2BVMX-BH-ATG01Thermal Scope

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Henan Bosean Technology Corporation Limited Add: Block 10. Yida Technology New Park No. 16 JinZhan Road National High-Tech Zone, Zhengzhou, Henan Province, China Date: 2026-4-13 FCC ID: 2BVMX-BH-ATG01 Dear Sir/Madam, We, Henan Bosean Technology Corporation Limited Hereby declares the following statement for Federal Communications Commission, the following models differ only in model number and Optical Parameters. They are completely identical in mechanical structure and design, as well as PCB and RF circuit, the difference will affect EMC/RF performance. Product name: Thermal Scope Model no.: BH-ATG01-650-LRF,BH-ATG01-335-LRF Sincerely, Name/Title： Yanqiao Yang/Manager Company: Henan Bosean Technology Corporation Limited Address: Block 10. Yida Technology New Park No. 16 JinZhan Road National High-Tech Zone, Zhengzhou, Henan Province, China Phone: +86 13027941006 Fax: N/A E-Mail: [email protected]

Page 1 of 3 FCC ID: 2BVMX-BH-ATG01 External photos Page 2 of 3 FCC ID: 2BVMX-BH-ATG01 Page 3 of 3 FCC ID: 2BVMX-BH-ATG01

Label FCC ID: 2BVMX-BH-ATG01

Page 1 of 4 FCC ID: 2BVMX-BH-ATG01 Internal photos Chip ANT Page 2 of 4 FCC ID: 2BVMX-BH-ATG01 Page 3 of 4 FCC ID: 2BVMX-BH-ATG01 Page 4 of 4 FCC ID: 2BVMX-BH-ATG01

Page 1 of 8 Report No.: AiTSZ-260327010FW2 Note: This device has been tested and found to comply with the standard(s) listed, this test report merely corresponds to the test sample. It is not permitted to copy extracts of these test result without the written permission of the test laboratory. This report shall not be reproduced except in full, without the written approval of Guangdong Asia Hongke Test Technology Limited. If there is a need to alter or revise this document, the right belongs to Guangdong Asia Hongke Test Technology Limited, and it should give a prior written notice of the revision document. This test report must not be used by the client to claim product endorsement. Guangdong Asia Hongke Test Technology Limited B1/F, Building 11, Junfeng Industrial Park, Chongqing Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China. RF Exposure evaluation Product Name : Thermal Scope Brand Name : N/A Model : BH-ATG01-650-LRF Series Model : BH-ATG01-335-LRF FCC ID : 2BVMX-BH-ATG01 Applicant : Henan Bosean Technology Corporation Limited Address : Block 10. Yida Technology New Park No. 16 JinZhan Road National High-Tech Zone, Zhengzhou, Henan Province, China Manufacturer : Henan Bosean Technology Corporation Limited Address : Block 10. Yida Technology New Park No. 16 JinZhan Road National High-Tech Zone, Zhengzhou, Henan Province, China Standard(s) : 47CFR §1.1310, 47CFR §2.1093 KDB447498 D01 General RF Exposure Guidance v06 Date of Receipt : Mar. 27, 2026 Date of Test : Mar. 27, 2026~ Apr. 03, 2026 Issued Date : Apr. 15, 2026 Issued By: Guangdong Asia Hongke Test Technology Limited B1/F, Building 11, Junfeng Industrial Park, Chongqing Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China Tel.: +86 0755-230967639 Fax.: +86 0755-230967639 Reviewed by: Approved by: Aalen.Ye Allen Wang Page 2 of 8 Report No.: AiTSZ-260327010FW2 Report Revise Record Report Version Issued Date Notes M0 Apr. 15, 2026 Initial Release Page 3 of 8 Report No.: AiTSZ-260327010FW2 Contents 1 GENERAL INFORMATION .......................................................................................................................................... 4 1.1 ENVIRONMENTAL CONDITIONS ........................................................................................................................................ 4 1.2 GENERAL DESCRIPTION OF EUT ...................................................................................................................................... 4 1.3 TEST FACILITY .............................................................................................................................................................. 5 1.4 MEASUREMENT UNCERTAINTY ........................................................................................................................................ 5 2 METHOD OF MEASUREMENT ................................................................................................................................... 6 2.1 APPLICABLE STANDARD.................................................................................................................................................. 6 2.2 EVALUATION METHOD AND LIMIT .................................................................................................................................... 6 2.3 MANUFACTURING TOLERANCE ........................................................................................................................................ 7 2.4 EVALUATION RESULT ..................................................................................................................................................... 8 2.5 CONCLUSION ............................................................................................................................................................... 8 Page 4 of 8 Report No.: AiTSZ-260327010FW2 1 GENERAL INFORMATION 1.1 Environmental conditions During the measurement the environmental conditions were within the listed ranges: Normal Temperature: 25°C Relative Humidity: 55 % Air Pressure: 101 kPa 1.2 General Description of EUT Product Name: Thermal Scope Model/Type reference: BH-ATG01-650-LRF Serial Model: BH-ATG01-335-LRF Model difference: BH-ATG01-650-LRF and BH-ATG01-335-LRF differ only in model number and Optical Parameters. They are completely identical in mechanical structure and design, as well as PCB and RF circuit, the difference will affect EMC/RF performance. Power Supply: Model:SG-0502000AU Input:100-240V~50/60HZ 0.3A MAX Output:5.0V2.0A 10.0W Battery:3.7V,3.2Ah Hardware Version: N/A Software Version: N/A Sample(s) Status: AiTSZ-260327010-1(Normal sample) AiTSZ-260327010-2(Engineer sample) 2.4G WIFI: Supported type: 802.11b/802.11g Modulation: 802.11b(DSSS):CCK,DQPSK,DBPSK 802.11g(OFDM):BPSK,QPSK,16-QAM,64-QAM Operation frequency: 802.11b/802.11g: 2412MHz~2462MHz Channel number: 802.11b/802.11g: 11 Channel separation: 5MHz Antenna type: Chip antenna Antenna gain: 3.64dBi Remark: The above DUT's information was declared by manufacturer. For more detailed features description, please refer to the manufacturer’s specifications or the User's Manual. Page 5 of 8 Report No.: AiTSZ-260327010FW2 1.3 Test Facility Test Laboratory: Guangdong Asia Hongke Test Technology Limited B1/F, Building 11, Junfeng Industrial Park, Chongqing Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China The test facility is recognized, certified or accredited by the following organizations: FCC-Registration No.: 251906 Designation Number: CN1376 Guangdong Asia Hongke Test Technology Limited has been registered and fully described in a report filed with the (FCC) Federal Communications Commission. The acceptance letter from the FCC is maintained in our files. IC —Registration No.: 31737 CAB identifier: CN0165 The 3m Semi-anechoic chamber of Guangdong Asia Hongke Test Technology Limited has bee…

