2BWB2-BA100BA100 PROJECTOR

DongguanJianshuTechnologyCo.,Ltd. Room314,No.Oneof552NorthTangxiaAvenue,TangxiaTownDongguan,Guangdong,P.R. China Date:2026-06-03 FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 Ref:AttestationStatementsPart2.911(d)(7)Filing SUBJECT:FCCApplicationforFCCID:2BWB2-BA100 FCCApplicationforFRN:0038473005 DongguanJianshuTechnologyCo.,Ltd.certifiesthat,asofthedateofthefilingofthe application,HOPEKCORPORATIONINCisourdesignatedU.S.agentforserviceofprocess fortheabovereferencedFCCID.DongguanJianshuTechnologyCo.,Ltd.acceptstomaintain anagentfornolessthanoneyearafterthegranteehasterminatedallmarketingand importationortheconclusionofanyCommission-relatedproceedinginvolvingtheequipment. HOPEKCORPORATIONINCaccepts,asofthedateofthefilingoftheapplication,the obligationofthedesignatedU.S.agentforserviceofprocessfortheabovereferencedFCC ID. DesignatedU.S.AgentInformation: Name:HOPEKCORPORATIONINC Address:16755CoyoteBushDrUnit84,SanDiego,CA92127UnitedStates FRN：0034562900 ContactPerson:YangyangXu Tel.:(561)875-9826 Email:[email protected] Sincerely, SignedonbehalfofDongguanJianshu TechnologyCo.,Ltd. SignedonbehalfofHOPEKCORPORATION INC Name:MaKaiName:YangyangXu Title:ManagerTitle: Date:2026-06-03Date:2026-06-03

Rev1/26/2023 DongguanJianshuTechnologyCo.,Ltd. Room314,No.Oneof552NorthTangxiaAvenue,TangxiaTownDongguan,Guangdong,P.R.China FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:06-02-2026 Ref:AttestationStatementsPart2.911(d)(5)(i)Filing FCCID:2BWB2-BA100 DongguanJianshuTechnologyCo.,Ltd.certifiesthattheequipmentforwhichauthorizationissoughtis not“covered”equipmentprohibitedfromreceivinganequipmentauthorizationpursuanttosection 2.903oftheFCCrules. DongguanJianshuTechnologyCo.,Ltd.certifiesthattheequipmentforwhichauthorizationissought doesnotincludecybersecurityoranti-virussoftwareproducedorprovidedbyKasperskyLab,Inc.orany ofitssuccessorsandassignees,includingequipmentwithintegratedKasperskyLab,Inc.(oranyofits successorsandassignees)cybersecurityoranti-virussoftwarepursuanttoDA-24-886andKDB986446 D01CoveredEquipmentGuidancesectionB(2a). Deviceisinherentlycompliantbasedonhardwarelimitationsorsoftwarecontrols. or ASoftwareBillofMaterials(SBOM)isprovidedtotheTCBforreview,and Theend-userorthirdpartiescannotinstalladditionalsoftwareonthisdevice. Sincerely, MaKai Rev1/26/2023 DongguanJianshuTechnologyCo.,Ltd. Room314,No.Oneof552NorthTangxiaAvenue,TangxiaTownDongguan,Guangdong,P.R.China FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:06-02-2026 Ref:AttestationStatementsPart2.911(d)(5)(ii)Filing FCCID:2BWB2-BA100 DongguanJianshuTechnologyCo.,Ltd.certifiesthat,asofthedateofthefilingoftheapplication,the applicantisnotidentifiedontheCoveredList(asaspecificallynamedentityoranyofitssubsidiariesor affiliates)asanentityproducing“covered”equipment. Sincerely, MaKai

DongguanJianshuTechnologyCo.,Ltd. Room314,No.Oneof552NorthTangxiaAvenue,TangxiaTownDongguan,Guangdong,P.R. China Date：06/02/2026 ProductModelNumber:BA100 FCCID ： 2BWB2-BA100 Towhomitmayconcern, Re:ProductCertificationRepresentativeAuthorizationLetter WeauthorizeQAILaboratoriesLtd.3980NorthFraserWay,BurnabyB.C. CanadaV5J5K5toactonourbehalfonallmattersconcerningtheabove namedequipment. Thisshallincludethefollowing: Testing Approvalapplicationsandprocedures WedeclarethatQAILaboratoriesLtd.isallowedtoforwardallinformation relatedtotheapprovalprojecttotheappliedcertificationbodyandtothe notificationentitiesandtodiscussanyissuesconcerningtheapproval application.AnyandallactscarriedoutbyQAILaboratoriesLtd.onour behalfshallhavethesameeffectasactsofourown. By: ContactListedonFCCWesbite Title:Manager Email:[email protected] Telephone:18823335054 Onbehalfof:DongguanJianshuTechnologyCo.,Ltd.

