2BSSW-L20MICRO CAM

ShenzhenFulaifuElectronicTechnologyCO.,Ltd. 601,BuildingD,ZoneC,ShangxueTechnologyIndustrialCity,XinxueCommunity,BantianStreet, LonggangDistrict,Shenzhen U.S.AgentLetterofAttestation To:FederalCommunicationsCommission 7435OaklandMillsRoad,Columbia,MD21046,USA Date:Jan.12,26 Ref:AttestationStatement–Part2.911(d)(7)filing FCCID:2BSSW-L20 ShenzhenFulaifuElectronicTechnologyCO.,Ltd.(“theapplicant”)certifiesthat,asofthedateof thefilingoftheapplication,[LOBOSIOWAINC](“theagent”)isourdesignatedU.S.agentfor serviceofprocessfortheabovereferenceFCCID.Theapplicantacceptstomaintainanagentfor serviceofprocessintheUnitedStatesfornolessthanoneyearaftereitherthegranteehas permanentlyterminatedallmarketingandimportationoftheapplicableequipmentwithintheU.S., ortheconclusionofanyCommission-relatedadministrativeorjudicialproceedinginvolvingthe equipment,whicheverislater.Theapplicantfurtheracknowledgesitisourresponsibilitytoinform theFCCwhenevertheagentinformationchanges. [LOBOSIOWAINC]("theagent)understanditistheagent'sobligationtoacceptserviceofprocess intheUnitedStatesformattersrelatedtotheapplicableequipment,andatthephysicalU.S. addressandemailaddress. DesignatedU.S.Agent CompanyName:LOBOSIOWAINC FRN:0036413961 Address:4623BittercreekDrColoradoSpringsco 80922Us Signature: ContactPerson:HarleyLi Tel:(818)818-0538Email:[email protected] Applicant CompanyName:ShenzhenFulaifuElectronicTechnologyCO.,Ltd. Address:601,BuildingD,ZoneC,Shangxue TechnologyIndustrialCity,XinxueCommunity, BantianStreet,LonggangDistrict,Shenzhen Signature: ContactPerson:XibiaoChen FRN:0037614062 Tel:13662281799Email:[email protected]

ShenzhenFulaifuElectronicTechnologyCO.,Ltd. 601,BuildingD,ZoneC,ShangxueTechnologyIndustrialCity,XinxueCommunity,BantianStreet, LonggangDistrict,Shenzhen AttestationStatements NotCoveredEntityApplicant&NotCoveredEquipment To:FederalCommunicationsCommissionDate:Jan.7,26 7435OaklandMillsRoad, Columbia,MD21046,USA Ref:InformationRequiredbySection2.911(d)(5)(i)&(ii) FCCID:2BSSW-L20 ShenzhenFulaifuElectronicTechnologyCO.,Ltd.(“theapplicant”)certifiesthat,asofthedateofthe filingoftheapplication,theapplicantisnotidentifiedontheCoveredList,establishedpursuantto§ 1.50002ofreferencechapter,asanentityproducing“covered”communicationequipment.The equipmentforwhichauthorizationissoughtisnot“covered”telecommunicationsequipmentandvideo surveillanceequipmentproducedbyentitiesidentifiedontheCommission’sCoveredListthatprohibited fromreceivinganequipmentauthorizationpursuanttosection§2.903oftheFCCrules. Sincerelyyours, ApplicantSignature PrintedName:XibiaoChen Title:Manager Address:601,BuildingD,ZoneC,ShangxueTechnologyIndustrialCity,XinxueCommunity,BantianStreet, LonggangDistrict,Shenzhen Tel.:13662281799 Email:[email protected]

ShenzhenFulaifuElectronicTechnologyCO.,Ltd. 601,BuildingD,ZoneC,ShangxueTechnologyIndustrialCity,XinxueCommunity,BantianStreet, LonggangDistrict,Shenzhen 1|Page AttestationStatements To:FederalCommunicationsCommissionDate:Jan.7,26 7435OaklandMillsRoad, Columbia,MD21046,USA Subject:AttestationofCompliancewithFCCCoveredListSoftwareRequirements FCCID:[2BSSW-L20] ProductName:[MICROCAM] Thisletterservesasanattestationthattheequipmentidentifiedabove☐is/☒isnot(selectone)"covered" softwareasdefinedundertheFederalCommunicationsCommission(FCC)CoveredListrequirements,as outlinedinFCC22-84andKDB986446. Specifically,theundersignedcertifiesthattheequipmentforwhichauthorizationissought: 1.Doesnotcontaincybersecurityoranti-virussoftwareproducedorprovidedbyKasperskyLab, Inc.oranyofitssuccessors,assignees,parents,subsidiaries,affiliates,oranyentitythathasrebranded orrelabeledsoftwareproducedbytheaforementionedentities. 