2BH4G-V2SILICONE BAND

-TunuevareddecomunicacionS.L.U- FederalCommunicationsCommission AuthorizationandEvaluationDivision EquipmentAuthorizationBranch 7435OaklandMillsRoad Columbia,MD21046 8/14/24 U.S.AgentDesignation TunuevareddecomunicacionSL.Uacknowledgestheirconsentforthefollowingconactlocatedinthe UnitedStatestoactastheiragentforserviceofprocessfortheequipmentforwhichauthorizationissought(FCC ID:2BH4G-V2): NameandcompanyofU.S.agent: PhysicalU.S.addressofagent. FRNofU.S.agent EmailaddressofU.S.agent EworldINC. 1624MARKETSTSTE226#78258DENVERCO80202-2523US 0035180447 [email protected] EworldINC.acknowledgestheirobligationtoacceptserviceofprocessonbehalfofTunuevaredde comunicacionS.L.U TunuevareddecomunicacionS.LUwiththeFRN0035762764acceptsitsobligationtomaintainanagent forserviceofprocessintheUnitedStatesfornolessthanoneyearaftereitherthegranteehaspermanently terminatedallmarketingandimportationoftheapplicableequipmentwithintheU.S.,ortheconcusionofany Commission-relatedadministrativeorjudicialproceedinginvolvingtheequipment,whicheverislater. Bysigningthisform,weconfimtheaboveandthatweareawareoftheapplicationrequirementslistedunders 2.911(d)(7). TheinformationprovidedinthisletterisbasedonthereferencedrulepartsofTite47oftheCFRaswellasKDB 986446D01. Anexpirationdateforthisetterdoesnotexist.IncasetheU.S.agentchanges,thegranteeisobligatedtonotiy theFCCwithin30daysviathegrantingTCB. Sincerely Signature YagoLepachFoncillas manager TunuevareddecomunicacionS.L.U. Signature Amy Manager EworldINC.

Page 1 of 4 FCC ID: 2BH4G-V2 Guangdong Asia Hongke Test Technology Limited B1/F, Building 11, Junfeng Industrial Park, Chongqing Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China. EUT Constructional Details External EUT Photo Photo 1 Photo 2 Page 2 of 4 FCC ID: 2BH4G-V2 Guangdong Asia Hongke Test Technology Limited B1/F, Building 11, Junfeng Industrial Park, Chongqing Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China. Photo 3 Photo 4 Page 3 of 4 FCC ID: 2BH4G-V2 Guangdong Asia Hongke Test Technology Limited B1/F, Building 11, Junfeng Industrial Park, Chongqing Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China. Photo 5 Photo 6 Page 4 of 4 FCC ID: 2BH4G-V2 Guangdong Asia Hongke Test Technology Limited B1/F, Building 11, Junfeng Industrial Park, Chongqing Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China. Photo 7 ---The End---

Label Size: L15mm * W5mm 1. The label is silk-screen on the sample SILICONE BAND Model Name: Ellu Band V2 FCC ID: 2BH4G-V2 L W

Page 1 of 5 FCC ID: 2BH4G-V2 Guangdong Asia Hongke Test Technology Limited B1/F, Building 11, Junfeng Industrial Park, Chongqing Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China. EUT Constructional Details Internal EUT Photo Photo 1 Photo 2 Page 2 of 5 FCC ID: 2BH4G-V2 Guangdong Asia Hongke Test Technology Limited B1/F, Building 11, Junfeng Industrial Park, Chongqing Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China. Photo 3 Photo 4 Page 3 of 5 FCC ID: 2BH4G-V2 Guangdong Asia Hongke Test Technology Limited B1/F, Building 11, Junfeng Industrial Park, Chongqing Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China. Photo 5 Photo 6 Page 4 of 5 FCC ID: 2BH4G-V2 Guangdong Asia Hongke Test Technology Limited B1/F, Building 11, Junfeng Industrial Park, Chongqing Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China. Photo 7 Photo 8 Antenna Page 5 of 5 FCC ID: 2BH4G-V2 Guangdong Asia Hongke Test Technology Limited B1/F, Building 11, Junfeng Industrial Park, Chongqing Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China. Photo 9 ------End------

