2A2GJ-HRI-3621Sensor Hub

https://heltec.org HeltecAutomation©Limitedstandardfiles DocumentsRev.1.0P2/8Apr.2023 HRI-3622 SensorHubBusTransformer ————Drivingthird-partySensor https://heltec.org HeltecAutomation©Limitedstandardfiles DocumentsRev.1.0P3/8Apr.2023 Documentversion VersionTimeDescriptionRemark Rev.1.02023-4-26PreliminaryversionAaron CopyrightNotice Allcontentsinthefilesareprotectedbycopyrightlaw,andallcopyrightsarereserved byChengduHeltecAutomationTechnologyCo.,Ltd.(hereinafterreferredtoasHeltec). Withoutwrittenpermission,allcommercialuseofthefilesfromHeltecareforbidden, suchascopy,distribute,reproducethefiles,etc.,butnon-commercialpurpose, downloadedorprintedbyindividualarewelcome. Disclaimer ChengduHeltecAutomationTechnologyCo.,Ltd.reservestherighttochange,modify orimprovethedocumentandproductdescribedherein.Itscontentsaresubjectto changewithoutnotice.Theseinstructionsareintendedforyouuse. https://heltec.org HeltecAutomation©Limitedstandardfiles DocumentsRev.1.0P4/8Apr.2023 Content HRI-3622 .................................................................................................................2 SensorHubBusTransformer............................................................................2 Documentversion.................................................................................................3 CopyrightNotice...................................................................................................3 Disclaimer.............................................................................................................3 1. Description............................................................................................................5 1.1Overview.........................................................................................................5 1.2Productfeatures.............................................................................................6 2.Specifications........................................................................................................7 2.1Generalspecification.......................................................................................7 2.2Operatingconditions.......................................................................................8 2.2.1Powersupplyrange.................................................................................8 2.2.2Powerconsumption@3.7V...................................................................8 2.3RFcharacteristics............................................................................................8 2.4LoRaWANFrequency.......................................................................................9 2.5RGBindicatorlightdescription.......................................................................9 3.Hardwarecharacteristics.....................................................................................10 3.1PhysicalDimensions......................................................................................10 3.2Interfacedefinition.......................................................................................10 4.Resource............................................................................................................11 4.1Relevantresource..........................................................................................11 4.2HeltecContactInformation...........................................................................11 https://heltec.org HeltecAutomation©Limitedstandardfiles DocumentsRev.1.0P5/8Apr.2023 1.Description 1.1Overview HRU-3622isasub-modeloftheSensorHubforoutdoorseriesthat