2BUN8-SEV1Smart Everyday Vehicle

NOTE: This document is issued by Shenzhen Morlab Communications Technology Co., Ltd., the test report shall not be reproduced except in full without prior written permission of the company. The test results apply only to the particular sample(s) tested and to the specific tests carried out which is available on request for validation and information confirmed at our website. MORLAB Shenzhen Morlab Communications Technology Co., Ltd. FL.1-3, Building A, FeiYang Science Park, No.8 LongChang Road, Block67, BaoAn District, ShenZhen, GuangDong Province, P. R. China Tel: 86-755-36698555 Fax: 86-755-36698525 Http://www.morlab.cn E-mail: [email protected] Page 1 of 156 REPORT No.：SZ25110146W03 TEST REPORT APPLICANT : Strutt Pte. Ltd. PRODUCT NAME : Smart Everyday Vehicle MODEL NAME :Strutt ev¹, Strutt ev¹c BRAND NAME : STRUTT FCC ID : 2BUN8-SEV1 STANDARD(S) : 47 CFR Part 15 Subpart E RECEIPT DATE : 2025-12-30 TEST DATE :2026-01-20 to 2026-03-27 ISSUE DATE :2026-04-10 Edited by: Zeng Xiaoying (Rapporteur) Approved by: Shen Junsheng (Supervisor) MORLAB Shenzhen Morlab Communications Technology Co., Ltd. FL.1-3, Building A, FeiYang Science Park, No.8 LongChang Road, Block67, BaoAn District, ShenZhen, GuangDong Province, P. R. China Tel: 86-755-36698555 Fax: 86-755-36698525 Http://www.morlab.cn E-mail: [email protected] Page 2 of 156 REPORT No.：SZ25110146W03 DIRECTORY 1. Summary of Test Result ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 4 1.1. Testing Applied Standards ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 5 1.2. Test Equipment List ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 6 1.3. Measurement Uncertainty ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 8 1.4. Testing Laboratory ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 8 2. General Description ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 9 2.1. Information of Applicant and Manufacturer ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 9 2.2. Information of EUT ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 9 2.3. Channel List of EUT ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 11 2.4. Test Configuration of EUT ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 12 2.5. Test Conditions ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 12 2.6. Test Setup Layout Diagram ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 13 3. Test Results ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 16 3.1. Antenna Requirement ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 16 3.2. Duty Cycle of Test Signal ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 17 3.3. Maximum Conducted Output Power ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 18 3.4. Emission Bandwidth ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 19 3.5. Peak Power Spectral Density ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 21 3.6. Frequency Stability ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 22 3.7. Dynamic Frequency Selection ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 23 3.8. Conducted Emission ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 28 3.9. Restricted Frequency Bands ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 29 3.10. Radiated Emission ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 31 Annex A Test Data and Result ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 33 Notes ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ 156 MORLAB Shenzhen Morlab Communications Technology Co., Ltd. FL.1-3, Building A, FeiYang Science Park, No.8 LongChang Road, Block67, BaoAn District, ShenZhen, GuangDong Province, P. R. China Tel: 86-755-36698555 Fax: 86-755-36698525 Http://www.morlab.cn E-mail: [email protected] Page 3 of 156 REPORT No.