2BUWX-MYE-H01electronic badge

CoveredEquipmentCertificationAttestationLetter 2026-3-2 FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA ATTN.:ReviewingEngineer FCCID:2BUWX-MYE-H01 DongguanMeiyiElectronicTechnologyCo.,Ltd(“theapplicant”)certifiesthatthe equipmentforwhichauthorizationissoughtisnot“covered”equipmentprohibitedfrom receivinganequipmentauthorizationpursuanttosection2.903oftheFCCrules. Note:Iftheequipmentforwhichtheapplicantseeksauthorizationisproducedby anyoftheentitiesidentifiedonthecurrentCoveredList,theapplicantshould includeanexplanationonwhytheequipmentisnot“covered”equipment. DongguanMeiyiElectronicTechnologyCo.,Ltd(“theapplicant”)certifiesthat,asofthe dateofthefilingoftheapplication,theapplicantisnotidentifiedontheCoveredListas anentityproducing“covered”equipment. DongguanMeiyiElectronicTechnologyCo.,Ltd(“theapplicant”)certifiesthatthe equipmentforwhichauthorizationissoughtdoesnotincludecybersecurityoranti-virus softwareproducedorprovidedbyKasperskyLab,Inc.oranyofitssuccessorsand assignees,includingequipmentwithintegratedKasperskyLab,Inc.(oranyofits successorsandassignees)cybersecurityoranti-virussoftwarepursuanttoDA-24-886 andKDB986446D01 CoveredEquipmentGuidancesectionB(2a). Signed: Printedname:KaipengWu Title:Manager CompanyName:DongguanMeiyiElectronicTechnologyCo.,Ltd Date:2026-3-2

2026-3-2 FederalCommunicationsCommission Authorization&EvaluationDivision 7345OaklandMillsRoad Columbia,Maryland21046 RE:LETTEROFAGENTAUTHORIZATION ToWhomItMayConcern: We,theundersigned,herebyauthorizeShenzhenBangceTestingTechnologyCo.,Ltd.toacton ourbehalfinallmattersrelatingtoapplicationforequipmentauthorization,includingthesigningofall documentsrelatingtothesematters. Wealsoherebycertifythatnopartytotheapplicationauthorizedhereunderissubjecttothedenialof benefits,includingFCCbenefits,pursuanttoSection5301oftheAnti-DrugAbuseActof1988,21 U.S.C.853(a). Sincerely, Name:KaipengWu Title:Manager Company:DongguanMeiyiElectronicTechnologyCo.,Ltd

2026-3-2 EquipmentAutorisationDivision FederalCommunicationsCommission 7435OaklandMillsRoad Columbia,MD21046 FCCID:2BUWX-MYE-H01 ProductName:electronicbadge RequestforConfidentiality PursuanttoSections0.457and0.459ofthecommission’srules,weherebyrequestthat thefollowingdocumentsbeheldconfidential: (Listherethedocumentsforwhichyouareseekingconfidentiality–forexample...) Schematics Blockdiagram  Operationdescription Thesematerialscontaintradesecretsandproprietaryinformationandarenot customarilyreleasedtothepublic.Thepublicdisclosureofthisinformationmightbe harmfultothecompanyandprovideunjustifiedbenefitstoourcompetitors. Name:KaipengWu Title:Manager Company:DongguanMeiyiElectronicTechnologyCo.,Ltd

ReportNo.:CISRR26020404901 Page 57 of 59 9.EXTERNALANDINTERNALPHOTOS 9.1.ExternalPhotos ReportNo.:CISRR26020404901 Page 58 of 59

Label Size:20mm*8mm FCCID:2BUWX-MYE-H01 LabelLocation

ReportNo.:CISRR26020404901 Page 59 of 59 9.2.InternalPhotos ------Endofthereport----- ANT

