,standalone1-gheadorbodyand10-gextremitySARevaluationforgeneral populationexposureconditions,bymeasurementornumericalsimulation,isnotrequired whenthecorrespondingSARTestExclusionThresholdcondition,listedbelow,issatisfied. Thesetestexclusionconditionsarebasedonsource-basedtime-averagedmaximum conductedoutputpoweroftheRFchannelrequiringevaluation,adjustedfortune-uptolerance, andtheminimumtestseparationdistancerequiredfortheexposureconditions.22The minimumtestseparationdistanceisdeterminedbythesmallestdistancefromtheantenna andradiatingstructuresoroutersurfaceofthedevice,accordingtothehostformfactor, exposureconditionsandplatformrequirements,toanypartofthebodyorextremityofauser orbystander(see5)ofsection4.1).ToqualifyforSARtestexclusion,thetestseparation distancesappliedmustbefullyexplainedandjustifiedbytheoperatingconfigurationsand exposureconditionsofthetransmitterandapplicablehostplatformrequirements,typicallyin theSARmeasurementorSARanalysisreport,accordingtotherequiredpublishedRF exposureKDBprocedures.WhennootherRFexposuretestingorreportingisrequired,a statementofjustificationandcompliancemustbeincludedintheequipmentapproval,inlieuof theSARreport,toqualifyfortheSARtestexclusion.Whenrequired,thedevicespecific conditionsdescribedintheotherpublishedRFexposureKDBproceduresmustbesatisfied beforeapplyingtheseSARtestexclusionprovisions;forexample,handheldPTTtwo-way radios,handsets,laptops&tabletsetc.23” [(max.powerofchannel,includingtune-uptolerance,mW)/(min.testseparationdistance, mm)]·[√f(GHz)]≤3.0for1-gSARand≤7.5for10-gextremitySAR,where: •f(GHz)istheRFchanneltransmitfrequencyinGHz •PoweranddistanceareroundedtothenearestmWandmmbeforecalculation •Theresultisroundedtoonedecimalplaceforcomparison •3.0and7.5arereferredtoasthenumericthresholdsinthestep2below Thetestexclusionsareapplicableonlywhentheminimumtestseparationdistanceis≤50 mmandfortransmissionfrequenciesbetween100MHzand6GHz.Whentheminimumtest separationdistanceis<5mm,adistanceof5mmaccordingto5)insection4.1isappliedto determineSARtestexclusion. Whenoneofthefollowingtestexclusionconditionsissatisfiedforallcombinationsof simultaneoustransmissionconfigurations,furtherequipmentapprovalisnotrequiredto incorporatetransmittermodulesinhostdevicesthatoperateinthemixedmobileandportable hostplatformexposureconditions.Thegranteeisresponsiblefordocumentingthisaccording toClassIpermissivechangerequirements.AntennasthatqualifyforstandaloneSARtest exclusionmustapplytheestimatedstandaloneSARtodeterminesimultaneoustransmission testexclusion. a)The[∑of(thehighestmeasuredorestimatedSARforeachstandaloneantenna configuration,adjustedformaximumtune-uptolerance)/1.6W/kg]+[∑ofMPEratios]is≤ 1.0. b)TheSARtopeaklocationseparationratiosofallsimultaneouslytransmittingantennapairs operatinginportabledeviceexposureconditionsareall≤0.04,andthe[∑ofMPEratios]is ≤1.0. 