2BXBU-DK01Finder

                                                                  
    
             
                 ­ €‚   ƒ    € ­ „ €  ‚       
            ‚…    ­ €‚   ƒ  € ­ƒ     ­ DK01 DK01                  ­€     ­€                 
   ‚           ƒ    „  … †  „       ‡                        „     „                 ˆ              ‰ „               „ Š        ‹‹    ‹‹‰   „   ‹‹„      Š      ‹‹ ‚   ŒŽ      ‚   „     ‚         ‘’“ 
     “               
  ” “      „ 
                  

 ”
’ ”    •”  •  •“
‰  ‘•   ‰ • “ “  ‘•        
 ”     •  • •  ” 
 ’„    •      

 

 
   
    ­

  Front Back

1/1 USAgentforServiceofProcessLETTEROFATTESTATION TO: OfficeofEngineeringTechnology FederalCommunicationsCommission 7435OaklandMillsRoad Columbia,MD21046 USAgentforServiceofProcess: CompanyName:HOPEKCORPORATIONINC Address:16755CoyoteBushDrUnit84,SanDiego,CA92127UnitedStates FRN:0034562900 ContactName:YangyangXu TelephoneNo:(561)875-9826 E-mail:[email protected] ThisletteristoconfirmthattheUSAgentforServiceofProcessacceptsresponsibilitytoactas alocalrepresentativeonbehalfofShenzhenMutualTechnologyCo.,Ltd TheUSAgentforServiceofProcessisawareofandagreestocomplywiththerequirements outlinedintheFCCEquipmentAuthorizationProgram,ReportandOrderFCC22-84,andclause §2.911. Applicant: CompanyName:ShenzhenMutualTechnologyCo.,Ltd ProductDescription:Finder FRN:0038692869 GranteeCode:2BXBU FCCID:2BXBU-DK01 ContactName:RyanHuang Address:RoomB,6thFloor,Building3,TingweiIndustrialPark,Xin'anStreet,Bao'anDistrict, Shenzhen TelephoneNo:13421337846 E-mail:[email protected] TheApplicantisawareofandagreestocomplywiththerequirementsoutlinedintheFCC EquipmentAuthorizationProgram,ReportandOrderFCC22-84,andclause§2.911. ThisAgreementisvaliduntil(Permanentlyvalid). Date:2026/8/18 Applicant’sName: ShenzhenMutualTechnologyCo.,Ltd USAgentforServiceofProcess’sName: HOPEKCORPORATIONINC Title:ManagerTitle:Manager SignatureSignature

Rev 1/26/2023 Shenzhen Mutual Technology Co., Ltd Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: Aug. 07, 2026 Ref: Attestation Statements Part 2.911(d)(5)(i) Filing FCC ID: 2BXBU-DK01 [Shenzhen Mutual Technology Co., Ltd] certifies that the equipment for which authorization is sought is not “covered” equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. [Shenzhen Mutual Technology Co., Ltd] certifies that the equipment for which authorization is sought does not include cybersecurity or anti-virus software produced or provided by Kaspersky Lab, Inc. or any of its successors and assignees, including equipment with integrated Kaspersky Lab, Inc. (or any of its successors and assignees) cybersecurity or anti-virus software pursuant to DA-24-886 and KDB 986446 D01 Covered Equipment Guidance section B(2a). Device is inherently compliant based on hardware limitations or software controls. or A Software Bill of Materials (SBOM) is provided to the TCB for review, and The end-user or third parties cannot install additional software on this device. Sincerely, (Applicant signature) (Applicant printed name) Ryan Huang Rev 1/26/2023 Shenzhen Mutual Technology Co., Ltd Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: Aug. 07, 2026 Ref: Attestation Statements Part 2.911(d)(5)(ii) Filing FCC ID: 2BXBU-DK01 [Shenzhen Mutual Technology Co., Ltd] certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List (as a specifically named entity or any of its subsidiaries or affiliates) as an entity producing “covered” equipment. Sincerely, (Applicant signature) (Applicant printed name) Ryan Huang

