2BSWM22402Bluetooth headphone

V01222025 Certification for Designating a U.S. Agent for Service of Process In compliance with section 2.911(d)(7), all applicants are required to appoint a U.S.-based contact to serve as their agent for service of process. This requirement applies to both domestic and foreign applicants. Entities located within the United States are permitted to designate themselves as their own agent for this purpose. Regardless of the applicant’s status, the designation of the U.S. agent must be included as an attachment to the equipment authorization application. The written certification must adhere to the following requirements: 1. It must bear the signatures of both the applicant and the designated U.S. agent for service of process, provided the agent is a separate entity from the applicant. 2. It must clearly state the applicant’s consent and confirm the agent’s obligation to accept service of process on the applicant’s behalf. 3. It must include a physical address and email address located in the United States for the designated agent. 4. It must acknowledge that the applicant will maintain the designated agent’s role for at least one year after ceasing all marketing and importation activities or upon the conclusion of any FCC-related proceedings involving the equipment. Key Details Regarding the U.S. Agent for Service of Process: ● The agent cannot be a Telecommunication Certification Body (TCB) or have affiliations with one (e.g., the agent cannot work for or be owned by a TCB or a related company). ● The agent must not be an FCC-recognized testing laboratory or have affiliations with one (e.g., the agent cannot work for or be owned by a test lab or a related company). ● The agent may be an individual or a company entity. ● The designated agent entity must have a physical U.S. address and phone number. ● It is recommended that the agent possess a Federal Registration Number (FRN), and including the FRN in the agent letter is considered best practice. ● The agent designation letter may be general for the grantee and is not required to be FCC ID-specific. If there is a change in the U.S. Agent for Service of Process for devices that are still being marketed or have ceased marketing for less than one year, the TCB must request the FCC to place the application in Audit Mode for every relevant TC Number. The updated agent letter will then need to supersede the previous version. Important Note: The role of the U.S. Agent for Service of Process should not be confused with the authorized agent responsible for signing the FCC Form 731, cover letters included in the application, or the agent who interacts directly with the TCB. Note for Attestation Letter: Print the attestation letter onto the manufacturer's corporate letterhead prior to submission. V01222025 Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 United States Date: 2025-12-04 Ref: Attestation Statement Part 2.911(d)(7) Filing FCC ID: 2BSWM22402 eldohm international limited certifies that, as of the dates of this application, Americas Compliance Consulting LLC dba iCertifi “iCertifi” is our designated U.S. agent for service of process for the above referenced FCC ID. eldohm international limited accepts to maintain an agent for no less than one year after the grantee has terminated all marketing and importation or the conclusion of any commission-related proceeding involving the equipment. iCertifi accepts, as of the date of the filing of the application, the obligation of the designated U.S. agent for service process for the above referenced FCC ID. Designated U.S. Agent Information: Name Americas Compliance consulting, LLC dba iCertifi FCC FRN 0033399411 Address 2445 NE Division Street, Suite 202 Bend, OR 97703 United States Contact Person Paul Preston Telephone +1-866-885-4575 Email [email protected] Sincerely, eldohm international limited Americas Compliance Consulting LLC dba iCertifi 0037625886 0033399411 calvin tang Paul Preston general manager President/CEO Signature Signature