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Page 1 of 33 Report No.: AiTSZ-260327010FW1 Note: This device has been tested and found to comply with the standard(s) listed, this test report merely corresponds to the test sample. It is not permitted to copy extracts of these test result without the written permission of the test laboratory. This report shall not be reproduced except in full, without the written approval of Guangdong Asia Hongke Test Technology Limited. If there is a need to alter or revise this document, the right belongs to Guangdong Asia Hongke Test Technology Limited, and it should give a prior written notice of the revision document. This test report must not be used by the client to claim product endorsement. Guangdong Asia Hongke Test Technology Limited B1/F, Building 11, Junfeng Industrial Park, Chongqing Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China. TEST REPORT Product Name : Thermal Scope Brand Name : N/A Model : BH-ATG01-650-LRF Series Model : BH-ATG01-335-LRF FCC ID : 2BVMX-BH-ATG01 Applicant : Henan Bosean Technology Corporation Limited Address : Block 10. Yida Technology New Park No. 16 JinZhan Road National High-Tech Zone, Zhengzhou, Henan Province, China Manufacturer : Henan Bosean Technology Corporation Limited Address : Block 10. Yida Technology New Park No. 16 JinZhan Road National High-Tech Zone, Zhengzhou, Henan Province, China Standard(s) : FCC CFR Title 47 Part 15 Subpart C Section 15.247 Date of Receipt : Mar. 27, 2026 Date of Test : Mar. 27, 2026~ Apr. 03, 2026 Issued Date : Apr. 15, 2026 Issued By: Guangdong Asia Hongke Test Technology Limited B1/F, Building 11, Junfeng Industrial Park, Chongqing Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China Tel.: +86 0755-230967639 Fax.: +86 0755-230967639 Reviewed by: Approved by: Aalen.Ye Allen Wang Page 2 of 33 Report No.: AiTSZ-260327010FW1 Report Revise Record Report Version Issued Date Notes M0 Apr. 15, 2026 Initial Release Page 3 of 33 Report No.: AiTSZ-260327010FW1 Contents 1 TEST SUMMARY ....................................................................................................................................................... 4 1.1 TEST STANDARDS ......................................................................................................................................................... 4 1.2 TEST SUMMARY ........................................................................................................................................................... 4 1.3 TEST FACILITY .............................................................................................................................................................. 5 1.4 MEASUREMENT UNCERTAINTY ........................................................................................................................................ 5 2 GENERAL INFORMATION .......................................................................................................................................... 6 2.1 ENVIRONMENTAL CONDITIONS ........................................................................................................................................ 6 2.2 GENERAL DESCRIPTION OF EUT ...................................................................................................................................... 6 2.3 DESCRIPTION OF TEST MODES AND TEST FREQUENCY .......................................................................................................... 7 2.4 SPECIAL ACCESSORIES ................................................................................................................................................... 8 2.5 EQUIPMENT LIST FOR THE TEST ....................................................................................................................................... 8 3 TEST CONDITIONS AND RESULTS ............................................................................................................................ 10 3.1 CONDUCTED EMISSIONS TEST ....................................................................................................................................... 10 3.2 RADIATED EMISSIONS AND BAND EDGE .......................................................................................................................... 13 3.3 MAXIMUM PEAK CONDUCTED OUTPUT POWER ............................................................................................................... 20 3.4 POWER SPECTRAL DENSITY .......................................................................................................................................... 21 3.5 6DB BANDWIDTH ....................................................................................................................................................... 22 3.6 OUT-OF-BAND EMISSIONS ........................................................................................................................................... 23 3.7 ANTENNA REQUIREMENT ............................................................................................................................................. 25 4 TEST SETUP PHOTOGRAPHS OF EUT ....................................................................................................................... 26 5 PHOTOS OF EUT ..................................................................................................................................................... 27 Page 4 of 33 Report No.: AiTSZ-260327010FW1 1 TEST SUMMARY 1.1 Test Standards The tests were performed according to following standards: FCC Rules Part 15.247: Frequency Hopping, Direct Spread Spectrum and Hybrid Systems that are in operation within the bands of 902-928 MHz, 2400-2483.5 MHz, and 5725-5850 MHz ANSI C63.10: 2020: American National Standard for Testing Unlicensed Wireless Devices KDB558074 D01 15.247 Meas Guidance v05r02: Guidance for Compliance Meas…

