FSUGG00A8Bluetooth Earbuds

KYE SYSTEMS CORP. Model Difference Data：2023.03.30 Product description: Bluetooth Earbuds Model name: HS-M920BT, HS-M915BT, HS-M925BT, HS-M930BT, HS-M935BT, HS-M940BT, HS-M945BT, HS-M950BT, HS-M955BT, HS-M960BT, HS-M965BT, HS-M970BT, HS-M975BT, HS-M980BT Trade Name: Genius FCC ID: FSUGG00A8 All the model are the same circuit and RF module, except model names. Regards Sincerely Client’s signature : Client’s name / title : Ricky Chen (Section Supervisor) Contact information / address: No.492, Sec.5, Chongxin Rd., Sanchong Dist., New Taipei City 24160, Taiwan

KYE SYSTEMS CORP. (2023.03.27) Eurofins Electrical and Electronic Testing NA, Inc. 914 West Patapsco Avenue Baltimore, MD 21230 RE: CONFIDENTIALITY REQUEST FOR (Bluetooth Earbuds / HS-M920BT, HS- M915BT, HS-M925BT, HS-M930BT, HS-M935BT, HS-M940BT, HS-M945BT, HS-M950BT, HS-M955BT, HS-M960BT, HS-M965BT, HS-M970BT, HS-M975BT, HS-M980BT / FCC ID: FSUGG00A8 ) To Whom It May Concern: This letter serves as an official request for confidentiality under sections 0.457 and 0.459 of CFR 47. We have requested that the Exhibits Long-Term Confidentiality Short-Term Confidentiality NOTE 2 ID Label/Location No No Attestation Statement No No External Photos No ☒ Block Diagram ☒ ☐ Schematics ☒ ☐ Test Report No No Test Setup Photos No ☒ User’s Manual ☐ NOTE 1 ☒ Internal Photos ☐ NOTE 1 ☒ Parts List / Tune Up ☐ ☐ RF Exposure Info No No Operational Description ☒ ☐ Cover Letter(s) No No SDR Software / Security Info ☐ No required to be submitted with this application be permanently withheld from public review. Above mentioned document contains detailed system and equipment description are considered as proprietary information in operation of the equipment. The public disclosure of above documents might be harmful to our company and would give competitor an unfair advantage in the market. Please contact me if there is any information you may need. Sincerely, Signature: Name: Ricky Chen Title: Section Supervisor

KYE SYSTEMS CORP. (2023.03.27) Eurofins Electrical and Electronic Testing NA, Inc. 914 West Patapsco Avenue Baltimore, MD 21230 RE: LETTER OF AGENT AUTHORIZATION To Whom It May Concern: We, the undersigned, hereby authorize (Shenzhen CTB Testing Technology Co., Ltd.) to act on our behalf in all matters relating to application for equipment authorization, including the signing of all documents relating to these matters. We also hereby certify that no party to the application authorized hereunder is subject to the denial of benefits, including FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C.853(a). This agreement expires one year from the current date. Sincerely, Signature: Name: Ricky Chen Title: Section Supervisor

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FCC ID LABEL: Label Location: FCC ID: FSUGG00A8 Model No.: HS-M920BT

