VBM-EPCE760EPC

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5 5 4 4 3 3 2 2 1 1 DD CC BB AA Control Signals USB Interface 3.3V Serial EEPROM 5V Interface Signals 2.4G TX0 RFX2402 2.4G RX0 Antenna T/R PAPE_G0 BPFPA RT2070 LDO Regulator LNA 5 5 4 4 3 3 2 2 1 1 DD CC BB AA Title SizeDocument NumberRev Date:Sheet of BV07-SY-8505 V1.0 Benign Technologies Co.,Ltd. C 112Tuesday, July 27, 2010 Title SizeDocument NumberRev Date:Sheet of BV07-SY-8505 V1.0 Benign Technologies Co.,Ltd. C 112Tuesday, July 27, 2010 Title SizeDocument NumberRev Date:Sheet of BV07-SY-8505 V1.0 Benign Technologies Co.,Ltd. C 112Tuesday, July 27, 2010 WM8505 PID IO Board WMS8061A Cover Page UART0 7" LCD SD CRAD 2GMB NAND MLC 128MB DDR2 SD/MMC 512KB SPI USB AC97 NAND I/F SFI Memory I/F BV07-SY-8505 SYSTEM BLOCK DIAGRAM 18b VT8505 LCD I/F AC97 Codec Line-Out Mic-In Debug Port Amplifier Speaker WiFi 8b 16b USB HUB Host Host GL850G USB 27MRTC/32.768KHZ 12M 24.576M USB3 USB2 USB1 10/100 PHY MII PS2 Touchpad PS2 KeyboardPS2 Touchpad PS2 Keyboard 6M Create PDF with GO2PDF for free, if you wish to remove this line, click here to buy Virtual PDF Printer

SCS-F18: Project and Product Certification Representative Authorization Letter Page 1 of 2 Rev 2.0 2206 Ringwood Avenue San Jose, CA 95131 Tel: 408-526-1188 Fax: 408-526-1088 Email: [email protected] Project and Product Certification Representative Authorization Letter Revision History Reason for Amendment (current / obsolete) From To Approved Date Initial Release (current) 1.0 1.0 Nov-14-2006 Revised wording (current) 1.0 2.0 Sept–25-2007 SCS-F18: Project and Product Certification Representative Authorization Letter Page 2 of 2 Rev 2.0 SHENZHEN YUDAFU ELECTRONIC CO., LTD. 2011-01-26 To: SIEMIC, INC. 2206 Ringwood Avenue, San Jose, CA 95131 USA Dear Sir/Madam, Re: Project and Product Certification Representative Authorization Letter We, SHENZHEN YUDAFU ELECTRONIC CO., LTD. hereby authorize SIEMIC, INC. to act as a Certification Body for certifying for the following project(s): (EPC, SX-E760) We affirm that between SIEMIC and SHENZHEN YUDAFU ELECTRONIC CO., LTD. any difference in understanding, including test plan, measurement methods, applicable standards and relevant procedures and processes have been resolved prior to commencement of testing activities. Sincerely, Signature Mingchun Cao / Manager E-mail: : [email protected] Phone: +86-755-2673-7355 Fax: +86-755-2673-7274 Address : YUDAFU Industrial Garden, Xingye West Road, ShajingTown, Baoan, Shenzhen, Guangdong, China

SHENZHEN YUDAFU ELECTRONIC CO., LTD. Date: 2011-01-26 To: Federal Communications Commission 7435 Oakland Mills Road Columbia, MD FCC ID: VBM-EPCE760 To Whom It May Concern: This letter is to ascertain that SHENZHEN YUDAFU ELECTRONIC CO., LTD. Product EPC has been the units used for conducting FCC compliance testing, the DoC part will be tested by FCC recognized test lab. If you have any question or concerns, pls. contact us. Sincerely, Signature Mingchun Cao / Manager E-mail: : [email protected] Phone: +86-755-2673-7355 Fax: +86-755-2673-7274 Address : YUDAFU Industrial Garden, Xingye West Road, ShajingTown, Baoan, Shenzhen, Guangdong, China

External of EUT External of EUT External of EUT

FCC ID Label FCC ID: VBM-EPCE760 Model Number: SX-E760 Made in China This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation

Label Location Proposed Label Location on EUT

Internal of EUT WIFI module Antenna Internal of EUT Internal of EUT

Product Diagram Information 1.Product function introduce SX-E760 is a wilelessbook device with 7 inch digital screen, It has function of visiting internet with WiFi or with Ethernet LAN, playing audio and video in NAND flash or SD card, audio recorder, calendar, real-time clock ,weather,MSN,calculator,Microsoft Office and so on. 2． Structure 2.1 Structure Introduce The system is consist of WM8505+，one piece of NAND Flash, one pieces of 128M DDR, 7” TFT panel, WiFi module(RK2070), SD CARD socket,three USB port,earphone port,microphone port,one standard mini keyboard,one Ethernet LAN port and some power conversions IC 2.2 Description When you stir the switch of power ,the system is powered on. When you choose any icon in the GUI of Android using touchpad,wm8505 first judge what happened and then give it to the ARM 2.3 Power It can use adaptor of 9V*1.5A, when the system display the battery remain a little of power or exhaust.

FCC ID : VBM-EPCE760 WLAN (Portable device) According to §15.247(e)(i) and §1.1307(b)(1), systems operating under the provisions of this section shall be operated in a manner that ensures that the public is not exposed to radio frequency energy level in excess of the Commission’s guidelines. According to KDB 447498 (2)(a)(i) Frequency Range Low Frequency (MHz) High Frequency(MHz) Center frequency (MHz) 60/f SAR Limitation (mw) 2412 2462 2437 25 Maximum measured transmitter power: 802.11b Conducted Power (dBm) Max Antenna Gain (dBi) EIRP (mw) 13.78 0 (PCB) 23.87 Maximum measured transmitter power: 802.11g Conducted Power (dBm) Max Antenna Gain (dBi) EIRP (mw) 12.31 0(PCB) 17.02 Threshold at which no SAR required is 25 mw. Maximum Tx power is 23.87 mw EIRP. Conclusion: No SAR is required. Sincerely, Signature Mingchun Cao / Manager E-mail: : [email protected] Phone: +86-755-2673-7355 Fax: +86-755-2673-7274 Address : YUDAFU Industrial Garden, Xingye West Road, ShajingTown, Baoan, Shenzhen, Guangdong, China