DongguanJianshuTechnologyCo.,Ltd. Room314,No.Oneof552NorthTangxiaAvenue,TangxiaTownDongguan,Guangdong,P.R. China OfficeofEngineeringTechnology FederalCommunicationsCommission 7435OaklandMillsRoad Columbia,MD21046 USA Date:June2,2026 Subject;RequestforConfidentiality FCCID:2BWB2-BA100 ToWhomItMayConcern, PursuanttotheprovisionsoftheCommission’srulesTitle47Sections§0.457and§0.459,we arerequestingtheCommissiontowithholdthefollowingattachment(s)asconfidential documentsfrompublicdisclosureindefinitely. Thesedocumentscontaindetailedsystemandequipmentdescriptionsandareconsideredas proprietaryinformationinoperationoftheequipment.Thepublicdisclosureofthese documentsmightbeharmfultoourcompanyandwouldgivecompetitorsanunfairadvantage inthemarket. SchematicDiagram BlockDiagram OperationalDescription SoftwareSecurityRequirementsforUNIIdevices Inadditionaltoabovementioneddocuments,inordertocomplywiththemarketingregulations inTitle47CFR§2.803andtheimportationrulesinTitle47CFR§2.1204,whileensuringthat businesssensitiveinformationremainsconfidentialuntiltheactualmarketingofnewly authorizeddevices,werequestShortTermConfidentialityofthefollowingattachment(s); TestSetupPhotos InternalPhotos UserManual For45days,pursuanttoPublicNoticeDA04-1705. OR For180dayspursuanttoKDB726920D01. Itisourunderstandingthatallmeasurementtestreports,FCCIDlabelformatand correspondenceduringthecertificationreviewprocesscannotbegrantedasconfidential documentsandthisinformationwillbeavailableforpublicreviewoncethegrantofequipment authorizationisissued. Sincerely, Signature: Name:MaKai Title:Manager

DongguanJianshuTechnologyCo.,Ltd. Room314,No.Oneof552NorthTangxiaAvenue,TangxiaTownDongguan,Guangdong,P.R. China FCCSoftwareConfigurationControlDeclaration Date:June2,2026 FederalCommunicationsCommission 7435OaklandMillsRoad Columbia,MD21046 USA Attn:OETDept. Product/ModelNumber:BA100 FCC-ID:2BWB2-BA100 RegardingFCCCountryCodeSelectionguidelinesidentifiedinKDB594280. “Allapplicationsforequipmentauthorizationfortransmittersthatcanhave radioparameters,orothertechnicalparameters,reportedtotheCommission setbysoftwaremusthaveanattestationindicatingthatnothirdpartywillhave software,orconfigurationcontrol,toprogramthedeviceoutofcomplianceof thetechnicalrulesunderwhichithasbeencertified.” Wedeclarethatnothirdpartywillhavesoftware,orconfigurationcontrol,toprogram thedeviceoutofcomplianceofthetechnicalrulesunderwhichithasbeencertified. Name:MaKaiDate:June2,2026 Title:Manager Signatureofapplicant ：

FCCID:2BWB2-BA100 Photo1 Photo2 FCCID:2BWB2-BA100 Photo3 Photo4 FCCID:2BWB2-BA100 Photo5 Photo6 FCCID:2BWB2-BA100 Photo7

FCCID:2BWB2-BA100 Label Labelsize:2.5cm*1cm Labelfont:Arial FCCID:2BWB2-BA100

RFExposureevaluation FCCID2BWB2-BA100 ProductNameBA100PROJECTOR Model/TypereferenceBA100 ListedModel(s)N/A 1.Reference ANSIC95.1–1999:IEEEStandardforSafetyLevelswithRespecttoHumanExposuretoRadio FrequencyElectromagneticFields,3kHzto300GHz. FCCKDBpublication447498D01General1RFExposureGuidancev06:MobileandPortable DevicesRFExposureProceduresandEquipmentAuthorizationPolicies. FCCCFR47part11.1310:Radiofrequencyradiationexposurelimits. FCCCFR47part22.1091:Radiofrequencyradiationexposureevaluation:mobiledevices 