ReportNo.: CISRR26020404902 Reporttemplateversion:CISE-TR-001-A0Page:1of6 TESTREPORT RFExposureEvaluation ReportNo.: CISRR26020404902 ProjectNo.: CISR260204049 FCCID:2BUWX-MYE-H01 Applicant:DongguanMeiyiElectronicTechnologyCo.,Ltd Address: Room801,Building7,No.6-1DuitangHualing1stRoad,ChashanTown, DongguanCity,GuangdongProvince Manufacturer: DongguanMeiyiElectronicTechnologyCo.,Ltd Address: Room801,Building7,No.6-1DuitangHualing1stRoad,ChashanTown, DongguanCity,GuangdongProvince ProductName: electronicbadge TradeMark:- Model/Typereference:MYE-H01 ListedModel(s):- Standard:47CFRPart2.1093 Issuedate:February7,2026 Testresult:Complied Reviewedby:MorganTan Approvedby:HansHu Thetestresultsrelateonlytothetestedsamples. ThetestreportshouldnotbereproducedexceptinfullwithoutthewrittenapprovalofShenzhenBangceTesting TechnologyCo.,Ltd. ReportNo.: CISRR26020404902 Reporttemplateversion:CISE-TR-001-A0Page:2of6 Contents 1.APPLICABLESTANDARD..............................................................................................................................3 2.REPORTVERSION..........................................................................................................................................3 3.RADIOSPECIFICATIONDESCRIPTION........................................................................................................4 4.SIMULTANEOUSTRANSMISSIONANALYSIS.............................................................................................4 5.TESTRESULT.................................................................................................................................................5 5.1.STANDALONETRANSMISSION.................................................................................................................5 5.2.SIMULTANEOUSTRANSMISSION.............................................................................................................6 ReportNo.: CISRR26020404902 Reporttemplateversion:CISE-TR-001-A0Page:3of6 1.APPLICABLESTANDARD 47CFRPart2.1093:Radiofrequencyradiationexposureevaluation:portabledevices ANSIC95.1–2019:IEEEStandardforSafetyLevelswithRespecttoHumanExposuretoRadioFrequency ElectromagneticFields,3kHzto300GHz. FCCKDBpublication447498D01GeneralRFExposureGuidancev06:MobileandPortableDevicesRF ExposureProceduresandEquipmentAuthorizationPolicies. 47CFRPart1.1307:Actionsthatmayhaveasignificantenvironmentaleffect,forwhichEnvironmental Assessments(EAs)mustbeprepared. 2.REPORTVERSION VersionNo.IssuedateDescription 00February7,2026Original ReportNo.: CISRR26020404902 Reporttemplateversion:CISE-TR-001-A0Page:4of6 3.RADIOSPECIFICATIONDESCRIPTION Bluetooth Supportedtype:BREDRLE-1Mbps LE-2Mbps Note:PleaserefertoRFreportfordetailedtechnicalspecifications 4.SIMULTANEOUSTRANSMISSIONANALYSIS ThesedevicesuseasingletransmittermoduleandantennaforbothBT,BTcannottransmitsimultaneously. ReportNo.: CISRR26020404902 Reporttemplateversion:CISE-TR-001-A0Page:5of6 5.TESTRESULT 