3.MaximumPeakOutputPower Left ModulationPacketTypeChannel PeakOutputPower (dBm) PeakOutputPower (mW) GFSKDH5 01.8381.527 391.3501.364 781.3651.369 π/4DQPSK2-DH5 01.7971.512 391.2651.338 781.2111.321 8DPSK3-DH5 01.3641.369 390.8141.206 780.7021.175 Right ModulationPacketTypeChannel PeakOutputPower (dBm) PeakOutputPower (mW) GFSKDH5 02.0381.599 391.6011.446 781.7511.497 π/4DQPSK2-DH5 01.5321.423 391.3781.373 781.5581.432 8DPSK3-DH5 01.0421.271 390.4561.111 780.3861.093 4.ManufacturingTolerance Left BR/EDR DH5 ChannelChannel0Channel39Channel78 Target(dBm)2.02.02.0 Tolerance±(dB)1.01.01.0 2DH5 ChannelChannel0Channel39Channel78 Target(dBm)2.02.02.0 Tolerance±(dB)1.01.01.0 3DH5 ChannelChannel0Channel39Channel78 Target(dBm)2.01.01.0 Tolerance±(dB)1.01.01.0 Right BR/EDR DH5 ChannelChannel0Channel39Channel78 Target(dBm)3.02.02.0 Tolerance±(dB)1.01.01.0 2DH5 ChannelChannel0Channel39Channel78 Target(dBm)2.02.02.0 Tolerance±(dB)1.01.01.0 3DH5 ChannelChannel0Channel39Channel78 Target(dBm)2.01.01.0 Tolerance±(dB)1.01.01.0 5.EvaluationResult Band/Modef(GHz) Antenna Distance (mm) RFoutputpower SARTest Exclusion Threshold SARTest Exclusion dBmmW BR/EDR2.480542.510.7786<3.0Yes Remark: 1.Outputpowerincludingtuneuptolerance; 2.Whentheminimumtestseparationdistanceis<5mm,adistanceof5mmaccordingtof)in section4.1isappliedtodetermineSARtestexclusion. 6.Conclusion ThemeasurementresultscomplywiththeFCCLimitper47CFR2.1093fortheuncontrolled RFExposureandSARExclusionThresholdperKDB447498v06. ------Endofthereport------

2.4GHz3216ChipAntenna:3216F245M02 第 1 页共 10 页 3216Chipantenna ForBluetooth/WLANApplicationsd P/N:RANT3216F245M02 Dimension(mm) L3.23±0.20 W1.66±0.20 T1.23±0.20 咏成國際科技有限公司 電話 : 13530576606 RAIN International Technology Co., Ltd. TEL: 13530576606 Address: Room 709, Building F, Yuxing Science and Technology Industrial Park, Nanchang Third Industrial Zone, Nanchang Community, Xixiang Street, Bao'an District, Shenzhen, China 2.4GHz3216ChipAntenna:3216F245M02 第 2 页共 10 页 PartNumberInformation RANT3216F245M02 ABCDEF A ProductSeriesAntenna BDimensionLxW3.2X1.6mm(+-0.2mm) CMaterialHighKmaterial D WorkingFrequency2.4~2.5GHz E FeedingmodeMonopole&SingleFeeding F AntennatypeType=02 1.ElectricalSpecification Specification PartNumberRANT3216F245M02 CentralFrequency2450MHz Bandwidth100(Min.)MHz ReturnLoss-6.5(Max)dB PeakGain3dBi Impedance50Ohm OperatingTemperature -40～+85°C MaximumPower4W ResistancetoSolderingHeats 10(@260 °C ) sec. PolarizationLinear AzimuthBeamwidthOmni-directional TerminationCu/Sn(Leadless) 2.4GHz3216ChipAntenna:3216F245M02 第 3 页共 10 页 2.RecommendedPCBPattern EvaluationBoardDimension Unit:mm SuggestedMatchingCircuit 2.4GHz3216ChipAntenna:3216F245M02 第 4 页共 10 页 LayoutDimensionsinClearancearea ( Size=5.2*5.0mm ) 50ohmtransmissionLine MatchingCircuit FootPrint(Unit:mm) 2.4GHz3216ChipAntenna:3216F245M02 第 5 页共 10 页 3.MeasurementResults ReturnLoss 2.4GHz3216ChipAntenna:3216F245M02 第 6 页共 10 页 RadiationPattern Y X Z Efficiency 2400MHz55.21% 2450MHz66.45% 2500MHz57.53% Peak Gain (dBi) 2.28 3.00 2.71 2.4GHz3216ChipAntenna:3216F245M02 第 7 页共 10 页 4.ReliabilityandTestCondictions ITEMREQUIREMENTSTESTCONDITION Solderability1.Wettingshallexceed90%coverage 2.Novisiblemechanicaldamage TEMP(°C) 230°C 4±1sec. 150 °C 60sec Pre-heatingtemperature:150°C/60sec. Soldertemperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Fluxforleadfree:rosin Solderheat Resistance 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% TEMP(°C) 260°C 10±0.5sec. 150°C 60sec Pre-heatingtemperature:150°C/60sec. Soldertemperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Fluxforleadfree:rosin Component Adhesion (Pushtest) 1.Novisiblemechanicaldamage Thedeviceshouldbereflow soldered(230±5°Cfor10sec.)toatinned coppersubstrateAdynometerforce gaugeshouldbeappliedthesideofthe component.Thedevicemustwith-ST-F 0.5Kgwithoutfailureofthetermination attachedtocomponent. Component Adhesion (Pulltest) 1.Novisiblemechanicaldamage Insert10cmwireintotheremainingopen eyebend,theendsofevenwirelengths upwardandwindtogether. Terminalshallnotberemarkably damaged. 