A3LSPP-2040Photo Printer

Block Diagram of SPP-2040/SPP-2020 MAIN Controller ARM7(67MHz) I-CACHE(2K) D-CACHE(2K) DSP (133MHz) SDRAM(133MHz) PLL DMA INT. CTRL TIMERS & WD USB 2.0 Device / USB 1.1 Host ADC (2MHz,8Bit) I/O PORT PWM Memory Card I/F & ETC. SDRAM (H:32MB,L:16MB) FLASH (H:4MB,L:1MB) MAIN CLOCK 48MHZ USB Device CON. TFT LCD 2.0” USB Host CON. (PictBridge) UDMOTOR STEP TPH Controller (ETCC) TPH ( 4” 300DPI) ADC Main PBA Photo- peri SDRAM (2MB) CF1,2 SOCKET SM/SD/MMC/ MS/XD SOCKET AC (110~240V) External Power +24V Paper Sensor Ribbon Sensor +24V SPP-2040 Only OPE 10Key TPH Temp TPH D(0:12) TPH STB TPH LAT TPH CLK D(0:15)A(0:21) CS,INI, RST,RD ,WR UD PH,EN Step MOTOR DRIVER MTD2009J A(0:21) D(0:7) CS,RST RD,WR SD_A(0:12) SD_D(0:7 ) RAS,CAS, WE,CLK, CKE,BA0,1 I/O PERI_D(0:15) PERI_A(0:10) RAS,CAS,WE,CS SCLK, CKE,BA, UDQM,LDQM D(0:7) A(1:4), A(14:21) RD,WR,CS, CLK,RST LCD_D(0:7) HSYNC,VSYNC SDI,CS,CLK,SCLK LFMOTOR STEP CLOCK 12MHZ REGULATOR +3.3V +1.8V REGULATOR 2-CH SWITCHING REGULATOR +5V +15~ +20V +5V Power KEY Power LED(Blue) +15~ +20V Ambient Temp Power CTL LF PH,EN UD OUT LFOUT ADC_SDA ADC_SCL Tray Sensor +3.3V REGULATOR Cassete Sensor

SPP-2040 1. External Pictures 1) Front View 2) Rear view 3) Side View 1 4) Side View 2

Label & Label Location ( SPP-2040 ) - Label - Label ( Samsung Electronics Co., Ltd. ) - Label (Shandong Samsung Telecommunications Co., Ltd. and Intops(Weihai) Electronics Co., Ltd.) - Label Location

2. Internal Pictures 1) Front View with Tray 2) Front View with Cover Open 3. PBA Pictures 1) Top view of Main PBA 2) Bottom view of Main PBA 3) TOP view of OPE 4) Bottom View of OPE