2.Limit LimitsforMaximumPermissibleExposure(MPE)/ControlledExposure Frequency Range(MHz) ElectricField Strength(V/m) MagneticField Strength(A/m) PowerDensity (mW/cm²) AveragingTime (minute) LimitsforOccupational/ControlledExposure 0.3–3.0 3.0–30 30–300 300–1500 1500–100,000 614 1842/f 61.4 / / 1.63 4.89/f 0.163 / / (100)* (900/f2)* 1.0 f/300 5 6 6 6 6 6 LimitsforMaximumPermissibleExposure(MPE)/UncontrolledExposure Frequency Range(MHz) ElectricField Strength(V/m) MagneticField Strength(A/m) PowerDensity (mW/cm²) AveragingTime (minute) LimitsforOccupational/ControlledExposure 0.3–3.0 3.0–30 30–300 300–1500 1500–100,000 614 824/f 27.5 / / 1.63 2.19/f 0.073 / / (100)* (180/f2)* 0.2 f/1500 1.0 30 30 30 30 30 F=frequencyinMHz *=Plane-waveequivalentpowerdensity 3.MPECalculationMethod PredicationofMPElimitatagivendistance Equationfrompage18ofOETBulletin65,Edition97-01 S=PG/4πR² Where:S=powerdensity P=powerinputtoantenna G=powergainoftheantennainthedirectionofinterestrelativetoanisotropicradiator R=distancetothecenterofradiationoftheantenna 4.AntennaInformation -Amodulecanonlyuseantennascertificatedasfollowsprovidedbymanufacturer; AntennaNo.Typeofantenna: Gainoftheantenna (Max.) Frequencyrange: 2.4GWIFIInternalAntenna2.95dBi2400-2500MHz 5.8GWIFIInternalAntenna3.40dBi5725-5850MHz 5.ConductedOutputPower BLE Modulation Channel OutputPower (dBm) OutputPower (mW) BLE1M 1 -7.550.18 19 -7.650.17 39 -7.570.17 BLE2M 1 -7.460.18 19 -7.580.17 39 -7.420.18 WiFi2.4G Modulation Channel OutputPower (dBm) OutputPower (mW) 802.11b 1 14.1726.12 6 13.9124.60 11 14.4027.54 802.11g 1 9.939.84 6 9.418.73 11 9.739.40 802.11n (HT20) 1 9.689.29 6 9.468.83 11 9.739.40 802.11n (HT40) 3 7.926.19 6 9.819.57 9 9.719.35 802.11ax (HT20) 1 10.5111.25 6 9.388.67 11 9.769.46 802.11ax (HT40) 3 7.906.17 6 7.956.24 9 7.796.01 WiFi5.8G Modulation Channel OutputPower (dBm) OutputPower (mW) 802.11a 1495.563.60 1575.483.53 1655.123.25 802.11n (HT20) 1495.753.76 1575.573.61 1655.513.56 802.11n (HT40) 1515.953.94 1595.843.84 802.11ac (HT20) 1496.084.06 1575.603.63 1655.223.33 802.11ac (HT40) 1515.343.42 1595.213.32 802.11ac (HT80) 1555.333.41 802.11ax (HT20) 1495.713.72 1575.583.61 1655.263.36 802.11ax (HT40) 1515.883.87 1595.693.71 802.11ax (HT80) 1555.813.81 6.ManufacturingTolerance BLE BLE1M ChannelChannel1 Channel19 Channel39 Target(dBm) -7-7-7 Tolerance±(dB) 1.0 1.01.0 BLE2M ChannelChannel1 Channel19 Channel39 Target(dBm) -7-7-7 Tolerance±(dB) 1.0 1.01.0 WiFi2.4G 11B ChannelChannel1 Channel6 Channel11 Target(dBm) 141314 Tolerance±(dB) 1.0 1.01.0 11G Channel Channel3Channel6Channel9 Target(dBm) 999 Tolerance±(dB) 1.01.01.0 11N20 ChannelChannel1Channel6Channel11 Target(dBm) 999 Tolerance±(dB) 1.0 1.01.0 11N40 ChannelChannel3Channel6Channel9 Target(dBm) 799 Tolerance±(dB) 1.01.01.0 11AX20 ChannelChannel1Channel6Channel11 Target(dBm) 1099 Tolerance±(dB) 1.0 1.01.0 11AX40 ChannelChannel3Channel6Channel9 Target(dBm) 777 Tolerance±(dB) 1.01.01.0 WiFi5.8G 11A Channel Channel149Channel157Channel165 Target(dBm) 555 Tolerance±(dB) 1.01.01.0 11N20 Channel Channel149Channel151 Channel165 Target(dBm) 55 5 Tolerance±(dB) 1.01.0 1.0 11N40 Channel Channel151 Channel155 