2.4GHz3216ChipAntenna:3216F245M02 第 8 页共 10 页 Thermalshock 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% Phase Temperature( °C ) Time(min) 1 +85±5°C 30±3 2 RoomWithin Temperature3sec 3 -40±2 °C 30±3 4 RoomWithin Temperature3sec +85 °C =>30±3min -40 °C =>30±3min Testcycle:10cycles Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. Resistanceto High Temperature 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 3.Nodisconnectionorshortcircuit. Temperature:85±5 °C Duration:1000±12hrs Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. Resistanceto Low Temperature 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 3.Nodisconnectionorshortcircuit. Temperature:-40±5 °C Duration:1000±12hrs Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. Humidity 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 3.Nodisconnectionorshortcircuit. Temperature:40±2°C Humidity:90%to95%RH Duration:1000±12hrs Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. 5.SolderingandMounting Mildlyactivatedrosinfluxesarepreferred.Theminimumamountofsoldercan leadtodamagefromthestressescausedbythedifferenceincoefficientsof expansionbetweensolder,chipandsubstrate.Theterminationsaresuitable forallwaveandre-flowsolderingsystems.Ifhandsolderingcannotbe avoided,thepreferredtechniqueistheutilizationofhotairsolderingtools. ReflowSoldering PRE-HEATING 250~260 230 180 150 SOLDERING 10smax. NATURAL COOLING IronSoldering PRE-HEATINGSOLDERINGNATURAL COOLING 60~120s30~60s TIME(sec.) TIME(sec.) Recommendedtemperatureprofilesforre-flowsolderinginFigure1. Productsattachmentwithasolderingironisdiscouragedduetotheinherent processcontrollimitations.Intheeventthatasolderingironmustbe employedthefollowingprecautionsarerecommended. within3s 350 150 Over60s Gradualcooling 300 T E M P E R A T U R E ( ° C ) T E M P E R A T U R E ( ° C ) 2.4GHz3216ChipAntenna:3216F245M02 第 9 页共 10 页 1.593.511.80 ‧Preheatcircuitandproductsto150°C ‧Nevercontacttheceramicwiththeirontip ‧Usea20wattsolderingironwithtipdiameterof1.0mm ‧280°Ctiptemperature(max) ‧1.0mmtipdiameter(max) ‧Limitsolderingtimeto3sec. 6.PackagingInformation TapeSpecification: ReelSpecification:(7’’,Φ180mm) 2.4GHz3216ChipAntenna:3216F245M02 第 10 页共 10 页 TapeWidth(mm)A(mm)B(mm)C(mm)D(mm)Chip/Reel(pcs) 89.0±0.560±213.5±0.5178±23000 7.StorageandTransportationInformation StorageConditions Tomaintainthesolderabilityofterminalelectrodes: 1.Temperatureandhumidityconditions:-10~40°Cand30~70%RH. 2.Recommendedproductsshouldbeusedwithin6monthsfromthetimeof delivery. 3.Thepackagingmaterialshouldbekeptwherenochlorineorsulfurexists intheair. TransportationConditions 1.Productsshouldbehandledwithcaretoavoiddamageorcontamination fromperspirationandskinoils. 2.Theuseoftweezersorvacuumpickupisstronglyrecommendedfor individualcomponents. 3.Bulkhandlingshouldensurethatabrasionandmechanicalshockare minimized.