：SZ25110146W03 Change History Version Date Reason for change 1.0 2026-04-10 First edition MORLAB Shenzhen Morlab Communications Technology Co., Ltd. FL.1-3, Building A, FeiYang Science Park, No.8 LongChang Road, Block67, BaoAn District, ShenZhen, GuangDong Province, P. R. China Tel: 86-755-36698555 Fax: 86-755-36698525 Http://www.morlab.cn E-mail: [email protected] Page 4 of 156 REPORT No.：SZ25110146W03 1. Summary of Test Result No. Section Description Test Date Test EngineerResult Remark 1 15.203 Antenna Requirement N/A N/A PASS / 2 ANSI C63.10 Duty Cycle of the Test Signal Feb. 12, 2026 Zhu Peihong PASS / 3 15.407(a) Maximum Conducted Output Power Feb. 12, 2026 Zhu Peihong PASS / 4 15.407(a) (e) Emission Bandwidth Feb. 12, 2026 Zhu Peihong PASS / 5 15.407(a) Peak Power Spectral Density Feb. 12, 2026 Zhu Peihong PASS / 6 15.407(g) Frequency Stability Feb. 12, 2026 Zhu Peihong PASS / 7 15.407(h) DFS Feb. 12, 2026 Zhu Peihong PASS / 8 15.207 Conducted Emission Mar. 25, 2026 Wang Yapeng PASS / 9 15.407(b) Restricted Frequency Bands Jan. 04, 2026 Tian Xin PASS / 10 15.407(b) Radiated Emission Jan. 04, 2026 Tian Xin PASS / Note 1: The tests of Conducted Emission and Radiated Emission were performed according to the method of measurements prescribed in ANSI C63.10-2020. Note 2: These RF tests were performed according to the method of measurements prescribed in KDB 789033 D02 v02r01. Note 3: These RF tests were performed according to the method of measurements prescribed in KDB 905462 D02 UNII DFS Compliance Procedures New Rules v02. Note 4: Any additions, deviation, or exclusions from the method shall be noted in the “Remark”. MORLAB S…

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深圳市承拓电子有限公司 承拓电子 www.kontec.com.cn 第 1 页 承认书 厂商： 深圳市承拓电子有限公司 原厂名称： FPC-WIFI 天线 原厂料号： 01010E01057 原厂规格： WiFi- FPC0065 （ 9471 胶） -1.13YX 黑 -C13-93mm 深圳市承拓电子有限公司 承拓电子 www.kontec.com.cn 第 2 页 产品规格书 PRODUCT SPECIFICATION Customer: Customer’s part number: Product description:FPC-WiFi 天线 Uni Link’s part number: WiFi- FPC0065（9471胶）-1.13YX黑-C13-93mm Issue Date:2026-01-20 Note:2400-2500/5150-5850 Customer Use Customer's authorized signature Remarks Full approved Conditional approved Rejected 承拓电子 Tel:86-755-89368800 Fax:86-755-89368100 Website:www.kontec.com.cn 深圳市承拓电子有限公司 承拓电子 www.kontec.com.cn 第 3 页 一、产品技术指标（ PRODUCT TECHNICALSPECIFICATION ） 电性能指标 Electrical Specifications 频率范围Frequency Range (MHz) 2400-2500/5150-5850 机械指标 Mechanical Specifications 天线长度 Antenna Length (mm)44.4*17.9±0.5mm 电缆长度Cable (mm)90±5mm 连接器型号 Connect TypeRF1 代端子 固定方式 Mounting 粘贴式 线材颜色Color of Cable黑色Black 工作温度（ Operating Temperature ） -40°C ～ +80°C 工作湿度（ % ） 0%-95% 存储温度（Storing Temperature）-40°C～+85°C 存储湿度（ % ） 0%-95% 深圳市承拓电子有限公司 承拓电子 www.kontec.com.cn 第 4 页 二、测试数据： 2.1 、驻波测试： 测试仪器：罗德与施瓦茨 ZVB8 测试数据： 深圳市承拓电子有限公司 承拓电子 www.kontec.com.cn 第 5 页 2.2 、 OTA 测试： 测试设备： 24 探头球型微波暗测试室 测试仪器： 5071B 测试数据： 深圳市承拓电子有限公司 承拓电子 www.kontec.com.cn 第 6 页 2D 方向图： 深圳市承拓电子有限公司 承拓电子 www.kontec.com.cn 第 7 页 深圳市承拓电子有限公司 承拓电子 www.kontec.com.cn 第 8 页 3D 方向图： 深圳市承拓电子有限公司 承拓电子 www.kontec.com.cn 第 9 页 注：测试数据以我司实验室为准。