5.1.Standalonetransmission Limit: KDB447498D01v06,Clause4.3.1a) For100MHzto6GHzandtestseparationdistances≤50mm,the1-gand10-g SARtestexclusionthresholdsaredeterminedbythefollowing: [(max.powerofchannel,includingtune-uptolerance,mW)/(min.testseparation distance,mm)]*[√f(GHz)]≤3.0for1-gSAR,and≤7.5for10-gextremitySAR,where f(GHz)istheRFchanneltransmitfrequencyinGHz PoweranddistanceareroundedtothenearestmWandmmbeforecalculation31The resultisroundedtoonedecimalplaceforcomparison Thevalues3.0and7.5arereferredtoasnumericthresholdsinstepb)below Thetestexclusionsareapplicableonlywhentheminimumtestseparationdistanceis≤50mm, andfortransmissionfrequenciesbetween100MHzand6GHz.Whentheminimumtest separationdistanceis<5mm,adistanceof5mmaccordingto4.1f)isappliedtodetermine SARtestexclusion. Result: Passed TestData Radiotype Frequency (GHz) Maximum output power #1 (dBm) Antenna gain #2 (dBi) Maximum EIRP #3 (dBm) Maximum tune-up EIRP #4 (dBm) Minimum distance (mm) Evaluated value LimitResult Bluetooth2.4020.342.73.044.005.000.77863.00PASS Note #1:ThisvaluecomesfromtheRFtestreport. #2:Thisvalueisdeclaredbytheapplicant. #3:EIRP=Maximumoutputpower+Antennagain. #4:Thisvalueisdeclaredbytheapplicant. ReportNo.: CISRR26020404902 Reporttemplateversion:CISE-TR-001-A0Page:6of6 5.2.Simultaneoustransmission Limit: KDB447498D01v06,Clause4.3.2,47CFRPart1.1307 InthecaseofxedRFsourcesoperatinginthesametime-averagingperiod,orof multiplemobileorportableRFsourceswithinadeviceoperatinginthesametime averagingperiod,ifthesumofthefractionalcontributionstotheapplicablethresholds islessthanorequalto1asindicatedinthefollowingequation. Where a=numberoffxed,mobile,orportableRFsourcesclaimingexemptionusingparagraph (b)(3)(i)(B)ofthissectionforP,includingexistingexempttransmittersandthosebeing added. b=numberoffxed,mobile,orportableRFsourcesclaimingexemptionusingparagraph (b)(3)(i)(C)ofthissectionforThresholdERP,includingexistingexempttransmittersand thosebeingadded. c=numberofexistingfixed,mobile,orportableRFsourceswithknownevaluationforthespeci edminimumdistanceincludingexistingevaluatedtransmitters. P j =theavailablemaximumtime-averagedpowerortheERP,whicheverisgreater,forxed, mobile,orportableRFsourceiatadistancebetween0.5cmand40cm(inclusive). P th,j =theexemptionthresholdpower(P)accordingtoparagraph(b)(3)(i)(B)ofthissectionfor xed,mobile,orportableRFsourcei. ERP j =theERPoffixed,mobile,orportableRFsourcej. ERP th,j =exemptionthresholdERPforfixed,mobile,orportableRFsourcej,atadistanceofat leastλ/2πaccordingtotheapplicableformulaofparagraph(b)(3)(i)(C)ofthissection. Evaluated k =themaximumreportedSARorMPEoffixed,mobile,orportableRFsourcekeither inthedeviceoratthetransmittersitefromanexistingevaluationatthelocationofexposure. ExposureLimit k =eitherthegeneralpopulation/uncontrolledmaximumpermissibleexposure (MPE)orspecicabsorptionrate(SAR)limitforeachxed,mobile,orportableRFsourcek, asapplicablefrom§1.1310ofthischapter. Result:NotApplicable --------EndofReport--------

