FCCID.CO- FCC ID Database
HomeCompaniesEquipment ClassesSearch

© 2026 FCC ID Database. All rights reserved.

AboutContactData sourced from FCC public records
  1. Home/
  2. Heltec Automation Technology Co., Ltd/
  3. 2A2GJ-HT-N5262

2A2GJ-HT-N5262Mesh Node

Heltec Automation Technology Co., Ltd
Mesh Node - FCC ID 2A2GJ-HT-N5262 - Heltec Automation Technology Co., Ltd
Click to zoom

Application Details

Equipment Class
DTS - Digital Transmission System
Date of Grant
Oct 11, 2024
Application Purpose
Original Equipment
Date of Application
Oct 11, 2024
Equipment Note
Mesh Node
Frequency Range
2402.00000000 - 2480.00000000
Company
Heltec Automation Technology Co., Ltd
Country
China

Documents & Files

Select a file to view

Users Manual

↗

Attestation Statements

↗
↗

Cover Letter(s)

↗
↗
↗

External Photos

↗

ID Label/Location Info

↗

Internal Photos

↗

RF Exposure Info

↗

Test Report

↗
↗
↗
↗
↗

Test Setup Photos

↗

Document Text

Text extracted from the exhibit documents filed with the FCC. Open a document above to read the original.

Users Manual

https://heltec.org Documents Rev. 1.0 P 1/12 May 2023 Heltec Automation © Limited standard files ` Mesh Node With Bluetooth And LoRa 1.14 TFT-LCD Display (Optional) https://heltec.org Documents Rev. 1.0 P 2/12 May 2023 Heltec Automation © Limited standard files Document Version Version Time Description Remark Rev. 1.0 2024-5-16 Preliminary version Richard Copyright Notice All contents in the files are protected by copyright law, and all copyrights are reserved by Chengdu Heltec Automation Technology Co., Ltd. (hereinafter referred to as Heltec). Without written permission, all commercial use of the files from Heltec are forbidden, such as copy, distribute, reproduce the files, etc., but non-commercial purpose, downloaded or printed by individual are welcome. Disclaimer Chengdu Heltec Automation Technology Co., Ltd. reserves the right to change, modify or improve the document and product described herein. Its contents are subject to change without notice. These instructions are intended for you use. https://heltec.org Documents Rev. 1.0 P 3/12 May 2023 Heltec Automation © Limited standard files Content Mesh Node T114 ............................................................................................................ 1 Document Version .................................................................................................. 2 Copyright Notice..................................................................................................... 2 Disclaimer ............................................................................................................... 2 Content ................................................................................................................... 3 1 Description .......................................................................................................... 4 1.1 Overview ....................................................................................................................... 4 1.2 Product Features ........................................................................................................... 5 2 Pin Definition ....................................................................................................... 7 2.1 Pin Map ......................................................................................................................... 7 2.2 Pin Definition ................................................................................................................ 7 3 Specifications ...................................................................................................... 8 3.1 General Specification .................................................................................................... 8 3.2 Power Consumption ...................................................................................................... 9 3.3 LoRa RF Characteristics ................................................................................................ 9 4 Physical Dimensions .......................................................................................... 11 5 Resource ............................................................................................................ 11 5.1 Relevant Resource ........................................................................ 错误!未定义书签。 5.2 Heltec Contact Information ........................................................................................ 11 https://heltec.org Documents Rev. 1.0 P 4/12 May 2023 Heltec Automation © Limited standard files 1 Description 1.1 Overview Mesh Node is a development board based on nRF52840 and SX1262, supports LoRa communication and Bluetooth 5.0, and provides a variety of power interfaces (5V USB, lithium battery and solar panel), optional 1.14 inch TFT display and GPS module as accessories. Mesh Node has powerful long-distance communication capabilities, scalability, and low power design, which make it excellent in a wide range of application scenarios such as smart cities, agricultural monitoring, logistics tracking, etc. With Heltec nRF52 development environment and libraries , you can use it for LoRa/LoRaWAN development work, as well as to run some open source projects, such as Meshtastic. https://heltec.org Documents Rev. 1.0 P 5/12 May 2023 Heltec Automation © Limited standard files 1.2 Product Features  MCU nRF52840 (Bluetooth), LoRa chipset SX1262.  Low power consumption, 11 uA in deep sleep.  Powerful display function (optional), onboard 1.14 inch TFT-LCD display contains 135(H)RGB x240(V) dots and can display up to 262k colors.  Type-C USB interface with a complete voltage regulator, ESD protection, short circuit protection, RF shielding, and other protection measures.  Various Interfaces (2*1.25mm LiPo connector, 2*1.25mm Solar panel connector, 8*1.25mm GNSS module connector) which greatly increase the extensibility of the board.  Operation condition: -20 ~ 70°C, 90%RH(No condensing).  Compatible with Arduino,and we provide Arduino development frameworks and libraries. https://heltec.org Documents Rev. 1.0 P 7/12 May 2023 Heltec Automation © Limited standard files 2 Pin Definition 2.1 Pin Map 2.2 Pin Definition P1 P2 Name Type Description Name Type Description 5V P 5V Power. Ve P 3V3 power. GND P Ground. GND P Ground. 3V3 P 3.3V Power. 0.08 I/O GPIO8. GND P Ground. 0.07 I/O GPIO7. 0.13 I/O GPIO13. 1.12 I/O GPIO44. 0.16 I/O GPIO14. 1.14 I/O GPIO46. RST I/O RESET. 0.05 I/O GPIO37. https://heltec.org Documents Rev. 1.0 P 8/12 May 2023 Heltec Automation © Limited standard files 1.01 I/O GPIO33. 1.15 I/O GPIO47. SWD I/O SWDIO. 1.13 I/O GPIO45. SWC I/O SWCLK. 0.31 I/O GPIO31. SWO I/O SWO. 0.29 I/O GPIO29. 0.09 I/O GPIO9, UART1_RX. 0.30 I/O GPIO30. 0.10 I/O GPIO10, UART1_TX. 0.28 I/O GPIO28. 3 Specifications 3.1 General Specification Table3.1: General specification Parameters Description MCU nRF52840 LoRa Chipset SX1262 Memory 1M ROM; 256KB SRAM Bluetooth Bluetooth 5, B…