RF Exposure evaluation FCC ID: 2BH4G-V2 Applicable Standard According to §1.1307(b)(1), systems operating under the provisions of this section shall be operated in a manner that ensures that the public is not exposed to radio frequency energy level in excess of the Commission’s guidelines. According to §1.1310 and §2.1093 RF exposure requirement KDB447498 v06: Mobile and Portable Devices RF Exposure Procedures and Equipment Authorization Policies 1.1. Requirement According to KDB447498 D01 General RF Exposure Guidance v06 Section 4.3.1 Standalone SAR test exclusion considerations: “Unless specifically required by the published RF exposure KDB procedures, standalone 1-g head or body and 10-g extremity SAR evaluation for general population exposure conditions, by measurement or numerical simulation, is not required when the corresponding SAR Test Exclusion Threshold condition, listed below, is satisfied. These test exclusion conditions are based on source-based time-averaged maximum conducted output power of the RF channel requiring evaluation, adjusted for tune-up tolerance, and the minimum test separation distance required for the exposure conditions.22 The minimum test separation distance is determined by the smallest distance from the antenna and radiating structures or outer surface of the device, according to the host form factor, exposure conditions and platform requirements, to any part of the body or extremity of a user or bystander (see 5) of section 4.1). To qualify for SAR test exclusion, the test separation distances applied must be fully explained and justified by the operating configurations and exposure conditions of the transmitter and applicable host platform requirements, typically in the SAR measurement or SAR analysis report, according to the required published RF exposure KDB procedures. When no other RF exposure testing or reporting is required, a statement of justification and compliance must be included in the equipment approval, in lieu of the SAR report, to qualify for the SAR test exclusion. When required, the device specific conditions described in the other published RF exposure KDB procedures must be satisfied before applying these SAR test exclusion provisions; for example, handheld PTT two-way radios, handsets, laptops & tablets etc.23 “ [(max. power of channel, including tune-up tolerance, mW)/ (min. test separation distance, mm)] · [√f (GHz)] ≤ 3.0 for 1-g SAR and ≤ 7.5 for 10-g extremity SAR, where: • f (GHz) is the RF channel transmit frequency in GHz • Power and distance are rounded to the nearest mW and mm before calculation • The result is rounded to one decimal place for comparison • 3.0 and 7.5 are referred to as the numeric thresholds in the step 2 below The test exclusions are applicable only when the minimum test separation distance is ≤ 50 mm and for transmission frequencies between 100 MHz and 6 GHz. When the minimum test separation distance is < 5 mm, a distance of 5 mm according to 5) in section 4.1 is applied to determine SAR test exclusion. Manufacturing Tolerance [BLE] GFSK1Mbps-RTL8762DT Channel Channel 0 Channel 19 Channel 39 Target (dBm) -10 -7 -7 Tolerance ±(dB) 1.0 1.0 1.0 2. E v a l u a t i o n R e s u l t Standalone Band/Mode f (GHz) Antenna Distance (mm) RF output power including tune up SAR Test Exclusion Threshold SAR Test Exclusion Estimated SAR dBm mW BLE 2.48 5 -6 0.25 0.079 <3.00 Yes / Remark: When the minimum test separation distance is < 5 mm, a distance of 5 mm according to f) in section 4.1 is applied to determine SAR test exclusion. 3. C o n c l u s i o n The measurement results comply with the FCC Limit per 47 CFR 2.1093 for the uncontrolled RF Exposure and SAR Exclusion Threshold per KDB 447498 v06, No SAR is required. .....................End.........................