Shenzhen Mutual Technology Co., Ltd Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 USA Date: August 18, 2026 Subject; Request for Confidentiality FCC ID: 2BXBU-DK01 To Whom It May Concern, Pursuant to the provisions of the Commission’s rules Title 47 Sections §0.457 and §0.459, we are requesting the Commission to withhold the following attachment(s) as confidential documents from public disclosure indefinitely. These documents contain detailed system and equipment descriptions and are considered as proprietary information in operation of the equipment. The public disclosure of these documents might be harmful to our company and would give competitors an unfair advantage in the market. Schematic Diagram Block Diagram Parts List Operational Description Tune-up Procedure Software Security Requirements for UNII devices In additional to above mentioned documents, in order to comply with the marketing regulations in Title 47 CFR §2.803 and the importation rules in Title 47 CFR §2.1204, while ensuring that business sensitive information remains confidential until the actual marketing of newly authorized devices, we request Short Term Confidentiality of the following attachment(s); External Photos Test Setup Photos Internal Photos User Manual For 45 days, pursuant to Public Notice DA 04-1705. OR For 180 days pursuant to KDB 726920 D01. It is our understanding that all measurement test reports, FCC ID label format and correspondence during the certification review process cannot be granted as confidential documents and this information will be available for public review once the grant of equipment authorization is issued. Sincerely, Signature: Name: Ryan Huang Title: Manager

Effective Date: April 2, 2020 QSF 7.6.4-8 – Agent Authorization Letter Template Page 1 of 1 Revision Date: Revision: 0 Shenzhen Mutual Technology Co., Ltd Date: Aug. 07, 2026 Product Model Number: DK01 FCC ID: 2BXBU-DK01 To whom it may concern, Re: Product Certification Representative Authorization Letter We authorize QAI Laboratories Ltd. 3980 North Fraser Way, Burnaby B.C. Canada V5J 5K5 to act on our behalf on all matters concerning the above named equipment. This shall include the following:  Testing  Approval applications and procedures We declare that QAI Laboratories Ltd. is allowed to forward all information related to the approval project to the applied certification body and to the notification entities and to discuss any issues concerning the approval application. Any and all acts carried out by QAI Laboratories Ltd. on our behalf shall have the same effect as acts of our own. By: Contact Listed on FCC Wesbite Title: Manager Email: [email protected] Telephone: 13421337846 On behalf of: Shenzhen Mutual Technology Co., Ltd

Ext Photos Model: DK01 Photo 1 Photo 2 Photo 3 Photo 4 Photo 5 Photo 6

Process: Laser Engraving Process: Screen printing / Laser engraving 32mm 32mm 7mm 12mm 7.5mm 2.3mm 11mm 11.5mm 16mm 8mm