Text truncated - open the document above for the full version.

Attestation Statements

Heltec Automation Technology Co., Ltd 1f, No.54,56,58, Zirui North Street, Gaoxin District, Chengdu, China. Federal Communications Commission Authorization and Evaluation Division Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MD 21046 2024-10-10 To whom it may concern: We, Heltec Automation Technology Co., Ltd, hereby certify that the equipment for which authorization is sought (FCC ID: 2A2GJ-HT-N5262) is not “covered” equipment prohibited from receiving an equipment authorization pursuant to § 2.903 of the FCC rules. We also certify that, as of the date of the filing of the application, we are not identified on the Covered List (https://www.fcc.gov/supplychain/coveredlist) as an entity producing “covered” equipment. By signing this form, we confirm the above and that we are aware of the application requirements listed under § 2.911(b) and (d)(5) and (6). The information provided in this letter is based on the referenced rule parts of Title 47 of the CFR as well as KDB 986446 D01. Sincerely, Signature Aaron Li General Manager Heltec Automation Technology Co., Ltd 62_[model] CoveredEqu_2.911(d)(5)(i) and (ii) - U, V03

Cover Letter(s)

Heltec Automation Technology Co., Ltd Add: 1f, No.54,56,58, Zirui North Street, Gaoxin District, Chengdu, China. Date: 2024-10-10 FCC ID: 2A2GJ-HT-N5262 Dear Sir/Madam, We, Heltec Automation Technology Co., Ltd Hereby declares the following statement for Federal Communications Commission, PCB board, circuit, structure and internal of these model(s) are the same, only difference is Different sales areas, different name: Product name: Mesh Node Model no.: HT-n5262, HT-n5262G, HT-n5262S, HT-n5262M, HT-n5362, HT-n5462, HT-n7062, HT- n9162, HT-n2162, HT-n5200 Sincerely, Name/Title: Aaron Li/General Manager Company: Heltec Automation Technology Co., Ltd Address: 1f, No.54,56,58, Zirui North Street, Gaoxin District, Chengdu, China. Phone: +86 18080100260 Fax: 028-62374838 E-Mail: [email protected]

Cover Letter(s)

