UZQC2D900PC System

Oasis Est. for Electronic Technologies

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Application Details

Equipment Class: JBC - Part 15 Class B Computing Device/Personal Computer
Date of Grant: Mar 05, 2007
Application Purpose: Original Equipment
Date of Application: Mar 05, 2007
Equipment Note: PC System
Company: Oasis Est. for Electronic Technologies
Country: Jordan

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Document Text

Text extracted from the exhibit documents filed with the FCC. Open a document above to read the original.

Users Manual

User Manual C2D900+ Smallest pBTX Desktop 2 C2D900+ is a high quality, highly scalable basis for your computing needs. You will find that the C2D900+ System has the following advantages Ultimate small and quiet C2D900+ is designed in the size that just enough for pBTX motherboard and LFX power supply unit; no space wasted inside the chassis. Proprietary thermal solution delivers best acoustic performance of 26dB handling office works. Perfect on office desktops With the carefully placed vent location, C2D900+ is able to be placed both vertically and horizontally on office desktops. It gives user the flexibility to arrange desktop space as desired. C2D900+ is also designed to hold legacy, heavy CRT monitors that are still commonly using today. Solid Security and Easy Maintenance C2D900+ is built with Kensington lock, pad lock, and Chassis intrusion that secure hardware. Latest Intel technology provides secure networking and administrating. Tool-less chassis allows easy maintenance with level 7 components assembling. Note: In order to install C2D900+ System efficiently, Please read this user’s manual carefully before unpacking and setting up your computer . 3 Copyright Copyright © SAMSYNC Corporation 2005. All right reserved. Disclaimer: SAMSYNC Corporation shall not be liable for technical or editorial errors or omissions contained herein; nor for incidental or consequential damages resulting from furnishing this material, or the performance or use this product. SAMSYNC Corporation reserves the right to change product specification without notice. Information in this document may change without notice. No part of this document may be copied, reproduced, or transmitted by any means, for any purpose without prior written permission from SAMSYNC Corporation. Safety Instructions ♦ The computer has been tested for conformance to international safety regulations. Like any electronic device, however, the computer should be used with care. To protect yourself from possible injury and to minimize the risk of damage to the computer, read and follow all the safety instructions mentioned in this manual. ♦ A modem card will be bundled with the system and installed in the extension slot. Do not touch the modem card if you are using the system. This may cause an electrical shock. WARNING: Do not attempt to service the computer yourself. Opening or removing covers might expose you to dangerous voltage points or other risk, have a qualified person repair it. WARNING: Keep hair, loose clothing, fingers, and all parts of body away from openings, moving parts and fan. WARNING: Do not operate the computer with the cover removed. WARNING: Always disconnect all telephone lines & all power cords from the wall outlet before servicing or disassembling this product. To reduce the risk of personal injury from electrical shock or hot surfaces, disconnect the power cord from the wall outlet, and allow the internal system components to cool before touching. 4 WARNING: This equipment is designed for connection to a grounded (earthed) outlet. The grounded type plug is an important safety feature. To reduce the risk of electrical shock, damage to your equipment, or loss of data, do not disable this feature. General Guidelines ♦ Read all of these instructions. ♦ Save these instructions for future use. ♦ Follow all warnings and instructions marked in the computer. ♦ Except as explained elsewhere in this manual, do not attempt to service the computer yourself. Opening or removing covers that are marked “Do Not Remove” might expose you to dangerous voltage points or other risks. Refer all servicing of marked components to a qualified personnel. Installation Restrictions 1. Follow all warnings and instructions marked on the product. 2. Unplug this product from the wall outlet before cleaning. Do not use liquid cleaners or aerosol cleaners. Use a damp cloth for cleaning. Ensure that no liquid enters the system. 3. Do not use this product near water. For example, near a bathtub, washbowl, kitchen sink or laundry tub, in a wet basement or near a swimming pool. 4. Do not connect or disconnect cables during a thunderstorm. 5. Do not place this product on an unstable cart, stand, or table. The product may fall, causing serious damage to it. 6. Avoid using a telephone (other than a cordless type) during an electrical storm. There may be remote risk of electric shock from lightning. 7. Do not use the telephone to report a gas leak in the vicinity of the leak. 8. Slots and openings in the cabinet and the back or bottom are provided for ventilation; to ensure reliable operation of the product and to protect it from overheating, these openings must not be blocked or covered. The product should never be placed near or over a radiator or heat register, or in a built-in installation unless proper ventilation is provided. 9. This product should be operated from the type of power indicated on the marking label. If you are not sure of the type of power available, consult your dealer or local power company. 10. Do not allow anything to rest on the power cord. Do not locate this product where persons will tread on the cord. 11. If an extension cord is used with this product, make sure that the total ampere rating of the equipment plugged into the extension cord does not exceed the extension cord ampere rating. Also, make sure that the total rating of all products plugged into the wall outlet does not exceed the fuse rating. 12. Never push objects of any kind into this product through cabinet slots as they may touch dangerous voltage points or short out parts that could resulting a fire or electronic shocks. Never spill liquid of any kind on the product. 5 13. To reduce the risk of fire, use at least No. 26 AWG wire for the telecommunication line cord. 14. Always disconnect all telephone lines & all power cords from the wall outlet before servicing or disassembling this product. And, refer it for servicing to qualified service personal under the …