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承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： WAN7020L245M0X 規格 DESCRIPTION ： Chip Antenna 7020 M-Ant 2.45G Type 03,04,05 版本 VERSION ： V2.1 日期 ISSUE DATE ： 2018/01/30 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray James Thor 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112台北市北投區中央南路二段36號3樓 2F., No.163, Sec. 1, Xi'an St., Beitou Dist., Taipei City 112, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 2/11 ONEWAVE TECHNOLOGY CO., LTD. 7020 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 7.00 ± 0.20 W 2.00 ± 0.20 T 1.95 ± 0.20 P/N: WAN7020L245M03 WAN7020L245M04 WAN7020L245M05 3/11 ONEWAVE TECHNOLOGY CO., LTD. Part Number Information WAN 7020 L 245 M 0X A B C D E F A Product Series Antenna B Dimension L x W 7.0X2.0mm (+-0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode Monopole & Single Feeding F Antenna type 0X=03,04,05 / Type=03,04,05 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN7020L245M03 WAN7020L245M04 WAN7020L245M05 Central Frequency 2450 MHz Bandwidth 170 (Min.) MHz Return Loss -10 (Max) dB Peak Gain 3.64 dBi Impedance 50 Ohm Operating Temperature -40～+85 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) 4/11 ONEWAVE TECHNOLOGY CO., LTD. 2. Recommended PCB Pattern Evaluation Board Dimension Unit : mm Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度±1%以下的電感、電容、電阻 5/11 ONEWAVE TECHNOLOGY CO., LTD.  Layout Dimensions in Clearance area ( Size=10.0*5.0mm) Matching circuit FootPrint (Unit : mm) 6/11 ONEWAVE TECHNOLOGY CO., LTD. 3. Measurement Results Return Loss 7/11 ONEWAVE TECHNOLOGY CO., LTD. Radiation Pattern Efficiency Peak Gain 2400MHz 73.40% 3.11 dBi 2450MHz 78.06 % 3.64 dBi 2500MHz 71.20 % 2.88 dBi Chamber Coordinate System Y Z X 8/11 ONEWAVE TECHNOLOGY CO., LTD. 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10±0.5 sec. 60sec .. TEMP (°C) 150°C 260°C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +85±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +85°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 85±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C 9/11 ONEWAVE TECHNOLOGY CO., LTD. 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradualcooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 10/11 ONEWAVE TECHNOLOGY CO., LTD. 6.Packaging Information  Tape Specification:  Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 12 12±1.0 60±2 13.5±0.5 178±2 2000 11/11 ONEWAVE TECHNOLOGY CO., LTD. 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: -10~ 40°C and 30~70% RH. 2. Recommended products should be used within 6 months from the time of delivery. 3. The packaging material shoul…