2.Doesnothavethecapabilitytostore,run,ordeliveranysoftwareidentifiedontheFCCCoveredList, includingbutnotlimitedtocybersecurityandanti-virussoftware. Tosupportthisattestation,theappendixevaluationdocumentationhasbeenpreparedandisincludedinthe certificationfiling. Thisattestationisbasedonathoroughevaluationofthedevice'sdesign,functionality,andsoftware environment.Theundersignedaffirmsthattheinformationprovidedisaccurateandcompletetothebestof theirknowledge. Sincerelyyours, ApplicantSignature PrintedName:XibiaoChen Title:Manager Address:601,BuildingD,ZoneC,ShangxueTechnologyIndustrialCity,XinxueCommunity,BantianStreet, LonggangDistrict,Shenzhen Tel.:13662281799 Email:[email protected] ShenzhenFulaifuElectronicTechnologyCO.,Ltd. 601,BuildingD,ZoneC,ShangxueTechnologyIndustrialCity,XinxueCommunity,BantianStreet, LonggangDistrict,Shenzhen 2|Page EvaluationregardingtotheCoveredListSoftware: Compliance Methodology EvaluationProcessResults Deviceis Inherent compliance ☒ TheChipset(s)usedislimitedtorun theCybersecurityoranti-virus software. Compliance ☒ TheMemoryusedislimitedtorunthe Cybersecurityoranti-virussoftware. Compliance ☒ Thereisstoragecapacitylimitationfor storeorinstalltheCybersecurityor anti-virussoftware. Compliance ☒ Operatingsystemusedislimitedto run,installordelivertheCybersecurity oranti-virussoftware. Compliance Deviceisnot Inherent compliance ☐ EvaluationBasedonSoftware BillofMaterials(SBoM) ☐ EvaluationBasedonScanfor Softwareonthedevice ☐ EvaluationBasedonFilesystemscan ☐ EvaluationBasedonRunning softwarecheck

ShenzhenFulaifuElectronicTechnologyCO.,Ltd. 601,BuildingD,ZoneC,ShangxueTechnologyIndustrialCity,XinxueCommunity,Bantian Street,LonggangDistrict,Shenzhen 1/7/2026 FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 Subject:ConfidentialityRequestfor:FCCID:2BSSW-L20 PursuanttoSections0.457and0.459oftheCommission’sRules,weherebyrequestpermanent confidentialtreatmentoftheexhibitsaccompanyingthiscertificationapplicationasoutlinedbelow: BlockDiagram  Schematics OperationalDescription Theaboveexhibitscontaintradesecretsand/orproprietaryinformationthatarenotpubliclyavailableand materialsthattheApplicanthasspentconsiderableeffortsindeveloping.Publicdisclosureofthesemay beharmfultotheApplicantandgiveanunfairadvantagetocompetitorsonthemarket. Sincerely, (Signature) PrintedName:XibiaoChen Title:Manager Address:601,BuildingD,ZoneC,ShangxueTechnologyIndustrialCity,XinxueCommunity,Bantian Street,LonggangDistrict,Shenzhen Tel.:13662281799 Email:[email protected]

ShenzhenFulaifuElectronicTechnologyCO.,Ltd. 601,BuildingD,ZoneC,ShangxueTechnologyIndustrialCity,XinxueCommunity,Bantian Street,LonggangDistrict,Shenzhen Date:Jan.7,26 FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 Subject:AgentAuthorizationforFCCID:2BSSW-L20 I,theundersigned,herebyauthorize(CTSLTesting(Dongguan）Co.,Ltd.)toactonourbehalfinall mattersrelatingtothisapplicationforequipmentcertification. Anyactcarriedoutby(CTSLTesting(Dongguan）Co.,Ltd.)shallhavethesameeffectasourownandI acknowledgethatallresponsibilityforcomplyingwiththetermsandconditionsofcertification,as specifiedbyDERYCOMCERTIFICATIONSERVICES,INC.,stillresideswith(ShenzhenFulaifu ElectronicTechnologyCO.,Ltd.). WecertifythatwearenotsubjecttoadenialoffederalbenefitsthatincludesFCCbenefitspursuantto Section5301oftheAnti-DrugAbuseActof1988,21U.S.C.