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Block Diagram

55 44 33 22 11 D D C C B B A A TitleSize Document Number Rev Date: Sheet of S05700D0 1.2a COVER SHEET First International Computer,Inc. 120 Wednesday, January 31, 2007 PTCQ965 533/800/1066MHz Broadwater GMCH Channel AChannel B DDR2DDR2 VGA PCI Expressx16 Analog Display PCI Express x16 ICH8 DMI Interface Controller Link USB 2.010 ports GPIO SATA2 ports SPI Flash SPI HDACodec SMBus 2.0/I2C SST FanSpeedControl LPC Interface S I/OTPM Nineveh or Ekron LAN LGA775 Processor PAGE 17: USBPAGE 20: SATA & VGA & CPU FAN & XDPPAGE 19: VRMPAGE 15: PCI EXPRESS(x1 , x16) & TPM & MINI PCIEPAGE 16: SIO PTCQ965 PAGE 2: CPU - LGA 775 - 1PAGE 3: CPU - LGA 775 - 2PAGE 4: GMCH 1PAGE 7: ICH 8 - 1PAGE 8: ICH 8 - 2PAGE 5: GMCH 2PAGE 6: GMCH 3PAGE 10: DDR2PAGE 12: 1394(VT6307S) Clock Generation XDP LCIGLCI PCI Bus 1394 PCIe Bus MINI PCIE PAGE 18:POWERPAGE 14:AUDIO(ALC262)PAGE 13:LANPAGE 11:DDR2(Termination)PAGE 9:Clock GeneratorPAGE 1:Cover Sheet & Block Diagram 1.1A~2.0A 6V~8V Polyswitch Name Voltage 6V~8V Page USBFS31394FS Current USBFS1USBFS2 15~16V 6V~8V6V~8V 1720121717 FS2 1.1A~1.5A1.1A~1.5A1.1A~2.0A1.1A~3.0A Crystal Name Frequency Page X1X2X3X4X5 FREQ XTL 14.31818MHzX'TAL 24.576MHzFREQ XTL 32.768KHzFREQ XTL 25.000MHzFREQ XTL 32.768KHz 0912071315

External Photos

ID Label/Location Info

90mm 30mm MADE IN CHINA MODEL NO : C2D900+ This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. AC INPUT:100-127V/200-240V~, 6/3A, 50-60Hz FCC ID: UZQ-C2D900 P/N:XX-XXXXX-XX Label here

