2BPTI-W008RV door lock

Dongguan Huaxun Plastic Technology Co., Ltd. Code 00018768 Ed. 1 Item 1. The device is able to install software/program installation? ☐ Yes, go to Item 2. ☒ No. In this case, the rest of the items do not apply. The device cannot support installation of Kaspersky cybersecurity or anti-virus software. Item 2. Technical Requirements for Kaspersky Cybersecurity Software: # General Requirements (For all Devices) Yes / No or N/A Comments 1 Internet connection for activation and updates (For all Operating Systems) N/A # General Requirements (For Windows Devices) Yes / No or N/A Comments 1 Storage: 1500 MB free space on the hard drive N/A Device RV door lock Company name Dongguan Huaxun Plastic Technology Co., Ltd. Grantee code 2BPTI FCC ID 2BPTI-W008 FRN 0037087285 Contact name Peng Yangjia Address Room 302, Building 1, No. 16 Fumin Road, Tangli, Fenggang Town, Dongguan City, Guangdong Province, China Telephone number 13667050992 E-mail [email protected] Chipset/module information HLK-B40 Operating System (if applicable) / Storage Capacity (hard drive or other permanent memory storage, if applicable) / 2 2 Operating System: Microsoft Windows 8, 8.1, 10 & 11 Home / Pro / Enterprise Microsoft Windows 7 Starter / Home Basic & Premium / Professional / Ultimate SP1 or higher N/A 3 Processor: 1 GHz or higher (x86 or x64) N/A 4 Memory (RAM)1 GB (32-bit) or 2 GB (64-bit) N/A 5 Screen Resolution: Minimum resolution of 1024 x 768 N/A # General Requirements (For macOS devices) Yes / No or N/A Comments 1 Operating System macOS® 13 – 14 N/A 2 Memory (RAM)4 GB N/A 3 Storage: 3455 MB free space on the hard drive N/A # General Requirements (For Android Devices) Yes / No or N/A Comments 1 Storage: 150 MB free space N/A 2 Operating System: Android™ 10 – 14 N/A 3 Screen Resolution: Minimum resolution of 320 x 480 N/A # General Requirements (for iOS devices) Yes / No or N/A Comments 1 Storage: 150 MB free space N/A 2 Operating System: iOS® 17 N/A # General Requirements (For Linux system) Yes / No or N/A Comments 1 Hard drive: 1 GB of free space N/A 2 CPU: Intel Pentium 1 GHz or higher N/A 3 3 RAM: 1 GB N/A 4 Minimum software requirements: AlmaLinux OS 8 or later; AlterOS 7.5 or later; Astra Linux Common Edition 2.12 or later; CentOS 6.7 or later; Debian GNU/Linux 10.0 or later; EulerOS 2.0 or later; Oracle Linux 7.3 or later ; Red Hat Enterprise Linux 6.7 or later ; Rocky Linux 8.5 or later ; SUSE Linux Enterprise Server 12.5 or later; Ubuntu 12.04 or later ; Uncom OS Home / Business / Education / Enterprise 2.2 or later; ALT Linux Workstaton / Workstation K / Server / Education 8 or later; ROSA Linux Workstation / Server 12 or later ; RED OS 7.3 and later ; After reviewed the technical requirements, is the device capable of supporting the installation of Kaspersky software? ☐Yes, go to Item 3. ☒No. In this case, the rest of the items do not apply. The device cannot support installation of Kaspersky software Item 3. Connectivity Capabilities: # Physical Interface Purpose Justification 1 1 The justification field is used to justify why the software cannot be received through that interface. Check the annex for more indications. N/A 4 1 USB Type-C port Can connect to docking station Built-in firmware blocks Kaspersky software downloads # Wireless Interface Purpose Justification 1 1 WiFi Can connect to Internet Built-in firmware blocks Kaspersky software downloads A fter the review of this items, the device: ☒Cannot support installation of any cybersecurity or anti-virus software on the covered list. ☐Potentially can operate with any cybersecurity or anti-virus software on the covered list – additional third- party proof is provided to demonstrate compliance with requirements as of 2.911(d)5(i),(ii) – “Proof of Compliance with Covered List Software Requirements” of this document applies Signature: Name: Peng Yangjia Date: 2026-3-31