Target(dBm) 5 5 Tolerance±(dB) 1.0 1.0 11AC20 Channel Channel149Channel157Channel165 Target(dBm) 655 Tolerance±(dB) 1.01.01.0 11AC40 Channel Channel151 Channel159 Target(dBm) 5 5 Tolerance±(dB) 1.0 1.0 11AC80 Channel Channel155 Target(dBm) 5 Tolerance±(dB) 1.0 11AX20 Channel Channel149Channel157Channel165 Target(dBm) 555 Tolerance±(dB) 1.01.01.0 11AX40 Channel Channel151 Channel159 Target(dBm) 5 5 Tolerance±(dB) 1.0 1.0 11AX80 Channel Channel155 Target(dBm) 5 Tolerance±(dB) 1.0 7.StandaloneMPEResult AsdeclaredbytheApplicant,theEUTisawirelessdeviceusedinafixapplication,atleast20 cmfromanybodypartoftheuserornearbypersons;fromthemaximumEUTRFoutput power,theminimumseparationdistance,r=20cm,aswellasthegainoftheusedantennais 2.08dBiand3.03,theRFpowerdensitycanbeobtained. Mode Outputpower Antenna Gain(dBi) Antenna Gain(linear) MPE (mW/cm 2 ) MPELimits (mW/cm 2 ) dBmmW BLE-6 0.25 2.951.97 0.00010 1.0000 2.4GWIFI1531.622.951.970.012411.0000 5GWIFI75.013.402.190.002181.0000 Remark: 1.Outputpowerincludingturn-uptolerance; 2.MPEevaluatedistanceis20cmfromusermanualprovidebymanufacturer. 8.Conclusion ThemeasurementresultscomplywiththeFCCLimitper47CFR2.1091fortheuncontrolled RFExposureofmobiledevice. ------Endofthereport------

FCCID:2BWB2-BA100 1.DutyCycle 1.1TestResult 1.1.1Ant1 Ant1 Mode TX Type Frequency (MHz) RU RU Pos T_on (ms) Period (ms) DutyCycle (%) DutyCycle CorrectionFactor(dB) Max.DC Variation(%) 802.11aSISO 5745//1.3941.43797.010.130.03 5785//1.3941.43697.080.130.03 5825//1.3941.43697.080.130.03 802.11n (HT20) SISO 5745//1.3021.34496.880.140.03 5785//1.3021.34596.800.140.03 5825//1.3021.34696.730.140.07 802.11n (HT40) SISO 5755//0.6490.69293.790.280.04 5795//0.6480.69293.640.290.04 802.11ac (VHT20) SISO 5745//1.3141.35796.830.140.03 5785//1.3131.35696.830.140.00 5825//1.3141.35796.830.140.03 802.11ac (VHT40) SISO 5755//0.6520.69693.680.280.03 5795//0.6530.69693.820.280.03 802.11ac (VHT80) SISO5775//0.3240.36888.040.550.07 802.11ax (HEW20) SISO 5745SU/1.3121.35696.760.140.03 5785SU/1.3131.35796.760.140.03 5825SU/1.3131.35796.760.140.03 802.11ax (HEW40) SISO 5755SU/0.6530.69793.690.280.06 5795SU/0.6530.69793.690.280.03 802.11ax (HEW80) SISO5775SU/0.3240.36888.040.550.08 FCCID:2BWB2-BA100 1.2TestGraph 1.2.1Ant1 802.11a_LCH_5745MHz_Ant1_NTNV 802.11a_MCH_5785MHz_Ant1_NTNV FCCID:2BWB2-BA100 802.11a_HCH_5825MHz_Ant1_NTNV 802.11n(HT20)_LCH_5745MHz_Ant1_NTNV FCCID:2BWB2-BA100 802.11n(HT20)_MCH_5785MHz_Ant1_NTNV 802.11n(HT20)_HCH_5825MHz_Ant1_NTNV FCCID:2BWB2-BA100 802.11n(HT40)_LCH_5755MHz_Ant1_NTNV 802.11n(HT40)_HCH_5795MHz_Ant1_NTNV FCCID:2BWB2-BA100 802.11ac(VHT20)_LCH_5745MHz_Ant1_NTNV 802.11ac(VHT20)_MCH_5785MHz_Ant1_NTNV FCCID:2BWB2-BA100 802.11ac(VHT20)_HCH_5825MHz_Ant1_NTNV 802.11ac(VHT40)_LCH_5755MHz_Ant1_NTNV FCCID:2BWB2-BA100 802.11ac(VHT40)_HCH_5795MHz_Ant1_NTNV 802.11ac(VHT80)_MCH_5775MHz_Ant1_NTNV FCCID:2BWB2-BA100 802.11ax(HEW20)_LCH_5745MHz_SU_/_Ant1_NTNV 802.11ax(HEW20)_MCH_5785MHz_SU_/_Ant1_NTNV FCCID:2BWB2-BA100 802.11ax(HEW20)_HCH_5825MHz_SU_/_Ant1_NTNV 802.11ax(HEW40)_LCH_5755MHz_SU_/_Ant1_NTNV FCCID:2BWB2-BA100 802.11ax(HEW40)_HCH_5795MHz_SU_/_Ant1_NTNV 802.11ax(HEW80)_MCH_5775MHz_SU_/_Ant1_NTNV FCCID:2BWB2-BA100 