specificallydrivesthird-partysensors.Itsinterfaceisaflangeseat,with RS-485interfacesand4GPIOinterfaces,canbeusedtoconnectRS-485 sensorsdirectly. SensorHubforIndustryhasexcellentlowpowerconsumptionandlong transmissiondistancecharacteristics,comeswithabuilt-in1100mAh rechargeablebattery.Thestainless-steelshellandhigh-strengthplastic provideanIP66protectionlevel,allowingittoperformstablyand excellentlyincomplexindustrialenvironments. HRI-3622areavailablein3productvariants: Table1.1Productvariants No.ModelDescription 1 HRI-3622-470 470~510MHzworkingLoRafrequency,usedfor Chinamainland(CN470)LPWband 2 HRI-3622-868 863~870MHzworkingLoRafrequency,usedfor EU868,IN865LPWbands. 3 HRI-3622-915 902~923MHzworkingfrequency,usedfor AS923,US915,AU915,KR920LPWbands. https://heltec.org HeltecAutomation©Limitedstandardfiles DocumentsRev.1.0P6/8Apr.2023 1.2Productfeatures Industrialgradeprotectionstructure,IP66protectiongrade. Ultra-lowpowerconsumptiondesign,built-in1000mAh18350rechargeable battery. Compatiblewithwallfixingorcylinderfixing.  Wirelessdatatransmissioncommunicationradiusupto3km(noocclusion). Workingtemperature 1 :--20~60°C,Workinghumidity:≤90%(non-condensing). Powersupplymode:built-inbatteryorexternal5VDCpowersupply. CanregisterbyscanningtheQRcodethroughtheAPP,oreasilyregisterthrough thedeviceWiFi. 1 Thisreferstotheoperatingtemperatureandhumidityofthecircuitandbattery,notthesensor. https://heltec.org HeltecAutomation©Limitedstandardfiles DocumentsRev.1.0P7/8Apr.2023 2.Specifications 2.1Generalspecification Table2.1Generalspecification ParametersDescription Recommendedoperating condition -20~60°C,10~90(nocondensing)RH% Interface FlangeSeat(see3.2) Inputformat RS-485;4~20mA 2 MicrocontrollerHeltecWirelessShell Sensormodule Custom LoRaWANChannelPlanEU868/US915/AU915/AS923/KR920/RU864/CN470 Max.ReceivingSensitivity-136dBm@SF12BW=125KHz Max.TXPower+20±2dBm CommunicationDistance 2to6km(dependingongatewayantennaand environments) IPRatingIP66 OperatingTemperature -20~60°C OperatingHumidity 10%~100%,no-condensing BatteryCapacity1100mAh BatteryType 18350 2 ThroughtheJunctionBox https://heltec.org HeltecAutomation©Limitedstandardfiles DocumentsRev.1.0P8/8Apr.2023 2.2Operatingconditions 2.2.1Powersupplyrange Table2.2:Powersupplyrange ParameterMin.TypicalMax.Unit Operatingvoltage2.73.75V Chargingvoltage5V [email protected] Table2.2.1:Work…

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FCC ID: 2A2GJ-HRI-3621 TB-RF-074-1.0 Appendix III EUT External Photographs Photo 1 Appearance of EUT Photo 2 Appearance of EUT FCC ID: 2A2GJ-HRI-3621 TB-RF-074-1.0 Photo 3 Appearance of EUT Photo 4 Appearance of EUT FCC ID: 2A2GJ-HRI-3621 TB-RF-074-1.0 Photo 5 Appearance of EUT Photo 6 Appearance of EUT FCC ID: 2A2GJ-HRI-3621 TB-RF-074-1.0 Photo 7 Appearance of EUT Photo 8 Appearance of EUT

FCC ID: 2A2GJ-HRI-3621 TB-RF-074-1.0 Appendix IID Label Appendix II ID Label Location FCC ID: 2A2GJ-HRI-3621 Model: HRI-3621

FCC ID: 2A2GJ-HRI-3621 TB-RF-074-1.0 Appendix IV EUT Internal Photographs Photo 9 Internal of EUT Photo 10 Appearance of PCB FCC ID: 2A2GJ-HRI-3621 TB-RF-074-1.0 Photo 11 Appearance of PCB Photo 12 Appearance of PCB FCC ID: 2A2GJ-HRI-3621 TB-RF-074-1.0 Photo 13 Appearance of PCB & Battery Photo 14 Internal of Battery FCC ID: 2A2GJ-HRI-3621 TB-RF-074-1.0 Photo 15 Appearance of PCB Photo 16 Appearance of PCB FCC ID: 2A2GJ-HRI-3621 TB-RF-074-1.0 Photo 17 Appearance of PCB Photo 18 Appearance of PCB LoRa Antenna BT&WIFI Antenna FCC ID: 2A2GJ-HRI-3621 TB-RF-074-1.0 Photo 19 Appearance of PCB