TCB CALL página 1 File FCC ID: 2BPTI-W008 Please upload an exhibit that explains how does the TCB verify the new agent information: 1- Is the address of the agent a valid physical US mailing address (not a US post office box, not a virtual mailbox, not P.O. Boxes, not a vacant lot, not a public building, etc.) ○We have checked if the address exists in a real and potential building (Google maps) + official US register, after this verification and the evidence below we can guarantee the following: not a US post office box not a virtual mailbox not P.O. Boxes not a vacant lot not a public building(note) ► We checked the FCC FRN Search based on the information provided by the grantee. On the official register from : https://bizfileonline.sos.ca.gov/search/business TCB CALL página 2 In google: TCB CALL página 3 ►CONCLUSION by TCB: The ASOP defined and provided by grantee is VALID and confirmed. Therefore the exhibit "C5266091_X23_Ed1_US_Agent_Letter" included in the file is ok. 2- Is the agent physically located at that valid US address such that the agent can be legally served at that address? Yes , check above 3- Has the listed agent clearly agreed in writing to serve as the agent for the grantee at that address? Yes, it is included in the exhibit "C5266091_X23_Ed1_US_Agent_Letter" >

C5266091_X10_Ed.2 1/1 < Dongguan Huaxun Plastic Technology Co., Ltd. > Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 Date: 2026/3/31 Subject: Request for Confidentiality FCC ID: 2BPTI-W008 To Whom It May Concern, Pursuant to the provisions of Sections 0.457 and 0.459 of Commission's rules (47CFR0.457, 0.459), we are requesting the Commission to withhold the following attachment(s) as confidential document from public disclosure. Exhibits Long-Term Confidentiality Short-Term Confidentiality NOTE 2 ID Label/Location No No Attestation Statement No No External Photos No ☒ Block Diagram ☒ ☐ Schematics ☒ ☐ Test Report No No Test Setup Photos No ☒ User’s Manual ☐ NOTE 1 ☒ Internal Photos ☐ NOTE 1 ☒ Parts List / Tune Up ☐ ☐ RF Exposure Info No No Operational Description ☒ ☐ Cover Letter(s) No No SDR Software / Security Info ☒ No NOTE 1: Long-Term Confidentiality may be permitted under special conditions (See II. LONG-TERM CONFIDENTIALITY, Section 3 of KDB 726920, use last in force) NOTE 2: Short-Term Confidentiality can be requested for a maximum of 180 days from the date of the grant. Above mentioned document contains detailed system and equipment description are considered as proprietary information in operation of the equipment. The public disclosure of above documents might be harmful to our company and would give competitor an unfair advantage in the market. In case of short-term Confidentiality, the applicant requests the exhibits selected above are withheld from public view for a period of _180__ days from the date of the Grant of Equipment Authorization and prior to marketing. It is our understanding that all measurement test reports, FCC ID label format and correspondent during certification review process cannot be granted as confidential documents and those information will be available for public review once the grant of equipment authorization is issued. C5266091_X10_Ed.2 1/1 Sincerely, Signature: Name: Peng Yangjia Title: manager

Model: W008 FCC ID: 2BPTI-W008

TotalorpartialreproductionofthisdocumentwithoutpermissionoftheLaboratoryisnotallowed.Page1of10 BTFTestingLab(Shenzhen)Co.,Ltd. Plant101,201and301,Building1,Block2,TantouIndustrialPark,TantouCommunity,SonggangStreet,Bao'anDistrict,Shenzhen,Guangdon g,China Email:[email protected]:+86-755-23146130http://www.btf-lab.comVersion:1/00 RFTestReport For Applicantname:DongguanHuaxunPlasticTechnologyCo.,Ltd. Address: Room302,Building1,No.16FuminRoad,Tangli,FenggangTown, DongguanCity,GuangdongProvince,China EUTname:RVdoorlock Brandname:/ Modelnumber:W008 Seriesmodelnumber:/ FCCID:2BPTI-W008 IssuedBy Companyname: BTFTestingLab(Shenzhen)Co.,Ltd. Address: Plant101,201and301,Building1,Block2,TantouIndustrialPark, TantouCommunity,SonggangStreet,Bao'anDistrict,Shenzhen, Guangdong,China Reportnumber: BTF260325R00202 Teststandards: 47CFRPart2SubpartJSection2.1091 Testconclusion: Pass Dateofsamplereceipt: 2026-03-19 Testdate: 2026-03-19to2026-03-30 Dateofissue: 2026-04-02 Preparedby: Approvedby: Chris.Liu/ProjectengineerRyan.CJ/EMCmanager Note:Allthetestresultsinthisreportonlyrelatedtothetestingsamples.Whichcanbeduplicatedcompletelyforthelegalusewithapprovalof applicant;itshallnotbereproducedexceptinfullwithoutthewrittenapprovalofBTFTestingLab(Shenzhen)Co.,Ltd.,Alltheobjectionsshouldbe raisedwithinthirtydaysfromthedateofissue.Tovalidatethereport,youcancontactus. ReportNumber:BTF260325R00202 TotalorpartialreproductionofthisdocumentwithoutpermissionoftheLaboratoryisnotallowed.Page2of10 BTFTestingLab(Shenzhen)Co.,Ltd. Plant101,201and301,Building1,Block2,TantouIndustrialPark,TantouCommunity,SonggangStreet,Bao'anDistrict,Shenzhen,Guangdon g,China Email:[email