2.Bandwidth 2.1TestResult 2.1.1OBW Mode TX Type Frequency (MHz) RU RU Pos ANT 99%OccupiedBandwidth(MHz) Verdict ResultLimit 802.11aSISO 5745//117.112/Pass 5785//117.051/Pass 5825//117.144/Pass 802.11n (HT20) SISO 5745//118.030/Pass 5785//118.056/Pass 5825//118.145/Pass 802.11n (HT40) SISO 5755//136.428/Pass 5795//136.288/Pass 802.11ac (VHT20) SISO 5745//117.963/Pass 5785//117.987/Pass 5825//117.991/Pass 802.11ac (VHT40) SISO 5755//136.275/Pass 5795//136.133/Pass 802.11ac (VHT80) SISO5775//175.742/Pass 802.11ax (HEW20) SISO 5745SU/118.082/Pass 5785SU/117.939/Pass 5825SU/118.021/Pass 802.11ax (HEW40) SISO 5755SU/136.278/Pass 5795SU/136.212/Pass 802.11ax (HEW80) SISO5775SU/175.734/Pass 2.1.26dBBW Mode TX Type Frequency (MHz) RU RU Pos ANT 6dBBandwidth(MHz) Verdict ResultLimit 802.11aSISO 5745//115.050>=0.5Pass 5785//115.676>=0.5Pass 5825//115.287>=0.5Pass 802.11n (HT20) SISO 5745//115.118>=0.5Pass 5785//115.142>=0.5Pass 5825//116.278>=0.5Pass 802.11n (HT40) SISO 5755//135.137>=0.5Pass 5795//135.105>=0.5Pass 802.11ac (VHT20) SISO 5745//116.972>=0.5Pass 5785//115.081>=0.5Pass 5825//115.401>=0.5Pass 802.11ac (VHT40) SISO 5755//133.890>=0.5Pass 5795//132.611>=0.5Pass 802.11ac (VHT80) SISO5775//175.151>=0.5Pass 802.11ax (HEW20) SISO 5745SU/115.101>=0.5Pass 5785SU/114.518>=0.5Pass 5825SU/115.151>=0.5Pass 802.11axSISO5755SU/135.106>=0.5Pass FCCID:2BWB2-BA100 (HEW40)5795SU/135.077>=0.5Pass 802.11ax (HEW80) SISO5775SU/175.023>=0.5Pass FCCID:2BWB2-BA100 2.2TestGraph 2.2.1OBW 802.11a_LCH_5745MHz_Ant1_NTNV 802.11a_MCH_5785MHz_Ant1_NTNV FCCID:2BWB2-BA100 802.11a_HCH_5825MHz_Ant1_NTNV 802.11n(HT20)_LCH_5745MHz_Ant1_NTNV FCCID:2BWB2-BA100 802.11n(HT20)_MCH_5785MHz_Ant1_NTNV 802.11n(HT20)_HCH_5825MHz_Ant1_NTNV FCCID:2BWB2-BA100 802.11n(HT40)_LCH_5755MHz_Ant1_NTNV 802.11n(HT40)_HCH_5795MHz_Ant1_NTNV FCCID:2BWB2-BA100 802.11ac(VHT20)_LCH_5745MHz_Ant1_NTNV 802.11ac(VHT20)_MCH_5785MHz_Ant1_NTNV FCCID:2BWB2-BA100 802.11ac(VHT20)_HCH_5825MHz_Ant1_NTNV 802.11ac(VHT40)_LCH_5755MHz_Ant1_NTNV FCCID:2BWB2-BA100 802.11ac(VHT40)_HCH_5795MHz_Ant1_NTNV 802.11ac(VHT80)_MCH_5775MHz_Ant1_NTNV FCCID:2BWB2-BA100 802.11ax(HEW20)_LCH_5745MHz_SU_/_Ant1_NTNV 802.11ax(HEW20)_MCH_5785MHz_SU_/_Ant1_NTNV FCCID:2BWB2-BA100 802.11ax(HEW20)_HCH_5825MHz_SU_/_Ant1_NTNV 802.11ax(HEW40)_LCH_5755MHz_SU_/_Ant1_NTNV FCCID:2BWB2-BA100 802.11ax(HEW40)_HCH_5795MHz_SU_/_Ant1_NTNV 802.11ax(HEW80)_MCH_5775MHz_SU_/_Ant1_NTNV FCCID:2BWB2-BA100 2.2.26dBBW 802.11a_LCH_5745MHz_Ant1_NTNV 802.11a_MCH_5785MHz_Ant1_NTNV FCCID:2BWB2-BA100 802.11a_HCH_5825MHz_Ant1_NTNV 802.11n(HT20)_LCH_5745MHz_Ant1_NTNV FCCID:2BWB2-BA100 802.11n(HT20)_MCH_5785MHz_Ant1_NTNV 802.11n(HT20)_HCH_5825MHz_Ant1_NTNV FCCID:2BWB2-BA100 802.11n(HT40)_LCH_5755MHz_Ant1_NTNV 802.11n(HT40)_HCH_5795MHz_Ant1_NTNV FCCID:2BWB2-BA100 802.11ac(VHT20)_LCH_5745MHz_Ant1_NTNV 802.11ac(VHT20)_MCH_5785MHz_Ant1_NTNV FCCID:2BWB2-BA100 802.11ac(VHT20)_HCH_5825MHz_Ant1_NTNV 802.11ac(VHT40)_LCH_5755MHz_Ant1_NTNV FCCID:2BWB2-BA100 802.11ac(VHT40)_HCH_5795MHz_Ant1_NTNV 802.11ac(VHT80)_MCH_5775MHz_Ant1_NTNV FCCID:2BWB2-BA100 802.11ax(HEW20)_LCH_5745MHz_SU_/_Ant1_NTNV 802.11ax(HEW20)_MCH_5785MHz_SU_/_Ant1_NTNV FCCID:2BWB2-BA100 