Internal Photos

GESTEK Lab Report No.: 0702003 Rev. 1 N0 3, Pau-Tou-Tsuo Valley, Chia-Pau Tsuen, Lin Kou Hsiang, Taipei County, Taiwan, R.O.C. Tel:886-2-2603-5321 Fax:886-2-2603-5325 Accredited Lab. Of BSMI, NEMKO, NVLAP. Page 34 of 49 Listed Lab. of Commerce, FCC, VCCI. NVLAP Lab Code:200085-0 3. Inner View Of PC System (EUT) 4. Inner View Of PC System (EUT) GESTEK Lab Report No.: 0702003 Rev. 1 N0 3, Pau-Tou-Tsuo Valley, Chia-Pau Tsuen, Lin Kou Hsiang, Taipei County, Taiwan, R.O.C. Tel:886-2-2603-5321 Fax:886-2-2603-5325 Accredited Lab. Of BSMI, NEMKO, NVLAP. Page 35 of 49 Listed Lab. of Commerce, FCC, VCCI. NVLAP Lab Code:200085-0 5. Inner View Of PC System (EUT) 6. Inner View Of PC System (EUT) GESTEK Lab Report No.: 0702003 Rev. 1 N0 3, Pau-Tou-Tsuo Valley, Chia-Pau Tsuen, Lin Kou Hsiang, Taipei County, Taiwan, R.O.C. Tel:886-2-2603-5321 Fax:886-2-2603-5325 Accredited Lab. Of BSMI, NEMKO, NVLAP. Page 36 of 49 Listed Lab. of Commerce, FCC, VCCI. NVLAP Lab Code:200085-0 7. Inner View Of PC System (EUT) GESTEK Lab Report No.: 0702003 Rev. 1 N0 3, Pau-Tou-Tsuo Valley, Chia-Pau Tsuen, Lin Kou Hsiang, Taipei County, Taiwan, R.O.C. Tel:886-2-2603-5321 Fax:886-2-2603-5325 Accredited Lab. Of BSMI, NEMKO, NVLAP. Page 37 of 49 Listed Lab. of Commerce, FCC, VCCI. NVLAP Lab Code:200085-0 8. Component Side Of Mother Board 9. Solder Side Of Mother Board GESTEK Lab Report No.: 0702003 Rev. 1 N0 3, Pau-Tou-Tsuo Valley, Chia-Pau Tsuen, Lin Kou Hsiang, Taipei County, Taiwan, R.O.C. Tel:886-2-2603-5321 Fax:886-2-2603-5325 Accredited Lab. Of BSMI, NEMKO, NVLAP. Page 38 of 49 Listed Lab. of Commerce, FCC, VCCI. NVLAP Lab Code:200085-0 10. Component Side Of CPU 11. Solder Side Of CPU GESTEK Lab Report No.: 0702003 Rev. 1 N0 3, Pau-Tou-Tsuo Valley, Chia-Pau Tsuen, Lin Kou Hsiang, Taipei County, Taiwan, R.O.C. Tel:886-2-2603-5321 Fax:886-2-2603-5325 Accredited Lab. Of BSMI, NEMKO, NVLAP. Page 39 of 49 Listed Lab. of Commerce, FCC, VCCI. NVLAP Lab Code:200085-0 12. Component Side Of DDRII 13. Solder Side Of DDRII GESTEK Lab Report No.: 0702003 Rev. 1 N0 3, Pau-Tou-Tsuo Valley, Chia-Pau Tsuen, Lin Kou Hsiang, Taipei County, Taiwan, R.O.C. Tel:886-2-2603-5321 Fax:886-2-2603-5325 Accredited Lab. Of