2BGRB-TAGMATET9Smart Tag

Rev1/26/2023 ShenZhenYuManYingTechnologyCo.,Ltd FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:12-9-2025 Ref:AttestationStatementsPart2.911(d)(5)(i)Filing FCCID:2BGRB-TAGMATET9 ShenZhenYuManYingTechnologyCo.,Ltd(“theapplicant”)certifiesthattheequipmentforwhich authorizationissoughtisnot“covered”equipmentprohibitedfromreceivinganequipment authorizationpursuanttosection2.903oftheFCCrules. ShenZhenYuManYingTechnologyCo.,Ltd(“theapplicant”)certifiesthattheequipmentforwhich authorizationissoughtdoesnotincludecybersecurityoranti-virussoftwareproducedorprovidedby KasperskyLab,Inc.oranyofitssuccessorsandassignees,includingequipmentwithintegratedKaspersky Lab,Inc.(oranyofitssuccessorsandassignees)cybersecurityoranti-virussoftwarepursuanttoDA-24- 886andKDB986446D01CoveredEquipmentGuidancesectionB(2a). Deviceisinherentlycompliantbasedonhardwarelimitationsorsoftwarecontrols. or ASoftwareBillofMaterials(SBOM)isprovidedtotheTCBforreview,and Theend-userorthirdpartiescannotinstalladditionalsoftwareonthisdevice. Sincerely, (signature) Name:YingyingZhao Title:manager Rev1/26/2023 ShenZhenYuManYingTechnologyCo.,Ltd FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:12-9-2025 Ref:AttestationStatementsPart2.911(d)(5)(ii)Filing FCCID:2BGRB-TAGMATET9 ShenZhenYuManYingTechnologyCo.,Ltd(“theapplicant”)certifiesthat,asofthedateofthefilingof theapplication,theapplicantisnotidentifiedontheCoveredList(asaspecificallynamedentityorany ofitssubsidiariesoraffiliates)asanentityproducing“covered”equipment. Sincerely, (signature) Name:YingyingZhao Title:manager

ShenZhenYuManYingTechnologyCo.,Ltd FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:12-9-2025 Ref:AttestationStatementsPart2.911(d)(7)Filing FCCIDorGranteeCode:FCCID:2BGRB-TAGMATET9 ApplicantFRN:0035497460 ShenZhenYuManYingTechnologyCo.,Ltd(“theapplicant”)certifiesthat,asofthedateof thefilingoftheapplication,REPAmericaLLCisourdesignatedU.S.agentforserviceof processfortheabovereferencedFCCID.ShenZhenYuManYingTechnologyCo.,Ltd acceptstomaintainanagentfornolessthanoneyearafterthegranteehasterminatedall marketingandimportationortheconclusionofanyCommission-relatedproceedinginvolving theequipment. REPAmericaLLCaccepts,asofthedateofthefilingoftheapplication,theobligationofthe designatedU.S.agentforserviceofprocessfortheabovereferencedFCCID. DesignatedU.S.AgentInformation: Name:REPAmericaLLC U.S.AgentFRN:0034192500 Address:350TerrySt.200Longmont,CO80501UnitedStates ContactPerson:MrBenXu Tel.:(719)201-3314 Email:[email protected] Sincerely, ShenZhenYuManYingTechnologyCo.,Ltd REPAmericaLLC YingyingZhao/ManagerBenXu/manager (sign)(sign)

Regards, ShenZhen YuManYing Technology Co., Ltd Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 Date: 1 2-9-2025 SUBJECT: FCC Application for FCC ID: 2BGRB-TAGMATET9 To Whom It May Concern: I, the undersigned, hereby states this equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules, and will apply the Supplier's Declaration of Conformity procedure to the class B computer peripheral portion of this composite device. I understand the following FCC requirements: 1. Devices subject to the SDoC procedure are required to be tested to show compliance with the FCC technical regulations by a recognized accredited testing laboratory. The testing laboratory must be accredited by a Commission approved accreditation body or designated under the terms of a government-to-government Mutual Recognition Agreement (MRA). A listing of those accredited testing laboratories that have been recognized by the Commission is published on the FCC Webpage: https://apps.fcc.gov/oetcf/eas/reports/TestFirmSearch.cfm (Select the "accredited" option to search for FCC recognized accredited test firms.) 2. Pt 2.1077 contains the list of information that must be included in the Supplier's Declaration of Conformity, which must be supplied with each product sold. The SDoC compliance info shall be included in the User’s Manual or as a separate sheet. The info must contain the name, address, and phone number of the responsible party, which must be located within the United States.According to 2.909(b), the responsible party is either the Manufacturer or if the product is imported the Importer. Sincerely, (signature) Name: YingYing Zhao Title: manager