eldohm international limited Date: 2025/11/24 To: Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Ref: Attestation Statements Part 2.911(d)(5)(i) and Part 2.911(d)(5)(ii) Filing Re. KDB 986446 D01 FCC ID: 2BSWM22402 Dear Sir or Madam, [eldohm international limited] (“the applicant”) certifies that the equipment for which authorization is sought is not “covered” equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. We also certify that, [eldohm international limited] (“the applicant”) certifies that, as of the date of the filing of the application, the applicant [ is not] identified on the Covered List ( as a specifically named entity or any of its subsidiaries or affiliates) as an entity producing “covered” equipment . If you have any questions, please contact us. Sincerely, Contact name: calvin tang Company name: eldohm international limited Address: rm.505, 5/f, tower A, new mandarin plaza, 14 science museum road, tst east, kowloon, Hong Kong E-mail: [email protected] Tel: 852-36158650

eldohm international limited Date (2025/11/24) TUV SUD BABT UNLIMITED TCB Octagon House, Segensworth North, Fareham, Hampshire, PO15 5RL, United Kingdom Confidentiality Request FCC ID: 2BSWM22402 Pursuant to Sections 0.457(d)(1)(ii) and 0.459 of the Commission’s Rules, eldohm international limited hereby requests permanent confidential treatment of information accompanying this application as outlined below: Schematics Bill of Materials/Parts List Block Diagrams Theory of Operation Anona Security Technology Limited. also hereby requests short-term confidential treatment of information accompanying this application as outlined below for a period of 180 days: Internal Photos External Photos User Manual Test Set-up Photographs The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to the Applicant and provide unjustified benefits to its competitors. The Applicant understands that pursuant to Rule 0.457(d)(1)(ii), disclosure of this Application and all accompanying materials will not be made before the date of the Grant for this Application. Yours sincerely, Company Officer: eldohm international limited Telephone Number: 852-36158650 Email: [email protected]

eldohm international limited Data: 2025-11-24 Subject: Statement of disabled BLE 1Mbps, BLE 2Mbps, BLE 125kbps and BLE 500kbps by software FCC ID: 2BSWM22402 To Whom It May Concern: We, eldohm international limited hereby declare that BLE 1Mbps, BLE 2Mbps, BLE 125kbps and BLE 500kbps are disabled by software in the factory, this setting is not accessible and can’t active by the user or any other third-party. Best Regards Contact name: calvin tang Company name: eldohm international limited Address: rm.505, 5/f, tower A, new mandarin plaza, 14 science museum road, tst east, kowloon, Hong Kong E-mail: [email protected] Tel: 852-36158650

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. MADE IN CHINAFCC ID: 2BSWM22402 USB input: 5V 1A (max) Battery: 3.7V 400mAh 22402/MX41H YYYYMMDD ELDOHM INTERNATIONAL LTD. Rm. 505, Tower A, New Mandarin Plaza T.S.T. East, Hong Kong [email protected] 10mm Maximum allowable logo size for laser engraving:10*25mm US version L R 25mm Batch code

Page1of12 RFExposureReport ReportNo.:AGC01662251006FH01 FCCID: 2BSWM22402 APPLICATIONPURPOSE: OriginalEquipment PRODUCTDESIGNATION:HybridActiveNoiseCancelingheadphones BRANDNAME:TheNextSoundbyTiësto MODELNAME:22402/MX41H APPLICANT:eldohminternationallimited DATEOFISSUE:Oct.29,2025 STANDARD(S): FCCPart2SubpartJ§2.1093 FCCKDB447498D01V06 REPORTVERSION:V1.0 AttestationofGlobalCompliance(Shenzhen)Co.,Ltd ReportNo.:AGC01662251006FH01 Page2of12 ReportReviseRecord ReportVersionReviseTimeIssuedDateValidVersionNotes V1.0/Oct.29,2025ValidInitialRelease ReportNo.:AGC01662251006FH01 Page3of12 TableofContents 1.GeneralInformation..........................................................................................................................................4 2.ProductInformation..........................................................................................................................................5 2.1ProductTechnicalDescription....................................................................................................................5 3.TestEnvironment..............................................................................................................................................6 