Shenzhen Toby Technology Co., Ltd. Report No.: TBR-C-202404-0276-7 Page: 1 of 5 TB-RF-073-3.0 1/F., Building 6, Rundongsheng Industrial Zone, Longzhu, Xixiang, Bao'an District, Shenzhen, Guangdong, China Tel: +86 75526509301 Fax: +86 75526509195 Maximum Permissible Exposure Evaluation FCC ID: 2A2GJ-HRI-3621 1. Client Information Applicant : Heltec Automation Technology Co., Ltd Address : 1f, No.54,56,58, Zirui North Street, Gaoxin District, Chengdu, China. Manufacturer : Heltec Automation Technology Co., Ltd Address : 1f, No.54,56,58, Zirui North Street, Gaoxin District, Chengdu, China. 2. General Description of EUT EUT Name : Sensor Hub Models No. : HRI-3621, HRI-3622, HRI-3623, HRI-362X, HRI-3621S, HRI-3621G, HRI-3621R, HRI-3622S, HRI-3622G, HRI-3622R, HRU-1000, HRU-1001, HRU-3601 Model Difference : All these models are identical in the same PCB, layout and electrical circuit, the only difference is Different sales areas, different name. Sample ID : HC-C-202404-0276-01-02-1#&HC-C-202404-0276-01-02-2# Product Description : Operation Frequency: LORA: 902.3MHz~914.9MHz(125KHz) 903MHz~914.2MHz(500KHz) Bluetooth LE 5.0: 2402MHz~2480MHz 802.11b/g/n(HT20): 2412MHz~2462MHz 802.11n(HT40): 2422MHz~2452MHz Power Rating : USB INPUT: DC 5V/1A DC 3.7V 900mAh 3.33Wh Rechargeable Li-ion battery Software Version : HRI-3621.V1.0 Hardware Version : HRI-3621.V1.0 Connecting I/O Port(S) : Please refer to the User's Manual Remark : the MPE report used the EUT-2(HC-C-202404-0276-01-02-2#). Report No.: TBR-C-202404-0276-7 Page: 2 of 5 TB-RF-074-1. 0 MPE Calculations for FCC 1. Antenna Gain: Antenna Brand Model Name Type Antenna Gain(dBi) LORA N/A N/A Chip 1.32 Antenna Brand Model Name Type Antenna Gain(dBi) Bluetooth LE N/A N/A Phosphorus Cu 2.0 2.4G WIFI N/A N/A Phosphorus Cu 2.0 2. EUT Operation Condition: Software provided by client enabled the EUT to transmit and receive data at lowest, middle and highest channel individually. 3. Exposure Evaluation: Equation from page 18 of OET Bulletin 65, Edition 97-01 S=(PG)/4πR 2 Where S: power density P: power input to the antenna G: power gain of the antenna in the direction of interest relative to an isotropic radiator. R: distance to the center of radiation of the antenna 4. Simultaneous transmission MPE Considerations According to KDB447498: All transmitters and antennas in the host must be either evaluated for MPE compliance, by measurement or computational modeling, or qualify for the standalone MPE test exclusion in section 7.1. Simultaneous transmission MPE test exclusion applies when the sum of the MPE ratios for all simultaneous transmitting antennas incorporated in a host device, based on the calculated/estimated, numerically modeled or measured field strengths or power density, is ≤ 1.0. This means that: ∑ of MPE ratios ≤ 1.0 Report No.: TBR-C-202404-0276-7 Page: 3 of 5 TB-RF-074-1. 0 5. Standalone MPE Evaluation: LORA(DSS) Worst Maximum MPE Result Mode N TX Freq. (MHz) Conducted Power(max) (dBm) Turn-up Power (dB) Max tune up power (dBm) [P] ANT Gain (dBi) [G] Distance (cm) [R] Power Density (mW/cm 2 ) [S] Limit of Power Density (mW/ cm 2 ) (S) LORA 1 902.3 10.827 10±1 11 1.32 20 0.00339 0.6015 908.9 10.742 10±1 11 1.32 20 0.00339 0.6015 914.9 10.646 10±1 11 1.32 20 0.00339 0.6015 Note: N TX = Number of Transmit Antennas RF Output power specifies that Maximum Conducted Peak Output Power. LORA(DTS) Worst Maximum MPE Result Mode N TX Freq. (MHz) Conducted Power(max) (dBm) Turn-up Power (dB) Max tune up power (dBm) [P] ANT Gain (dBi) [G] Distance (cm) [R] Power Density (mW/cm 2 ) [S] Limit of Power Density (mW/ cm 2 ) (S) LORA 1 903 10.807 10±1 11 1.32 20 0.00339 0.6015 907.8 10.748 10±1 11 1.32 20 0.00339 0.6015 914.2 