2BHAT-SK19Wireless headset

Shenzhen Jinlangmei Technology Co., Ltd. 2.911 (d)(5)(i) Equipment Type Attestation v1.2 Section 2.911(d)(5)(i) Certification – Equipment Type Company name: Shenzhen Jinlangmei Technology Co., Ltd. Address: 202, Building 2, Tianhao Industrial Park, No. 2852 Songbai Road, Bao’an Distrit, Shenzhen, 518108 China Product Name: Wireless headset FCC ID: 2BHAT-SK19 Model(s): SK19 2.911(d)(5)(i) Equipment Type We, [Shenzhen Jinlangmei Technology Co., Ltd.] (“the applicant”) certify that the equipment for which authorization is sought through certification is not:  Prohibited from receiving an equipment authorization pursuant to § 2.903; of the FCC rules.  Identified as an equipment type in the “Covered List” NOTE 1 Yours sincerely, Name: Haiping Chen Date: Jul. 01, 2024 Title: General manager Company name: Shenzhen Jinlangmei Technology Co., Ltd. Signature: NOTE 1 “Covered List ”; is the List of Equipment and Services Covered By Section 2 of The Secure Networks Act, available at https://www.fcc.gov/supplychain/coveredlist References; 1) 986446 D01 Covered Equipment v01 https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?switch=P&id=325672 2) Federal Register document 2022-28263 published on 02/06/23 https://www.federalregister.gov/documents/2023/02/06/2022-28263/protecting-against-national-security-threats-to-the-com munications-supply-chain-through-the

Shenzhen Jinlangmei Technology Co., Ltd. 2.911 (d)(5)(ii) Applicant Attestation v1.3 Section 2.911(d)(5)(ii) Certification – Applicant (Covered List ) Company name: Shenzhen Jinlangmei Technology Co., Ltd. Address: 202, Building 2, Tianhao Industrial Park, No. 2852 Songbai Road, Bao’an Distrit, Shenzhen, 518108 China Product Name: Wireless headset FCC ID: 2BHAT-SK19 Model(s): SK19 2.911(d)(5)(ii) Applicant filing We, [Shenzhen Jinlangmei Technology Co., Ltd.] (“the applicant”) certify that, as of the date of the filing of the application, the applicant is not identified NOTE 1 on the “Covered List” NOTE 2 ,established pursuant to §1.50002 of this chapter, as an entity producing covered communications equipment. Yours sincerely, Name: Haiping Chen Date: Jul. 01, 2024 Title: General manager Company name: Shenzhen Jinlangmei Technology Co., Ltd. Signature: NOTE 1 Delete option not applicable to this application. NOTE 2 “Covered List ”; is the List of Equipment and Services Covered By Section 2 of The Secure Networks Act, available at https://www.fcc.gov/supplychain/coveredlist References; 1) 986446 D01 Covered Equipment v01 https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?switch=P&id=325672 2) Federal Register document 2022-28263 published on 02/06/23 https://www.federalregister.gov/documents/2023/02/06/2022-28263/protecting-against-national-security-threats-to-the-com munications-supply-chain-through-the