Page 1 of 35 Report No.: AiTSZ-240718005FW1 Guangdong Asia Hongke Test Technology Limited B1/F, Building 11, Junfeng Industrial Park, Chongqing Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China. TEST REPORT Client Information: Applicant: Tu nueva red de comunicación S.L.U. Applicant add.: Paseo de la Castellana 144, Planta 14, Puerta B, 28046, Madrid, Spain Manufacturer: Tu nueva red de comunicación S.L.U. Manufacturer add.: Paseo de la Castellana 144, Planta 14, Puerta B, 28046, Madrid, Spain Product Information: Product Name: SILICONE BAND Model No.: Ellu Band V2 Series Model: Ellu Band V3, Ellu Band V4, Ellu Band V5, Ellu Band V6 Brand Name: N/A Test samples.: AiTSZ-240718005-1 FCC ID: 2BH4G-V2 Applicable standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247 Prepared By: Guangdong Asia Hongke Test Technology Limited B1/F, Building 11, Junfeng Industrial Park, Chongqing Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China Tel.: +86 0755-230967639 Fax.: +86 0755-230967639 Date of Receipt: July 18,2024 Date of Test: July 18,2024~ July 23, 2024 Date of Issue: July 23, 2024 Test Result: Pass This device described above has been tested by Guangdong Asia Hongke Test Technology Limited and the test results show that the equipment under test (EUT) is in compliance with the FCC requirements. And it is applicable only to the tested sample identified in the report. Note: This report shall not be reproduced except in full, without the written approval of Guangdong Asia Hongke Test Technology Limited, this document may be altered or revised by Guangdong Asia Hongke Test Technology Limited, personal only, and shall be noted in the revision of the document. This test report must not be used by the client to claim product endorsement. Reviewed by: Approved by: Leon.yi Sean She Page 2 of 35 Report No.: AiTSZ-240718005FW1 Guangdong Asia Hongke Test Technology Limited B1/F, Building 11, Junfeng Industrial Park, Chongqing Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China. 1 Contents Page COVER PAGE 1 CONTENTS .................................................................................................................................................................... 2 2 TEST SUMMARY .......................................................................................................................................................... 4 2.1 Statement of the Measurement Uncertainty ....................................................................................... 4 2.2 Measurement Uncertainty ................................................................................................................... 4 3 TEST FACILITY ............................................................................................................................................................. 5 3.1 Deviation from standard ...................................................................................................................... 5 3.2 Abnormalities from standard conditions .............................................................................................. 5 3.3 Test Location ....................................................................................................................................... 5 4 GENERAL INFORMATION ......................................................................................................................................... 6 4.1 Test frequencies .................................................................................................................................. 7 4.2 EUT Peripheral List ............................................................................................................................. 7 4.3 Test Peripheral List .............................................................................................................................. 7 4.4 TEST METHODOLOGY ...................................................................................................................... 8 4.4.1 EUT Configuration ................................................................................................................................... 8 4.4.2 EUT Exercise ........................................................................................................................................... 8 4.4.3 General Test Procedures ......................................................................................................................... 8 4.5 Description of Test Modes ................................................................................................................... 9 5 EQUIPMENT USED DURING TEST ........................................................................................................................ 10 6 TEST RESULTS AND MEASUREMENT DATA .................................................................................................... 11 6.1 Antenna requirement .......................................................................................................................... 11 6.2 On Time and Duty Cycle ................................................................................................................... 13 6.3 Maximum Conducted Output Power Measurement .......................................................................... 14 6.4 6 dB Spectrum Bandwidth Measurement.......................................................................................... 16 6.5 Power Spectral Density ..................................................................................................................... 17 6.6 Conducted Spurious Emissions and Band Edges Test ..................................................................... 18 6.7 Radiated Emissions and Radiation Restricted band Measurement ................................................. 19 6.8 Cond…

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Page 1 of 8 Report No.: AiTSZ-240718005FW1 Conducted Output Power Test Result Mode Channel Peak Output Power (dBm) Peak Output Power (mW) Max. Avg. Power (dBm) Limit (dBm) Result BLE 1M 0 -10.012 0.1 None ≤30 PASS 19 -7.940 0.16 None ≤30 PASS 39 -7.460 0.18 None ≤30 PASS Test Graphs Peak Output Power BLE 1M_Channel 0 Peak Output Power BLE 1M_Channel 19 Peak Output Power BLE 1M_Channel 39 Page 2 of 8 Report No.: AiTSZ-240718005FW1 99% Bandwidth Test Result Mode Channel Center Frequency (MHz) 99% BW (MHz) BLE 1M 0 2402 1.0770 BLE 1M 19 2440 1.0770 BLE 1M 39 2480 1.0770 Test Graphs BLE 1M_Channel 0 BLE 1M_Channel 19 BLE 1M_Channel 39 Page 3 of 8 Report No.: AiTSZ-240718005FW1 6dB Bandwidth Test Result Mode Channel Center Frequency (MHz) 6 dB Bandwidth (MHz) Limit (MHz) Result BLE 1M 0 2402 0.6700 ≥0.5 PASS 19 2440 0.6600 PASS 39 2480 0.6600 PASS Test Graphs BLE 1M_Channel 0 BLE 1M_Channel 19 BLE 1M_Channel 39 Page 4 of 8 Report No.: AiTSZ-240718005FW1 Conducted Out Of Band Emission Test Result Mode Channel OOB Emission Frequency (MHz) OOB Emission Level (dBm) Limit (dBm) Over Limit (dB) Result BLE 1M 0 2396.92 -57.936 -30.51 -27.426 PASS 2400.00 -61.004 -30.51 -30.494 PASS 4802.40 -48.958 -30.51 -18.448 PASS 7206.10 -50.689 -30.51 -20.179 PASS 9609.00 -49.707 -30.51 -19.197 PASS 24645.4 -42.638 -30.51 -12.128 PASS 19 4878.18 -51.110 -28.44 -22.670 PASS 7320.16 -49.052 -28.44 -20.612 PASS 9758.82 -49.790 -28.44 -21.350 PASS 24582.2 -43.303 -28.44 -14.863 PASS 39 2483.50 -60.108 -27.86 -32.248 PASS 4958.91 -50.311 -27.86 -22.451 PASS 7440.02 -50.985 -27.86 -23.125 PASS 9919.46 -49.191 -27.86 -21.331 PASS 24104.4 -42.395 -27.86 -14.535 PASS Test Graphs In-Band Reference Level BLE 1M_Channel 0 Out Of Band Emission BLE 1M_Channel 0 30.0 MHz - 25000.0 MHz BLE 1M_Channel 0 In-Band Reference Level BLE 1M_Channel 19 Page 5 of 8 Report No.: AiTSZ-240718005FW1 30.0 MHz - 25000.0 MHz BLE 1M_Channel 19 In-Band Reference Level BLE 1M_Channel 39 Out Of Band Emission BLE 1M_Channel 39 30.0 MHz - 25000.0 MHz BLE 1M_Channel 39 Page 6 of 8 Report No.: AiTSZ-240718005FW1 Duty Cycle Test Result Mode Channel On Time (ms) Period (ms) Duty Cycle (%) Duty Cycle (linear) Duty Cycle Factor (dB) BLE 1M 0 1.637 1.874 87.35 0.8735 0.5874 19 1.636 1.874 87.31 0.8731 0.5894 39 1.637 1.874 87.35 0.8735 0.5874 Test Graphs BLE 1M_Channel 0 Page 7 of 8 Report No.: AiTSZ-240718005FW1 BLE 1M_Channel 19 BLE 1M_Channel 39 Page 8 of 8 Report No.: AiTSZ-240718005FW1 Power Spectral Density Test Result Mode Channel PSD (dBm/3kHz) Limit (dBm/3kHz) Result BLE 1M 0 -26.713 ≤8 PASS BLE 1M 19 -24.201 ≤8 PASS BLE 1M 39 -23.839 ≤8 PASS Test Graphs BLE 1M_Channel 0 BLE 1M_Channel 19 BLE 1M_Channel 39