10.573 10±1 11 1.32 20 0.00339 0.6015 Note: N TX = Number of Transmit Antennas RF Output power specifies that Maximum Conducted Peak Output Power. Bluetooth LE Worst Maximum MPE Result Mode N TX Freq. (MHz) Conducted Power(max) (dBm) Turn-up Power (dB) Max tune up power (dBm) [P] ANT Gain (dBi) [G] Distance (cm) [R] Power Density (mW/cm 2 ) [S] 1M 1 2402 4.570 4±1 5 2.0 20 0.00099 2440 5.202 5±1 6 2.0 20 0.00125 2480 5.456 5±1 6 2.0 20 0.00125 2M 1 2402 4.469 4±1 5 2.0 20 0.00099 2440 5.248 5±1 6 2.0 20 0.00125 2480 5.678 5±1 6 2.0 20 0.00125 Note: N TX = Number of Transmit Antennas RF Output power specifies that Maximum Conducted Peak Output Power. Report No.: TBR-C-202404-0276-7 Page: 4 of 5 TB-RF-074-1. 0 2.4G WIFI Worst Maximum MPE Result Mode N TX Freq. (MHz) Conducted Power(max) (dBm) Turn-up Power (dB) Max tune up power (dBm) [P] ANT Gain (dBi) [G] Distance (cm) [R] Power Density (mW/cm 2 ) [S] 802.11b 1 2412 15.63 15±1 16 2.0 20 0.01255 2437 15.72 15±1 16 2.0 20 0.01255 2462 15.46 15±1 16 2.0 20 0.01255 802.11g 1 2412 14.90 14±1 15 2.0 20 0.00997 2437 15.60 15±1 16 2.0 20 0.01255 2462 15.50 15±1 16 2.0 20 0.01255 802.11n (HT20) 1 2412 15.30 15±1 16 2.0 20 0.01255 2437 15.47 15±1 16 2.0 20 0.01255 2462 15.29 15±1 16 2.0 20 0.01255 802.11n (HT40) 1 2422 15.07 15±1 16 2.0 20 0.01255 2437 15.30 15±1 16 2.0 20 0.01255 2452 15.22 15±1 16 2.0 20 0.01255 Note: N TX = Number of Transmit Antennas RF Output power specifies that Maximum Conducted Peak Output Power. Remark: 1. Output power including turn-up tolerance; 2. Output power was adjust to duty cycle at 100% if measured duty cycle less than 98%; 3. MPE evaluate distance is 20cm from user manual provide by manufacturer. 4. Only the worst power was evaluated for each wireless function Report No.: TBR-C-202404-0276-7 Page: 5 of 5 TB-RF-074-1. 0 6. Conclusion: As specified in Table 1B of 47 CFR 1.1310- Limits for Maximum Permissible Exposure (MPE), Limits for General Population/ Uncontrolled Exposure Frequency Range (MHz) Power density (mW/ cm 2 ) 300-1,500 F/1500 1,500-100,000 1.0 7. Summary simultaneous transmission information The sample supports two antennas for LORA Antenna and (Bluetooth LE&WLAN) Antenna. The LORA Antenna and (Bluetooth LE&WLAN) Antenna can transmit simultaneous. The LO…

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1 / 13 承認書 SPECIFICATIONFORAPPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’SP/N ： 料號 PARTNUMBER ： WAN1003F039M03 規格 DESCRIPTION ： ChipAntenna1003M-Ant470,868,915MType03 版本 VERSION ： V1.3 日期 ISSUEDATE ： 2023/07/12 客戶承認 CUSTOMERAPPROVED 工程部 R&DCENTER 承認 APPROVAL 確認 CHECKED 製作 DRAWN RayTennysonSnow 萬誠科技股份有限公司OneWaveElectronicCo.,Ltd. 11261台北市北投區立功街151號1樓1F,No.151,LiGongStreet,BeitouDistrict, TaipeiCity11261,Taiwan 電話 : (02)2898-2220TEL:+88622898-2220 傳真 : (02)2898-5055FAX:+88622898-5055 2 / 13 ONEWAVETECHNOLOGYCO.,LTD. 1003Chipantenna For470/868/915MHzApplications Dimension(mm) L 10.50±0.20 W 3.00±0.20 T 1.23±0.20 P/N:WAN1003F039M03 3 / 13 ONEWAVETECHNOLOGYCO.,LTD. PartNumberInformation WAN1003F039M03 ABCDEF AProductSeriesAntenna BDimensionLxW10x3mm(±0.2mm) CMaterialHighKmaterial DWorkingFrequency470MHz/868MHz/915MHz EFeedingmodeMonopole&SingleFeeding FAntennatypeType=03 1.ElectricalSpecification Remark:Bandwidth&PeakGainwasmeasuredunderevaluationboardofnextpage Specification PartNumberWAN1003F039M03 CentralFrequency470/868/915MHz Bandwidth25(Min.)MHz ReturnLoss-10(Max)dB PeakGain1.21/1.27/1.32dBi Impedance50Ohm OperatingTemperature -40～+110°C MaximumPower4W ResistancetoSolderingHeats 10(@260°C) sec. PolarizationLinear AzimuthBeamwidthOmni-directional TerminationCu/Sn(Leadless) 