protected]:+86-755-23146130http://www.btf-lab.comVersion:1/00 RevisionHistory VersionIssuedateRevisionscontent R_V02026-04-02Original ReportNumber:BTF260325R00202 TotalorpartialreproductionofthisdocumentwithoutpermissionoftheLaboratoryisnotallowed.Page3of10 BTFTestingLab(Shenzhen)Co.,Ltd. Plant101,201and301,Building1,Block2,TantouIndustrialPark,TantouCommunity,SonggangStreet,Bao'anDistrict,Shenzhen,Guangdon g,China Email:[email protected]:+86-755-23146130http://www.btf-lab.comVersion:1/00 TableofContents 1Introduction...............................................................................................................................................................4 1.1LaboratoryLocation..........................................................................................................................................4 1.2LaboratoryFacility............................................................................................................................................4 1.3Announcement..................................................................................................................................................4 2ProductInformation..................................................................................................................................................5 2.1ApplicationInformation.....................................................................................................................................5 2.2ManufacturerInformation.................................................................................................................................5 2.3FactoryInformation...........................................................................................................................................5 2.4GeneralDescriptionofEquipmentunderTest(EUT)......................................................................................5 2.5TechnicalInformation.......................................................................................................................................5 3RFOutputPower.......................................................................................................................................................6 4AppliedReferenceDocuments................................................................................................................................7 5DeviceCategoryandRFExposureLimit...............................................................................................................7 6RFExposureAssessment........................................................................................................................................9 ReportNumber:BTF260325R00202 TotalorpartialreproductionofthisdocumentwithoutpermissionoftheLaboratoryisnotallowed.Page4of10 BTFTestingLab(Shenzhen)Co.,Ltd. Plant101,201and301,Building1,Block2,TantouIndustrialPark,TantouCommunity,SonggangStreet,Bao'anDistrict,Shenzhen,Guangdon g,China Email:[email protected]:+86-755-23146130http://www.btf-lab.comVersion:1/00 1Introduction 1.1LaboratoryLocation Testlocation:BTFTestingLab(Shenzhen)Co.,Ltd. Address: Plant101,201and301,Building1,Block2,TantouIndustrialPark,Tantou Community,SonggangStreet,Bao'anDistrict,Shenzhen,Guangdong,China Description: AllmeasurementfacilitiesusedtocollectthemeasurementdataarelocatedatPlant 101,201and301,Building1,Block2,TantouIndustrialPark,TantouCommunity, SonggangStreet,Bao'anDistrict,Shenzhen,Guangdong,China Phonenumber:+86-0755-23146130 Faxnumber:+86-0755-23146130 1.2LaboratoryFacility Thetestfacilityisrecognized,certified,oraccreditedbythefollowingorganizations: FCC-DesignationNo.:CN1409 BTFTestingLab(Shenzhen)Co.,Ltd.hasbeenaccreditedasatestinglaboratorybyFCC(Federal CommunicationsCommission).ThetestfirmRegistrationNo.is695374. CNAS-RegistrationNo.:CNASL17568 BTFTestingLab(Shenzhen)Co.,Ltd.isaccreditedtoISO/IEC17025:2017GeneralRequirementsfor theCompetenceofTestingandCalibrationlaboratoriesforthecompetenceoftesting.TheRegistration No.isCNASL17568. A2LA-RegistrationNo.:6660.01 BTFTestingLab(Shenzhen)Co.,Ltd.isaccreditedinaccordancewiththerecognizedInternational StandardISO/IEC17025:2017Generalrequirementsforthecompetenceoftestingandcalibration laboratories. 1.3Announcement (1)Thetestreport…