3.1AddressOfTheTestLaboratory.................................................................................................................6 3.2TestFacility..................................................................................................................................................6 3.3EnvironmentalConditions...........................................................................................................................7 4.PortableDeviceEvaluationMethodandLimit..............................................................................................8 5.MobileDeviceEvaluationMethodandLimit.................................................................................................9 6.MeasurementResults.....................................................................................................................................10 7.MeasurementEvaluation...............................................................................................................................10 ReportNo.:AGC01662251006FH01 Page4of12 1.GeneralInformation Applicanteldohminternationallimited Address rm.505,5/f,towerA,newmandarinplaza,14sciencemuseumroad,tsteast, kowloon,HongKong Manufacturer eldohminternationallimited Address rm.505,5/f,towerA,newmandarinplaza,14sciencemuseumroad,tsteast, kowloon,HongKong Factory N/A Address N/A ProductDesignation HybridActiveNoiseCancelingheadphones BrandName TheNextSoundbyTiësto TestModel 22402/MX41H SeriesModel(s) N/A DifferenceDescription N/A Dateofreceiptoftestitem Oct.16,2025 DateofTest Oct.16,2025~Oct.24,2025 DeviationfromStandard Noanydeviationfromthetestmethod ConditionofTestSample Normal TestResult Pass TestReportFormNo AGCER-FCC-RFExposure-V1 Note:Thetestresultsofthisreportrelateonlytothetestedsampleidentifiedinthisreport. PreparedBy JasielXie (ProjectEngineer) Oct.29,2025 ReviewedBy JackGui (Reviewer) Oct.29,2025 ApprovedBy AngelaLi (AuthorizedOfficer) Oct.29,2025 ReportNo.:AGC01662251006FH01 Page5of12 2.ProductInformation 2.1ProductTechnicalDescription FrequencyBand(Operating) WLAN:2.412GHz~2.462GHz WLAN:5.18GHz~5.32GHz/5.50GHz~5.70GHz WLAN:5.745GHz~5.825GHz Bluetooth:2.402GHz~2.480GHz Other: HardwareVersionYF-6080-MIAN-V1.3 SoftwareVersion2025-08-11-16-58 ModulationTypeBT_BR_EDR:GFSK,EDRπ/4-DQPSK,8DPSK DeviceCategory Portable(<20cmseparation) Mobile(>20cmseparation) Others: AntennaDiversity Singleantenna Multipleantennas Txdiversity Rxdiversity Tx/Rxdiversity AntennaDesignationChipantenna AntennaGain2.71dBi MinimumAssessmentDistance5mm EvaluationApplied MPEEvaluation SAREvaluation ReportNo.:AGC01662251006FH01 Page6of12 3.TestEnvironment 3.1AddressOfTheTestLaboratory Laboratory:AttestationofGlobalCompliance(Shenzhen)Co.,Ltd. Address:1-2/F,Building19,JunfengIndustrialPark,ChongqingRoad,HepingCommunity,FuhaiStreet, Bao'anDistrict,Shenzhen,Guangdong,China 3.2TestFacility Thetestfacilityisrecognized,certified,oraccreditedbythefollowingorganizations: CNAS-LabCode:L5488 AttestationofGlobalCompliance(Shenzhen)Co.,Ltd.hasbeenassessedandprovedtofollowCNAS-CL01 AccreditationCriteriaforTestingandCalibrationLaboratories(identicaltoISO/IEC17025:2017General RequirementsfortheCompetenceofTestingandCalibrationLaboratories.) A2LA-LabCert.No.:5054.02 AttestationofGlobalCompliance(Shenzhen)Co.,Ltd.EMCLaboratoryhasbeenaccreditedbyA2LAfor technicalcompetenceinthefieldofelectricaltesting,andprovedtofollowISO/IEC17025:2017General RequirementsfortheCompetenceofTestingandCalibrationLaboratoriesandanyadditionalprogram requirementsintheidentifiedfieldoftesting. FCC-RegistrationNo.:975832 AttestationofGlobalCompliance(Shenzhen)Co.,Ltd.EMCLaboratoryhasbeenregisteredandfully describedinareportfiledwiththeFCC(FederalCommunicationsCommission).Theacceptanceletterfromthe FCCismaintainedinourfileswithRegistration975832. IC-RegistrationNo.:24842(CABidentifier:CN0063) AttestationofGlobalCompliance(Shenzhen)Co.,Ltd.EMCLaboratoryhasbeenregisteredandfully describedinareportfiledwiththeCertificationandEngineeringBureauofIndustryCanada.Theacceptance letterfromtheICismaintainedinourfileswithRegistration24842. ReportNo.:AGC01662251006FH01 Page7of12 3.3EnvironmentalConditions NormalConditions Temperaturerange(°C) 15-35 Relativehumidityrange 20%-75% Pressurerange(kPa) 86-106 PowersupplyDC3.7VbybatteryorDC5Vbyadapter ReportNo.:AGC01662251006FH01 Page8of12 4.PortableDeviceEvaluationMethodandLimit FollowingFCCKDB447498D01“GeneralSARtestexclusionguidance”ThecorrespondingSARExclusion Thresholdcondition,listedbelow:  The1-gand10-gSARtestexclusionthresholdsfor100MHzto6GHzattestseparationdistances≤50 mmaredeterminedby: [(max.powerofchannel,includingtune-uptolerance,mW)/(min.testseparationdistance,mm)][√ f(GHz)]≤3.0for1-gSAR,and≤7.5for10-gextremitySAR,where …