Int Photos Model: DK01 Photo 1 Photo 2 Photo 3 Photo 4 ANT Photo 5 Photo 6

- Page 1 of 9 - Report No.: HB20260720011E-02 Add:Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen,China Tel: (86-755) 29989321 Fax: (86-755) 29985110 Web:www.sz-hongbiao.com RF EXPOSURE Test Report Product: Finder Trade Mark: SUNDA Model Number: DK01 FCC ID: 2BXBU-DK01 Prepared for Shenzhen Mutual Technology Co., Ltd Room B, 6th Floor, Building 3, Tingwei Industrial Park, Xin'an Street, Bao'an District, Shenzhen Prepared by Shenzhen HongBiao Certification& Testing Co., Ltd Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen, China Tel.: +86-755-2998 9321 Fax.: +86-755-2998 5110 Website: http://www.sz-hongbiao.com - Page 2 of 9 - Report No.: HB20260720011E-02 Add:Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen,China Tel: (86-755) 29989321 Fax: (86-755) 29985110 Web:www.sz-hongbiao.com Table of Contents 1 GENERAL DESCRIPTION ..................................................................................................................................... 5 1.1 DESCRIPTION OF EUT ................................................................................................................................................ 5 1.2 TEST MODE .............................................................................................................................................................. 5 1.3 TEST SETUP .............................................................................................................................................................. 5 1.4 ANCILLARY EQUIPMENT .............................................................................................................................................. 5 2 TEST FACILITIES AND ACCREDITATIONS .............................................................................................................. 6 2.1 TEST LABORATORY ..................................................................................................................................................... 6 2.2 ENVIRONMENTAL CONDITIONS ..................................................................................................................................... 6 2.3 MEASUREMENT UNCERTAINTY ..................................................................................................................................... 6 2.4 TEST SOFTWARE ........................................................................................................................................................ 6 3 LIST OF TEST EQUIPMENT .................................................................................................................................. 7 4 RF EXPOSURE..................................................................................................................................................... 8 4.1 STANDALONE SAR TEST EXCLUSION CONSIDERATIONS........................................................................................................ 8 4.1.1. Limit ............................................................................................................................................................ 8 4.1.2. Test Procedures ........................................................................................................................................... 8 4.1.3. Test Result ................................................................................................................................................... 9 - Page 3 of 9 - Report No.: HB20260720011E-02 Add:Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen,China Tel: (86-755) 29989321 Fax: (86-755) 29985110 Web:www.sz-hongbiao.com TEST RESULT CERTIFICATION Applicant’s Name ................. : Shenzhen Mutual Technology Co., Ltd Address ................................. : Room B, 6th Floor, Building 3, Tingwei Industrial Park, Xin'an Street, Bao'an District, Shenzhen Manufacturer's Name .......... : Shenzhen Mutual Technology Co., Ltd Address ................................. : Room B, 6th Floor, Building 3, Tingwei Industrial Park, Xin'an Street, Bao'an District, Shenzhen Product description Product name ........................ : Finder Model Number ....................... : DK01 Standards ............................. : FCC CFR 47 PART 1 , 1.1310 Test procedure ....................... : KDB 447498 D01 General RF Exposure Guidance v06 This device described above has been tested by Shenzhen HongBiao Certification& Testing Co., Ltd and the test results show that the equipment under test (EUT) is in compliance with the EMC requirements. And it is applicable only to the tested sample identified in the report. Date of Test ........................................... : Date (s) of performance of tests ............. : July 20, 2026~Aug. 07, 2026 Test Result .............................................. : Pass Testing Engineer : ( Z o e Su) Technical Manager : (M i n g L i u) Authorized Signatory : (Leo S u) - Page 4 of 9 - Report No.: HB20260720011E-02 Add:Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen,China Tel: (86-755) 29989321 Fax: (86-755) 29985110 Web:www.sz-hongbiao.com Revision History Revised No. Date of Issue Description 01 Aug. 07, 2026 Original - Page 5 of 9 - Report No.: HB20260720011E-02 Add:Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen,China Tel: (86-755) 29989321 Fax: (86-755) 29985110 Web:www.sz-hongbiao.com 1 General Description 1.1 Description of EUT Product name: Finder Model name: DK01 Series…

Text truncated - open the document above for the full version.

2/11 ONEWAVE TECHNOLOGY CO., LTD. No. 151, Ligong St., Beitou Dist., Taipei City 11261, Taiwan (R.O.C.) 3216 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 3.23 ± 0.20 W 1.66 ± 0.20 T 0.45 ± 0.20 P/N: WAN3216F245H0X 3/11 ONEWAVE TECHNOLOGY CO., LTD. Part Number Information WAN 3216 F 245 H 0X A B C D E F A Product Series Antenna B Dimension L x W 3.2X1.6mm (+-0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode PIFA & Single Feeding F Antenna type X=06,07,08 / Type=06,07,08 1.Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN3216F245H0X Central Frequency 2450 MHz Bandwidth 120 (Min.) MHz Return Loss -6.5 (Max)dB Peak Gain 2.21 dBi Impedance 50 Ohm Operating Temperature -40～+85°C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Ni / Au (Leadless) 4/11 ONEWAVE TECHNOLOGY CO., LTD. 2.Recommended PCB Pattern Evaluation Board Dimension 2 nd Evaluation Board Dimension Suggested Matching Circuit Important Information : It is recommended to use inductors, capacitors and resistors with an accuracy of ±1% or less for matching components. 5/11 ONEWAVE TECHNOLOGY CO., LTD. Layout Dimensions in Clearance area( Size=5.9*5.0mm) FootPrint (Unit : mm) ◆2 nd Layout Dimensions in Clearance area( Size=8.0*3.0mm) Matching Circuit 50 ohm transmission Line 6/11 ONEWAVE TECHNOLOGY CO., LTD. 3.Measurement Results Return Loss 7/11 ONEWAVE TECHNOLOGY CO., LTD. Radiation Pattern Efficiency Peak Gain Directivity 2450MHz 85.65% 2.21 dBi 2.89 dBi Chamber Coordinate System X Y Z 4 2 8/11 ONEWAVE TECHNOLOGY CO., LTD. 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1.Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2.Central Freq. change :within ± 6% 10±0.5 sec. 60sec .. TEMP (°C) 150°C 260°C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2.Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +85±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +85°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3.No disconnection or short circuit. Temperature: 85±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3.No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3.No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C 9/11 ONEWAVE TECHNOLOGY CO., LTD. 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 10/11 ONEWAVE TECHNOLOGY CO., LTD. 6.Packaging Information Tape Specification: Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 13.5±0.5 178±2 3000 11/11 ONEWAVE TECHNOLOGY CO., LTD. 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: -10~ 40°C and 30~70% RH. 2. Recommended products should be used within 6 months from the time of delivery. 3. The packaging material should be kept where no chlorine or sulfur exists in the air. Transportation Conditions 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechani…