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Shenzhen CTB Testing Co., Ltd. FCC ID: FSUGG00A8 Portable device According to §15.247(e)(i) and §1.1307(b)(1), systems operating under the provisions of this section shall be operated in a manner that ensures that the public is not exposed to radio frequency energy level in excess of the Commission’s guidelines. According to KDB447498 D01 General RF Exposure Guidance V06 The 1-g SAR and 10-g SAR test exclusion thresholds for 100 MHz to 6 GHz at test separation distances ≤ 50 mm are determined by: [(max. power of channel, including tune-up tolerance, mW)/(min. test separation distance, mm)]·[√f(GHZ)] ≤ 3.0 for 1-g SAR and ≤ 7.5 for 10-g extremity SAR, where: • f(GHZ) is the RF channel transmit frequency in GHz • Power and distance are rounded to the nearest mW and mm before calculation • The result is rounded to one decimal place for comparison When the minimum test separation distance is < 5 mm, a distance of 5 mm is applied to determine SAR test exclusion. EDR: Modulation Channel Freq. (GHz) Conduct ed power (dBm) Conducte d power (mW) Tune-up power (dBm) Max tune-up power (dBm) Max tune-up power (mW) Distance (mm) Result calculatio n SAR Exclusion threshold SAR test exclusion 2.402 1.165 1.31 1±1 2.00 1.58 <5 0.49127 3.00 YES 2.441 2.4 1.74 2±1 3.00 2.00 <5 0.62347 3.00 YES 2.480 3.252 2.11 3±1 4.00 2.51 <5 0.79114 3.00 YES 2.402 1.962 1.57 1±1 2.00 1.58 <5 0.49127 3.00 YES 2.441 3.112 2.05 3±1 4.00 2.51 <5 0.78490 3.00 YES 2.480 3.723 2.36 3±1 4.00 2.51 <5 0.79114 3.00 YES GFSK π /4DQPSK BLE: Modulation Channel Freq. (GHz) Conduct ed power (dBm) Conducte d power (mW) Tune-up power (dBm) Max tune-up power (dBm) Max tune-up power (mW) Distance (mm) Result calculatio n SAR Exclusion threshold SAR test exclusion 2.402 -4.069 -2.632 -2±1 -1.00 0.79 <5 0.24622 3.00 YES 2.44 -3.091 -0.737 0±1 1.00 1.26 <5 0.39330 3.00 YES 2.480 -2.402 0.694 0±1 1.00 1.26 <5 0.39651 3.00 YES GFSK Conclusion: For the max result : 0.79114≤ FCC Limit 3.0 for 1g SAR.