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TotalorpartialreproductionofthisdocumentwithoutpermissionoftheLaboratoryisnotallowed.Page1of33 BTFTestingLab(Shenzhen)Co.,Ltd. Plant101,201and301,Building1,Block2,TantouIndustrialPark,TantouCommunity,SonggangStreet,Bao'anDistrict,Shenzhen,Guangdon g,China Email:[email protected]:+86-755-23146130http://www.btf-lab.comVersion:1/00 RFTestReport For Applicantname:DongguanHuaxunPlasticTechnologyCo.,Ltd. Address: Room302,Building1,No.16FuminRoad,Tangli,FenggangTown, DongguanCity,GuangdongProvince,China EUTname:RVdoorlock Brandname:/ Modelnumber:W008 Seriesmodelnumber:/ FCCID: 2BPTI-W008 IssuedBy Companyname: BTFTestingLab(Shenzhen)Co.,Ltd. Address: Plant101,201and301,Building1,Block2,TantouIndustrialPark, TantouCommunity,SonggangStreet,Bao'anDistrict,Shenzhen, Guangdong,China Reportnumber: BTF260325R00201 Teststandards: FCCCFRTitle47Part15SubpartC( § 15.247) Testconclusion: Pass Dateofsamplereceipt: 2026-03-19 Testdate: 2026-03-19to2026-03-30 Dateofissue: 2026-04-02 Preparedby: Approvedby: Chris.Liu/ProjectengineerRyan.CJ/EMCmanager Note:Allthetestresultsinthisreportonlyrelatedtothetestingsamples.Whichcanbeduplicatedcompletelyforthelegalusewithapprovalof applicant;itshallnotbereproducedexceptinfullwithoutthewrittenapprovalofBTFTestingLab(Shenzhen)Co.,Ltd.,Alltheobjectionsshouldbe raisedwithinthirtydaysfromthedateofissue.Tovalidatethereport,youcancontactus. ReportNumber:BTF260325R00201 TotalorpartialreproductionofthisdocumentwithoutpermissionoftheLaboratoryisnotallowed.Page2of33 BTFTestingLab(Shenzhen)Co.,Ltd. Plant101,201and301,Building1,Block2,TantouIndustrialPark,TantouCommunity,SonggangStreet,Bao'anDistrict,Shenzhen,Guangdon g,China Email:[email protected]:+86-755-23146130http://www.btf-lab.comVersion:1/00 RevisionHistory VersionIssuedateRevisionscontent R_V02026-04-02Original ReportNumber:BTF260325R00201 TotalorpartialreproductionofthisdocumentwithoutpermissionoftheLaboratoryisnotallowed.Page3of33 BTFTestingLab(Shenzhen)Co.,Ltd. Plant101,201and301,Building1,Block2,TantouIndustrialPark,TantouCommunity,SonggangStreet,Bao'anDistrict,Shenzhen,Guangdon g,China Email:[email protected]:+86-755-23146130http://www.btf-lab.comVersion:1/00 TableofContents 1Introduction...........................................................................................................................................................4 1.1LaboratoryLocation....................................................................................................................................4 1.2LaboratoryFacility......................................................................................................................................4 1.3Announcement............................................................................................................................................4 2ProductInformation.............................................................................................................................................5 2.1ApplicationInformation...............................................................................................................................5 2.2ManufacturerInformation............................................................................................................................5 2.3FactoryInformation.....................................................................................................................................5 2.4GeneralDescriptionofEquipmentunderTest(EUT).................................................................................5 2.5TechnicalInformation.................................................................................................................................5 2.6ChannelList................................................................................................................................................6 3TestInformation....................................................................................................................................................7 3.1TestStandards............................................................................................................................................7 3.2SummaryofTest.........................................................................................................................................7 3.3UncertaintyofTest......................................................................................................................................7 