C5 100nF/NC C24 100nF 1 2 C30 4.7uF C13 100nF 1 2 R10 80.6R C2 10pF L10R 1 2 C23 10uF/6.3V 12 R14 0R 12 R9 1M/NC 12 R7 1M/NC   1 RX 2 NC 3 NC 4 TX 5 TX/RXN 6 CE 7 V_DET 8 NC 9 NC 10 ANT 11 GND 12 NC 13 RES 14 PAVCC 15 NC 16 LNAVCC 17 GND U1 RFX2402 6 H2 5 H1 1 VCC 2 D- 3 D+ 4 GND 7 NC1 8 NC2 J3 USB_A_Single 1 2 C22 1pF/NC 12 R8 620/NC 4 VIN 1 EN 3 SW 5 FB 2 GND U4 SY8009B SOT-25 C54 10uF/6.3V C0805 C53 10uF/6.3V C0805 L9 VLS2520-4R7M C27 1nF R15 680K/F R0402 R16 150K/F R0402 C51 22pF C52 1nF 1 2 L5 1.5nH 12 C9 1pF 12 C12 0.8pF/NC 1 2 L4 3.9nH/NC 12 C7 1.5pF/NC 12 L30R 1 2 C6 1.5pF/NC C8 2.2pF/NC 12 C10 1.8pF 12 L2 1.5nH 12 C4 1.8pF C1 2.2pF/NC 1 TP J1 TP 1 GND 2 GND 3 GND M1 SHIELD COVER/NC C31 10pF 1 RF 2 GND [2] PA_PE_G GNDGND GND VB1 [2] UDP GND GND GND +3.3V_LDO VBUS +3.3V [2] UDM GND GND VBUS +3.3V [2] RFING [2] PA_RFG GNDGND GND BPF1 GND GND PAIN_G +3.3V GND MPAOMPAOM ANTEC Place RT1 close to Power Amp. Reserve FOR RX LO leakage 12 C44 27pF C16 100nF t 1 2 RT1 CT6103-3435-5P/NC C21 100nF C49 10pF C25 10pF C20 100nF 1 2 R11 10K C11100nF 12 C26 2.7pF/NC 12 C34 22nF C32 100nF C47 100nF/NC 12 C46 100nF 12 C39 1uF 12 R5 12K 12 D1LED 12 R12 10K 12 C45 100nF C35 100nF C14 10pF 1 2 R3 10K/NC 1 2 C19 100pF 12 C50100nF 12C371uF C38 100nF C17 10pF 12 C48 100nF 12 C41 1uF 12 R2100K 1 2 R6 8.2K 12 R4 10K 12 C42 100nF C40 10pF 12 R13 4.7K/NC 12 C33 1uF 12 C15 100nF 12 R1 330R 12 L7 2.7nH/NC 12 C43 100nF 12 C18 1pF 1 RF2G_INP 2 RF2G_INN 3 RF_V12A 4 RF2G_OUTP 5 RF_IO_V33A 6 RF_PA_PE 7 RF_TSSI_IN 8 BASE_1_V12A 9 LDO_CORE_VO12 10 LDO_CORE_VI15 11 RST_N 12 LDO_FUSE_VO25 13 LDO_FUSE_VI33 14 VDD 15 TR_SW0 16 TR_SWN0 17 EXT_PM_MODE 18 CPU_PFL_CSN 19 LED_ACT_N 20 LED_RDYG_N 21 VDD 22 VCCIO 23 TESTEN 24 SEL_EFUSE 25 LNA_PE 26 GPIO3 27 GPIO2 28 GPIO1 29 GPIO0 30 USB_SUSPM 31 SEL_EXT_CLK 32 CLK_EXT 33 VDD 34 VRES 35 VDDA 36 PADM 37 PADP 38 VDDL 39 SPICSN 40 SPISCK 41 SPISI 42 SPISO 43 VDD 44 VCCIO 45 PLL_AVDD_V12A 46 PLL_DVDD_V12D 47 BASE_TRX_QN 48 BASE_TRX_QP 49 BASE_TRX_IN 50 BASE_TRX_IP 51 BASE_2_V12A 52 ADC_V33A 53 ADC_VREF 54 ADC_VREF025N 55 ADC_VREF025P 56 ADC_VCC12D 57 ADC_VCC12D 58 ADC_VCC12A 59 ADC_VCC12A 60 ADC_VREFN 61 ADC_VREFP 62 ADC_VCC12A 63 LDO_OUT1_V12A 64 LDO_IN12_VX 65 LDO_OUT2_V12A 66 BG_VBG 67 BG_RES_12K 68 BG_V33A 69 PLL_X2 70 PLL_X1 71 PLL_DIV_V12A 72 PLL_PRE_V12A 73 PLL_VC_CAP 74 VCO_LO_V12A 75 VCO_VCO_V12A 76 RF_LO_V12A 77 GND U2 RT2070 1 X1 2 GND 3 X2 4 GND Y1 XTAL_S4 12 C28 3.9pF 12 L6 3.3nH 12 C29 0.5pF 12 L8 1.8nH 1 CS 2 SO 3 WP 4 GND 5 SI 6 SCK 7 HOLD 8 VCC U3 AT25080A/NC 1 2 C36 27pF/NC [1] PA_PE_G [1] PA_RFG [1] RFING [1] UDP [1] UDM GND GNDGNDGND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND RF_ING RFING SEL_EFUSE VRES 40MX1 ADC_VREF025P LED_LKACT# ADC_VREFP ADC_VREF025N ADC_VREFN PLL_VC_CAP UDP UDM TSSI RST_N BG_RES_12K 2_5V ADC_VREF SPISO SPICSN SPISCK SPISI RFING0+ RFING0- RF_ING_L LD1P_ACT 1_2V 1_2VA_21_2VA_21_2VA_21_2VA_21_2VA_2 +3.3V +3.3V +3.3V +3.3V +3.3V +3.3V +3.3V 1_2VA_1 1_2VA_1 1_2VA_11_2VA_1 1_2VA_1 +3.3V_LDO +3.3V_LDO 1_2V 1_2V 1_2V 1_2V 1_2V 1_2V 1_2V 1_2V 1_2V1_2V 1_2V 1_2V 1_2V GND GND GND GNDGND GND GND GND GND GND GND GND +3.3V 1_2VA_1 1_2V 1_2VA_2 +3.3V +3.3V_LDO +3.3V +3.3V +3.3V 5 5 4 4 3 3 2 2 1 1 DD CC BB AA Title SizeDocument NumberRev Date:Sheet of BV07-SY-8505LED<RevCode> LEDBOARDFORSY A 11Tuesday, March 09, 2010 Title SizeDocument NumberRev Date:Sheet of BV07-SY-8505LED<RevCode> LEDBOARDFORSY A 11Tuesday, March 09, 2010 Title SizeDocument NumberRev Date:Sheet of BV07-SY-8505LED<RevCode> LEDBOARDFORSY A 11Tuesday, March 09, 2010 R6510RR6510R D3D3R3510RR3510R R1510RR1510R R5510RR5510R SW2 TS1187(1.5H) SW2 TS1187(1.5H) 13 42 R8510RR8510R D5D5 D2D2R70RR70R D1D1 CON1 CON12 CNS12_1_R1 CON1 CON12 CNS12_1_R1 1 2 3 4 5 6 7 8 9 10 11 12 1314 D6D6 R2510RR2510R SW1 TS1187(1.5H) SW1 TS1187(1.5H) 13 42 SW1-L SW_TC_SPST BUTTON5S_6D2 SW1-L SW_TC_SPST BUTTON5S_6D2 14 235 SW2-R SW_TC_SPST BUTTON5S_6D2 SW2-R SW_TC_SPST BUTTON5S_6D2 14 235 D4D4R4510RR4510R Create PDF with GO2PDF for free, if you wish to remove this line, click here to buy Virtual PDF Printer 5 5 4 4 3 3 2 2 1 1 DD CC BB AA Title SizeDocument NumberRev Date:Sheet of BV07-SY-8505 V1.0 Benign Technologies Co.,Ltd. Custom 212Tuesday, July 27, 2010 Title SizeDocument NumberRev Date:Sheet of BV07-SY-8505 V1.0 Benign Technologies Co.,Ltd. Custom 212Tuesday, July 27, 2010 Title SizeDocument NumberRev Date:Sheet of BV07-SY-8505 V1.0 Benign Technologies Co.,Ltd. Custom 212Tuesday, July 27, 2010 [VCCA15USBPLL] [VCCA33USBPLL] [VCC33USB] [VCCRGMII]@MII [VCCA33DAC] (pull-lowforAutoPowerOnMode) POWER SEQUENCE:POWER TREE: Power Tree & Power Sequence 5V PWREN15 PWREN33 PWREN18 PWRBTN# PWRGD 5 4 5 VINSW 5VSUS 1 3 2 1 3 2 VDD VCC33 VCCMEM RSMRST# PowerONSuspendResumePowerOFF 5 5 4 1P5VSUS 3P3VSUS 3P3V 2 12VDC 5V/3A U2 APW7145 12VDCIN PWREN15 1 1.5V/1A U5 APW7102 3.3V/1A APW7102 U6 2 PWREN33 3P3VSUS [3P3VSUS] 1.5V,3.3V/300mA U14 RT9193-15PB 5V_SUS 1P5VSUS [1P5VSUS] VDD 3P3V [VCCMEM]@DRAM 5V Q8Q7 PWREN33 2N7002 APM2301 [VCCMEM] [VCC33PLL] [VCC33XTAL] [VCC33] [3P3V]@Devices [VDD] 1.8V/600mA U4 SoC Sus-power: APW7101 PWREN18 VCCMEM 3 [5V]@LCD [5V_USB] USB POWER: 1.5V,3.3V/300mA U13 RT9193-33PB Power Sequence Create PDF with GO2PDF for free, if you wish to remove this line, click here to buy Virtual PDF Printer 5 5 4 4 3 3 2 2 1 1 DD CC BB AA SATA1 PWRBTN- APW7145_ENSATA1 VPACK+ VDCIN VDCINVIN VDCIN VPACK+ VDCIN 3P3VSUS 3P3VSUS VIN 3P3V VDCIN 3P3V PWRGD4,12 DCIN_DT12 PWRBTN-12 PWRBTN-KEY11 APW7145_EN4 Charger_STAT12 CHAR_LED+9 SATA1_LED-9 Title SizeDocument NumberRev Date:Sheet of BV07-SY-8505 V1.0 Benign Technologies Co.,Ltd. Custom 312Tuesday, July 27, 2010 Title SizeDocument NumberRev Date:Sheet of BV07-SY-8505 V1.0 Benign Technologies Co.,Ltd. Custom 312Tuesday, July 27, 2010 Title SizeDocument NumberRev Date:Sheet of BV07-SY-8505 V1.0 Benign Technologies Co.,Ltd. Custom 312Tuesday, July 27, 2010 Near Connector Pin for ESD RESET BUTTON 1206 Co-Layer 9V Input 2A 1.5A Rating Buttons 1 9V Ad…