ReportNo.:CISRR240522131 AppendixA ReportNo.:CISRR240522131 FCCID:2BGGM-230 ProductName:HMYBluetoothheadset ModelNo.:230 TestEngineer:LucasHuang Supervisedby:RoryHuang ReportNo.:CISRR240522131 ConductedPeakOutputPower TestResult Left ModulationPacketTypeChannel PeakOutput Power (dBm) PeakOutput Power (mW) Limit (dBm) Result GFSKDH5 01.8381.527 30 PASS 391.3501.364PASS 781.3651.369PASS π/4DQPSK2-DH5 01.7971.512 20.97 PASS 391.2651.338PASS 781.2111.321PASS 8DPSK3-DH5 01.3641.369PASS 390.8141.206PASS 780.7021.175PASS Right ModulationPacketTypeChannel PeakOutput Power (dBm) PeakOutput Power (mW) Limit (dBm) Result GFSKDH5 02.0381.599 30 PASS 391.6011.446PASS 781.7511.497PASS π/4DQPSK2-DH5 01.5321.423 20.97 PASS 391.3781.373PASS 781.5581.432PASS 8DPSK3-DH5 01.0421.271PASS 390.4561.111PASS 780.3861.093PASS ReportNo.:CISRR240522131 99%Bandwidth TestResult Left ModulationChannel99%BW(MHz) GFSK 00.90760 390.90060 780.88500 π/4DQPSK 01.2226 391.2034 781.1992 8DPSK 01.2226 391.2158 781.2120 TestGraphs GFSK_DH5_Channel0π/4DQPSK_2-DH5_Channel0 GFSK_DH5_Channel39π/4DQPSK_2-DH5_Channel39 ReportNo.:CISRR240522131 GFSK_DH5_Channel78π/4DQPSK_2-DH5_Channel78 8DPSK_3-DH5_Channel08DPSK_3-DH5_Channel39 8DPSK_3-DH5_Channel78 ReportNo.:CISRR240522131 Right TestResult ModulationChannel99%BW(MHz) GFSK 00.90360 390.89680 780.89140 π/4DQPSK 01.2386 391.2102 781.1984 8DPSK 01.2206 391.2126 781.2164 TestGraphs GFSK_DH5_Channel0π/4DQPSK_2-DH5_Channel0 GFSK_DH5_Channel39π/4DQPSK_2-DH5_Channel39 ReportNo.:CISRR240522131 GFSK_DH5_Channel78π/4DQPSK_2-DH5_Channel78 8DPSK_3-DH5_Channel08DPSK_3-DH5_Channel39 8DPSK_3-DH5_Channel78 ReportNo.:CISRR240522131 20dBBandwidth TestResult Left ModulationChannelCenterFrequency(MHz)20dBBandwidth(MHz) GFSK 02402MHz1.000 392441MHz1.020 782480MHz1.020 π/4DQPSK 02402MHz1.320 392441MHz1.310 782480MHz1.310 8DPSK 02402MHz1.300 392441MHz1.290 782480MHz1.290 TestGraphs GFSK_DH5_Channel0GFSK_DH5_Channel39 GFSK_DH5_Channel78π/4DQPSK_2-DH5_Channel0 ReportNo.:CISRR240522131 π/4DQPSK_2-DH5_Channel39π/4DQPSK_2-DH5_Channel78 8DPSK_3-DH5_Channel08DPSK_3-DH5_Channel39 8DPSK_3-DH5_Channel78 ReportNo.:CISRR240522131 Right TestResult ModulationChannelCenterFrequency(MHz)20dBBandwidth(MHz) GFSK 02402MHz1.020 392441MHz1.010 782480MHz1.010 π/4DQPSK 02402MHz1.320 392441MHz1.300 782480MHz1.310 8DPSK 02402MHz1.290 392441MHz1.300 782480MHz1.290 TestGraphs GFSK_DH5_Channel0GFSK_DH5_Channel39 GFSK_DH5_Channel78π/4DQPSK_2-DH5_Channel0 ReportNo.:CISRR240522131 π/4DQPSK_2-DH5_Channel39π/4DQPSK_2-DH5_Channel78 8DPSK_3-DH5_Channel08DPSK_3-DH5_Channel39 8DPSK_3-DH5_Channel78 ReportNo.:CISRR240522131 CarrierFrequenciesSeparation TestResult Left ModulationPacket LeftCenter frequency (MHz) RightCenter frequency (MHz) Hopping Frequency Separation (MHz) Limit(MHz)Result GFSKDH52440.0192441.0231.02411.020PASS π/4DQPSK2-DH52440.03582441.00350.96780.88PASS 8DPSK3-DH52440.15972441.04370.88410.867PASS TestGraphs GFSKπ/4DQPSK 8DPSK ReportNo.:CISRR240522131 Right TestResult ModulationPacket LeftCenter frequency (MHz) RightCenter frequency (MHz) Hopping Frequency Separation (MHz) Limit(MHz)Result GFSKDH52440.04062441.01411.02441.020PASS π/4DQPSK2-DH52440.17522441.18061.00530.88PASS 8DPSK3-DH52440.03522441.0030.96780.86PASS TestGraphs GFSKπ/4DQPSK 8DPSK ReportNo.:CISRR240522131 ConductedOutOfBandEmission TestResult Left Non-Hopping ModulationPacketChannel OOB Emission Frequency (MHz) OOB Emission Level (dBm) Limit (dBm) OverLimit (dB) Result GFSKDH5 0 2400.00-49.478-18.77-30.708PASS 7205.96-39.560-18.77-20.790PASS 399763.72-42.836-19.39-23.446PASS 78 2483.50-52.027-19.43-32.597PASS 9920.20-40.148-19.43-20.718PASS π/4DQPSK2-DH5 0 2400.00-48.479-18.88-29.599PASS 7206.79-44.467-18.88-25.587PASS 399763.72-42.013-19.56-22.453PASS 