深圳市承拓电子有限公司 承拓电子 www.kontec.com.cn 第 1 页 承认书 厂商： 深圳市承拓电子有限公司 原厂名称： FPC-4G 天线 原厂料号： 01010E02025 原厂规格： 4G- FPC0066-0.81YX 黑 -4 代端子 -67mm 深圳市承拓电子有限公司 承拓电子 www.kontec.com.cn 第 2 页 产品规格书 PRODUCT SPECIFICATION Customer: Customer’s part number: Product description:FPC-4G 天线 Uni Link’s part number: 4G- FPC0066-0.81YX 黑 -4 代端子 -67mm Issue Date:2025-11-14 Note:800-960/1710-2700 承拓电子 Tel:86-755-89368800 Fax:86-755-89368100 Website:www.kontec.com.cn 深圳市承拓电子有限公司 承拓电子 www.kontec.com.cn 第 3 页 一、产品技术指标（ PRODUCT TECHNICALSPECIFICATION ） 电性能指标 Electrical Specifications 频率范围Frequency Range (MHz) 800-960/1710-2700 机械指标 Mechanical Specifications 天线长度 Antenna Length (mm)64.9*18.6±0.5mm 电缆长度Cable (mm)65±5mm 连接器型号 Connect Type 四代端子 固定方式 Mounting 粘贴式 线材颜色Color of Cable黑色Black 工作温度（ Operating Temperature ） -35°C ～ +80°C 工作湿度（ % ） 0%-95% 存储温度（Storing Temperature）-40°C～+85°C 存储湿度（ % ） 0%-95% 深圳市承拓电子有限公司 承拓电子 www.kontec.com.cn 第 4 页 二、测试数据： 2.1 、驻波测试： 测试仪器：罗德与施瓦茨 ZVB8 测试数据： 深圳市承拓电子有限公司 承拓电子 www.kontec.com.cn 第 5 页 2.2 、 OTA 测试： 测试设备： 24 探头球型微波暗测试室 测试仪器： 5071B 测试数据： 深圳市承拓电子有限公司 承拓电子 www.kontec.com.cn 第 6 页 2D 方向图： 深圳市承拓电子有限公司 承拓电子 www.kontec.com.cn 第 7 页 3D 方向图： 深圳市承拓电子有限公司 承拓电子 www.kontec.com.cn 第 8 页 注：测试数据以我司实验室为准。

PB-03FV1.0.0 PB-03F V1.0.0 PB-03FV1.0.0 PB-03FV1.0.0 / V1.0.0 2021.11.23 PB-03FV1.0.0 1. ................................................................................................................................. 5 1.1. .............................................................................................................................. 6 2. ................................................................................................................................. 6 2.1. ...................................................................................................................... 7 2.2. ...................................................................................................................... 7 2.3. .............................................................................................................. 7 ............................................................................................................................. 8 3. ................................................................................................................................. 9 4. ............................................................................................................................... 10 5. ................................................................................................................................... 12 6. ............................................................................................................................... 13 6.1. ........................................................................................................ 13 6.2. S ................................................................................................................ 14 6.3. ........................................................................................................ 14 6.4. ................................................................................................................ 15 7. ............................................................................................................................... 16 7.1. .................................................................................................... 16 7.2. ............................................................................................................ 17 7.3. ............................................................................................................................ 17 7.4. GPIO........................................................................................................... 19 8. ....................................................................................................................... 20 9. ....................................................................................................................... 21 .................................................................................................................... 22 11. ............................................................................................................................. 