3216 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 3.23 ± 0.10 W 1.66 ± 0.10 T 1.27 ± 0.10 P/N：WAN3216F245M03 WAN3216F245M04 WAN3216F245M05 1 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of page2  Part Number Information WAN 3216 F 245 M 0X(X=3~5) A B C D E F A Product Series Antenna B Dimension L x W 3.2X1.6mm (+-0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode Monopole & Single Feeding F Antenna type Type 03~05 Specification Part Number WAN3216F245M03 WAN3216F245M04 WAN3216F245M05 Central Frequency 2450 MHz Bandwidth 100 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 2.41 dBi Impedance 50 Ohm Operating Temperature -40～+85 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Ni / Sn (Leadless) 2 2. Recommended PCB Pattern  Evaluation Board Dimension  Suggested Matching Circuit 3  Layout Dimensions in Clearance area( Size=5.2*5.0mm) FootPrint (Unit : mm) 3. Measurement Results 4  Return Loss  Radiation Pattern 5 Efficiency Peak Gain Directivity 2400MHz 41.21 % 1.15 dBi 5.32 dBi 2450MHz 52.45 % 2.41 dBi 5.21 dBi 2500MHz 43.53 % 1.68 dBi 5.29 dBi Chamber Coordinate System 4. Reliability and Test Condictions Y Z X 6 ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage  Pre-heating temperature:150°C/60sec.  Solder temperature:230±5°C  Duration:4±1sec.  Solder:Sn-Ag3.0-Cu0.5  Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6%  Pre-heating temperature:150°C/60sec.  Solder temperature:260±5°C  Duration:10±0.5sec.  Solder:Sn-Ag3.0-Cu0.5  Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage  Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together.  Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min)  +85°C=>30±3min -40°C=>30±3min  Test cycle:10 cycles 7 1 +85±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec  The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit.  Temperature: 85±5°C  Duration: 1000±12hrs  The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit.  Temperature:-40±5°C  Duration: 1000±12hrs  The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit.  Temperature: 40±2°C  Humidity: 90% to 95% RH  Duration: 1000±12hrs  The chip shall be stabilized at normal condition for 2~3 hours before measuring. 5. Soldering and Mounting 8 Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. 6. Packaging Information 9  Tape Specification:  Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 13.5±0.5 178±2 3000 7. Storage and Transportation Information 10  Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: -10~ 40°C and 30~70% RH. 2. Recommended products should be used within 6 months from the time of delivery. 3. The packaging material should be kept where no chlorine or sulfur exists in the air.  Transportation Conditions 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. Revision Table 11 Revision Date Content Remark V1 11 th ,Sep, 2013 New issued V2 23 rd ,Jan, 2014 Add Antenna Marker Direction

Page 1 of 2 FCC ID: 2BH4G-V2 Guangdong Asia Hongke Test Technology Limited B1/F, Building 11, Junfeng Industrial Park, Chongqing Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China. Test Setup Photo DTS Radiated Emission Page 2 of 2 FCC ID: 2BH4G-V2 Guangdong Asia Hongke Test Technology Limited B1/F, Building 11, Junfeng Industrial Park, Chongqing Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China. Conducted Emission ------End------