BSMI, NEMKO, NVLAP. Page 40 of 49 Listed Lab. of Commerce, FCC, VCCI. NVLAP Lab Code:200085-0 14. Front View Of H.D.D. 15. Back View Of H.D.D. GESTEK Lab Report No.: 0702003 Rev. 1 N0 3, Pau-Tou-Tsuo Valley, Chia-Pau Tsuen, Lin Kou Hsiang, Taipei County, Taiwan, R.O.C. Tel:886-2-2603-5321 Fax:886-2-2603-5325 Accredited Lab. Of BSMI, NEMKO, NVLAP. Page 41 of 49 Listed Lab. of Commerce, FCC, VCCI. NVLAP Lab Code:200085-0 16. Front View Of ODD(M/N:SDW-0851) 17. Back View Of ODD (M/N:SDW-0851) GESTEK Lab Report No.: 0702003 Rev. 1 N0 3, Pau-Tou-Tsuo Valley, Chia-Pau Tsuen, Lin Kou Hsiang, Taipei County, Taiwan, R.O.C. Tel:886-2-2603-5321 Fax:886-2-2603-5325 Accredited Lab. Of BSMI, NEMKO, NVLAP. Page 42 of 49 Listed Lab. of Commerce, FCC, VCCI. NVLAP Lab Code:200085-0 18. Front View Of ODD(M/N:UJ-850UPKA-A) 19. Back View Of ODD (M/N:UJ-850UPKA-A) GESTEK Lab Report No.: 0702003 Rev. 1 N0 3, Pau-Tou-Tsuo Valley, Chia-Pau Tsuen, Lin Kou Hsiang, Taipei County, Taiwan, R.O.C. Tel:886-2-2603-5321 Fax:886-2-2603-5325 Accredited Lab. Of BSMI, NEMKO, NVLAP. Page 43 of 49 Listed Lab. of Commerce, FCC, VCCI. NVLAP Lab Code:200085-0 20. Front View Of SATA Transfer board. 21. Back View Of SATA Transfer board. GESTEK Lab Report No.: 0702003 Rev. 1 N0 3, Pau-Tou-Tsuo Valley, Chia-Pau Tsuen, Lin Kou Hsiang, Taipei County, Taiwan, R.O.C. Tel:886-2-2603-5321 Fax:886-2-2603-5325 Accredited Lab. Of BSMI, NEMKO, NVLAP. Page 44 of 49 Listed Lab. of Commerce, FCC, VCCI. NVLAP Lab Code:200085-0 22. Front View Of Card Reader. (IOI) 23. Back View Of Card Reader. (IOI) GESTEK Lab Report No.: 0702003 Rev. 1 N0 3, Pau-Tou-Tsuo Valley, Chia-Pau Tsuen, Lin Kou Hsiang, Taipei County, Taiwan, R.O.C. Tel:886-2-2603-5321 Fax:886-2-2603-5325 Accredited Lab. Of BSMI, NEMKO, NVLAP. Page 45 of 49 Listed Lab. of Commerce, FCC, VCCI. NVLAP Lab Code:200085-0 24. Front View Of Front I/O. 25. Back View Of Front I/O. GESTEK Lab Report No.: 0702003 Rev. 1 N0 3, Pau-Tou-Tsuo Valley, Chia-Pau Tsuen, Lin Kou Hsiang, Taipei County, Taiwan, R.O.C. Tel:886-2-2603-5321 Fax:886-2-2603-5325 Accredited Lab. Of BSMI, NEMKO, NVLAP. Page 46 of 49 Listed Lab. of Commerce, FCC, VCCI. NVLAP Lab Code:200085-0 26. Front View Of S.P.S. 27. Back View Of S.P.S.