22 ................................................................................................................ 23 .......................................................................................................................................... 23 PB-03FV1.0.0 1. PB-03F PHY6252(SSOP24)(SoC)(IoT) PHY6252(SSOP24)BLE 5.2 64 KB SRAM256KB flash96 KB ROM256bit efuse PB-03FUART, PWM, ADC, I2C, SPI, PDM, DMA 19IO PB-03FAES PB-03FBluetooth5.2Bluetooth mesh125Kbps 500Kbps1Mbps2Mbps 1 PB-03FV1.0.0 1.1. ◼ BLE5.2125Kbps500Kbps1Mbps2Mbps ◼ 64 KB SRAM256KB flash, 96 KB ROM256bit efuse ◼ UART/GPIO/ADC/PWM/I2C/SPI/PDM/DMA ◼ SMD-22 ◼ 1uA ◼ FOTA ◼ AT ◼ Windows 2. 1 PB-03F 22 24.0*16.0*3.1(0.2)mm 03.5 -40 °C ~ 85 °C -40 °C ~ 125 °C , < 90%RH 2.72 /PDM/DMA IO 19 2 AES-128 Flash 256KB PB-03FV1.0.0 2.1. PB-03F 2 ESD 2.2. 2 2.3. 3 2400 - 2483.5 MHz BLE 2Mbps -20 8 10 dBm BLE 1Mbps -20 8 10 dBm BLE 500Kbps -20 8 10 dBm BLE 125kbps -20 8 10 dBm BLE 2Mbps - -93 - dBm VDD 2.7 3.3 3.6 V I/O V IL /V IH - -0.3/0.75VDD - 0.25VDD/VDD+0.3 V V OL /V OH - N/0.8VIO - 0.1VIO/N V I MAX - - - 12 mA PB-03FV1.0.0 BLE 1Mbps - -96 - dBm BLE 500Kbps - -97 - dBm BLE 125Kbps - -102 - dBm 3.3V 25C ◼ SAW ◼ TX_Burst_Test & RX_Burst_Test 4 TX_Burst_Test Power output 8dBm - 11.5 - mA TX_Burst_Test Power output 5dBm - 9 - mA TX_Burst_Test Power output 0dBm - 8 - mA RX_Burst_Test - 9.4 - mA Sleep(1) - 50.58 - uA Sleep(2) - 28.25 - uA Sleep() - 7.2 - uA Power Off - 0.57 - uA PB-03FV1.0.0 3. 3 4 PB-03FV1.0.0 4. PB-03F 22 5 PB-03FV1.0.0 6 1 P15 GPIO15/ADC input 4/micbias output 2 P11 GPIO11/ADC input 0 3 P31 GPIO31 4 P7 GPIO7 5 P32 GPIO32 6 P33 GPIO33 7 P14 GPIO14/ADC input 3 8 VDD 9 P16 GPIO16/32.768KHz crystal input 10 P17 GPIO17/32.768KHz crystal output 11 P18 GPIO18/ADC input 7/PGA negative input 12 P0 GPIO0 13 P34 GPIO34 14 NC 15 GND 16 P2 GPIO2/SWD debug data inout 17 P3 GPIO3/SWD debug clock 18 P20 GPIO20/ADC input 9/PGA positive input 19 P23 GPIO23/ADC input 1/micbias reference 20 P24 GPIO24/ADC input 2 21 P10 RXD/GPIO10 22 P9 TXD/GPIO9 PB-03FV1.0.0 5. 6 PB-03FV1.0.0 6. 6.1. 7 PB-03FV1.0.0 6.2. S 8 S 6.3. 7 Frequency ID 1 2 3 4 5 6 7 8 9 10 11 Frequency (MHz) 2400.0 2410.0 2420.0 2430.0 2440.0 2450.0 2460.0 2470.0 2480.0 2490.0 2500.0 Gain (dBi) Efficiency (%) PB-03FV1.0.0 6.4. 9 PB-03FV1.0.0 7. 7.1. (>= 200mA,DC-DCLDO) 10 ◼ PB-03F PMOS ◼ TX & RX23.3V PB-03FV1.0.0 7.2. ◼ 2 ◼ 11 7.3. ◼ 2 ◼ ◼ ◼ 3.3VESD PB-03FV1.0.0 12 DC-DC PB-03FV1.0.0 7.4. GPIO ◼ ◼ ◼ ◼ 13 PB-03FV1.0.0 8. 14 PB-03FV1.0.0 9. 8 PB-03F 2.7V ~ 3.6V I>200mA SMD-22 24.0*16.0*3.1( 0.2)mm PCB PB-03M 2.7V ~ 3.6V I>200mA DIP-18 18.0*18.0*2.8( 0.2)mm PCB PB-03 2.7V ~ 3.6V I>200mA SMD-61 16.6*13.2*2.8( 0.2)mm PCB NodeMCU- PB-03F-Kit 5V, I>200mA DIP-30 49.3*25.4*12.9( 0.2)mm PCB NodeMCU- PB-03M-Kit 5V, I>200mA DIP-20 32.8*28.6*18.3( 0.2)mm PCB NodeMCU- PB-03-Kit 5V, I>200mA DIP-30 49.3*25.4*12.9( 0.2)mm PCB https://d…

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BW [MHz]ModulationRB SizeRB OffsetLow Channel Middle Channel High Channel 187001890019100 186018801900 20QPSK1022.8723.523.3224.024.3825.0 20QPSK14925.0626.023.2524.022.8223.5 20QPSK19923.6024.524.6525.524.0025.0 20QPSK50022.9923.521.9322.523.0124.0 20QPSK502423.7824.522.2223.022.1723.0 20QPSK505023.4524.022.9423.522.2723.0 20QPSK100023.2624.022.5223.522.5323.5 2016QAM1021.7222.022.5523.523.7124.5 2016QAM14924.1025.022.5623.522.1323.0 2016QAM19922.5923.523.9624.523.2824.0 2016QAM50021.8422.522.1723.023.4624.0 2016QAM502423.8624.522.2023.022.0023.0 2016QAM505022.8623.523.5624.522.8623.5 2016QAM100021.1722.021.2122.022.4823.0 186751890019125 1857.518801902.5 15QPSK1022.7723.523.3024.024.3525.0 