§862,andthatnopartytotheapplication,as definedin47CFR§1.2002(b),issubjecttoadenialoffederalbenefitsthatincludesFCCbenefits pursuanttothatsection. Sincerely, ApplicantSignature: PrintedName:XibiaoChen Title:Manager Address:601,BuildingD,ZoneC,ShangxueTechnologyIndustrialCity,XinxueCommunity,Bantian Street,LonggangDistrict,Shenzhen Tel.:13662281799 Email:[email protected]

Page1of4 CTSLTesting(Dongguan)Co.,Ltd. ReportNo.:CTSL2521220072ER AnnexA. EUTExternalPhotos FCCID:2BSSW-L20 Room112,Building1,No.15,Jiaoyuansongshan,HetianVilltage,HoujieTown,DongguanCity,Guangdong,China. Tel:0769-86009597E-mail:[email protected]://www.ctsl-lab.com AnnexA. EUTExternalPhotos Photo1ExternalphotosofEUT Photo2ExternalphotosofEUT Page2of4 CTSLTesting(Dongguan)Co.,Ltd. ReportNo.:CTSL2521220072ER AnnexA. EUTExternalPhotos FCCID:2BSSW-L20 Room112,Building1,No.15,Jiaoyuansongshan,HetianVilltage,HoujieTown,DongguanCity,Guangdong,China. Tel:0769-86009597E-mail:[email protected]://www.ctsl-lab.com Photo3ExternalphotosofEUT Photo4ExternalphotosofEUT Page3of4 CTSLTesting(Dongguan)Co.,Ltd. ReportNo.:CTSL2521220072ER AnnexA. EUTExternalPhotos FCCID:2BSSW-L20 Room112,Building1,No.15,Jiaoyuansongshan,HetianVilltage,HoujieTown,DongguanCity,Guangdong,China. Tel:0769-86009597E-mail:[email protected]://www.ctsl-lab.com Photo5ExternalphotosofEUT Photo6ExternalphotosofEUT Page4of4 CTSLTesting(Dongguan)Co.,Ltd. ReportNo.:CTSL2521220072ER AnnexA. EUTExternalPhotos FCCID:2BSSW-L20 Room112,Building1,No.15,Jiaoyuansongshan,HetianVilltage,HoujieTown,DongguanCity,Guangdong,China. Tel:0769-86009597E-mail:[email protected]://www.ctsl-lab.com Photo7ExternalphotosofEUT ------------------------------------------EndofEUTExternalPhotos------------------------------------------

LabelandLabelLocation FCCID:2BSSW-L20 L*W:10mm*5mm labelandWhitefont

Page1of2 CTSLTesting(Dongguan)Co.,Ltd. ReportNo.:CTSL2521220072ER AnnexB. EUTInternalPhotos FCCID:2BSSW-L20 Room112,Building1,No.15,Jiaoyuansongshan,HetianVilltage,HoujieTown,DongguanCity,Guangdong,China. Tel:0769-86009597E-mail:[email protected]://www.ctsl-lab.com AnnexB. EUTInternalPhotos Photo1InternalphotosofEUT Photo2InternalphotosofEUT Antennaposition Page2of2 CTSLTesting(Dongguan)Co.,Ltd. ReportNo.:CTSL2521220072ER AnnexB. EUTInternalPhotos FCCID:2BSSW-L20 Room112,Building1,No.15,Jiaoyuansongshan,HetianVilltage,HoujieTown,DongguanCity,Guangdong,China. Tel:0769-86009597E-mail:[email protected]://www.ctsl-lab.com Photo3InternalphotosofEUT Photo4InternalphotosofEUT ------------------------------------------EndofEUTInternalPhotos------------------------------------------

Page1of1 CTSLTesting(Dongguan)Co.,Ltd. ReportNo.:CTSL2521220072ER RFExposure Evaluation FCCID:2BSSW-L20 Room112,Building1,No.15,Jiaoyuansongshan,HetianVilltage,HoujieTown,DongguanCity,Guangdong,China. Tel:0769-86009597E-mail:[email protected]://www.ctsl-lab.com RFExposureEvaluation 1.CalculatedResultandLimit EUTDescription:MICROCAM ModelNo.:L20 FCCID:2BSSW-L20 Equipmenttype:PortableDevice TestProcedure AccordingtoKDB447498D01GeneralRFExposureGuidancev06and2.1093 The1-gand10-gSARtestexclusionthresholdsfor100MHzto6GHzattestseparationdistances ≤50mmaredeterminedby: [(max.powerofchannel,includingtune-uptolerance,mW)/ (min.testseparationdistance,mm)]·[√f(GHz)]≤3.0for1-gSARand≤7.5for10-gextremity SAR, Wheref(GHz)istheRFchanneltransmitfrequencyinGHz PoweranddistanceareroundedtothenearestmWandmmbeforecalculationTheresultis roundedtoonedecimalplaceforcomparison Thetestexclusionsareapplicableonlywhentheminimumtestseparation distanceis≤50mmandfortransmissionfrequenciesbetween100MHzand6GHz.Whenthe minimumtestseparationdistanceis<5mm,adistanceof5mmisappliedtodetermineSARtest exclusion. TestResultofRFExposureEvaluation Conclusion:So,SARtestisnotrequired --------------------------------------EndofRFExposureEvaluation-------------------------------------- ModulationOutput power （dBm） Output power (mW) Antenn a Gain (dBi) Result calculation SAR Exclusion threshold SAR Test exclusion 802.11b 3.992.50613.50.7825 3.0Yes 802.11g3.942.47743.50.77753.0Yes 802.11n(20M Hz) 3.522.24913.50.7022 3.0Yes

2.4GHz3216ChipAntenna:3216F245M02 第 1 页共 10 页 TEL:1353057660 咏成國際科技有限公司 電話:13530576606 RAIN International Technology Co., Ltd. 6 3216Chipantenna ForBluetooth/WLANApplicationsd P/N:RANT3216F245M02 Dimension(mm) L3.23±0.20 W1.66±0.20 T1.23±0.20 Address: 7th Floor, Building A, Ruitai Science and Technology Park, Guwu District, Shenzhen City 2.4GHz3216ChipAntenna:3216F245M02 第 2 页共 10 页 咏成國際科技有限公司電話:13530576606 RAINInternationalTechnologyCo.,Ltd.TEL:13530576606 PartNumberInformation RANT3216F245M02 ABCDEF A ProductSeriesAntenna BDimensionLxW3.2X1.6mm(+-0.2mm) CMaterialHighKmaterial D WorkingFrequency2.4~2.5GHz E FeedingmodeMonopole&SingleFeeding F AntennatypeType=02 1.ElectricalSpecification Specification PartNumberRANT3216F245M02 CentralFrequency2450MHz Bandwidth100(Min.)MHz ReturnLoss-6.5(Max)dB PeakGaindB3.5i Impedance50Ohm OperatingTemperature -40～+85°C MaximumPower4W ResistancetoSolderingHeats 10(@260 °C ) sec. PolarizationLinear AzimuthBeamwidthOmni-directional TerminationCu/Sn(Leadless) Remark:Bandwidth&PeakGainwasmeasuredunderevaluationboardofnextpage 2.4GHz3216ChipAntenna:3216F245M02 第 3 页共 10 页 咏成國際科技有限公司電話:13530576606 RAINInternationalTechnologyCo.,Ltd.TEL:13530576606 2.RecommendedPCBPattern EvaluationBoardDimension Unit:mm SuggestedMatchingCircuit 2.4GHz3216ChipAntenna:3216F245M02 第 4 页共 10 页 咏成國際科技有限公司電話:13530576606 RAINInternationalTechnologyCo.,Ltd.TEL:13530576606 LayoutDimensionsinClearancearea ( Size=5.2*5.0mm ) 50ohmtransmissionLine MatchingCircuit FootPrint(Unit:mm) 2.4GHz3216ChipAntenna:3216F245M02 第 5 页共 10 页 咏成國際科技有限公司電話:13530576606 RAINInternationalTechnologyCo.,Ltd.TEL:13530576606 3.MeasurementResults ReturnLoss 2.4GHz3216ChipAntenna:3216F245M02 第 6 页共 10 页 咏成國際科技有限公司電話:13530576606 RAINInternationalTechnologyCo.,Ltd.TEL:13530576606 RadiationPattern Y X Z 2.4GHz3216ChipAntenna:3216F245M02 第 7 页共 10 页 咏成國際科技有限公司電話:13530576606 RAINInternationalTechnologyCo.,Ltd.TEL:13530576606 4.ReliabilityandTestCondictions ITEMREQUIREMENTSTESTCONDITION Solderability1.Wettingshallexceed90%coverage 2.Novisiblemechanicaldamage TEMP(°C) 230°C 4±1sec. 150 °C 60sec Pre-heatingtemperature:150°C/60sec. Soldertemperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Fluxforleadfree:rosin Solderheat Resistance 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% TEMP(°C) 260°C 10±0.5sec. 150°C 60sec Pre-heatingtemperature:150°C/60sec. Soldertemperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Fluxforleadfree:rosin Component Adhesion (Pushtest) 1.Novisiblemechanicaldamage Thedeviceshouldbereflow soldered(230±5°Cfor10sec.)toatinned coppersubstrateAdynometerforce gaugeshouldbeappliedthesideofthe component.Thedevicemustwith-ST-F 0.5Kgwithoutfailureofthetermination attachedtocomponent. Component Adhesion (Pulltest) 1.Novisiblemechanicaldamage Insert10cmwireintotheremainingopen eyebend,theendsofevenwirelengths upwardandwindtogether. Terminalshallnotberemarkably damaged. 