ShenzhenJinlangmeiTechnologyCo.,Ltd. 2.911(d)(7)USAAgentv1.4 Section2.911(d)(7)USAAgentforServiceofProcess Companyname:ShenzhenJinlangmeiTechnologyCo.,Ltd. Address:202,Building2,TianhaoIndustrialPark,No.2852SongbaiRoad,Bao’an Distrit,Shenzhen,518108China ProductName:Wirelessheadset FCCID:2BHAT-SK19 Model(s):SK19 2.911(d)(7)USADesignatedAgentforServiceofProcess We,[ShenzhenJinlangmeiTechnologyCo.,Ltd.](“theapplicant”)designate [UGK-LVMUNITEDINC] NOTE1 forthepurposeofacceptingserviceofprocesson behalfoftheapplicant. Applicantconsent:Weacknowledgeourconsenttoacceptserviceofprocessinthe UnitedStatesformattersrelatedtotheapplicableequipment,andatthephysicalU.S. addressandemailaddressofthedesignatedagentandacknowledgeour acceptanceofourobligationtomaintainanagentforserviceofprocessintheUnited Statesfornolessthanoneyearaftereitherwethegranteehavepermanently terminatedallmarketingandimportationoftheapplicableequipmentwithintheU.S., orattheconclusionofanyCommission-relatedadministrativeorjudicialproceeding involvingtheequipment,whicheverislater. Agentobligation:Weacknowledgeourobligationtoacceptserviceofprocessinthe UnitedStatesformattersrelatedtotheapplicableequipmentatourphysicalU.S. addressandemailaddressfornolessthanoneyearaftereitherthegranteehas permanentlyterminatedallmarketingandimportationoftheapplicableequipment withintheU.S.,orattheconclusionofanyCommission-relatedadministrativeor judicialproceedinginvolvingtheequipment,whicheverislater. USAAgent Companyname:UGK-LVMUNITEDINC USAAddress:6547NAcademyBlvd#2266 ColoradoSprings,CO80918UnitedStates FRNNumber:0033401928 ContactName:Jimmychen TelephoneNo:(323)510-4660 Email:[email protected] Applicant Companyname:ShenzhenJinlangmei TechnologyCo.,Ltd. Address:202,Building2,Tianhao IndustrialPark,No.2852SongbaiRoad, Bao’anDistrit,Shenzhen,518108China FCCGranteeCode:2BHAT FRNNumber:0035611094 ContactName:HaipingChen TelephoneNo:18566527746 Email:[email protected] ShenzhenJinlangmeiTechnologyCo.,Ltd. 2.911(d)(7)USAAgentv1.4 Signature: Title:Generalmanager Signature: Title:Generalmanager Date:Jul.11,2024Date:Jul.11,2024 NOTE1:AnapplicantlocatedintheUnitedStatesmaydesignateitselfastheagentforservice ofprocess. Reference;FederalRegisterdocument2022-28263publishedon02/06/23 https://www.federalregister.gov/documents/2023/02/06/2022-28263/protecting-against-nation al-security-threats-to-the-communications-supply-chain-through-the

Shenzhen Jinlangmei Technology Co., Ltd. Agent Authorization Company: Shenzhen Jinlangmei Technology Co., Ltd. Address: 202, Building 2, Tianhao Industrial Park, No. 2852 Songbai Road, Bao’an Distrit, Shenzhen, 518108 China Product Name: Wireless headset Model Number(s): SK19 Product Description: Wireless headset We authorize MiCOM Labs Inc., 575 Boulder Court, Pleasanton, California 94566, USA, to act on our behalf on all matters concerning the certification of above named equipment. We declare that MiCOM Labs Inc. is allowed to forward all information related to the approval and certification of equipment to the regulatory agencies as required and to discuss any issues concerning the approval application. Any and all acts carried out by MiCOM Labs on our behalf shall have the same effect as acts of our own. Signature: Date: Jul. 01, 2024 Name: Haiping Chen Title: General manager Company: Shenzhen Jinlangmei Technology Co., Ltd.

Shenzhen Jinlangmei Technology Co., Ltd. Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 USA Date: Jul. 01, 2024 Subject; Request for Confidentiality FCC ID: 2BHAT-SK19 To Whom It May Concern, Pursuant to the provisions of the Commission’s rules Title 47 Sections §0.457 and §0.459, we are requesting the Commission to withhold the following attachment(s) as confidential documents from public disclosure indefinitely. These documents contain detailed system and equipment descriptions and are considered as proprietary information in operation of the equipment. The public disclosure of these documents might be harmful to our company and would give competitors an unfair advantage in the market. Schematic Diagram Block Diagram Parts List Operational Description Tune-up Procedure In additional to above mentioned documents, in order to comply with the marketing regulations in Title 47 CFR §2.803 and the importation rules in Title 47 CFR §2.1204, while ensuring that business sensitive information remains confidential until the actual marketing of newly authorized devices, we request Short Term Confidentiality of the following attachment(s); External Photos Test Setup Photos Internal Photos User Manual For 45 days, pursuant to Public Notice DA 04-1705. OR For 180 days pursuant to KDB 726920 D01. It is our understanding that all measurement test reports, FCC ID label format and correspondence during the certification review process cannot be granted as confidential documents and this information will be available for public review once the grant of equipment authorization is issued. Sincerely, Signature: Name: Haiping Chen Title: General manager