Operational Description

Theory of Operation/Technical Description

Schematics

55 44 33 22 11 D D C C B B A A TitleSize Document Number Rev Date: Sheet of S05700D0 1.2a COVER SHEET First International Computer,Inc. 120 Thursday, January 18, 2007 PTCQ965 533/800/1066MHz Broadwater GMCH Channel AChannel B DDR2DDR2 VGA PCI Expressx16 Analog Display PCI Express x16 ICH8 DMI Interface Controller Link USB 2.010 ports GPIO SATA4 ports SPI Flash SPI HDACodec SMBus 2.0/I2C SST FanSpeedControl LPC Interface S I/OTPM Nineveh or Ekron LAN LGA775 Processor PAGE 17: USBPAGE 20: SATA & VGA & CPU FAN & XDPPAGE 19: VRMPAGE 15: PCI EXPRESS(x1 , x16) & TPM & MINI PCIEPAGE 16: SIO PTCQ965 PAGE 2: CPU - LGA 775 - 1PAGE 3: CPU - LGA 775 - 2PAGE 4: GMCH 1PAGE 7: ICH 8 - 1PAGE 8: ICH 8 - 2PAGE 5: GMCH 2PAGE 6: GMCH 3PAGE 10: DDR2PAGE 12: 1394(VT6307S) Clock Generation XDP LCIGLCI PCI Bus 1394 PCIe Bus MINI PCIE PAGE 18:POWERPAGE 14:AUDIO(ALC262)PAGE 13:LANPAGE 11:DDR2(Termination)PAGE 9:Clock GeneratorPAGE 1:Cover Sheet & Block Diagram 1.1A~2.0A 6V~8V Polyswitch Name Voltage 6V~8V Page USBFS31394FS Current USBFS1USBFS2 15~16V 6V~8V6V~8V 1720121717 FS2 1.1A~1.5A1.1A~1.5A1.1A~2.0A1.1A~3.0A 55 44 33 22 11 D D C C B B A A CPUGTLREF_0CPUGTLREF_1 H_COMP2H_COMP3 H_TDIH_TDOH_TCK-THERMTRIP_ICH8-H_FERR H_PWRGD H_VSSA -H_DBI2-H_STBP2 H_VCCIOPLL H_TESTHI_12H_TESTHI_11 -HA_14-HA_7-HA_10-HA_16-HA_9-HA_5-HA_11-HA_15-HA_4-HA_6-HA_12-HA_3-HA_8-HA_13-H_ADSTB0-H_REQ4-H_REQ1-H_REQ2-H_REQ0-H_REQ3 -H_BNR-H_HIT-H_ADS-H_IERR-H_DRDY-H_DBSY-H_INIT-H_DEFER-H_HITM-H_LOCK-H_BPRI-H_TRDY H_TESTHI_10-H_BR0H_TESTHI_8H_TESTHI_9-H_STBN3-H_DBI3-H_STBP3-H_D59-H_D62-H_D52-H_D56-H_D55-H_D57-H_D53-H_D51-H_D61-H_D63-H_D54-H_D60-H_D49-H_D48-H_D50-H_D58-H_STBN2-H_D37-H_D41-H_D40-H_D36-H_D42-H_D38-H_D47-H_D32-H_D45-H_D34-H_D44-H_D39-H_D35-H_D33-H_D46-H_D43 -H_DBI1-H_STBP1-H_STBN1 -H_D20-H_D21-H_D25-H_D22-H_D17-H_D19-H_D18-H_D23-H_D31-H_D28-H_D16-H_D29-H_D27-H_D24-H_D26-H_D30-H_DBI0-H_STBP0-H_STBN0-H_D2-H_D9-H_D8-H_D6-H_D4-H_D13-H_D1-H_D15-H_D14-H_D3-H_D10-H_D0-H_D7-H_D11-H_D12-H_D5 -H_FORCEPH H_PWRGD-THERMTRIP_ICH8-H_PROCHOTH_COMP2H_COMP1H_COMP0 H_VCCAH_VSSAH_SKTOCC H_TDIH_TDOH_TCK-H_TRSTH_TMS CPU_GTLREF_0 CPU_GTLREF_1CPU_GTLREF_0 CPU_GTLREF_1 CPU_MCH_GTLREF H_INTR-H_A20M-H_STPCLK-H_SMIH_NMI-H_FERR-H_IGNNECPU_CLK-CPU_CLKVCC_PKGSENSEVSS_PKGSENSE H_COMP3H_COMP4H_COMP5H_COMP6H_COMP7 H_COMP7H_COMP5H_COMP4 H_TESTHI_13 -FP_RST -H_TRST H_COMP1H_COMP0 H_TESTHI_0 -H_BPM3-H_BPM0-H_BPM4-H_BPM1-H_BPM2-H_BPM5 H_TESTHI_1 -HA_19-HA_20-HA_28-HA_22-HA_24-HA_29-HA_23-HA_26-HA_21-HA_30-HA_17-HA_25-HA_27-HA_18-HA_31-HA_32-HA_33-HA_34-HA_35-H_ADSTB1 -H_RS2-H_RS0-H_RS1-H_CPURST H_VCCIOPLLH_VCCPLLVRD_VIDSELCPU_THERMDACPU_THERMDCVCC_SENSEVSS_SENSE PECI H_TESTHI_2_7 H_COMP8 MS_ID0MS_ID1 -H_BPM4-H_BPM0-H_BPM1-H_BPM3-H_BPM2-H_BPM5FSB_SEL1FSB_SEL0FSB_SEL2 VR_READY VTT_SEL H_VID1H_VID0H_VID4H_VID7H_VID3H_VID5H_VID2H_VID6 H_VID7H_TESTHI_8H_TESTHI_9H_TESTHI_10H_TESTHI_11 H_TESTHI_12 -H_IERR -H_CPURST FSB_SEL0FSB_SEL1FSB_SEL2 -H_FORCEPHH_COMP6H_COMP8H_VCCPLL VSS_PKGSENSEVCC_PKGSENSE VCC_VRMSENVSS_VRMSEN VCC_SENSEVSS_SENSE -H_PROCHOTVR_READYVRD_VIDSEL H_TESTHI_0 H_TESTHI_2_7 CPU_THERMDACPU_THERMDC H_VCCA -H_BR0 H_VID0H_VID1H_VID2H_VID3H_VID4H_VID5H_VID6H_TMS H_TESTHI_1 H_TESTHI_13 H_VID3H_VID6H_VID2H_VID7H_VID4H_VID0H_VID5H_VID1 CPU_GTLREF_2CPU_GTLREF_3 CPUGTLREF_2CPUGTLREF_3 CPU_GTLREF_2CPU_GTLREF_3 -H_ADSTB0 [4] -H_REQ[0:4] [4] -H_DBI2 [4] -H_STBP2 [4] -HA_[3:16] [4] -H_BNR [4] -H_ADS [4] -H_HIT [4] -H_DBSY [4]-H_DRDY [4]-H_BPRI [4] -H_TRDY [4]-H_INIT [7] -H_HITM [4] -H_LOCK [4]-H_DEFER [4]-H_BR0 [4] -H_STBN3 [4]-H_STBP3 [4]-H_DBI3 [4] -H_D[48:63] [4]-H_STBN2 [4]-H_D[32:47] [4] -H_DBI1 [4] -H_STBP1 [4] -H_STBN1 [4] -H_D[16:31] [4] -H_STBN0 [4] -H_STBP0 [4] -H_DBI0 [4] -H_D[0:15] [4] -H_FORCEPH [19]-THERMTRIP_ICH8 [7]-H_PROCHOT [7,19]H_PWRGD [7] CPU_MCH_GTLREF [4] -H_A20M [7] -H_SMI [7] -H_IGNNE [7] H_NMI [7] H_INTR [7] -H_FERR [7] -H_STPCLK [7] -CPU_CLK [9] CPU_CLK [9] -FP_RST [7,16,20] -HA_[17:35] [4] -H_ADSTB1 [4] -H_RS[0:2] [4]-H_CPURST [4,20] H_VID[0:7] [19] VRD_VIDSEL