4 / 13 ONEWAVETECHNOLOGYCO.,LTD. 2.RecommendedPCBPattern EvaluationBoardDimension 60 SuggestedMatchingCircuit ImportantInformation: Thematchingelementisrecommendedtousehighprecision inductor ± 0.1~0.3nHandcapacitor ± 0.1pF 5 / 13 ONEWAVETECHNOLOGYCO.,LTD. EvaluationBoardDimension SuggestedMatchingCircuit Fc［MHz] Inductance[nH] Capacitance[pF] L1L2L3 C1 47010120153 8682398.2 0Ω 915 0Ω 366.8 0Ω FootPrint(Unit:mm) L1 L2 L3 60.0 1.7 9.1 C1 6 / 13 ONEWAVETECHNOLOGYCO.,LTD. 3.MeasurementResults ReturnLoss 915MHz 868MHz 9.1 3.2 1.71.0 7 / 13 ONEWAVETECHNOLOGYCO.,LTD. 470MHz 8 / 13 ONEWAVETECHNOLOGYCO.,LTD. RadiationPattern 9 / 13 ONEWAVETECHNOLOGYCO.,LTD. EfficiencyPeakGainDirectivity 915MHz54.67%1.32dBi3.08dBi 868MHz50.67%1.27dBi3.58dBi 470MHz46.78%1.21dBi4.51dBi ChamberCoordinateSystem 4.ReliabilityandTestCondictions X Z Y 10 / 13 ONEWAVETECHNOLOGYCO.,LTD. ITEMREQUIREMENTSTESTCONDITION Solderability1.Wettingshallexceed90%coverage 2.Novisiblemechanicaldamage Pre-heatingtemperature:150°C/60sec. Soldertemperature:230 ± 5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Fluxforleadfree:rosin Solderheat Resistance 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% Pre-heatingtemperature:150°C/60sec. Soldertemperature:260 ± 5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Fluxforleadfree:rosin Component Adhesion (Pushtest) 1.Novisiblemechanicaldamage Thedeviceshouldbereflow soldered(230±5°Cfor10sec.)toatinned coppersubstrateAdynometerforce gaugeshouldbeappliedthesideofthe component.Thedevicemustwith-ST-F 0.5Kgwithoutfailureofthetermination attachedtocomponent. Component Adhesion (Pulltest) 1.Novisiblemechanicaldamage Insert10cmwireintotheremainingopen eyebend,theendsofevenwirelengths upwardandwindtogether. Terminalshallnotberemarkably damaged. Thermalshock 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Testcycle:10cycles Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. Resistanceto High Temperature 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 3.Nodisconnectionorshortcircuit. Temperature:+110±5°C Duration:1000±12hrs Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. Resistanceto Low Temperature 1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 3.Nodisconnectionorshortcircuit. Temperature:-40±5°C Duration:1000 ± 12hrs Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. Humidity1.Novisiblemechanicaldamage 2.CentralFreq.change:within±6% 3.Nodisconnectionorshortcircuit. Temperature:40±2°C Humidity:90%to95%RH Duration:1000±12hrs Thechipshallbestabilizedatnormal conditionfor2~3hoursbefore measuring. 4±1sec. 60sec TEMP(°C) 150°C 230°C 11 / 13 ONEWAVETECHNOLOGYCO.,LTD. 5.SolderingandMounting Mildlyactivatedrosinfluxesarepreferred.Theminimumamountofsolder canleadtodamagefromthestressescausedbythedifferencein coefficientsofexpansionbetweensolder,chipandsubstrate.The terminationsaresuitableforallwaveandre-flowsolderingsystems.Ifhand solderingcannotbeavoided,thepreferredtechniqueistheutilizationofhot airsolderingtools. Recommendedtemperatureprofilesforre-flowsolderinginFigure1. Productsattachmentwithasolderingironisdiscouragedduetotheinherent processcontrollimitations.Intheeventthatasolderingironmustbe employedthefollowingprecautionsarerecommended. ‧Preheatcircuitandproductsto150°C ‧Nevercontacttheceramicwiththeirontip ‧Usea20wattsolderingironwithtipdiameterof1.0mm ‧280°Ctiptemperature(max) ‧1.0mmtipdiameter(max) ‧Limitsolderingtimeto3sec. SOLDERING COOLING NATURAL PRE-HEATING T E M P E R A T U R E ( ¢ XC ) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING T E M P E R A T U R E ( ¢ XC ) within 3s Gradualcooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 