802.11ax(HEW20)_HCH_5825MHz_SU_/_Ant1_NTNV 802.11ax(HEW40)_LCH_5755MHz_SU_/_Ant1_NTNV FCCID:2BWB2-BA100 802.11ax(HEW40)_HCH_5795MHz_SU_/_Ant1_NTNV 802.11ax(HEW80)_MCH_5775MHz_SU_/_Ant1_NTNV FCCID:2BWB2-BA100 3.MaximumConductedOutputPower 3.1TestResult 3.1.1Power Mode TX Type Frequency (MHz) RU RU Pos MaximumAverageConductedOutputPower (dBm) Verdict ANT1Limit 802.11aSISO 5745//5.56<=30Pass 5785//5.48<=30Pass 5825//5.12<=30Pass 802.11n (HT20) SISO 5745//5.75<=30Pass 5785//5.57<=30Pass 5825//5.51<=30Pass 802.11n (HT40) SISO 5755//5.95<=30Pass 5795//5.84<=30Pass 802.11ac (VHT20) SISO 5745//6.08<=30Pass 5785//5.60<=30Pass 5825//5.22<=30Pass 802.11ac (VHT40) SISO 5755//5.34<=30Pass 5795//5.21<=30Pass 802.11ac (VHT80) SISO5775//5.33<=30Pass 802.11ax (HEW20) SISO 5745SU/5.71<=30Pass 5785SU/5.58<=30Pass 5825SU/5.26<=30Pass 802.11ax (HEW40) SISO 5755SU/5.88<=30Pass 5795SU/5.69<=30Pass …

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承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： WAN097030JD251SN03 規格 DESCRIPTION ： Internal Antenna7030 M-Ant 2.45G +5G Type 03I 版本 VERSION ： V1.0 日期 ISSUE DATE ： 2023/12/7 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray Snow Jerry 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112台北市北投區立功街151號1樓 1F, No. 151, Li Gong Street, Beitou District, Taipei City 112, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 2/12 ONEWAVE TECHNOLOGY CO., LTD. 7030 Chip antenna For WLAN Dual-Band Applications Dimension (mm) L 7.00 ± 0.20 W 3.00 ± 0.20 T 1.15 ± 0.20 P/N: WAN097030JD251SN03 3/12 ONEWAVE TECHNOLOGY CO., LTD. Part Number Information WAN 09 7030 J D25 1S N 03 A G B C D H E F A Product Series Antenna B Dimension L x W 7.0X3.0mm (+-0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz + 5.15~5.85GHz E Feeding mode Monopole & Single Feeding F Antenna type Type = 03 G、H Internal Code 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN097030JD251SN03 Central Frequency 2450 / 5850MHz Bandwidth 100 / 800 (Min.) MHz Return Loss -10 (Max) dB Peak Gain 2.95/ 3.40dBi Impedance 50 Ohm Operating Temperature -40～+110 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) 4/12 ONEWAVE TECHNOLOGY CO., LTD. 2. Recommended PCB Pattern Evaluation Board Dimension Unit : mm Suggested Matching Circuit 5/12 ONEWAVE TECHNOLOGY CO., LTD. ◆ Layout Dimensions in Clearance area( Size=27.0*7.0mm) 50 ohm transmission Line FootPrint (Unit : mm) Matching circuit 6/12 ONEWAVE TECHNOLOGY CO., LTD. 3. Measurement Results Return Loss 7/12 ONEWAVE TECHNOLOGY CO., LTD. Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 70.69 % 4.33 2.83dBidBi 2450MHz 72.86 % 4.32 2.95 dBidBi 2500MHz 71.46 % 2.89 dBi 4.34 dBi Efficiency Peak Gain Directivity 5150MHz 75.83 % 3.28 dBi 6.48dBi 5500MHz 78.80 % 6.43 3.34dBidBi 5850MHz 76.44 % 6.50 3.40dBidBi X Z Y X Z Y 8/12 ONEWAVE TECHNOLOGY CO., LTD. Chamber Coordinate System 9/12 ONEWAVE TECHNOLOGY CO., LTD. 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10 ± 0.5 sec. 60 sec . . T E M P ( °C ) 150 °C 2 6 0 °C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C 10/12 ONEWAVE TECHNOLOGY CO., LTD. 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 11/12 ONEWAVE TECHNOLOGY CO., LTD. 6.Packaging Information ◆ Tape Specification: Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 16 16±1.0 60±2 13.5±0.5 178±2 2000 12/12 ONEWAVE TECHNOLOGY CO., LTD. 7.Storage and Transportation Information Storage Conditions To maintain the solderabi…