2.4GHz3216ChipAntenna:3216F245M02 第 8 页共 10 页 咏成國際科技有限公司電話:13530576606 RAINInternationalTechnologyCo.,Ltd.TEL:13530576606 Thermalshock 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% Phase Temperature( °C ) Time(min) 1 +85±5°C 30±3 2 RoomWithin Temperature3sec 3 -40±2 °C 30±3 4 RoomWithin Temperature3sec +85 °C =>30±3min -40 °C =>30±3min Testcycle:10cycles Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. Resistanceto High Temperature 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 3.Nodisconnectionorshortcircuit. Temperature:85±5 °C Duration:1000±12hrs Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. Resistanceto Low Temperature 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 3.Nodisconnectionorshortcircuit. Temperature:-40±5 °C Duration:1000±12hrs Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. Humidity 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 3.Nodisconnectionorshortcircuit. Temperature:40±2°C Humidity:90%to95%RH Duration:1000±12hrs Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. 5.SolderingandMounting Mildlyactivatedrosinfluxesarepreferred.Theminimumamountofsoldercan leadtodamagefromthestressescausedbythedifferenceincoefficientsof expansionbetweensolder,chipandsubstrate.Theterminationsaresuitable forallwaveandre-flowsolderingsystems.Ifhandsolderingcannotbe avoided,thepreferredtechniqueistheutilizationofhotairsolderingtools. ReflowSoldering PRE-HEATING 250~260 230 180 150 SOLDERING 10smax. NATURAL COOLING IronSoldering PRE-HEATINGSOLDERINGNATURAL COOLING 60~120s30~60s TIME(sec.) TIME(sec.) Recommendedtemperatureprofilesforre-flowsolderinginFigure1. Productsattachmentwithasolderingironisdiscouragedduetotheinherent processcontrollimitations.Intheeventthatasolderingironmustbe employedthefollowingprecautionsarerecommended. within3s 350 150 Over60s Gradualcooling 300 T E M P E R A T U R E ( ° C ) T E M P E R A T U R E ( ° C ) 2.4GHz3216ChipAntenna:3216F245M02 第 9 页共 10 页 咏成國際科技有限公司電話:13530576606 RAINInternationalTechnologyCo.,Ltd.TEL:13530576606 1.593.511.80 ‧Preheatcircuitandproductsto150°C ‧Nevercontacttheceramicwiththeirontip ‧Usea20wattsolderingironwithtipdiameterof1.0mm ‧280°Ctiptemperature(max) ‧1.0mmtipdiameter(max) ‧Limitsolderingtimeto3sec. 6.PackagingInformation TapeSpecification: ReelSpecification:(7’’,Φ180mm) 2.4GHz3216ChipAntenna:3216F245M02 第 10 页共 10 页 咏成國際科技有限公司電話:13530576606 RAINInternationalTechnologyCo.,Ltd.TEL:13530576606 TapeWidth(mm)A(mm)B(mm)C(mm)D(mm)Chip/Reel(pcs) 89.0±0.560±213.5±0.5178±23000 7.StorageandTransportationInformation StorageConditions Tomaintainthesolderabilityofterminalelectrodes: 1.Temperatureandhumidityconditions:-10~40°Cand30~70%RH. 2.Recommendedproductsshouldbeusedwithin6monthsfromthetimeof delivery. 3.Thepackagingmaterialshouldbekeptwherenochlorineorsulfurexists intheair. TransportationConditions 1.Productsshouldbehandledwithcaretoavoiddamageorcontamination fromperspirationandskinoils. 2.Theuseoftweezersorvacuumpickupisstronglyrecommended…