2.4GHz1608ChipAntenna: RANT1608F245C01/1608F245C04/1608F245C05 １ Application: WLAN,802.11b/g,Bluetooth,WLAN,etc... Features SMD,highreliability,ultraImpact,Omni-directional... PartnumberInformation RANT1608F245C01/04 (A)(B)(C)(D)(E)(F) ElectricalSpecification DimensionandTerminalConfiguration No.TerminalName 1Feeding/GNG 2GND/Feeding (A)ProductTypeChipAntenna (B)SizeCode 1.6x0.8mm( ± 0.1mm) (C)MaterialHighKmaterial (D)Frequency2.4~2.5GHz (E)FeedingmodePIFA&SingleFeeding (F)AntennatypeType=01/04/05 WorkingFrequencyRange2400~2500MHz Bandwidth120MHz(Min.) PeakGain2.7dBi(Typ.) Impedance50Ohm Returnloss10dB(Min) PolarizationLinear AzimuthBeamwidthOmni-directional OperationTemperature( °C )-40~85 °C ResistancetoSolderingHeats 10sec.(@280 °C ) TerminationNi/Au(Leadless) Dimension(mm) L 1.60±0.10 W 0.80 ± 0.10 T 0.80 ± 0.10 咏成國際科技有限公司電話 :13530576606 RAINInternationalTechnologyCo.,Ltd.TEL:13530576606 2.4GHz1608ChipAntenna: RANT1608F245C01/1608F245C04/1608F245C05 ２ 1 EvaluationBoardReference 长条板Layout建议参考如下： Toplayer: Bottomlayer: 2.4GHz1608ChipAntenna: RANT1608F245C01/1608F245C04/1608F245C05 ３ 异形Layout建议参考如下： Toplayer: Toplayer: 2.4GHz1608ChipAntenna: RANT1608F245C01/1608F245C04/1608F245C05 ４ ElectricalCharacteristics ReturnLoss&Radiation ELECTRICALCHARACTERISTICSS11 RadiationPattern 2.4GHz1608ChipAntenna: RANT1608F245C01/1608F245C04/1608F245C05 ５ ElectricalCharacteristics 2.4GHz1608ChipAntenna: RANT1608F245C01/1608F245C04/1608F245C05 ６ TapingSpecifications ReelandTapingSpecification ReelSpecification TYPESIZEABCD 16087”4K/Reel 4.0±0.5 4.0±213.5±0.5178±2 TappingSpecification PackagingTypeABWEFGHTψDP PaperType1608 1.90±0.203.50±0.208.0±0.201.75±0.103.5±0.054.0±0.102.0±0.050.75±0.10 1.50±0.10 4.0±0.1 2.4GHz1608ChipAntenna: RANT1608F245C01/1608F245C04/1608F245C05 ７ ReliabilityTable TestItemProcedure Requirements CeramicType Remark (Reference) Electrical Characterization Fulfilltheelectrical specification UserSpec. Thermal Shock 1.Preconditioning: 50±10°C/1hr,thenkeepfor24±1hrsatroomtemp. 2.Initialmeasure:Spec:referInitialspec. 3.Rapidchangeoftemperaturetest: -30°Cto+85°C;100cycles; 15minutesatLowercategorytemperature; 15minutesatUppercategorytemperature. NoVisibleDamage. Fulfilltheelectrical specification. MIL-STD-202 107 Temperature Cycling 1.Initialmeasure:Spec:referInitialspec. 2.100Cycles(-30°Cto+85°C),SoakMode=1(2Cycle/hours). 3.Measurementat24±2Hoursaftertestcondition. NoVisibleDamage. Fulfilltheelectrical specification. JESD22 JA104 HighTemperature Exposure 1.Initialmeasure:Spec:referInitialspec. 2.Unpowered;500hours@T=+85°C. 3.Measurementat24±2hoursaftertest. NoVisibleDamage. Fulfilltheelectrical specification. MIL-STD-202 108 LowTemperature Storage 1.Initialmeasure:Spec:referInitialspec. 2.Unpowered:500hours@T=-30°C. 3.Measurementat24±2hoursaftertest. NoVisibleDamage. Fulfilltheelectrical specification. MIL-STD-202 108 Solderability (SMDBottomSide) Dippingmethod: a.Temperature:235±5°C b.Dippingtime:3±0.5s Thesoldershouldcover over95%ofthecritical areaofbottomside. IEC60384-21/22 4.10 SolderingHeat Resistance (RSH) Preheatingtemperature:150±10°C. Preheatingtime:1~2min. Soldertemperature:260±5°C. Dippingtime:5±0.5s NoVisibleDamage.IEC60384-21/22 4.10 Vibration5g'sfor20min.,12cycleseachof3orientations Note:Use8"X5"PCB.031"thick7securepointson,onelong sideand2securepointsatcornersofoppositesides.Parts mountedwithin2"fromanysecurepoint.Testfrom10-2000 Hz. NoVisibleDamage.MIL-STD-202 Method204 Mechanical Shock Threeshocksineachdirectionshallbeappliedalongthethree mutuallyperpendicularaxesofthetestspecimen(18shocks) Peakvalue:1,500g’s Duration:0.5ms Velocitychange:15.4ft/s Waveform:Half-sine NoVisibleDamage.MIL-STD-202 Method213 Humidity Bias 1.Humidity:85%R.H.,Temperature:85±2°C. 2.Time:500±24hours. 3.Measurementat24±2hrsaftertestcondition. NoVisibleDamage. Fulfilltheelectrical specification. MIL-STD-202 Method106 2.4GHz3216ChipAntenna: RANT1608F245C01/RANT1608F245C04/1608F245C05 _ ８ Board Flex (SMD) 1.Mountingmethod: IR-Reflow.PCBSize(L:100×W:40×T:1.6mm) 2.Applytheloadindirectionofthearrowuntilbendingreaches 2mm. NoVisibleDamage.AEC-Q200 005 AdhesionForceof1.8Kgfor60seconds.NoVisibleDamage Magnificationof20Xor greatermaybeemployed forinspectionofthe mechanicalintegrityofthe devicebodyterminalsand body/terminaljunction. AEC-Q200 006 Physical Dimension Anyapplicablemethodusingx10magnification,micrometers, calipers,gauges,contourprojectors,orothermeasuring equipment,capableofdeterminingtheactualspecimen dimensions. Inaccordancewith specification. JESD22 JB100 RevisionHistory RevisionDateContent 12019/03/01NewDatasheet 22020/02/22Add2Dradiationcharacteristic