FCC ID LABEL: Size: 1mm x 8mm Label Location FCC ID: 2BHAT-SK19

FCC RF Exposure Product Name: Wireless headset FCC ID: 2BHAT‐SK19 Model(s): SK19 1. Limits According to KDB 447498 D01 General RF Exposure Guidance v06 The 1‐g and 10‐g SAR test exclusion thresholds for 100 MHz to 6 GHz at test separation distances ≤50 mm are determined by: [(max power of channel, including tune‐up tolerance, mW)/(min. test separation distance, mm)]·[√ f(GHz)]≤3.0 for 1‐g SAR and ≤ 7.5 for 10‐g extremity SAR, Where: Result=P/D*√F F= the RF channel transmit frequency in GHz P=Maximum turn‐up power in mw D=Min. test separation distance in mm 2. Test Result of RF Exposure Evaluation Frequency (MHz) Output power (dBm) Tune Up Power (dBm) Max Tune Up power dBm/mW Min test separatio n distance mm Result Limit (mW/cm 2 ) SAR Test Exclusion 2480 6.85 6±1 7/5.01 5 1.58 3.0 Pass Note: PK Output power= conducted power. Conducted power see the test report HK2406123064‐E, antenna gain=2dBi Per KDB 447498 D01, when the minimum test separation distance is < 5 mm, a distance of 5 mm is applied to determine RF Exposure test exclusion. The test exclusion threshold is 1.58 which is<= 3, RF Exposure testing is not required. Note: Exclusion Thresholds Results=[(max. power of channel, including tune-up tolerance, mW)/(min. test separation distance, mm)] ·[√f (GHz)] f(GHz) is the RF channel transmit frequency in GHz Distance=5mm