CPU_THERMDC [16] CPU_THERMDA PECI [7] FSB_SEL0 [4,9] FSB_SEL1 [4,9] FSB_SEL2 [4,9] -H_BMP0 [20] -H_BMP1 [20] -H_BMP2 [20] -H_BMP3 [20] -H_BMP4 [20] -H_BMP5 [20] VCC_VRMSEN [19]VSS_VRMSEN [19] H_TDO -H_TRST [20] H_TCK [20] H_TDI [20] H_TMS [20] H_SKTOCC H_VCCPLL [6] VR_READY [8] VTT_SEL [18] VTT_R [3,19,20] VTT_R [3,19,20] VTT_R [3,19,20] VTT_L [3] FSB_VTT [4,6,8,16,18] FSB_VTT [4,6,8,16,18] VCORE [3,16,19] VTT_R [3,19,20] VTT_L [3] FSB_VTT [4,6,8,16,18] VTT_L [3] VTT_R [3,19,20] FSB_VTT [4,6,8,16,18] FSB_VTT [4,6,8,16,18] VTT_L [3] VTT_R [3,19,20] VTT_L [3] VTT_L [3] VTT_L [3] VTT_R [3,19,20] TitleSize Document Number Rev Date: Sheet of S05700D0 1.2a CPU LGA775-1 First International Computer,Inc. 220 Thursday, January 18, 2007 PTCQ965 Place at ICH end of route Place at CPU end of route Place components as close as possibleto processor socket trace width to capsmust be no smaller than 12mil LGA775 eMOW WW44 eMOW WW42eMOW WW42eMOW WW42 eMOW WW42 eMOW WW42eMOW WW42 For next version ConroeFor next version Conroe CPUD CPU_775P TCK AE1 TDI AD1 TDO AF1 TMS AC1 TRST# AG1 VTT1 A29 VTT2 B25 VTT3 B29 VTT4 B30 VTT5 C29 VTT6 A26 VTT7 B27 VTT8 C28 VTT9 A25 VTT10 A28 VTT11 A27 VTT12 C30 VTT13 A30 VTT14 C25 VTT15 C26 VTT16 C27 VTT17 B26 VTT18 D27 VTT19 D28 VTT20 D25 VTT21 D26 VTT22 B28 VTT23 D29 VTT24 D30 VTTPWRGD AM6 VTT_OUT_R AA1 VTT_OUT_L J1 VTT_SEL F27 SPARE0 N5 SPARE3 AE6 SPARE1 C9 NC_DSS2 D16 NC_DSS3 A20 NC E23 BPM0# AJ2 BPM1# AJ1 BPM2# AD2 BPM3# AG2 BPM4# AF2 BPM5# AG3 DBR# AC2 ITP_CLK0 AK3 ITP_CLK1 AJ3 BSEL0 G29 BSEL1 H30 BSEL2 G30 SPARE2 E7 R146 49.9_1%_0402 + CE1033uF_16V R211 10_1%_0402 R210124_1%_0402 CPUB CPU_775P D00# B4 D01# C5 D02# A4 D03# C6 D04# A5 D05# B6 D06# B7 D07# A7 D08# A10 D09# A11 D10# B10 D11# C11 D12# D8 D13# B12 D14# C12 D15# D11 DBI0# A8 DSTBN0# C8 DSTBP0 B9 D16# G9 D17# F8 D18# F9 D19# E9 D20# D7 D21# E10 D22# D10 D23# F11 D24# F12 D25# D13 D26# E13 D27# G13 D28# F14 D29# G14 D30# F15 D31# G15 DBI1# G11 DSTBN1# G12 DSTBP1 E12 D32# G16 D33# E15 D34# E16 D35# G18 D36# G17 D37# F1…