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Page1of55 FCCPART15SUBPARTC FCCPART15.247 TESTREPORT FCCID:2BSSW-L20 ReportNo:CTSL2521220072ER ProductName:MICROCAM MainTestModel:L20 SeriesModels:N/A Applicant:ShenzhenFulaifuElectronicTechnologyCO.,Ltd. EXECUTIVESUMMARY Asampleofthisproductwastestedandfoundtobeincompliancewith FCCPART15SUBPARTC(15.247). Anyreproductionofthisdocumentmustbedoneinfull.Nosinglepartofthisdocument maybereproducedwithoutpermissionfromCTSL;AllTestDataPresentedinthisreport isonlyapplicabletopresentedTestsample. CTSLTesting(Dongguan)Co.,Ltd. Maincompanyaddress:HexingBuilding,HoujieAvenue,HoujieRoadHoujieTown, GuangdongProvinceDongguanCity,People’sRepublicofChina Page2of55 CTSLTesting(Dongguan)Co.,Ltd. ReportNo.:CTSL2521220072ER Room112,Building1,No.15,Jiaoyuansongshan,HetianVilltage,HoujieTown,DongguanCity,Guangdong,China. Tel:0769-86009597E-mail:[email protected]://www.ctsl-lab.com TestReport FCCID:2BSSW-L20 Applicant Name ShenzhenFulaifuElectronicTechnologyCO.,Ltd. Applicant Address 601,BuildingD,ZoneC,ShangxueTechnologyIndustrialCity,Xinxue Community,BantianStreet,LonggangDistrict,Shenzhen Manufacturer Name ShenzhenFulaifuElectronicTechnologyCO.,Ltd. Manufacturer Address 601,BuildingD,ZoneC,ShangxueTechnologyIndustrialCity,Xinxue Community,BantianStreet,LonggangDistrict,Shenzhen TradeMarkN/A ProductnameMICROCAM MainTest Model L20 SeriesModelsN/A Standard FCCPart15SubpartC(15.247) ANSIC63.10:2020 FCCKDB558074D0115.247MeasGuidancev05r02 TestLocation ISO/IEC17025byILAC-MRAisA2LA7556.01 CTSLTesting(Dongguan)Co.,Ltd. Room112,Building1,No.15,JiaoyuansongshanHetianVillage,HoujieTown DongguanCity,Guangdong,People’sRepublicofChina ReceiptDate2025.12.10Testperiod2025.12.10-2025.12.24IssueDate2025.12.24 Conclusion Theequipmentundertestwasfoundtobecompliancewiththe requirementsofthestandardsapplied. Performs Testing: EthanZhao TestReport Reviewer: SteveQin TestReport Authorizer: AlanLi Page3of55 CTSLTesting(Dongguan)Co.,Ltd. ReportNo.:CTSL2521220072ER Room112,Building1,No.15,Jiaoyuansongshan,HetianVilltage,HoujieTown,DongguanCity,Guangdong,China. Tel:0769-86009597E-mail:[email protected]://www.ctsl-lab.com TABLEOFCONTENTS DescriptionPage TESTREPORTVERIFICATION......................................................................................................................3 1.GENERALINFORMATION........................................................................................................................5 1.1.GeneralDescriptionofEUT(EquipmentUnderTest).......................................................................5 1.2.AntennaInformation................................................................................................................................6 1.3.InformationofRFCable..........................................................................................................................6 2.SUMMARYOFTEST................................................................................................................................7 2.1.TestStandards.........................................................................................................................................7 2.2.Summaryoftestresult............................................................................................................................7 2.3.TestFacilities............................................................................................................................................8 