1 of 20 Samsung EMC Testing and Certification Laboratory Project No: LBE050582 This report shall not be reproduced except in full, without the written approval of SEC EMC Testing laboratory. EMC Test Report According to FCC Part 15 Subpart B Project No. LBE050582 Equipment under Test Applicant Samsung Electronics Co., Ltd. 416 Maetan 3-Dong, Yeongtong-Gu, Suwon-Si, Gyeonggi-Do, Korea, 443-742 FCC ID A3LSPP-2040 Product Name Photo Printer Model Name SPP-2040 Manufacturer 1) Samsung Electronics Co., Ltd. 259, Gongdan-Dong, Gumi-City, Gyeongsangbuk-Do, 730-030, KOREA 2) Shandong Samsung Telecommunications Co., Ltd. #264209, Samsung Road, Weihai Hi-Tech IDZ Shandong Province CHINA 3) Intops(Weihai) Electronics Co., Ltd. 3, Huoju Road, Weihai Hi-tech IDZ Shandong Province CHINA Date of Test March 17, 2005 ~ March 22, 2005 Issued Date March 30, 2005 Name/Position Signature Tested by Young Hun, Cheong Test Engineer Reviewed by No Cheon, Park Manager of EMC Lab. Authorized by Seung Kyu, Cha Chief of EMC Lab. 1. This test reports does not constitute an endorsement by NIST/NVLAP or U.S Government. 2. This test report is to certify that the tested device properly complies with the requirements of FCC Rules and Regulations Part 15 Subpart B Unintentional Radiators. All tests necessary to show compliance to the requirements were and these results met the specifications requirement. This laboratory is registered by the NIST/NVLAP, U.S.A. The test reported herein have been performed in accordance with its terms of registration. 3. FCC filing Registration Number : 873282 NVLAP LAB CODE 200623-0 2 of 20 Samsung EMC Testing and Certification Laboratory Project No: LBE050582 This report shall not be reproduced except in full, without the written approval of SEC EMC Testing laboratory. Table of Contents 1. General Information 1.1 Basic Information related Product 1.2 Detail Information related Product 1.3 Operating Mode and Condition 1.4 Test System Details 1.5 Equipment Modifications 1.6 Test Procedure 1.7 Test Configuration 1.8 Applied Standards 1.9 Test Facility 2. Summary of Test Results 3. Description of individual tests 3.1 Conducted Emission 3.2 Radiated Emission 4. Appendix 4.1 Test Photography 4.2 EUT Photography 3 of 20 Samsung EMC Testing and Certification Laboratory Project No: LBE050582 This report shall not be reproduced except in full, without the written approval of SEC EMC Testing laboratory. 1. General Information 1.1 Basic Information related Product Applicant Samsung Electronics Co., Ltd. Model name SPP-2040 Applicant Address 416 Maetan 3-Dong, Yeongtong-Gu, Suwon-Si, Gyeonggi-Do, Korea, 443-742 Contact Person Young Hun, Cheong Kind of product Photo Printer Valiant list - Manufacturer 1) Samsung Electronics Co., Ltd. 259, Gongdan-Dong, Gumi-City, Gyeongsangbuk-Do, 730-030, KOREA 2) Shandong Samsung Telecommunications Co., Ltd. #264209, Samsung Road, Weihai Hi-Tech IDZ Shandong Province CHINA 3) Intops(Weihai) Electronics Co., Ltd. 3, Huoju Road, Weihai Hi-tech IDZ Shandong Province CHINA New / Alternative / Permissive change Information New 4 of 20 Samsung EMC Testing and Certification Laboratory Project No: LBE050582 This report shall not be reproduced except in full, without the written approval of SEC EMC Testing laboratory. 1.2 Detail Information related Product Specification Item Specification Remark Interface PC (USB 1.1 and USB 2.0) PictBridge Memory Card(CF typeI/II,MS,MMC,SD,SM,XD) - Memory Size SDRAM : 32MB Flash : 4MB Display :2MB - Printing Method D2T2(Dye diffusion Thermal Transfer) Printing Resolution 300 x 300 dpi - Printing Speed About 1 min./4x6” - Power Adaptor Input: AC 110~240V 50/60Hz Output: DC 24V 1.7A - Interface PC (USB 1.1 and USB 2.0) PictBridge Memory Card(CF typeI/II,MS,MMC,SD,SM,XD) - Operating Frequency Main Clock is 48MHz and SDRAM clock is 132MHz 1.3 Operating Mode and Condition The system was configured for testing in typical fashion use. Cables were attached to each of the available I/O ports. Where applicable peripherals were attached to the I/O cables. The mode of operation utilized for testing was selected to best simulate typical EUT use. 1.4 Test System Details Refer to 1.2 1.5 Equipment Modifications No equipment modifications were required. 5 of 20 Samsung EMC Testing and Certification Laboratory Project No: LBE050582 This report shall not be reproduced except in full, without the written approval of SEC EMC Testing laboratory. 1.6 Test Procedure 1.6.1 Conducted Emission EUT was placed on a platform nominal size, 1m by 1.5m, raised 80cm above the conduct -ing ground plane. The rear of tabletop was located 40cm to the vertical conducting ground plane. The rear of EUT, including peripherals was aligned and flush with rear of tabletop. All other surfaces of tabletop was at least 80cm from any other grounded conducing surface. I/O cables and AC cables that were connected to the peripherals were bundled in center. They were folded back and forth forming a bindle 30cm to 40cm long and were handed at a 40cm height to the ground plane. Each EUT current-carrying power lead, except the ground(safety)lead, were individually connected through a LISN to the input power source. All unused 50 ohm connectors of the LISN were resistively terminated in 50 ohm when not connected to the measuring equipment. 1.6.2 Radiated Emission EUT was placed on a platform of nominal size, 1m by 1.5m, raised 80cm above the conducting ground plane. The rear of EUT, including peripherals was aligned and flush with rear of tabletop. I/O cables that were connected to the peripherals were bundle in center. They were folded back and forth forming a bundle 30cm to 40cm long and were hanged 40cm height to the ground plane. Test was made with the antenna positioned in both the horizontal and vertical planes of polarization. The measurement antenna was varied in height above the conducting ground plane and the run table azimuth was varied to obtain the maximum signal strength The system co…

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16 of 19 Samsung EMC Testing and Certification Laboratory Project No: LBE050582 This report shall not be reproduced except in full, without the written approval of SEC EMC Testing laboratory. 4. Appendix 4.1 Test Photography Picture 1. Conducted Emission (Front) Picture 2. Conducted Emission (Rear) 17 of 19 Samsung EMC Testing and Certification Laboratory Project No: LBE050582 This report shall not be reproduced except in full, without the written approval of SEC EMC Testing laboratory. Picture 3. Radiated Emission (Front) Picture 4. Radiated Emission (Rear)