P/N:HLX160808D06 Features 1.SurfaceMountedDeviceswithasmalldimensionof1.6x0.8x0.8mmmeetfutureminiaturization trend. 2,EmbeddedandLTCC(lowtemperatureco-firedceramic)technologyisabletointegratewithsystemdesign aswellasbeatifyingthehousingoffinalproduct. 3.Highstabilityandlowtolerance. Applications 1.Bluetooth 2.WirelessLAN 3.ISMband2.4GHzwirelessapplications DimensionsUnitmm L ① (TopView) A (BottomView) NumberTerminalName ① INPUT ② NC T (SideView) Symbols LWTA Dimensions1.60±0.200.80±0.200.80±0.200.30±0.10 地址：深圳市宝安区西乡街道共乐社区铁仔路九方广场2栋1905 Manufacturer:SHENZHENHELIXUNTECHNOLOGYCO.LTD. TEL:0755-23591525,FAX:0755-23591525 ② w P/N:HLX160808D06 EvaluationBoardandMatchingCircuits 地址：深圳市宝安区西乡街道共乐社区铁仔路九方广场2栋1905 Manufacturer:SHENZHENHELIXUNTECHNOLOGYCO.LTD. TEL:0755-23591525,FAX:0755-23591525 地址：深圳市宝安区西乡街道共乐社区铁仔路九方广场2栋1905 Manufacturer:SHENZHENHELIXUNTECHNOLOGYCO.LTD. TEL:0755-23591525,FAX:0755-23591525 P/N:HLX160808D06 S11-Parameter Frequency(MHz) 2400245024802500 VSWR 1.561.161.481.79 地址：深圳市宝安区西乡街道共乐社区铁仔路九方广场2栋1905 Manufacturer:SHENZHENHELIXUNTECHNOLOGYCO.LTD. TEL:0755-23591525,FAX:0755-23591525 P/N:HLX160808D06 RadiationPattern coordinates： Y-ZPlane X-ZPlane 地址：深圳市宝安区西乡街道共乐社区铁仔路九方广场2栋1905 Manufacturer:SHENZHENHELIXUNTECHNOLOGYCO.LTD. TEL:0755-23591525,FAX:0755-23591525 P/N:HLX160808D06 X-YPlane Avg.gaindBi 1.300.930.45 PeakgaindBi 2.02.01.95 EfficiencydBi 57%54%53% 地址：深圳市宝安区西乡街道共乐社区铁仔路九方广场2栋1905 Manufacturer:SHENZHENHELIXUNTECHNOLOGYCO.LTD. TEL:0755-23591525,FAX:0755-23591525 P/N:HLX160808D06 DependabilityTest TestTemperature: 25°C±3°C OperatingTemperature Temperature RelativeHumidity MoistureProof Temperature：40±2°CHumidity：90~95%RH Duration：500h Recoveryconditions：RoomtemperatureRecoveryTime：24h(Class1)or48h(Class2) Solderability Atleast95%oftheterminalelectrodeiscoveredbynewsolder.Preheatingconditions:80to120; 10~30s. SolderTemperature:235±5Duration:2±0.5s,SolderTemperature:245±5Duration:2±0.5s OptimumSolderAmountforReflowSoldering Toomuchsolder Notenoughsolder Crackstendtooccurdueto largestress. Weakholdingforcemaycausebadconnectionbetweenthe capacitorandPCB. RecommendedSolderingamounts Theoptimalsolderfilletamountsforre-flowsolderingTheoptimalsolderfilletamountsforwavesoldering 天线厚度 以下 -25C~+85C 5~40°C 20~70% 地址：深圳市宝安区西乡街道共乐社区铁仔路九方广场2栋1905 Manufacturer:SHENZHENHELIXUNTECHNOLOGYCO.LTD. TEL:0755-23591525,FAX:0755-23591525 P/N:HLX160808D06 TemperatureCycleTest 10±1SAppliedForce:5NDuration:10±1S Preheatingconditions:up-categorytemperature,1h Recoverytime:24±1h InitialMeasurement CyclingTimes:5times,1cycle,4steps: ResistancetoSolderingHeat Preheating80to120°C;10~30s.SolderTemperature:235±5°CDuration:2±0.5s，SolderTemperature:245±5°C Duration:2±0.5s，Preheating100to200°C;10±2min. SolderTemperature:265 ± 5°CDuration:10 ± 1s Cleanthecapacitorwithsolventandexamineitwitha10X(min.)microscope. RecoveryTime:24±2h Recoverycondition:Roomtemperature ResistancetoFlexureofSubstrate TestBoard:Al2O3orPCB Warp:1mmSpeed:0.5mm/sec. Unit:mm Themeasurementshouldbemadewiththeboardin thebendingposition. 地址：深圳市宝安区西乡街道共乐社区铁仔路九方广场2栋1905 Manufacturer:SHENZHENHELIXUNTECHNOLOGYCO.LTD. TEL:0755-23591525,FAX:0755-23591525 P/N:HLX160808D06 Whileinpreheating,pleasekeepthetemperaturedifferencebetweensolderingtemperature andsurfacetemperatureofchipsas:T≤150°C. 地址：深圳市宝安区西乡街道共乐社区铁仔路九方广场2栋1905 Manufacturer:SHENZHENHELIXUNTECHNOLOGYCO.LTD. TEL:0755-23591525,FAX:0755-23591525 P/N:HLX160808D06 Dimensionsofpapertapingfor0603types Unit：mm Reel(4000pcs/Reel) StoragePeriod Theguaranteedperiodforsolderabilityis6months(Underdeliverpackage condition).Temperature5~40°C/RelativeHumidity20~70%