3.4Additionsto,deviations,orexclusionsfromthemethod............................................................................8 3.5TestAuxiliaryEquipment............................................................................................................................8 3.6TestEquipmentList....................................................................................................................................8 4TestConfiguration..............................................................................................................................................10 4.1EnvironmentCondition.............................................................................................................................10 4.2Testmode.................................................................................................................................................10 4.3TestChannelofEUT................................................................................................................................10 4.4Testsoftware............................................................................................................................................10 4.5Testprocedure..........................................................................................................................................11 4.6TestSetupBlock...................................................................................…

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承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： WAN2012F245C04 規格 DESCRIPTION ： Chip Antenna 2012 L Ant 2.45G Type 04 版本 VERSION ： V1.7 日期 ISSUE DATE ： 2022/03/08 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray Tennyson Snow 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112台北市北投區立功街151號1樓 1F, No. 151, Li Gong Street, Beitou District, Taipei City 112, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 2/11 ONEWAVE TECHNOLOGY CO., LTD. 2012 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 2.05 ± 0.20 W 1.23 ± 0.20 T 0.45 ± 0.20 P/N: WAN2012F245C04 3/11 ONEWAVE TECHNOLOGY CO., LTD. Part Number Information WAN 2012 F 245 C 04 A B C D E F A Product Series Antenna B Dimension L x W 2.05X1.23mm ( ± 0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode PIFA & Single Feeding F Antenna type Type = 04 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN2012F245C04 Central Frequency 2450 MHz Bandwidth 85 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 1.72 dBi Impedance 50 Ohm Operating Temperature -40～+110 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) 4/11 ONEWAVE TECHNOLOGY CO., LTD. 2. Recommended PCB Pattern Evaluation Board Dimension (board size 80x40mm) 2 nd Evaluation Board Dimension Evaluation Board Dimension (board size 80x40mm) Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感±0.1~0.3nH、電容±0.1pF 1.0pF 5/11 ONEWAVE TECHNOLOGY CO., LTD. Layout Dimensions in Clearance area( Size=3.0*5.0mm) FootPrint (Unit : mm) ◆ 2 nd Layout Dimensions in Clearance area( Size=8.0*2.5mm) Matching circuit Tuning Component Matching circuit Tuning Compon ent 6/11 ONEWAVE TECHNOLOGY CO., LTD. 3. Measurement Results Return Loss 7/11 ONEWAVE TECHNOLOGY CO., LTD. Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 63.12 % 1.62 dBi 3.61 dBi 2450MHz 70.56 % 1.72 dBi 3.23 dBi 2500MHz 65.48 % 1.64 dBi 3.47 dBi Chamber Coordinate System Z Y X 8/11 ONEWAVE TECHNOLOGY CO., LTD. 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10 ± 0.5 sec. 60 sec . . T E M P ( °C ) 150 °C 2 6 0 °C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C 9/11 ONEWAVE TECHNOLOGY CO., LTD. 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 10/11 ONEWAVE TECHNOLOGY CO., LTD. 6.Packaging Information Tape Specification: Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 13.5±0.5 178±2 3000 11/11 ONEWAVE TECHNOLOGY CO., LTD. 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal elect…