15QPSK13725.0325.523.1924.022.7123.5 15QPSK17423.5924.524.5325.523.9524.5 15QPSK36022.9123.521.8422.522.9723.5 15QPSK361923.7124.522.1223.022.1023.0 15QPSK363923.4224.022.9123.522.1523.0 15QPSK75023.1624.022.4223.022.5123.5 1516QAM1021.6622.522.5423.523.7024.5 1516QAM13724.0925.022.4623.022.0223.0 1516QAM17422.5723.523.8924.523.2024.0 1516QAM36021.8222.522.1423.023.4324.0 1516QAM363023.7824.522.1123.021.9022.5 1516QAM366122.8523.523.4424.022.8623.5 1516QAM75021.0822.021.1322.022.3723.0 186501890019150 185518801905 10QPSK1022.8423.523.2524.024.2825.0 10QPSK12425.0425.523.2024.022.7123.5 10QPSK14923.5724.524.5725.523.9424.5 10QPSK25022.9723.521.9122.522.9323.5 10QPSK251223.7824.522.2123.022.1423.0 10QPSK252523.4524.022.8923.522.2023.0 10QPSK50023.1624.022.4723.022.4223.0 1016QAM1021.6322.522.5123.523.6324.5 1016QAM12424.0025.022.5123.522.0223.0 1016QAM14922.5123.523.9424.523.2624.0 1016QAM25021.8122.522.1423.023.4424.0 1016QAM251223.7724.522.1023.021.9422.5 1016QAM252522.8423.523.5524.522.7923.5 1016QAM50021.1022.021.1922.022.4723.0 186251890019175 1852.518801907.5 5QPSK1022.7823.523.2324.024.2725.0 5QPSK11225.0525.523.1424.022.7423.5 5QPSK12423.5424.524.5725.524.0025.0 5QPSK12022.9123.521.8922.522.9323.5 5QPSK12723.7024.522.2123.022.0823.0 5QPSK121323.4224.022.8823.522.2323.0 5QPSK25023.1424.022.4323.022.4623.0 516QAM1021.6522.522.4823.023.6924.5 516QAM11224.0725.022.4623.022.0423.0 516QAM12422.5123.523.9124.523.2424.0 516QAM12021.7722.522.0923.023.3824.0 516QAM12723.7424.522.1323.021.9422.5 516QAM121322.7723.523.5024.522.8223.5 516QAM25021.1522.021.1922.022.4223.0 186151890019185 1851.518801908.5 3QPSK1022.8423.523.2324.024.3625.0 3QPSK1724.9625.523.2224.022.7923.5 3QPSK11423.5124.524.5925.523.9524.5 3QPSK8022.9623.521.9122.522.9423.5 Band 2 (1900MHz Band) (dBm) Part 24E Tune-up limit (dBm) Tune-up limit (dBm) Tune-up limit (dBm) Channel Tune-up limit (dBm) Frequency (MHz) Tune-up limit (dBm) Channel Frequency (MHz) Channel Frequency (MHz) Tune-up limit (dBm) Frequency (MHz) Channel Channel Frequency (MHz) Tune-up limit (dBm) Tune-up limit (dBm) Tune-up limit (dBm) Tune-up limit (dBm) Tune-up limit (dBm) Tune-up limit (dBm) Tune-up limit (dBm) Tune-up limit (dBm) Tune-up limit (dBm) 3QPSK8323.7124.522.1223.022.0823.0 3QPSK8723.4224.022.8423.522.2123.0 3QPSK15023.2024.022.4823.022.4723.0 316QAM1021.7022.522.5423.523.6724.5 316QAM1724.1025.022.5423.522.0123.0 316QAM11422.5623.523.8824.523.2124.0 316QAM8021.8222.522.1023.023.3524.0 316QAM8323.7924.522.1023.021.9122.5 316QAM8722.7623.523.4724.022.8223.5 316QAM15021.0822.021.1022.022.3723.0 186071890019193 1850.718801909.3 1.4QPSK1022.8623.523.2824.024.2825.0 1.4QPSK1224.9625.523.2424.022.8023.5 1.4QPSK1523.5724.524.5825.523.8924.5 1.4QPSK3023.4624.022.3423.023.3924.0 1.4QPSK3124.1825.022.7123.522.6323.5 1.4QPSK3323.8924.523.3924.022.7123.5 1.4QPSK6023.2324.022.4923.022.4523.0 1.416QAM1021.7122.522.5423.523.6324.5 1.416QAM1224.0825.022.4923.022.0423.0 1.416QAM1522.4823.023.8424.523.1624.0 1.416QAM3022.0023.022.3123.023.6224.5 1.416QAM3123.9524.522.3223.022.1023.0 1.416QAM3322.9523.523.7524.522.9523.5 1.416QAM6021.0722.021.1722.022.4423.0 Channel Tune-up limit (dBm) Frequency (MHz) Tune-up limit (dBm) Tune-up limit (dBm) BW [MHz]ModulationRB SizeRB OffsetLow Channel Middle Channel High Channel 200502017520300 17201732.51745 20QPSK1023.0424.023.1024.022.5023.5 20QPSK14923.1524.022.8023.523.1424.0 20QPSK19922.8423.523.1424.022.8423.5 20QPSK50022.0623.022.1023.021.9422.5 20QPSK502422.0823.021.9522.522.2323.0 20QPSK505022.0523.022.0323.022.3123.0 20QPSK100022.0723.022.1423.022.1723.0 2016QAM1022.3023.022.5123.521.9122.5 2016QAM14922.4923.022.2323.022.5323.5 2016QAM19922.1523.022.5823.522.3223.0 2016QAM50022.1723.022.3323.021.7522.5 