ReportNo.:CISRR26020404901 Thetestresultsrelateonlytothetestedsamples. ThetestreportshouldnotbereproducedexceptinfullwithoutthewrittenapprovalofShenzhenBangce TestingTechnologyCo.,Ltd. Page1of53 TESTREPORT ReportNo.CISRR26020404901 ProjectNo.CISR260204049 FCCID:2BUWX-MYE-H01 ApplicantDongguanMeiyiElectronicTechnologyCo.,Ltd Address Room801,Building7,No.6-1DuitangHualing1stRoad,Chashan Town,DongguanCity,GuangdongProvince ManufacturerDongguanMeiyiElectronicTechnologyCo.,Ltd Address Room801,Building7,No.6-1DuitangHualing1stRoad,Chashan Town,DongguanCity,GuangdongProvince ProductNameelectronicbadge Trademark- Model/TypereferenceMYE-H01 ListedModel(s)- Standard 47CFRPart15.247 DateofsamplereceiptFebruary5,2026 TestdateFebruary5,2026toFebruary7,2026 IssuedateFebruary7,2026 TestresultComplied Reviewedby:MorganTan Approvedby:HansHu ReportNo.:CISRR26020404901 Page 2 of 53 Contents 1.STANDARDANDAPPLICABLETESTMETHODS........................................................................................3 2.REPORTVERSION..........................................................................................................................................3 3.TESTDESCRIPTION.......................................................................................................................................4 4.SUMMARY........................................................................................................................................................5 4.1.ProductDescription*..................................................................................................................................5 4.2.RadioSpecificationDescription*..............................................................................................................5 4.3.ModificationofEUT.....................................................................................................................................6 4.4.Deviationfromstandards...........................................................................................................................6 4.5.TestingSite...................................................................................................................................................6 5.TESTCONFIGURATION.................................................................................................................................7 5.1.Testfrequencylist.......................................................................................................................................7 5.2.Descriptionsoftestmode...........................................................................................................................7 5.3.Supportunitusedintestconfiguration....................................................................................................7 5.4.Testsampleinformation.............................................................................................................................7 5.5.Environmentalconditions...........................................................................................................................7 5.6.Statementofthemeasurementuncertainty.............................................................................................7 5.7.EquipmentUsedduringtheTest................................................................................................................9 6.TESTRESULTS.............................................................................................................................................11 6.1.EvaluationResults(Evaluation)...............................................................................................................11 6.1.1.AntennaRequirement.............................................................................................................................11 6.2.RadioSpectrumMatterTestResults(RF)...............................................................................................12 6.2.1.ConductedEmissionatACpowerline.................................................................................................12 6.2.2.20dBBandwidth......................................................................................................................................15 6.2.3.MaximumConductedOutputPower.....................................................................................................17 6.2.4.ChannelSeparation................................................................................................................................18 6.2.5.NumberofHoppingFrequencies..........................................................................................................19 6.2.6.DwellTime...............................................................................................................................................20 6.2.7.Conductedbandedgeandspuriousemission...................................................................................22 6.2.8.Radiatedbandedgeemission...............................................................................................................24 6.2.9.RadiatedSpuriousEmission(below1GHz).........................................................................................30 6.2.10.RadiatedSpuriousEmission(Above1GHz)......................................................................................34 7.APPENDIXREPORT......................................................................................................................................42 7.1.ConductedOutputPower.........................................................................................................................42 7.2.20dBBandwidth.........................................................................................................................................44 7.3.NumberOfHoppingChannel....................................................................…