78 2483.50-52.320-19.57-32.750PASS 9920.20-40.815-19.57-21.245PASS 8DPSK3-DH5 0 2400.00-47.301-18.92-28.381PASS 5828.45-41.682-18.92-22.762PASS 399763.72-40.818-20.0-20.818PASS 78 2483.50-52.317-19.75-32.567PASS 9920.20-40.585-19.75-20.835PASS Hopping ModulationPacketChannel OOB Emission Frequency (MHz) OOB Emission Level (dBm) Limit (dBm) OverLimit (dB) Result GFSKDH5 Hopping 2395.25-50.423-18.86-31.563PASS 2400.00-52.788-18.86-33.928PASS 2483.50-51.195-19.32-31.875PASS 2397.90-50.106-18.6-31.506PASS 2400.00-51.681-18.6-33.081PASS 2483.50-51.870-19.72-32.150PASS π/4DQPSK2-DH5 2400.00-49.796-18.81-30.986PASS 2483.50-51.393-19.64-31.753PASS 2400.00-49.495-18.89-30.605PASS 2483.50-51.218-19.8-31.418PASS 8DPSK3-DH5 2400.00-49.445-19.48-29.965PASS 2483.50-51.831-20.05-31.781PASS 2395.41-49.843-19.02-30.823PASS 2400.00-50.409-19.02-31.389PASS 2483.50-52.011-19.85-32.161PASS TestGraphs ReportNo.:CISRR240522131 OutOfBandEmission GFSK_DH5_Channel0 OutOfBandEmission π/4DQPSK_2-DH5_Channel0 SpuriousEmission GFSK_DH5_Channel0 SpuriousEmission π/4DQPSK_2-DH5_Channel0 OutOfBandEmissionOutOfBandEmission ReportNo.:CISRR240522131 GFSK_DH5_Channel39π/4DQPSK_2-DH5_Channel39 SpuriousEmissions GFSK_DH5_Channel39 SpuriousEmissions π/4DQPSK_2-DH5_Channel39 OutOfBandEmission GFSK_DH5_Channel78 OutOfBandEmission π/4DQPSK_2-DH5_Channel78 ReportNo.:CISRR240522131 SpuriousEmission GFSK_DH5_Channel78 SpuriousEmission π/4DQPSK_2-DH5_Channel78 OutOfBandEmission 8DPSK_3-DH5_Channel0 SpuriousEmission 8DPSK_3-DH5_Channel0 OutOfBandEmission 8DPSK_3-DH5_Channel39 SpuriousEmissions 8DPSK_3-DH5_Channel39 ReportNo.:CISRR240522131 OutOfBandEmission 8DPSK_3-DH5_Channel78 SpuriousEmission 8DPSK_3-DH5_Channel78 OutOfBandEmission(Left) GFSK_DH5_ChannelHopping OutOfBandEmission(Left) π/4DQPSK_2-DH5_ChannelHopping ReportNo.:CISRR240522131 OutOfBandEmission(Right) GFSK_DH5_ChannelHopping OutOfBandEmission(Right) π/4DQPSK_2-DH5_ChannelHopping OutOfBandEmission(Left) GFSK_DH5_ChannelHopping OutOfBandEmission(Left) π/4DQPSK_2-DH5_ChannelHopping OutOfBandEmission(Right)OutOfBandEmission(Right) ReportNo.:CISRR240522131 GFSK_DH5_ChannelHoppingπ/4DQPSK_2-DH5_ChannelHopping OutOfBandEmission(Left) 8DPSK_3-DH5_ChannelHopping OutOfBandEmission(Right) 8DPSK_3-DH5_Channel…

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ReportNo.:CISRR240522131 Page:1of33 TESTREPORT ReportNo.:CISRR240522131 ProjectNo.CISR240522131 FCCID2BGGM-230 Applicant:ShenzhenHuamingYuTechnologyCo.,LTD Address:2019,Floor2,Building409,SundaIndustrialZone,LicunCommunity,Futian District,Shenzhen,China ManufacturerShenzhenHuamingYuTechnologyCo.,LTD Address2019,Floor2,Building409,SundaIndustrialZone,LicunCommunity,Futian District,Shenzhen,China ProductName:HMYBluetoothheadset TradeMark:-- Model/Typereference:230 ListedModel(s):220,260 Standard:Part15SubpartCSection15.247 Testdate:May22,2023~May28,2024 IssuedateMay29,2024 Testresult:Complied Preparedby:RoryHuangApprovedby:GenryLong Thetestresultsrelateonlytothetestedsamples. ThetestreportshouldnotbereproducedexceptinfullwithoutthewrittenapprovalofShenzhenBangce TestingTechnologyCo.,Ltd. ReportNo.:CISRR240522131 Page:2of33 Contents 1.REPORTVERSION.........................................................................................................................................3 2.SUMMARYOFTESTRESULT.......................................................................................................................4 3.SUMMARY.....................................................................................................................................................5 3.1.ProductDescription....................................................................................................................................5 