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ShenzhenBKCTestingCo.,Ltd.ReportNo.:BKC26052378EE-3 TestReportTel:4000-875-3820755-84829082Web:Http://www.bkc-lab.comPage1of28 TESTREPORT Applicant:DongguanJianshuTechnologyCo.,Ltd. Address: Room314,No.Oneof552NorthTangxiaAvenue,TangxiaTown Dongguan,Guangdong,P.R.China Manufacturer: DongguanJianshuTechnologyCo.,Ltd. Address: Room314,No.Oneof552NorthTangxiaAvenue,TangxiaTown Dongguan,Guangdong,P.R.China ProductName:BA100PROJECTOR ModelNumber:BA100 Trademark:N/A FCCID:2BWB2-BA100 TestDate:May20,2026toMay.28,2026 DateofReport: May.28,2026 TestResult: ThisdevicedescribedabovehasbeentestedbyBKC,andthetest resultsshowthattheequipmentundertest(EUT)isincompliance withtheStandardrequirements.Anditisapplicableonlytothetested sampleidentifiedinthereport. TestProcedureUsed: Standards:FCCCFR47Part15Section15.407 ANSIC63.10:2020+Cor1:2023 Preparedby(TestEngineer): StenHuang Reviewer(Supervisor): CaseyWang Approved(Manager): JerryLiao ShenzhenBKCTestingCo.,Ltd.ReportNo.:BKC26052378EE-3 TestReportTel:4000-875-3820755-84829082Web:Http://www.bkc-lab.comPage2of28 TABLEOFCONTENT 1.GeneralInformation......................................................................................4 1.1.DescriptionofDevice(EUT).......................................................................................................................4 1.2.ChannelList..................................................................................................................................................4 1.3.Summaryoftestresult................................................................................................................................4 1.4.SpecialAccessoriesandAuxiliaryEquipment........................................................................................5 1.5.Testmode......................................................................................................................................................5 1.6.BlockDiagram...............................................................................................................................................5 1.7.TestConditions.............................................................................................................................................5 1.8.MeasurementUncertainty(95%confidencelevels,k=2)......................................................................6 1.9.TestFacility....................................................................................................................................................6 1.10.TestEquipment...........................................................................................................................................6 2.Conductedemissionatthemainsterminalstest......................................9 2.1.Limit................................................................................................................................................................9 2.2.TestSetup......................................................................................................................................................9 2.3.TestProcedure..............................................................................................................................................9 2.4.TestResult...................................................................................................................................................10 3.RadiatedSpuriousEmissions...................................................................10 3.1.Limit..............................................................................................................................................................12 3.2.TestSetup....................................................................................................................................................14 3.3.TestProcedure............................................................................................................................................15 3.4.TestResult...................................................................................................................................................16 4.MaximumPeakOutputPower....................................................................20 4.1.Limit..............................................................................................................................................................20 4.2.TestSetup....................................................................................................................................................20 4.3.TestProcedure............................................................................................................................................20 4.4.TestResult...................................................................................................................................................21 5.-26dBBandwidth,-6dBBandwidthand99%BandwidthMeasurement22 5.1.Limit..............................................................................................................................................................22 5.2.TestSetup....................................................................................................................................................22 5.3.TestProcedure............................................................................................................................................22 5.4.TestResult...................................................................................................................................................23 6.PowerSpectraldensity...............................................................................24 6.1.Limit..............................................................................................................................................................24 6.2.TestSetup.............................…

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