ShenZhenYuManYingTechnologyCo.,Ltd FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:12-9-2025 ConfidentialityRequestregardingapplicationforcertificationofFCCID:2BGRB-TAGMATET9 PursuanttoSections0.457and0.459oftheCommission’sRules,weherebyrequestconfidential treatmentofinformationaccompanyingthisapplicationasoutlinedbelow: ExhibitType BlockDiagram OperationalDescription Schematics Theabovematerialscontaintradesecretsandproprietaryinformationnotcustomarilyreleasedto thepublic.Thepublicdisclosureofthesematerialsmaybeharmfultotheapplicantandprovide unjustifiedbenefitstoitscompetitors. TheapplicantunderstandsthatpursuanttoSection0.457oftheRules,disclosureofthis applicationandallaccompanyingdocumentationwillnotbemadebeforethedateoftheGrantfor thisapplication. PursuanttoDA04-1705June15,2004oftheCommission’spublicnotice,wealsorequest temporaryconfidentialtreatmentofinformationaccompanyingthisapplicationasoutlinedbelow: ExhibitType Sincerely, (signature) Name:YingyingZhao Title:manager

ShenZhenYuManYingTechnologyCo.,Ltd FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 Date:12-9-2025 SUBJECT:FCCApplicationforFCCID:2BGRB-TAGMATET9 ToWhomItMayConcern: We,theundersigned,herebyauthorizeColinHuangatShenzhenDACETestingTechnology Co.,Ltd.onourbehalf,toapplytotheFederalCommunicationsCommissiononourequipment. AnyandallactscarriedoutbyShenzhenDACETestingTechnologyCo.,Ltd.onourbehalf shallhavethesameeffectasactsofourown. ThisistoadvisethatweareinfullcompliancewiththeAnti-DrugAbuseAct.We,theapplicant, arenotsubjecttoadenialoffederalbenefitspursuanttoSection5301oftheAnti-DrugActof 1988,21USC853a,andnopartytotheapplicationissubjecttoadenialoffederalbenefits pursuanttothatsection. Regards, Sincerely, (signature) Name:YingyingZhao Title:manager

FCCID:2BGRB-TAGMATET9 External

FCCID:2BGRB-TAGMATET9 FCCIDplace SAMPLE: SmartTag Model:TagMateT9 FCCID:2BGRB-TAGMATET9 MadeinChina

FCCID:2BGRB-TAGMATET9 Internal

Page1of1 RFExposureEvaluationReport 1RFEXPOSURE ProductName:SmartTag ModelNo.:TagMateT9 FCCID:2BGRB-TAGMATET9 2.RFExposureEvaluation FCCKDB447498D01GeneralRFExposureGuidancev06:MobileandPortableDevice,RF Exposure,EquipmentAuthorizationProcedures. FCCCFR47part11.1310:Radiofrequencyradiationexposurelimits. FCCCFR47part22.1093Radiofrequencyradiationexposureevaluation:portabledevices. 2.1LIMITS The1-gand10-gSARtestexclusionthresholdsfor100MHzto6GHzattestseparation distances≤50mmaredeterminedby: [(max.powerofchannel,includingtune-uptolerance,mW)/(min.testseparationdistance, mm)]*[√f(GHz)]≤3.0for1-gSARand≤7.5for10-gextremitySAR,where  f(GHz)istheRFchanneltransmitfrequencyinGHz PoweranddistanceareroundedtothenearestmWandmmbeforecalculation  Theresultisroundedtoonedecimalplaceforcomparison Thetestexclusionsareapplicableonlywhentheminimumtestseparationdistanceis≤50 mmandfortransmissionfrequenciesbetween100MHzand6GHz.Whentheminimumtest separationdistanceis<5mm,adistanceof5mmisappliedtodetermineSARtest exclusion. 2.2EUTRFEXPOSUREEVALUATION WorstMode: Channel (MHz) Conducted Power (dBm) Tuneup Tolerance (dBm) Maximum tune-upPower Calculated value Limit (dBm)(mW) 2402 (2Mbps) 2.78 3 ± 1.0 4.02.5120.7793.0 Calculatedvalueis0.779<3.0,SothereisnorequireSARtest.