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Page 1 of 26 Report No.: AiTSZ-260327010FW1 Appendix RF test data for WIFI2.4G Page 2 of 26 Report No.: AiTSZ-260327010FW1 1. Duty Cycle 1.1 Test Result 1.1.1 Ant1 Ant1 Mode TX Type Frequency (MHz) T_on (ms) Period (ms) Duty Cycle (%) Duty Cycle Correction Factor (dB) Max. DC Variation (%) 802.11b SISO 2412 100.000 100.000 100.00 0.00 0.00 2437 100.000 100.000 100.00 0.00 0.00 2462 100.000 100.000 100.00 0.00 0.00 802.11g SISO 2412 100.000 100.000 100.00 0.00 0.00 2437 100.000 100.000 100.00 0.00 0.00 2462 100.000 100.000 100.00 0.00 0.00 Page 3 of 26 Report No.: AiTSZ-260327010FW1 1.2 Test Graph 1.2.1 Ant1 802.11b_LCH_2412MHz_Ant1 (SISO)_NTNV 802.11b_MCH_2437MHz_Ant1 (SISO)_NTNV Page 4 of 26 Report No.: AiTSZ-260327010FW1 802.11b_HCH_2462MHz_Ant1 (SISO)_NTNV 802.11g_LCH_2412MHz_Ant1 (SISO)_NTNV Page 5 of 26 Report No.: AiTSZ-260327010FW1 802.11g_MCH_2437MHz_Ant1 (SISO)_NTNV 802.11g_HCH_2462MHz_Ant1 (SISO)_NTNV Page 6 of 26 Report No.: AiTSZ-260327010FW1 2. Bandwidth 2.1 Test Result 2.1.1 OBW Mode TX Type Frequency (MHz) ANT 99% Occupied Bandwidth (MHz) Verdict Result Limit 802.11b SISO 2412 1 12.523 / Pass 2437 1 12.933 / Pass 2462 1 12.613 / Pass 802.11g SISO 2412 1 16.448 / Pass 2437 1 16.504 / Pass 2462 1 16.523 / Pass 2.1.2 6dB BW Mode TX Type Frequency (MHz) ANT 6dB Bandwidth (MHz) Verdict Result Limit 802.11b SISO 2412 1 8.138 >=0.5 Pass 2437 1 8.178 >=0.5 Pass 2462 1 8.118 >=0.5 Pass 802.11g SISO 2412 1 16.129 >=0.5 Pass 2437 1 16.184 >=0.5 Pass 2462 1 16.168 >=0.5 Pass Page 7 of 26 Report No.: AiTSZ-260327010FW1 2.2 Test Graph 2.2.1 OBW 802.11b_LCH_2412MHz_Ant1 (SISO)_NTNV 802.11b_MCH_2437MHz_Ant1 (SISO)_NTNV Page 8 of 26 Report No.: AiTSZ-260327010FW1 802.11b_HCH_2462MHz_Ant1 (SISO)_NTNV 802.11g_LCH_2412MHz_Ant1 (SISO)_NTNV Page 9 of 26 Report No.: AiTSZ-260327010FW1 802.11g_MCH_2437MHz_Ant1 (SISO)_NTNV 802.11g_HCH_2462MHz_Ant1 (SISO)_NTNV Page 10 of 26 Report No.: AiTSZ-260327010FW1 2.2.2 6dB BW 802.11b_LCH_2412MHz_Ant1 (SISO)_NTNV 802.11b_MCH_2437MHz_Ant1 (SISO)_NTNV Page 11 of 26 Report No.: AiTSZ-260327010FW1 802.11b_HCH_2462MHz_Ant1 (SISO)_NTNV 802.11g_LCH_2412MHz_Ant1 (SISO)_NTNV Page 12 of 26 Report No.: AiTSZ-260327010FW1 802.11g_MCH_2437MHz_Ant1 (SISO)_NTNV 802.11g_HCH_2462MHz_Ant1 (SISO)_NTNV Page 13 of 26 Report No.: AiTSZ-260327010FW1 3. Maximum Conducted Output Power 3.1 Test Result 3.1.1 Power Mode TX Type Frequency (MHz) Maximum Peak Conducted Output Power (dBm) Verdict ANT1 Limit 802.11b SISO 2412 8.59 <=30 Pass 2437 8.22 <=30 