2.4.Measurementuncertainty.......................................................................................................................9 2.5.BlockDiagram........................................................................................................................................10 2.6.Assistantequipmentusedfortest.......................................................................................................10 2.7.Testmode...............................................................................................................................................11 2.8.ChannelList............................................................................................................................................12 2.9.PowerSettingofTestSoftware...........................................................................................................12 2.10.TestEquipment....................................................................................................................................13 3.6DBBANDWIDTH.............................................................................................................................15 3.1.Limit..........................................................................................................................................................15 3.2.TestSetup...............................................................................................................................................15 3.3.SpectrumAnalyzerSetting...................................................................................................................15 3.4.TestProcedure.......................................................................................................................................15 3.5.TestResult..............................................................................................................................................16 3.6.OriginalTestrecord...............................................................................................................................17 4.99%BANDWIDTH.................................................................................................................................19 4.1.Limit..........................................................................................................................................................19 4.2.TestSetup.......................................................................................…

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Page1of2 CTSLTesting(Dongguan)Co.,Ltd. ReportNo.:CTSL2521220072ER AnnexC. TestSetupPhotos FCCID:2BSSW-L20 Room112,Building1,No.15,Jiaoyuansongshan,HetianVilltage,HoujieTown,DongguanCity,Guangdong,China. Tel:0769-86009597E-mail:[email protected]://www.ctsl-lab.com AnnexC. TestSetupPhotos Photo1TestSetupPhotosofRadiatedEmissionTest(30-1000MHz) Photo2TestSetupPhotosofRadiatedEmissionTest(Above1GHz) Page2of2 CTSLTesting(Dongguan)Co.,Ltd. ReportNo.:CTSL2521220072ER AnnexC. TestSetupPhotos FCCID:2BSSW-L20 Room112,Building1,No.15,Jiaoyuansongshan,HetianVilltage,HoujieTown,DongguanCity,Guangdong,China. Tel:0769-86009597E-mail:[email protected]://www.ctsl-lab.com Photo3TestSetupPhotosofACPowerLineConductedEmissions ------------------------------------------EndofTestSetupPhotos------------------------------------------