3.2.RadioSpecificationDescription................................................................................................................5 3.3.ModificationofEUT.....................................................................................................................................6 3.4.TestingSite...................................................................................................................................................6 3.5.FieldStrengthCalculation..........................................................................................................................6 3.6.DISTURBANCECalculation........................................................................................................................6 4.TESTCONFIGURATION.............................................................................................................................7 4.1.Testfrequencylist.......................................................................................................................................7 4.2.Testmode.....................................................................................................................................................7 4.3.Supportunitusedintestconfigurationandsystem...............................................................................7 4.4.Testsampleinformation.............................................................................................................................7 4.5.Testingenvironmentalcondition...............................................................................................................8 4.6.Statementofthemeasurementuncertainty.............................................................................................8 4.7.EquipmentUsedduringtheTest...............................................................................................................9 5.TESTCONDITIONSANDRESULTS.....................................................................................................10 5.1.AntennaRequirement...............................................................................................................................10 5.2.ACConductedEmission...........................................................................................................................11 5.3.PeakOutputPower....................................................................................................................................14 5.4.20dBBandwidth........................................................................................................................................15 5.5.99%OccupiedBandwidth.........................................................................................................................16 5.6.CarrierFrequenciesSeparation...............................................................................................................17 5.7.HoppingChannelNumber........................................................................................................................18 5.8.DwellTime..................................................................................................................................................19 5.9.DutyCycleCorrectionFactor(DCCF).....................................................................................................20 5.10.PseudorandomFrequencyHoppingSequence...................................................................................21 5.11.ConductedBandedgeandSpuriousEmission..................................................................................…

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