2016QAM502422.1923.022.0023.022.2623.0 2016QAM505022.0623.022.2723.022.2423.0 2016QAM100021.2322.021.3622.020.9321.5 200252017520325 1717.51732.51747.5 15QPSK1022.9423.523.0224.022.3923.0 15QPSK13723.0824.022.7523.523.0924.0 15QPSK17422.8423.523.0624.022.8323.5 15QPSK36021.9522.522.0023.021.8522.5 15QPSK362021.9622.521.8922.522.1723.0 15QPSK363921.9922.522.0223.022.2823.0 15QPSK75022.0523.022.0323.022.0823.0 1516QAM1022.2423.022.4123.021.7922.5 1516QAM13722.4623.022.1223.022.4623.0 1516QAM17422.0623.022.5423.522.2123.0 1516QAM36022.1023.022.2323.021.7122.5 1516QAM362022.1423.022.0023.022.1923.0 1516QAM363922.0223.022.1523.022.2323.0 1516QAM75021.1822.021.3022.020.8221.5 200002017520350 17151732.51750 10QPSK1023.0124.023.0424.022.4123.0 10QPSK12523.0824.022.7023.523.0424.0 10QPSK14922.7423.523.1424.022.7823.5 10QPSK25022.0223.022.0823.021.8922.5 10QPSK251222.0623.021.8722.522.1223.0 10QPSK252521.9422.521.9122.522.2623.0 10QPSK50021.9622.522.0823.022.1123.0 1016QAM1022.2023.022.4623.021.9122.5 1016QAM12522.4223.022.1623.022.4723.0 1016QAM14922.0523.022.5323.522.2323.0 1016QAM25022.1623.022.2523.021.6622.5 1016QAM251222.1523.021.9822.522.2123.0 1016QAM252522.0623.022.2223.022.1423.0 1016QAM50021.1222.021.3322.020.8321.5 199752017520375 1712.51732.51752.5 5QPSK1023.0424.023.0324.022.4823.0 5QPSK11223.1324.022.6923.523.0924.0 5QPSK12422.7323.523.0624.022.7723.5 5QPSK12022.0023.022.0323.021.8822.5 5QPSK12722.0023.021.8822.522.1423.0 5QPSK121321.9622.521.9722.522.2723.0 5QPSK25022.0323.022.1323.022.1123.0 516QAM1022.2723.022.5023.521.8222.…

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NOTE: This document is issued by Shenzhen Morlab Communications Technology Co., the test report shall not be reproduced except in full without prior written permission of the company. The test results apply only to the particular sample(s) tested and to the specific tests carried out which is available on request for validation and information confirmed at our website. MORLAB Shenzhen Morlab Communications Technology Co., Ltd. FL.1-3, Building A, FeiYang Science Park, No.8 LongChang Road, Block67, BaoAn District, ShenZhen , GuangDong Province, P. R. China Tel: 86-755-36698555 Fax: 86-755-36698525 Http://www.morlab.cn E-mail: [email protected] REPORT No.：SZ25110146S01 Page 1 of 50 TEST REPORT APPLICANT : Strutt Pte. Ltd. PRODUCT NAME : Smart Everyday Vehicle MODEL NAME : Strutt ev¹, Strutt ev¹c BRAND NAME : STRUTT FCC ID : 2BUN8-SEV1 STANDARD(S) : FCC 47 CFR Part 2 (2.1093) IEEE 1528-2013 RECEIPT DATE : 2025-12-31 TEST DATE : 2026-03-02 to 2026-03-07 ISSUE DATE : 2026-04-02 Edited by: Pang Siyu (Rapporteur) Approved by: Shen Junsheng (Supervisor) MORLAB Shenzhen Morlab Communications Technology Co., Ltd. FL.1-3, Building A, FeiYang Science Park, No.8 LongChang Road, Block67, BaoAn District, ShenZhen , GuangDong Province, P. R. China Tel: 86-755-36698555 Fax: 86-755-36698525 Http://www.morlab.cn E-mail: [email protected] REPORT No.：SZ25110146S01 Page 2 of 50 DIRECTORY 1. Statement of Compliance·································································································· 5 2. Technical Information ········································································································ 6 2.1. Applicant and Manufacturer Information ····································································· 6 2.2. Equipment under Test (EUT) Description ···································································· 6 2.3. Environment of Test Site/Conditions ··········································································· 7 3. Specific Absorption Rate (SAR) ······················································································· 