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2.4GHz3216ChipAntenna:3216F245M0 Shenzhen LITONGCHUANG Technology Co., Ltd. Bao'an District, Xixiang Subdistrict, Shenzhen City, Guangdong Province 2 第 1 页共 10 页 3216Chipantenna ForBluetooth/WLANApplicationsd P/N:RANT3216F245G2 Dimension(mm) L3.23±0.20 W1.66±0.20 T1.23±0.20 2.4GHz3216ChipAntenna:3216F245M02 第 2 页共 10 页 PartNumberInformation RANT3216F245G2 ABCDEF A ProductSeriesAntenna BDimensionLxW3.2X1.6mm(+-0.2mm) CMaterialHighKmaterial D WorkingFrequency2.4~2.5GHz E FeedingmodeMonopole&SingleFeeding F AntennatypeType=02 1.ElectricalSpecification Specification PartNumberRANT3216F245M02 CentralFrequency2450MHz Bandwidth100(Min.)MHz ReturnLoss-6.5(Max)dB PeakGaindB 2.71 i Impedance50Ohm OperatingTemperature -40～+85°C MaximumPower4W ResistancetoSolderingHeats 10(@260 °C ) sec. PolarizationLinear AzimuthBeamwidthOmni-directional TerminationCu/Sn(Leadless) Remark:Bandwidth&PeakGainwasmeasuredunderevaluationboardofnextpage Shenzhen LITONGCHUANG Technology Co., Ltd. Bao'an District, Xixiang Subdistrict, Shenzhen City, Guangdong Province 2.4GHz3216ChipAntenna:3216F245M02 第 3 页共 10 页 2.RecommendedPCBPattern EvaluationBoardDimension Unit:mm SuggestedMatchingCircuit Shenzhen LITONGCHUANG Technology Co., Ltd. Bao'an District, Xixiang Subdistrict, Shenzhen City, Guangdong Province 2.4GHz3216ChipAntenna:3216F245M02 第 4 页共 10 页 LayoutDimensionsinClearancearea ( Size=5.2*5.0mm ) 50ohmtransmissionLine MatchingCircuit FootPrint(Unit:mm) Shenzhen LITONGCHUANG Technology Co., Ltd. Bao'an District, Xixiang Subdistrict, Shenzhen City, Guangdong Province 2.4GHz3216ChipAntenna:3216F245M02 第 5 页共 10 页 3.MeasurementResults ReturnLoss Shenzhen LITONGCHUANG Technology Co., Ltd. Bao'an District, Xixiang Subdistrict, Shenzhen City, Guangdong Province 2.4GHz3216ChipAntenna:3216F245M02 第 6 页共 10 页 RadiationPattern Y X Z EfficiencyPeakGainDirectivity 2400MHz55.21%1.45dBi5.32dBi 2450MHz66.45%2.71dBi5.21dBi 2500MHz57.53%1.98dBi5.29dBi ChamberCoordinateSystem Shenzhen LITONGCHUANG Technology Co., Ltd. Bao'an District, Xixiang Subdistrict, Shenzhen City, Guangdong Province 2.4GHz3216ChipAntenna:3216F245M02 第 7 页共 10 页 4.ReliabilityandTestCondictions ITEMREQUIREMENTSTESTCONDITION Solderability1.Wettingshallexceed90%coverage 2.Novisiblemechanicaldamage TEMP(°C) 230°C 4±1sec. 150 °C 60sec Pre-heatingtemperature:150°C/60sec. Soldertemperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Fluxforleadfree:rosin Solderheat Resistance 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% TEMP(°C) 260°C 10±0.5sec. 150°C 60sec Pre-heatingtemperature:150°C/60sec. Soldertemperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Fluxforleadfree:rosin Component Adhesion (Pushtest) 1.Novisiblemechanicaldamage Thedeviceshouldbereflow soldered(230±5°Cfor10sec.)toatinned coppersubstrateAdynometerforce gaugeshouldbeappliedthesideofthe component.Thedevicemustwith-ST-F 0.5Kgwithoutfailureofthetermination attachedtocomponent. Component Adhesion (Pulltest) 1.Novisiblemechanicaldamage Insert10cmwireintotheremainingopen eyebend,theendsofevenwirelengths upwardandwindtogether. Terminalshallnotberemarkably damaged. Shenzhen LITONGCHUANG Technology Co., Ltd. Bao'an District, Xixiang Subdistrict, Shenzhen City, Guangdong Province 2.4GHz3216ChipAntenna:3216F245M02 第 8 页共 10 页 Thermalshock 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% Phase Temperature( °C ) Time(min) 1 +85±5°C 30±3 2 RoomWithin Temperature3sec 3 -40±2 °C 30±3 4 RoomWithin Temperature3sec +85 °C =>30±3min -40 °C =>30±3min Testcycle:10cycles Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. Resistanceto High Temperature 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 3.Nodisconnectionorshortcircuit. Temperature:85±5 °C Duration:1000±12hrs Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. Resistanceto Low Temperature 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 3.Nodisconnectionorshortcircuit. Temperature:-40±5 °C Duration:1000±12hrs Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. Humidity 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 3.Nodisconnectionorshortcircuit. Temperature:40±2°C Humidity:90%to95%RH Duration:1000±12hrs Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. 