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2.4GHz 1608 Chip Antenna: RANT1608F245C01 _ Application: WLAN,802.11b/g,Bluetooth,WLAN,etc... Features SMD,highreliability,ultraImpact,Omni-directional... PartnumberInformation RANT0603F245 (A)(B)(C)(D) ElectricalSpecificatio C (E) 01 (F) n DimensionandTerminalConfiguration No.TerminalName 1Feeding/GNG 2GND/Feeding (A)ProductTypeChipAntenna (B)SizeCode 1.6x0.8mm( ± 0.1mm) (C)MaterialHighKmaterial (D)Frequency2.4~2.5GHz (E)FeedingmodePIFA&SingleFeeding (F)AntennatypeType=5 WorkingFrequencyRange2400~2500MHz Bandwidth120MHz(Min.) PeakGain2.7dBi(Typ.) Impedance50Ohm Returnloss10dB(Min) PolarizationLinear AzimuthBeamwidthOmni-directional OperationTemperature(°C)-40~85°C ResistancetoSolderingHeats 10sec.(@280°C) TerminationNi/Au(Leadless) Dimension(mm) L 1.60±0.10 W 0.80±0.10 T 0.45±0.10 咏成國際科技有限公司 電話 :13530576606 RAINInternationalTechnologyCo.,Ltd. TEL:13530576606 2.4GHz 1608 Chip Antenna: RANT1608F245C01 _ 1 EvaluationBoardReference PCBDimensionUnit:mm ReturnLoss&Radiation 2.4GHz 1608 Chip Antenna: RANT1608F245C01 _ 2.4GHz 1608 Chip Antenna: RANT1608F245C01 _ TapingSpecifications ReelandTapingSpecification ReelSpecification TYPESIZEABCD 16087”4K/Reel 4.0±0.5 4.0±213.5±0.5178±2 TappingSpecification PackagingTypeABWEFGHTψDP PaperType1608 1.90±0.203.50±0.208.0±0.201.75±0.103.5±0.054.0±0.102.0±0.050.75±0.10 1.50±0.10 4.0±0.1 _ 2.4GHz 1608 Chip AntennaRANT1608F245C01 Reliability Table TestItemProcedure Requirements CeramicType Remark (Reference) Electrical Characterization Fulfilltheelectrical specification UserSpec. Thermal Shock 1.Preconditioning: 50±10°C/1hr,thenkeepfor24±1hrsatroomtemp. 2.Initialmeasure:Spec:referInitialspec. 3.Rapidchangeoftemperaturetest: -30°Cto+85°C;100cycles; 15minutesatLowercategorytemperature; 15minutesatUppercategorytemperature. NoVisibleDamage. Fulfilltheelectrical specification. MIL-STD-202 107 Temperature Cycling 1.Initialmeasure:Spec:referInitialspec. 2.100Cycles(-30°Cto+85°C),SoakMode=1(2Cycle/hours). 3.Measurementat24±2Hoursaftertestcondition. NoVisibleDamage. Fulfilltheelectrical specification. JESD22 JA104 HighTemperature Exposure 1.Initialmeasure:Spec:referInitialspec. 2.Unpowered;500hours@T=+85°C. 3.Measurementat24±2hoursaftertest. NoVisibleDamage. Fulfilltheelectrical specification. MIL-STD-202 108 LowTemperature Storage 1.Initialmeasure:Spec:referInitialspec. 2.Unpowered:500hours@T=-30°C. 3.Measurementat24±2hoursaftertest. NoVisibleDamage. Fulfilltheelectrical specification. MIL-STD-202 108 Solderability (SMDBottomSide) Dippingmethod: a.Temperature:235±5°C b.Dippingtime:3±0.5s Thesoldershouldcover over95%ofthecritical areaofbottomside. IEC60384-21/22 4.10 SolderingHeat Resistance (RSH) Preheatingtemperature:150±10°C. Preheatingtime:1~2min. Soldertemperature:260±5°C. Dippingtime:5±0.5s NoVisibleDamage.IEC60384-21/22 4.10 Vibration5g'sfor20min.,12cycleseachof3orientations Note:Use8"X5"PCB.031"thick7securepointson,onelong sideand2securepointsatcornersofoppositesides.Parts mountedwithin2"fromanysecurepoint.Testfrom10-2000 Hz. NoVisibleDamage.MIL-STD-202 Method204 Mechanical Shock Threeshocksineachdirectionshallbeappliedalongthethree mutuallyperpendicularaxesofthetestspecimen(18shocks) Peakvalue:1,500g’s Duration:0.5ms Velocitychange:15.4ft/s Waveform:Half-sine NoVisibleDamage.MIL-STD-202 Method213 Humidity Bias 1.Humidity:85%R.H.,Temperature:85±2°C. 2.Time:500±24hours. 3.Measurementat24±2hrsaftertestcondition. NoVisibleDamage. Fulfilltheelectrical specification. MIL-STD-202 Method106 2.4GHz 1608 Chip Antenna: RANT1608F245C01 _ Board Flex (SMD) 1.Mountingmethod: IR-Reflow.PCBSize(L:100×W:40×T:1.6mm) 2.Applytheloadindirectionofthearrowuntilbendingreaches 2mm. NoVisibleDamage.AEC-Q200 005 AdhesionForceof1.8Kgfor60seconds.NoVisibleDamage Magnificationof20Xor greatermaybeemployed forinspectionofthe mechanicalintegrityofthe devicebodyterminalsand body/terminaljunction. AEC-Q200 006 Physical Dimension Anyapplicablemethodusingx10magnification,micrometers, calipers,gauges,contourprojectors,orothermeasuring equipment,capableofdeterminingtheactualspecimen dimensions. Inaccordancewith specification. JESD22 JB100 RevisionHistory RevisionDateContent 12019/03/01NewDatasheet 22020/02/22Add2Dradiationcharacteristic

ReportNo.:CISRR26020404901 Page 55 of 59 8.TESTSETUPPHOTOS ConductedEmissionatACpowerline Radiatedbandedgeemission RadiatedSpuriousEmission(Above1GHz) ReportNo.:CISRR26020404901 Page 56 of 59 RadiatedSpuriousEmission(below1GHz)