8 3.1. Introduction······················································································································ 8 3.2. SAR Definition ················································································································· 8 4. RF Exposure Limits ··········································································································· 9 4.1. Uncontrolled Environment ····························································································· 9 4.2. Controlled Environment ································································································· 9 5. Applied Reference Documents ······················································································ 10 6. SAR Measurement System ····························································································· 11 6.1. E-Field Probe ················································································································· 12 6.2. Data Acquisition Electronics (DAE) ············································································ 13 6.3. Robot ······························································································································ 13 6.4. Measurement Server ····································································································· 14 6.5. Light Beam Unit ············································································································· 14 6.6. Phantom ························································································································· 14 6.7. Device Holder ················································································································ 15 6.8. Data Storage and Evaluation ······················································································· 16 6.9. Test Equipment List ······································································································ 18 7. Tissue Simulating Liquids ······························································································ 20 8. SAR System Verification ································································································· 22 8.1. Purpose of System Performance Check ···································································· 22 8.2. System Setup ················································································································· 22 MORLAB Shenzhen Morlab Communications Technology Co., Ltd. FL.1-3, Building A, FeiYang Science Park, No.8 LongChang Road, Block67, BaoAn District, ShenZhen , GuangDong Province, P. R. China Tel: 86-755-36698555 Fax: 86-755-36698525 Http://www.morlab.cn E-mail: [email protected] REPORT No.：SZ25110146S01 Page 3 of 50 8.3. Validation Results ········································································································· 23 9. EUT Testing Position ······································································································· 26 9.1. Body-worn Configurations ·························································································· 26 10. Measurement Procedures ······························································································· 27 10.1. Spatial Peak SAR Evaluation ······················································································· 27 10.2. Power Reference Measurement ·················································································· 28 10.3. Area Scan Procedures ·································································································· 28 10.4. Zoom Scan Procedures ···················································…