12 / 13 ONEWAVETECHNOLOGYCO.,LTD. 6.PackagingInformation TapeSpecification: WAoBoKoPFEDD1PoP2t 24.0 ±0.30 3.61 ±0.10 11.78 ±0.10 2.49 ±0.10 8.00 ±0.10 11.5 ±0.10 1.75 ±0.10 1.50 ±0.10 1.50 ±0.15 4.00 ±0.10 2.00 ±0.10 0.305 ±0.02 ReelSpecification:(’’7’’,Φ180mm) TapeWidth(mm)A(mm)B(mm)C(mm)D(mm)Chip/Reel(pcs) 2425±0.560±1.013.5±0.5178±1.01000 7”x24 13 / 13 ONEWAVETECHNOLOGYCO.,LTD. 7.StorageandTransportationInformation StorageConditions Tomaintainthesolderabilityofterminalelectrodes: 1.Temperatureandhumidityconditions:-10~40°Cand30~70%RH. 2.Recommendedproductsshouldbeusedwithin6monthsfromthetime ofdelivery. 3.Thepackagingmaterialshouldbekeptwherenochlorineorsulfur existsintheair. TransportationConditions 1.Productsshouldbehandledwithcaretoavoiddamageor contaminationfromperspirationandskinoil…

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Shenzhen Toby Technology Co., Ltd. Report No.: TBR-C-202404-0276-22 Page: 1 of 64 TB-RF-074-1.0 1/F.,Building 6, Rundongsheng Industrial Zone, Longzhu, Xixiang, Bao'an District, Shenzhen, Guangdong, China Tel: +86 75526509301 Fax: +86 75526509195 RF Test Report FCC ID: 2A2GJ-HRI-3621 Report No. : TBR-C-202404-0276-22 Applicant : Heltec Automation Technology Co., Ltd Equipment Under Test (EUT) EUT Name : Sensor Hub Model No. : HRI-3621 Series Model No. : HRI-3622, HRI-3623, HRI-362X, HRI-3621S, HRI-3621G, HRI-3621R, HRI-3622S, HRI-3622G, HRI-3622R, HRU-1000, HRU-1001, HRU-3601 Brand Name : Heltec Automation Sample ID : HC-C-202404-0276-01-02-1#&HC-C-202404-0276-01-02-2# Receipt Date : 2024-06-13 Test Date : 2024-06-13 to 2024-07-25 Issue Date : 2024-07-27 Standards : FCC Part 15 Subpart C 15.247 Test Method : ANSI C63.10: 2013 KDB 558074 D01 15.247 Meas Guidance v05r02 Conclusions : PASS In the configuration tested, the EUT complied with the standards specified above. Tested By : Mike Yan Reviewed By : Wade. Lv Approved By : Ivan Su This report details the results of the testing carried out on one sample. The results contained in this test report do not relate to other samples of the same product. The manufacturer should ensure that all products in series production are in conformity with the product sample detailed in the report. Report No.: TBR-C-202404-0276-22 Page: 2 of 64 TB-RF-074-1.0 Contents CONTENTS ............................................................................................................................................. 2 1. GENERAL INFORMATION ABOUT EUT.............................................................................. 6 1.1 Client Information ................................................................................................................. 6 1.2 General Description of EUT (Equipment Under Test) ................................................... 6 1.3 Block Diagram Showing the Configuration of System Tested ...................................... 8 1.4 Description of Support Units .............................................................................................. 8 1.5 Description of Test Mode .................................................................................................... 9 1.6 Description of Test Software Setting .............................................................................. 10 1.7 Measurement Uncertainty ................................................................................................ 10 1.8 Test Facility ......................................................................................................................... 