5.SolderingandMounting Mildlyactivatedrosinfluxesarepreferred.Theminimumamountofsoldercan leadtodamagefromthestressescausedbythedifferenceincoefficientsof expansionbetweensolder,chipandsubstrate.Theterminationsaresuitable forallwaveandre-flowsolderingsystems.Ifhandsolderingcannotbe avoided,thepreferredtechniqueistheutilizationofhotairsolderingtools. ReflowSoldering PRE-HEATING 250~260 230 180 150 SOLDERING 10smax. NATURAL COOLING IronSoldering PRE-HEATINGSOLDERINGNATURAL COOLING 60~120s30~60s TIME(sec.) TIME(sec.) Recommendedtemperatureprofilesforre-flowsolderinginFigure1. Productsattachmentwithasolderingironisdiscouragedduetotheinherent processcontrollimitations.Intheeventthatasolderingironmustbe employed the following precautiongs are recommended. within3s 350 150 Over60s Gradualcooling 300 T E M P E R A T U R E ( ° C ) T E M P E R A T U R E ( ° C ) Shenzhen LITONGCHUANG Technology Co., Ltd. Bao'an District, Xixiang Subdistrict, Shenzhen City, Guangdong Province 2.4GHz3216ChipAntenna:3216F245M02 第 9 页共 10 页 1.593.511.80 ‧Preheatcircuitandproductsto150°C ‧Nevercontacttheceramicwiththeirontip ‧Usea20wattsolderingironwithtipdiameterof1.0mm ‧280°Ctiptemperature(max) ‧1.0mmtipdiameter(max) ‧Limitsolderingtimeto3sec. 6.PackagingInformation TapeSpecification: ReelSpecification:(7’’,Φ180mm) Shenzhen LITONGCHUANG Technology Co., Ltd. Bao'an District, Xixiang Subdistrict, Shenzhen City, Guangdong Province 2.4GHz3216ChipAntenna:3216F245M02 第 10 页共 10 页 TapeWidth(mm)A(mm)B(mm)C(mm)D(mm)Chip/Reel(pcs) 89.0±0.560±213.5±0.5178±25000 7.StorageandTransportationInformation StorageConditions Tomaintainthesolderabilityofterminalelectrodes: 1.Temperatureandhumidityconditions:-10~40°Cand30~70%…

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Page 1 of 77 FCCTestReport ReportNo.:AGC01662251006FR01 FCCID: 2BSWM22402 APPLICATIONPURPOSE: OriginalEquipment PRODUCTDESIGNATION:HybridActiveNoiseCancelingheadphones BRANDNAME:TheNextSoundbyTiësto MODELNAME:22402/MX41H APPLICANT:eldohminternationallimited DATEOFISSUE:Oct.29,2025 STANDARD(S):FCCPart15SubpartC§15.247 REPORTVERSION:V1.0 AttestationofGlobalCompliance(Shenzhen)Co.,Ltd ReportNo.:AGC01662251006FR01 Page2of77 ReportReviseRecord ReportVersionReviseTimeIssuedDateValidVersionNotes V1.0/Oct.29,2025ValidInitialRelease ReportNo.:AGC01662251006FR01 Page3of77 TableofContents 1.GeneralInformation..........................................................................................................................................5 2.ProductInformation..........................................................................................................................................6 2.1ProductTechnicalDescription....................................................................................................................6 2.2TestFrequencyList.....................................................................................................................................6 2.3RelatedSubmittal(S)/Grant(S).................................................................................................................7 2.4TestMethodology........................................................................................................................................7 2.5ReceiverInputBandwidth...........................................................................................................................7 2.6EquallyAverageUseofFrequenciesandBehaviour................................................................................7 