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Annual validation for test lab. Appendix Annual validation for Test Lab. General calibration information Date 2025.09.25 Test Laboratory ShenZhen Morlab Communications Technology Co., Ltd. Antenna serial No. D5250V2-SN: 1176 Antenna Parameters with Head TSL Impedance, transformed to feed point 51.07Ω+2.05jΩ Return Loss -32.818dB General Antenna Parameters and Design Electrical Delay (one direction) 1.276 ns After long term use with 100W radiated power，only a slight warming of the dipole near the feed point can be measured The dipole is made of standard semirigid coaxial cable. The center conductor of the feeding line is directly connected to the second arm of the dipole. The antenna is therefore short-circuited for DC-signals. On some of the dipoles, small end caps are added to the dipole arms in order to improve matching when loaded according to the position as explained in the "Measurement Conditions" paragraph. The SAR data are not affected by this change. The overall dipole length is still according to the Standard No excessive force must be applied to the dipole arm， because they might bend or the soldered connections near the feed point may be damaged . Annual validation for test lab. Annual validation for test lab. Appendix Impedance Measurement Plot for Head TSL Annual validation for test lab. Appendix Annual validation for Test Lab. General calibration information Date 2025.09.25 Test Laboratory ShenZhen Morlab Communications Technology Co., Ltd. Antenna serial No. D5600V2-SN: 1176 Antenna Parameters with Head TSL Impedance, transformed to feed point 50.89Ω-2.58jΩ Return Loss -31.355dB General Antenna Parameters and Design Electrical Delay (one direction) 1.276 ns After long term use with 100W radiated power，only a slight warming of the dipole near the feed point can be measured The dipole is made of standard semirigid coaxial cable. The center conductor of the feeding line is directly connected to the second arm of the dipole. The antenna is therefore short-circuited for DC-signals. On some of the dipoles, small end caps are added to the dipole arms in order to improve matching when loaded according to the position as explained in the "Measurement Conditions" paragraph. The SAR data are not affected by this change. The overall dipole length is still according to the Standard No excessive force must be applied to the dipole arm， because they might bend or the soldered connections near the feed point may be damaged . Annual validation for test lab. Annual validation for test lab. Appendix Impedance Measurement Plot for Head TSL Annual validation for test lab. Appendix Annual validation for Test Lab. General calibration information Date 2025.09.25 Test Laboratory ShenZhen Morlab Communications Technology Co., Ltd. Antenna serial No. D5750V2-SN: 1176 Antenna Parameters with Head TSL Impedance, transformed to feed point 50.962Ω+0.196jΩ Return Loss -40.247dB General Antenna Parameters and Design Electrical Delay (one direction) 1.276 ns After long term use with 100W radiated power，only a slight warming of the dipole near the feed point can be measured The dipole is made of standard semirigid coaxial cable. The center conductor of the feeding line is directly connected to the second arm of the dipole. The antenna is therefore short-circuited for DC-signals. On some of the dipoles, small end caps are added to the dipole arms in order to improve matching when l…

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