Text truncated - open the document above for the full version.

- Page 1 of 49 - Report No.: HB20260720011E-01 Add:Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen,China Tel: (86-755) 29989321 Fax: (86-755) 29985110 Web:www.sz-hongbiao.com Test Report Product: Finder Trade Mark: SUNDA Model Number: DK01 FCC ID: 2BXBU-DK01 Prepared for Shenzhen Mutual Technology Co., Ltd Room B, 6th Floor, Building 3, Tingwei Industrial Park, Xin'an Street, Bao'an District, Shenzhen Prepared by Shenzhen HongBiao Certification& Testing Co., Ltd Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen, China Tel.: +86-755-2998 9321 Fax.: +86-755-2998 5110 Website: http://www.sz-hongbiao.com - Page 2 of 49 - Report No.: HB20260720011E-01 Add:Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen,China Tel: (86-755) 29989321 Fax: (86-755) 29985110 Web:www.sz-hongbiao.com Table of Contents 1 GENERAL DESCRIPTION ..................................................................................................................................... 6 1.1 DESCRIPTION OF EUT ................................................................................................................................................ 6 1.2 TEST MODE .............................................................................................................................................................. 6 1.3 OPERATION CHANNEL LIST ........................................................................................................................................... 7 1.4 TEST SETUP .............................................................................................................................................................. 7 1.5 POWER SETTING CONFIGURATION PARAMETERS ............................................................................................................... 7 1.6 ANCILLARY EQUIPMENT .............................................................................................................................................. 7 2 SUMMARY OF TEST RESULT ............................................................................................................................... 8 3 TEST FACILITIES AND ACCREDITATIONS .............................................................................................................. 9 3.1 TEST LABORATORY ..................................................................................................................................................... 9 3.2 ENVIRONMENTAL CONDITIONS ..................................................................................................................................... 9 3.3 MEASUREMENT UNCERTAINTY ..................................................................................................................................... 9 3.4 TEST SOFTWARE ...................................................................................................................................................... 10 4 LIST OF TEST EQUIPMENT .................................................................................................................................11 5 TEST ITEM AND RESULTS ...................................................................................................................................13 5.1 ANTENNA REQUIREMENT .......................................................................................................................................... 13 5.1.1 Standard Requirement ............................................................................................................................. 13 5.1.2 Test Result ................................................................................................................................................. 13 5.2 CONDUCTED EMISSION ............................................................................................................................................. 14 5.2.1 Limits ........................................................................................................................................................ 14 5.2.2 Test Procedures ......................................................................................................................................... 14 5.2.3 Test Setup .................................................................................................................................................. 15 5.2.4 Test Result ................................................................................................................................................. 15 5.3 RADIATED EMISSION ................................................................................................................................................ 16 5.3.1 Limits ........................................................................................................................................................ 16 5.3.2 Test Procedures ......................................................................................................................................... 16 5.3.3 Test Setup .................................................................................................................................................. 16 5.3.4 Test Result ................................................................................................................................................. 17 5.3.5 Band Edge - Radiated ............................................................................................................................... 21 5.3.6 Spurious emission in band 1000MHz-25000MHz .................................................................................... 22 5.4 PEA…

Text truncated - open the document above for the full version.

- Page 1 of 1 - Photographs of the Test Setup Model: DK01 Radiated Emission Below 1GHz Radiated Emission Above 1GHz