Pass 2462 7.51 <=30 Pass 802.11g SISO 2412 6.08 <=30 Pass 2437 6.77 <=30 Pass 2462 5.71 <=30 Pass Note1: Antenna Gain: Ant1: 3.64dBi; Page 14 of 26 Report No.: AiTSZ-260327010FW1 4. Maximum Power Spectral Density 4.1 Test Result 4.1.1 PSD Mode TX Type Frequency (MHz) Maximum PSD (dBm) Verdict ANT1 Limit 802.11b SISO 2412 -4.93 <=8 Pass 2437 -2.23 <=8 Pass 2462 -2.60 <=8 Pass 802.11g SISO 2412 -14.38 <=8 Pass 2437 -13.76 <=8 Pass 2462 -14.57 <=8 Pass Note1: Antenna Gain: Ant1: 3.64dBi; Page 15 of 26 Report No.: AiTSZ-260327010FW1 4.2 Test Graph 4.2.1 PSD 802.11b_LCH_2412MHz_Ant1 (SISO)_NTNV 802.11b_MCH_2437MHz_Ant1 (SISO)_NTNV Page 16 of 26 Report No.: AiTSZ-260327010FW1 802.11b_HCH_2462MHz_Ant1 (SISO)_NTNV 802.11g_LCH_2412MHz_Ant1 (SISO)_NTNV Page 17 of 26 Report No.: AiTSZ-260327010FW1 802.11g_MCH_2437MHz_Ant1 (SISO)_NTNV 802.11g_HCH_2462MHz_Ant1 (SISO)_NTNV Page 18 of 26 Report No.: AiTSZ-260327010FW1 5. Unwanted Emissions In Non-restricted Frequency Bands 5.1 Test Result 5.1.1 Ref Mode TX Type Frequency (MHz) ANT Level of Reference (dBm) 802.11b SISO 2412 1 -4.82 2437 1 -2.22 2462 1 -2.85 802.11g SISO 2412 1 -14.49 2437 1 -13.58 2462 1 -15.16 5.1.2 CSE Mode TX Type Frequency (MHz) ANT Level of Reference (dBm) Limit (dBm) Verdict 802.11b SISO 2412 1 -4.82 -24.82 Pass 2437 1 -2.22 -22.22 Pass 2462 1 -2.85 -22.85 Pass 802.11g SISO 2412 1 -14.49 -34.49 Pass 2437 1 -13.58 -33.58 Pass 2462 1 -15.16 -35.16 Pass Page 19 of 26 Report No.: AiTSZ-260327010FW1 5.2 Test Graph 5.2.1 Ref 802.11b_LCH_2412MHz_Ant1 (SISO)_NTNV 802.11b_MCH_2437MHz_Ant1 (SISO)_NTNV Page 20 of 26 Report No.: AiTSZ-260327010FW1 802.11b_HCH_2462MHz_Ant1 (SISO)_NTNV 802.11g_LCH_2412MHz_Ant1 (SISO)_NTNV Page 21 of 26 Report No.: AiTSZ-260327010FW1 802.11g_MCH_2437MHz_Ant1 (SISO)_NTNV 802.11g_HCH_2462MHz_Ant1 (SISO)_NTNV Page 22 of 26 Report No.: AiTSZ-260327010FW1 5.2.2 CSE 802.11b_LCH_2412MHz_Ant1 (SISO)_NTNV 802.11b_LCH_2412MHz_Ant1 (SISO)_NTNV Page 23 of 26 Report No.: AiTSZ-260327010FW1 802.11b_MCH_2437MHz_Ant1 (SISO)_NTNV 802.11b_HCH_2462MHz_Ant1 (SISO)_NTNV Page 24 of 26 Report No.: AiTSZ-260327010FW1 802.11b_HCH_2462MHz_Ant1 (SISO)_NTNV 802.11g_LCH_2412MHz_Ant1 (SISO)_NTNV Page 25 of 26 Report No.: AiTSZ-260327010FW1 802.11g_LCH_2412MHz_Ant1 (SISO)_NTNV 802.11g_MCH_2437MHz_Ant1 (SISO)_NTNV Page 26 of 26 Report No.: AiTSZ-260327010FW1 802.11g_HCH_2462MHz_Ant1 (SISO)_NTNV 802.11g_HCH_2462MHz_Ant1 (SISO)_NTNV ********************** End of Report **********************

Page 1 of 2 FCC ID: 2BVMX-BH-ATG01 Page 2 of 2 FCC ID: 2BVMX-BH-ATG01