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Report Number: BTF260325R00201 Total or partial reproduction of this document without permission of the Laboratory is not allowed. Page 1 of 20 BTF Testing Lab (Shenzhen) Co., Ltd. Plant 101, 201 and 301, Building 1, Block 2, Tantou Industrial Park, Tantou Community, Songgang Street, Bao'an District, Shenzhen, Guangdong, China Email: [email protected] Tel: +86-755-23146130 http://www.btf-lab.com Version: 1/00 Appendix - BLE 1. Duty Cycle 1.1 Test Result Ant1 Mode TX Type Frequency (MHz) T_on (ms) Period (ms) Duty Cycle (%) Duty Cycle Correction Factor (dB) Max. DC Variation (%) 1M SISO 2402 100.000 100.000 100.00 0.00 0.00 2440 100.000 100.000 100.00 0.00 0.00 2480 100.000 100.000 100.00 0.00 0.00 Report Number: BTF260325R00201 Total or partial reproduction of this document without permission of the Laboratory is not allowed. Page 2 of 20 BTF Testing Lab (Shenzhen) Co., Ltd. Plant 101, 201 and 301, Building 1, Block 2, Tantou Industrial Park, Tantou Community, Songgang Street, Bao'an District, Shenzhen, Guangdong, China Email: [email protected] Tel: +86-755-23146130 http://www.btf-lab.com Version: 1/00 1.2 Test Graph 1M_LCH_2402MHz_Ant1_NTNV 1M_MCH_2440MHz_Ant1_NTNV Report Number: BTF260325R00201 Total or partial reproduction of this document without permission of the Laboratory is not allowed. Page 3 of 20 BTF Testing Lab (Shenzhen) Co., Ltd. Plant 101, 201 and 301, Building 1, Block 2, Tantou Industrial Park, Tantou Community, Songgang Street, Bao'an District, Shenzhen, Guangdong, China Email: [email protected] Tel: +86-755-23146130 http://www.btf-lab.com Version: 1/00 1M_HCH_2480MHz_Ant1_NTNV Report Number: BTF260325R00201 Total or partial reproduction of this document without permission of the Laboratory is not allowed. Page 4 of 20 BTF Testing Lab (Shenzhen) Co., Ltd. Plant 101, 201 and 301, Building 1, Block 2, Tantou Industrial Park, Tantou Community, Songgang Street, Bao'an District, Shenzhen, Guangdong, China Email: [email protected] Tel: +86-755-23146130 http://www.btf-lab.com Version: 1/00 2. Bandwidth 2.1 Test Result 2.1.1 OBW Mode TX Type Frequency (MHz) ANT 99% Occupied Bandwidth (MHz) Verdict Result Limit 1M SISO 2402 1 1.088 / Pass 2440 1 1.101 / Pass 2480 1 1.098 / Pass 2.1.2 6dB BW Mode TX Type Frequency (MHz) ANT 6dB Bandwidth (MHz) Verdict Result Limit 1M SISO 2402 1 0.667 >=0.5 Pass 2440 1 0.681 >=0.5 Pass 2480 1 0.677 >=0.5 Pass Report Number: BTF260325R00201 Total or partial reproduction of this document without permission of the Laboratory is not allowed. Page 5 of 20 BTF Testing Lab (Shenzhen) Co., Ltd. Plant 101, 201 and 301, Building 1, Block 2, Tantou Industrial Park, Tantou Community, Songgang Street, Bao'an District, Shenzhen, Guangdong, China Email: [email protected] Tel: +86-755-23146130 http://www.btf-lab.com Version: 1/00 2.2 Test Graph 2.2.1 OBW 1M_LCH_2402MHz_Ant1_NTNV 1M_MCH_2440MHz_Ant1_NTNV Report Number: BTF260325R00201 Total or partial reproduction of this document without permission of the Laboratory is not allowed. Page 6 of 20 BTF Testing Lab (Shenzhen) Co., Ltd. Plant 101, 201 and 301, Building 1, Block 2, Tantou Industrial Park, Tantou Community, Songgang Street, Bao'an District, Shenzhen, Guangdong, China Email: [email protected] Tel: +86-755-23146130 http://www.btf-lab.com Version: 1/00 1M_HCH_2480MHz_Ant1_NTNV Report Number: BTF260325R00201 Total or partial reproduction of this document without permission of the Laboratory is not allowed. Page 7 of 20 BTF Testing Lab (Shenzhen) Co., Ltd. Plant 101, 201 and 301, Building 1, Block 2, Tantou Industrial Park, Tantou Community, Songgang Street, Bao'an District, Shenzhen, Guangdong, China Email: [email protected] Tel: +86-755-23146130 http://www.btf-lab.com Version: 1/00 2.2.2 6dB BW 1M_LCH_2402MHz_Ant1_NTNV 1M_MCH_2440MHz_Ant1_NTNV Report Number: BTF260325R00201 Total or partial reproduction of this document without permission of the Laboratory is not allowed. Page 8 of 20 BTF Testing Lab (Shenzhen) Co., Ltd. Plant 101, 201 and 301, Building 1, Block 2, Tantou Industrial Park, Tantou Community, Songgang Street, Bao'an District, Shenzhen, Guangdong, China Email: [email protected] Tel: +86-755-23146130 http://www.btf-lab.com Version: 1/00 1M_HCH_2480MHz_Ant1_NTNV Report Number: BTF260325R00201 Total or partial reproduction of this document without permission of the Laboratory is not allowed. Page 9 of 20 BTF Testing Lab (Shenzhen) Co., Ltd. Plant 101, 201 and 301, Building 1, Block 2, Tantou Industrial Park, Tantou Community, Songgang Street, Bao'an District, Shenzhen, Guangdong, China Email: [email protected] Tel: +86-755-23146130 http://www.btf-lab.com Version: 1/00 3. Maximum Conducted Output Power 3.1 Test Result Mode TX Type Frequency (MHz) Maximum Peak Conducted Output Power (dBm) Verdic…

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