Shenzhen CTB Testing Technology Co., Ltd. Report No.: CTB230317010RFX Report Tel: 4008-707-283 Web: http://www.ctb-lab.net Page 1 of 52 TEST REPORT Compiled by: Reviewed by: Approved by: Chen Zheng Arron Liu Bin Mei / Director Note: If there is any objection to the inspection results in this report, please submit a written report to the company within 15 days from the date of receiving the report. The test report is effective only with both signature and specialized stamp. This result(s) shown in this report refer only to the sample(s) tested. Without written approval of Shenzhen CTB Testing Technology Co., Ltd. this report can’t be reproduced except in full. The tested sample(s) and the sample information are provided by the client. “*” indicates the testing items were fulfilled by subcontracted lab. “#” indicates the items are not in CNAS accreditation scope. Product Name: Bluetooth Earbuds FCC ID: FSUGG00A8 Trademark: Genius Model Number: HS-M920BT, HS-M915BT, HS-M925BT, HS-M930BT, HS-M935BT, HS-M940BT, HS-M945BT, HS-M950BT, HS-M955BT, HS-M960BT, HS-M965BT, HS-M970BT, HS-M975BT, HS-M980BT Prepared For: KYE SYSTEMS CORP. Address: No.492, Sec.5, Chongxin Rd., Sanchong Dist., New Taipei City 24160, Taiwan Manufacturer: Dongguan Kunying Computer Products Co., Ltd Address: Baodun Village, Houjie Town, Dongguan City, Guangdong Provinc, 523961 China Prepared By: Shenzhen CTB Testing Technology Co., Ltd. Address: 1&2/F., Building A, No.26, Xinhe Road, Xinqiao, Xinqiao Street, Bao'an District, Shenzhen, Guangdong, China Sample Received Date: Mar. 13, 2023 Sample tested Date: Mar. 13, 2023 to Mar. 17, 2023 Issue Date: Mar. 17, 2023 Report No.: CTB230317010RFX Test Standards FCC Part15.247 ANSI C63.10:2013 Test Results PASS Remark: This is Bluetooth radio test report. Shenzhen CTB Testing Technology Co., Ltd. Report No.: CTB230317010RFX Report Tel: 4008-707-283 Web: http://www.ctb-lab.net Page 2 of 52 TABLE OF CONTENT Test Report Declaration Page 1. VERSION .......................................................................... 4 2. TEST SUMMARY ................................................................... 5 3. MEASUREMENT UNCERTAINTY ..................................................... 6 4. PRODUCT INFORMATION AND TEST SETUP .......................................... 7 4.1 Product Information .................................................................... 7 4.2 Test Setup Configuration ............................................................... 7 4.3 Support Equipment .................................................................... 7 4.4 Channel List .......................................................................... 8 4.5 Test Mode ............................................................................ 8 4.6 Test Environment ...................................................................... 8 5. TEST FACILITY AND TEST INSTRUMENT USED ....................................... 9 5.1 Test Facility ........................................................................... 9 5.2 Test Instrument Used .................................................................. 9 6. AC POWER LINE CONDUCTED EMISSION ............................................ 11 6.1 Block Diagram Of Test Setup .......................................................... 11 6.2 Limit ................................................................................ 11 6.3 Test procedure ....................................................................... 11 6.4 Test Result .......................................................................... 13 7. RADIATED SPURIOUS EMISSION ................................................... 15 7.1 Block Diagram Of Test Setup .......................................................... 15 7.2 Limit ................................................................................ 15 7.3 Test procedure ....................................................................... 16 7.4 Test Result .......................................................................... 17 8. BAND EDGE AND RF COUNDUCTED SPURIOUS EMISSIONS .......................... 26 8.1 Block Diagram Of Test Setup .......................................................... 26 8.2 Limit ................................................................................ 26 8.3 Test procedure ....................................................................... 26 8.4 Test Result .......................................................................... 27 9. COUDUCTED PEAK OUTPUT POWER ............................................... 32 9.1 Block Diagram Of Test Setup .......................................................... 32 9.2 Limit ................................................................................ 32 9.3 Test procedure ....................................................................... 32 9.4 Test Result .......................................................................... 33 10. 20DB OCCUPIED BANDWIDTH...................................................... 36 10.1 Block Diagram Of Test Setup ......................................................... 36 10.2 Limit ............................................................................... 36 10.3 Test procedure ...................................................................... 36 10.4 Test Result ......................................................................... 36 11. CARRIERFREQUENCIES SEPARATION .............................................. 39 11.1 Block Diagram Of Test Setup ......................................................... 39 11.2 Limit ............................................................................... 39 11.3 Test procedure ...................................................................... 39 11.4 Test Result ......................................................................... 39 12. HOPPING CHANNEL NUMBER ...................................................... 42 12.1 Blo…

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Radiated Emission Below 1G Above 1G Conducted emissions