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Test Report

Certificate Gestek GESTEK Gestek Gestek GESTEK Gestek estek GESTEK Gestek GES T stek GESTEK Gestek GESTE tek GESTEK Gestek GESTEK ek GESTEK Gestek GESTEK k GESTEK Gestek GESTEK GESTEK Gestek GESTEK February 2007 GesTek EMC Lab N0. 3, Pau-Tou-Tsuo Valley, Chia-Pau Tsuen, Lin Kou Hsiang, Taipei County, Taiwan, R.O.C. TEL:886-2-2603-5321 FAX:886-2-2603-5325 Oasis Est. for Electronic Technologies Product Type : PC System Model Number : C2D900+ Brand Name : Samsync FCC ID : UZQ-C2D900 Test Report Number : 0702003 Rev. 1 Date of Test : September 21, 2006 February 01, 2007 This Product was tested to the following standards at the laboratory of Global EMC Standard Tech. Corp., and found Compliance. Standards: CFR 47, Part 15 / CISPR 22 3rd Edition: 1997, Class B ANSI C63.4: 2005 Canadian ICES-003 Sharon Chang, President Date: February 15, 2007 http : //www.gestek.com.tw 200085-0 GESTEK Lab Report No.: 0702003 Rev. 1 N0 3, Pau-Tou-Tsuo Valley, Chia-Pau Tsuen, Lin Kou Hsiang, Taipei County, Taiwan, R.O.C. Tel:886-2-2603-5321 Fax:886-2-2603-5325 Accredited Lab. Of BSMI, NEMKO, NVLAP. Page 1 of 49 Listed Lab. of Commerce, FCC, VCCI. NVLAP Lab Code:200085-0 Test Report Application for Certification On Behalf Of Oasis Est. for Electronic Technologies EUT: PC System Model Number: C2D900+ FCC ID: UZQ-C2D900 Prepared for: Oasis Est. for Electronic Technologies P.O. Box 950615, Amman 11195, Jordan Report By : Global EMC Standard Tech. Corp. No.3 Pau-Tou-Tsuo Valley, Chia-Pau Tsuen, Lin Kou Hsiang, Taipei County, Taiwan, R.O.C. Tel : 886-2-2603-5321 Fax : 886-2-2603-5325 Test results given in this report only relate to the specimen(s) tested, calibrated or measured. This report shall not be reproduced other than in full without the written consent of Gestek. This report must not be use to claim product endorsement by any agency of the U.S. Government. All data in this report are traceable to national standard or international standard. GESTEK Lab Report No.: 0702003 Rev. 1 N0 3, Pau-Tou-Tsuo Valley, Chia-Pau Tsuen, Lin Kou Hsiang, Taipei County, Taiwan, R.O.C. Tel:886-2-2603-5321 Fax:886-2-2603-5325 Accredited Lab. Of BSMI, NEMKO, NVLAP. Page 2 of 49 Listed Lab. of Commerce, FCC, VCCI. NVLAP Lab Code:200085-0 TABLE OF CONTENTS DESCRIPTION PAGE 1. CERTIFICATION..................................................................................................... 3 2. SUMMARY OF TEST RESULTS ............................................................................ 4 3. GENERAL INFORMATION..................................................................................... 5 3.1 PRODUCTION DESCRIPTION ............................................................................... 5 3.2 TEST MODES & EUT COMPONENTS DESCRIPTION ......................................... 6 3.3 CONFIGURATION OF THE TESTED SYSTEM ..................................................... 7 3.4 BLOCK DIAGRAM OF CONNECTIONS BETWEEN EUT AND SIMULATORS .. 10 3.5 TEST METHODOLOGY ........................................................................................ 11 3.6 TEST FACILITY..................................................................................................... 11 4. CONDUCTED EMISSION MEASUREMENT ........................................................ 12 4.1 TEST EQUIPMENTS............................................................................................. 12 4.2 BLOCK DIAGRAM OF TEST SETUP ................................................................... 12 4.3 CONDUCTED EMISSION LIMIT ........................................................................... 13 4.4 EUT CONFIGURATION ON MEASUREMENT ..................................................... 13 4.5 CONDUCTED EMISSION DATA .......................................................................... 13 4.6 OPERATING CONDITIONS OF THE EUT............................................................ 14 4.7 CONDUCTED EMISSION MEASUREMENT RESULTS...................................... 15 5. RADIATED EMISSION MEASUREMENT ............................................................ 17 5.1 TEST EQUIPMENT ............................................................................................... 17 5.2 OPEN TEST SITE SETUP DIAGRAM .................................................................. 17 5.3 RADIATED EMISSION LIMIT................................................................................ 18 5.4 EUT CONFIGURATION ........................................................................................ 19 5.5 OPERATING CONDITION OF EUT ...................................................................... 19 5.6 RADIATED EMISSION DATA ............................................................................... 19 5.7 RADIATED EMISSIONS MEASUREMENT RESULTS ......................................... 20 6. PHOTOGRAPHS FOR TEST................................................................................ 30 6.1 TEST PHOTOGRAPHS FOR CONDUCTION....................................................... 30 6.2 TEST PHOTOGRAPHS FOR RADIATED............................................................. 31 7. PHOTOGRAPHS FOR PRODUCT ....................................................................... 33 8. EMI REDUCTION METHOD DURING COMPLIANCE TESTING ........................ 47 GESTEK Lab Report No.: 0702003 Rev. 1 N0 3, Pau-Tou-Tsuo Valley, Chia-Pau Tsuen, Lin Kou Hsiang, Taipei County, Taiwan, R.O.C. Tel:886-2-2603-5321 Fax:886-2-2603-5325 Accredited Lab. Of BSMI, NEMKO, NVLAP. Page 3 of 49 Listed Lab. of Commerce, FCC, VCCI. NVLAP Lab Code:200085-0 1. CERTIFICATION Applicant : Oasis Est. for Electronic Technologies EUT Description : PC System Model Number : C2D900+ Brand Name : Samsync FCC ID : UZQ-C2D900 Serial Number : N/A Tested Power Supply : 120Vac/60Hz MEASUREMENT PROCEDURES USED: ; CFR 47, Part 15 Radio Frequency Device Subpart B Unintentional Radiators Class B ; CISPR 22 3 rd Edition:1997 Limits and methods of measurement of radio …

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Test Setup Photos