11 2. TEST SUMMARY ..................................................................................................................... 12 3. TEST SOFTWARE ................................................................................................................... 12 4. TEST EQUIPMENT AND TEST SITE ................................................................................... 13 5. CONDUCTED EMISSION ....................................................................................................... 15 5.1 Test Standard and Limit .................................................................................................... 15 5.2 Test Setup ........................................................................................................................... 15 5.3 Test Procedure ................................................................................................................... 15 5.4 Deviation From Test Standard ......................................................................................... 16 5.5 EUT Operating Mode ........................................................................................................ 16 5.6 Test Data ............................................................................................................................. 16 6. RADIATED AND CONDUCTED UNWANTED EMISSIONS ............................................ 17 6.1 Test Standard and Limit .................................................................................................... 17 6.2 Test Setup ........................................................................................................................... 18 6.3 Test Procedure ................................................................................................................... 19 6.4 Deviation From Test Standard ......................................................................................... 20 6.5 EUT Operating Mode ........................................................................................................ 20 6.6 Test Data ............................................................................................................................. 20 7. EMISSIONS IN NONRESTRICTED FREQUENCY BANDS ............................................ 21 7.1 Test Standard and Limit .................................................................................................... 21 7.2 Test Setup ........................................................................................................................... 21 7.3 Test Procedure ................................................................................................................... 21 7.4 Deviation From Test Standard ......................................................................................... 22 7.5 EUT Operating Mode ........................................................................................................ 22 7.6 Test Data ............................................................................................................................. 22 8. 99% OCCUPIED AND 20DB BANDWIDTH ........................................................................ 23 8.1 Test Standard and Limit ........................…

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FCC ID: 2A2GJ-HRI-3621 TB-RF-074-1.0 Appendix V EUT Test Photographs Photo of Setup for Radiated Emission (Below 1 GHz) Photo of Setup for Radiated Emission (Above 1 GHz) FCC ID: 2A2GJ-HRI-3621 TB-RF-074-1.0 Photo of Setup for Radiated Emission (Above 1 GHz) Photo of Setup for Conducted Emission -----END OF THE REPORT-----