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SHENZHEN EMTEK CO., LTD. REPORT NO: ES110110035F FCC ID: VBM-EPCE760 DATE: 1/25/2011 Page 1 of 51 ELECTROMAGNETIC EMISSIONS COMPLIANCE REPORT INTENTIONAL RADIATOR CERTIFICATION TO FCC PART 15 SUBPART C REQUIREMENT OF EPC MODEL No.: SX-E760 FCC ID: VBM-EPCE760 REPORT NO: ES110110035F ISSUE DATE: January 25, 2011 Prepared for SHENZHEN YUDAFU ELECTRONIC CO., LTD. YUDAFU Industrial Garden, Xingye West Road, ShajingTown, Baoan, Shenzhen, Guangdong, China Prepared by SHENZHEN EMTEK CO., LTD Bldg 69, Majialong Industry Zone, Nan0shan District, Shenzhen, Guangdong, China TEL: 86-755-26954280 FAX: 86-755-26954282 SHENZHEN EMTEK CO., LTD. REPORT NO: ES110110035F FCC ID: VBM-EPCE760 DATE: 1/25/2011 Page 2 of 51 VERIFICATION OF COMPLIANCE Applicant: SHENZHEN YUDAFU ELECTRONIC CO., LTD. YUDAFU Industrial Garden, Xingye West Road, ShajingTown, Baoan, Shenzhen, Guangdong, China Manufacturer: SHENZHEN YUDAFU ELECTRONIC CO., LTD. Building NO. 22, 23, Fifth Region, Baiwangxin Industrial Park, Songbai Rd., Nanshan, Shenzhen 518108, China Product Description: EPC Brand Name: SKYTEX Model Number: SX-E760 Serial Number: N/A File Number: ES110110035F Date of Test: January 10, 2011 to January 23, 2011 We hereby certify that: The above equipment was tested by SHENZHEN EMTEK CO., LTD. The test data, data evaluation, test procedures, and equipment configurations shown in this report were made in accordance with the procedures given in ANSI C63.4 (2009) and the energy emitted by the sample EUT tested as described in this report is in compliance with conducted and radiated emission limits of FCC Rules Part 15.247. The test results of this report relate only to the tested sample identified in this report. Approved By David Lee / Q.A. Manager SHENZHEN EMTEK CO., LTD. SHENZHEN EMTEK CO., LTD. REPORT NO: ES110110035F FCC ID: VBM-EPCE760 DATE: 1/25/2011 Page 3 of 51 Table of Contents 1. GENERAL INFORMATION ................................................................................................. 5 1.1 PRODUCT DESCRIPTION........................................................................................................................... 5 1.2 RELATED SUBMITTAL(S) / GRANT (S) ..................................................................................................... 5 1.3 TEST METHODOLOGY.............................................................................................................................. 5 1.4 SPECIAL ACCESSORIES............................................................................................................................ 6 1.5 EQUIPMENT MODIFICATIONS.................................................................................................................. 6 1.6 TEST FACILITY........................................................................................................................................ 6 2. SYSTEM TEST CONFIGURATION ........................................................................................... 7 2.1 EUT CONFIGURATION............................................................................................................................. 7 2.2 EUT EXERCISE........................................................................................................................................ 7 2.3 TEST PROCEDURE.................................................................................................................................... 7 2.4 CONFIGURATION OF TESTED SYSTEM..................................................................................................... 7 3. DESCRIPTION OF TEST MODES ...................................................................................... 9 4. CONDUCTED EMISSIONS TEST ..................................................................................... 10 4.1 MEASUREMENT PROCEDURE:................................................................................................................ 10 4.2 TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) ....................................................................... 10 4.3 MEASUREMENT EQUIPMENT USED: ...................................................................................................... 10 4.4 CONDUCTED EMISSION LIMIT.................................................................................................................. 10 4.5 MEASUREMENT RESULT:....................................................................................................................... 11 4.6 CONDUCTED MEASUREMENT PHOTOS:.................................................................................................... 12 5. RADIATED EMISSION TEST ............................................................................................ 13 5.1 MEASUREMENT PROCEDURE................................................................................................................. 13 5.2 TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) ....................................................................... 13 5.3 MEASUREMENT EQUIPMENT USED: ...................................................................................................... 14 5.4 RADIATED EMISSION LIMIT..................................................................................................................... 14 5.5 MEASUREMENT RESULT......................................................................................................................... 15 5.6 RADIATED MEASUREMENT PHOTOS: ..................................................................................................... 27 6. OCCUPIED BANDWIDTH TEST....................................................................................... 28 6.1 MEASUREMENT PROCEDURE................................................................................................................. 28 6.2 TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) ....................................................…

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RADIATED EMISSION TEST CONDUCTED EMISSION TEST