2.7PseudorandomFrequencyHoppingSequence.........................................................................................8 2.8SpecialAccessories....................................................................................................................................9 2.9EquipmentModifications.............................................................................................................................9 2.10AntennaRequirement...............................................................................................................................9 3.TestEnvironment............................................................................................................................................10 3.1AddressofTheTestLaboratory................................................................................................................10 3.2TestFacility................................................................................................................................................10 3.3EnvironmentalConditions.........................................................................................................................11 3.4MeasurementUncertainty.........................................................................................................................11 3.5ListofEquipmentUsed.............................................................................................................................12 4.SystemTestConfiguration.............................................................................................................................13 4.1EUTConfiguration....................................................................................................................................13 4.2EUTExercise............................................................................................................................................13 4.3ConfigurationofTestedSystem................................................................................................................13 4.4EquipmentUsedinTestedSystem..........................................................................................................14 4.5SummaryofTestResults..........................................................................................................................15 5.DescriptionofTestModes.............................................................................................................................16 6.RFOutputPowerMeasurement....................................................................................................................18 6.1ProvisionsApplicable................................................................................................................................18 6.2MeasurementProcedure..........................................................................................................................18 6.3MeasurementSetup(BlockDiagramofConfiguration)...........................................................................18 6.4MeasurementResult.................................................................................................................................19 7.20dBBandwidthand99%OccupiedBandwidthMeasurement...............................................................25 7.1ProvisionsApplicable................................................................................................................................25 7.2MeasurementProcedure..........................................................................................................................25 7.3MeasurementSetup(BlockDiagramofConfiguration)...........................................................................25 7.4MeasurementResults...............................................................................................................................26 8.ConductedBandEdgeandOut-of-BandEmissions..................................................................................31 8.1ProvisionsApplicable.............................................................................................…

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