承認書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： WAN3216F245W36 規格 DESCRIPTION ： Chip Antenna 3216 M-Ant 2.45G Type 36 版本 VERSION ： V2.2 日期 ISSUE DATE ： 2018/01/30 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray James Thor 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112台北市北投區中央南路二段36號3樓 2F., No.163, Sec. 1, Xi'an St., Beitou Dist., Taipei City 112, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 LUCKY SOUND TECHNOLOGY CO.,LTD ONEWAVE TECHNOLOGY CO., LTD. 2/11 3216 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 3.23 ± 0.20 W 1.66 ± 0.20 T 1.23 ± 0.20 P/N: WAN3216F245W36 ONEWAVE TECHNOLOGY CO., LTD. 3/11 Part Number Information WAN 3216 F 245 W 36 A B C D E F A Product Series Antenna B Dimension L x W 3.2X1.6mm (+-0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode Monopole & Single Feeding F Antenna type Type=36 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN3216F245W36 Central Frequency 2450 MHz Bandwidth 100 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 2.71 dBi Impedance 50 Ohm Operating Temperature -40～+85 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) ONEWAVE TECHNOLOGY CO., LTD. 4/11 2. Recommended PCB Pattern 1.Evaluation Board Dimension 2.Evaluation Board Dimension (若淨空區夠大，建議使用此Layout，效能較佳) Unit : mm Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度±1%以下的電感、電容、電阻 ONEWAVE TECHNOLOGY CO., LTD. 5/11 1.Layout Dimensions in Clearance area(Size=5.2*5.0mm) 50 ohm transmission Line Matching Circuit 2.Layout Dimensions in Clearance area(Size=8.2*5.0mm) (若淨空區夠大，建議使用此Layout，效能較佳) 50 ohm transmission Line Matching Circuit FootPrint (Unit : mm) ONEWAVE TECHNOLOGY CO., LTD. 6/11 3. Measurement Results Return Loss ONEWAVE TECHNOLOGY CO., LTD. 7/11 Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 55.21 % 1.45 dBi 5.32 dBi 2450MHz 66.45 % 2.71 dBi 5.21 dBi 2500MHz 57.53 % 1.98 dBi 5.29 dBi Chamber Coordinate System Y Z X ONEWAVE TECHNOLOGY CO., LTD. 8/11 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10±0.5 sec. 60sec .. TEMP (°C) 150°C 260°C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +85±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +85°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 85±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C ONEWAVE TECHNOLOGY CO., LTD. 9/11 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradualcooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 ONEWAVE TECHNOLOGY CO., LTD. 10/11 6.Packaging Information  Tape Specification: W Ao Bo Ko P F E D D1 Po P2 t 8.0 ±0.30 1.80 ±0.05 3.51 ±0.10 1.59 ±0.10 4.00 ±0.05 3.50 ±0.05 1.75 ±0.10 1.50 ±0.10 0.00 ±0.10 4.00 ±0.10 2.00 ±0.05 0.25 ±0.05  Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 1…