Page 1 of 53 Report No.: HK2406123064-E FCC Test Report Test Report On Behalf of Shenzhen Jinlangmei Technology Co., Ltd. For Wireless headset Model No.: SK19 FCC ID: 2BHAT-SK19 Prepared For: Shenzhen Jinlangmei Technology Co., Ltd. 202, Building 2, Tianhao Industrial Park, No. 2852 Songbai Road, Bao’an Distrit, Shenzhen, 518108 China Prepared By: Shenzhen HUAK Testing Technology Co., Ltd. 1-2/F., Building B2, Junfeng Zhongcheng Zhizao Innovation Park, Heping, Fuhai Street, Bao’an District, Shenzhen, Guangdong, China Date of Test: Jun. 12, 2024 ~ Jun. 25, 2024 Date of Report: Jun. 25, 2024 Report Number: HK2406123064-E Page 2 of 53 Report No.: HK2406123064-E Test Result Certification Applicant’s Name ................. : Shenzhen Jinlangmei Technology Co., Ltd. Address .................................. : 202, Building 2, Tianhao Industrial Park, No. 2852 Songbai Road, Bao’an Distrit, Shenzhen, 518108 China Manufacturer's Name ........... : Shenzhen Jinlangmei Technology Co., Ltd. Address .................................. : 202, Building 2, Tianhao Industrial Park, No. 2852 Songbai Road, Bao’an Distrit, Shenzhen, 518108 China Product Description Trade Mark ............................. : N/A Product Name ........................... : Wireless headset Model and/or type reference...: SK19 Standards .............................. : 47 CFR FCC Part 15 Subpart C 15.247 This publication may be reproduced in whole or in part for non-commercial purposes as long as the Shenzhen HUAK Testing Technology Co., Ltd. is acknowledged as copyright owner and source of the material. Shenzhen HUAK Testing Technology Co., Ltd. takes no responsibility for and will not assume liability for damages resulting from the reader's interpretation of the reproduced material due to its placement and context. Date of Test ........................................... : Date (s) of Performance of Tests ............ : Jun. 12, 2024 ~ Jun. 25, 2024 Date of Issue .......................................... : Jun. 25, 2024 Test Result .............................................. : Pass Testing Engineer : (Len Liao) Technical Manager : (Sliver Wan) Authorized Signatory : (Jason Zhou) Page 3 of 53 Report No.: HK2406123064-E Table of Contents Page 1. Summary .............................................................................................................................................................. 5 1.1. Test Standards ......................................................................................................................................................... 5 1.2. Test Description ....................................................................................................................................................... 5 1.3. Information of the Test Laboratory ......................................................................................................................... 6 1.4. Statement of the Measurement Uncertainty .......................................................................................................... 6 2. General Information ............................................................................................................................................. 7 2.1. Environmental Conditions ....................................................................................................................................... 7 2.2. General Description of EUT ..................................................................................................................................... 7 2.3. Description of Test Modes and Test Frequency ....................................................................................................... 8 2.4. Equipments Used during the Test ............................................................................................................................ 9 2.5. Related Submittal(s) / Grant (s) ............................................................................................................................. 10 2.6. Modifications ........................................................................................................................................................ 10 2.7. Description of Test Setup ....................................................................................................................................... 10 2.8. Description of Support Units ................................................................................................................................. 11 3. Test Conditions and Results ................................................................................................................................. 12 3.1. Conducted Emissions Test ..................................................................................................................................... 12 3.2. Radiated Emissions and Band Edge ....................................................................................................................... 15 3.3. Maximum Peak Conducted Output Power ............................................................................................................ 26 3.4. 20dB Bandwidth .................................................................................................................................................... 27 3.5. Frequency Separation ........................................................................................................................................... 31 3.6. Number of Hopping Frequency ............................................................................................................................. 33 3.7. Time of Occupancy (Dwell Time) .......................................................................................................................... 35 3.8. Out‐of‐Band Emissions ........................................................................…

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Model No: SK19 Radiated Emissions Conducted Emission