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V1.0ReportNo.:DACE251125001RL001 102,BuildingH1,&1/F.,BuildingH,HongfaScience&TechnologyPark,TangtouCommunity,ShiyanSubdistrict,Bao'anDistrict,Shenzhen,Guangdong,China Web:http://www.dace-lab.comTel:+86-755-23010613E-mail:[email protected] 1 of 62 RFTESTREPORT For ShenZhenYuManYingTechnologyCo.,Ltd ProductName:SmartTag TestModel(s):TagMateT9 ReportReferenceNo.:DACE251125001RL001 FCCID:2BGRB-TAGMATET9 Applicant’sName:ShenZhenYuManYingTechnologyCo.,Ltd Address: 812,InformationBuilding,BaoYunDaLogisticsCenter,FuHua Community,XiXiangStreet,BaoAn,Shenzhen,Guangdong,CN(China) TestingLaboratory:ShenzhenDACETestingTechnologyCo.,Ltd. Address: 102,BuildingH1,&1/F.,BuildingH,HongfaScience&TechnologyPark, TangtouCommunity,ShiyanSubdistrict,Bao'anDistrict,Shenzhen, Guangdong,China TestSpecificationStandard:47CFRPart15.247 DateofReceipt:November25,2025 DateofTest:November25,2025toDecember5,2025 DataofIssue:December5,2025 Result:Pass Note:Thisreportshallnotbereproducedexceptinfull,withoutthewrittenapprovalofShenzhenDACE TestingTechnologyCo.,Ltd.ThisdocumentmaybealteredorrevisedbyShenzhenDACETestingTechnology Co.,Ltd.personnelonly,andshallbenotedintherevisionsectionofthedocument.Thetestresultsinthe reportonlyapplytothetestedsample V1.0ReportNo.:DACE251125001RL001 102,BuildingH1,&1/F.,BuildingH,HongfaScience&TechnologyPark,TangtouCommunity,ShiyanSubdistrict,Bao'anDistrict,Shenzhen,Guangdong,China Web:http://www.dace-lab.comTel:+86-755-23010613E-mail:[email protected] 2 of 62 Applyforcompanyinformation Applicant’sName:ShenZhenYuManYingTechnologyCo.,Ltd Address:812,InformationBuilding,BaoYunDaLogisticsCenter,FuHua Community,XiXiangStreet,BaoAn,Shenzhen,Guangdong,CN(China) ProductName:SmartTag TestModel(s):TagMateT9 SeriesModel(s):N/A TestSpecificationStandard(s):47CFRPart15.247 NOTE1: Themanufacturershouldensurethatallproductsinseriesproductionareinconformitywiththeproductsampledetailedin thisreport.Iftheproductinthisreportisusedinanyconfigurationotherthanthatdetailedinthereport,themanufacturer mustensurethenewsystemcomplieswithallrelevantstandards. Compiledby:Supervisedby:Approvedby: LucyMo/TestEngineerStoneYin/ProjectEngineerTomChen/Manager December5,2025December5,2025December5,2025 V1.0ReportNo.:DACE251125001RL001 102,BuildingH1,&1/F.,BuildingH,HongfaScience&TechnologyPark,TangtouCommunity,ShiyanSubdistrict,Bao'anDistrict,Shenzhen,Guangdong,China Web:http://www.dace-lab.comTel:+86-755-23010613E-mail:[email protected] 3 of 62 RevisionHistoryOfReport VersionDescriptionREPORTNo.IssueDate V1.0OriginalDACE251125001RL001December5,2025 V1.0ReportNo.:DACE251125001RL001 102,BuildingH1,&1/F.,BuildingH,HongfaScience&TechnologyPark,TangtouCommunity,ShiyanSubdistrict,Bao'anDistrict,Shenzhen,Guangdong,China Web:http://www.dace-lab.comTel:+86-755-23010613E-mail:[email protected] 4 of 62 CONTENTS 1TESTSUMMARY...................................................................................................................................................6 1.1TESTSTANDARDS........................................................................................................................................6 1.2SUMMARYOFTESTRESULT.........................................................................................................................6 2GENERALINFORMATION....................................................................................................................................7 2.1CLIENTINFORMATION..................................................................................................................................7 2.2DESCRIPTIONOFDEVICE(EUT)..................................................................................................................7 2.3DESCRIPTIONOFTESTMODES....................................................................................................................8 2.4DESCRIPTIONOFSUPPORTUNITS................................................................................................................8 2.5EQUIPMENTSUSEDDURINGTHETEST........................................................................................................8 2.6STATEMENTOFTHEMEASUREMENTUNCERTAINTY....................................................................................10 2.7IDENTIFICATIONOFTESTINGLABORATORY.................................................................................................10 2.8ANNOUNCEMENT.......................................................................................................................................10 3EVALUATIONRESULTS(EVALUATION)...........................................................................................................11 3.1ANTENNAREQUIREMENT............................................................................................................................11 3.1.1Conclusion:.................................................................................................................................11 4RADIOSPECTRUMMATTERTESTRESULTS(RF).........................................................................................12 4.16DBBANDWIDTH.......................................................................................................................................12 4.1.1E.U.T.Operation:........................................................................................................................12 4.1.2TestSetupDiagram:...................................................................................................................12 4.1.3TestData:...................................................................................................................................13 4.2MAXIMUMCONDUCTEDOUTPUTPOWER....................................................................................................14 4.2.1E.U.T.Operation:..............................................................................................................…

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FCCID:2BGRB-TAGMATET9 Testsetup Emissionsinfrequencybands(below1GHz) Emissionsinfrequencybands(above1GHz)