CONFIDENTIALITY REQUEST for Certification Service in USA Federal Communication Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21046 Date:<2024-10-10> Pursuant to Paragraphs §0.457 and 0.459 of the Commission’s Rules (47 C.F.R.) and Section §552(b)(4) of the Freedom of Information Act, we requests confidentiality for the following products: FCC ID Model name 2A2GJ-HT-N5262 HT-n5262 For the product stated above, we request that the following information be held confidential; Exhibits Long-Term Confidentiality Short-Term Confidentiality Short-Term Confidentiality Days External Photos Internal Photos Block Diagram Schematics Test Setup Photos User’s Manual Parts List Tune Up Operational Descriptions The long-term confidentiality exhibits contain our trade secrets and proprietary information that could be of benefit to our competitors. The short-term confidentiality on the basis of ensuring that business sensitive information remains confidential until the actual marketing of our new device. If you have any questions, please feel free to contact me at the address shown below. Sincerely, Name/Title: Aaron Li/General Manager Company: Heltec Automation Technology Co., Ltd Address: 1f, No.54,56,58, Zirui North Street, Gaoxin District, Chengdu, China. Phone: +86 18080100260 Fax: 028-62374838 E-Mail: [email protected]

Cover Letter(s)

Heltec Automation Technology Co., Ltd 1f, No.54,56,58, Zirui North Street, Gaoxin District, Chengdu, China. Federal Communications Commission Authorization and Evaluation Division Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MD 21046 2024-10-10 To whom it may concern: We, the undersigned, hereby authorize Eurofins Product Service GmbH to act on our behalf in all matters relating to applications for equipment authorization FCC ID: 2A2GJ-HT-N5262 including the signing of all documents related to these matters. Any and all acts carried out by Eurofins Product Service GmbH on our behalf shall have the same effect as acts of our own. By signing this application form, we agree to Eurofins’ current valid General Terms and Conditions (AGB),Testing and Certification Regulations (PZO) which can be viewed on following website www.eurofins.de/ee or retrieved on request. We also hereby certify that no party to this application is subject to a denial of benefits, including FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. 862. Sincerely, Name/Title: Aaron Li/General Manager Company: Heltec Automation Technology Co., Ltd Address: 1f, No.54,56,58, Zirui North Street, Gaoxin District, Chengdu, China. Phone: +86 18080100260 Fax: 028-62374838 E-Mail: [email protected]

External Photos

FCC ID: 2A2GJ-HT-N5262 TB-RF-074-1.0 Appendix III EUT External Photographs Photo 1 Appearance of EUT Photo 2 Appearance of EUT

ID Label/Location Info

FCC ID: 2A2GJ-HT-N5262 TB-RF-074-1.0 Appendix IID Label Appendix II ID Label Location FCC ID: 2A2GJ-HT-N5262 Model: HT-n5262

Internal Photos

FCC ID: 2A2GJ-HT-N5262 TB-RF-074-1.0 Appendix IV EUT Internal Photographs Photo 3 Internal of EUT Photo 4 Internal of PCB FCC ID: 2A2GJ-HT-N5262 TB-RF-074-1.0 Photo 5 Internal of PCB Photo 6 Internal of PCB LoRa Antenna BT Antenna FCC ID: 2A2GJ-HT-N5262 TB-RF-074-1.0 Photo 7 Internal of PCB

RF Exposure Info

Shenzhen Toby Technology Co., Ltd. Report No.: TBR-C-202408-0104-14 Page: 1 of 4 TB-RF-073-3.0 1/F., Building 6, Rundongsheng Industrial Zone, Longzhu, Xixiang, Bao'an District, Shenzhen, Guangdong, China Tel: +86 75526509301 Fax: +86 75526509195 Maximum Permissible Exposure Evaluation FCC ID: 2A2GJ-HT-N5262 1. Client Information Applicant : Heltec Automation Technology Co., Ltd Address : 1f, No.54,56,58, Zirui North Street, Gaoxin District, Chengdu, China. Manufacturer : Heltec Automation Technology Co., Ltd Address : 1f, No.54,56,58, Zirui North Street, Gaoxin District, Chengdu, China. 2. General Description of EUT EUT Name : Mesh Node Models No. : HT-n5262, HT-n5262G, HT-n5262S, HT-n5262M, HT-n5362, HT-n5462, HT-n7062, HT-n9162, HT-n2162, HT-n5200 Model Difference : All these models are identical in the same PCB, layout and electrical circuit, the only difference is Different sales areas, different name. Sample ID : HC-C-202408-0104-01-03-1#&HC-C-202408-0104-01-03-2# Product Description : Operation Frequency: LORA: 902.3MHz~914.9MHz(125KHz) 903MHz~914.2MHz(500KHz) Bluetooth LE 5.0: 2402MHz~2480MHz Power Rating : USB INPUT: DC 5V Software Version : ---- Hardware Version : ---- Connecting I/O Port(S) : Please refer to the User's Manual Remark : the MPE report used the EUT-2(HC-C-202408-0104-01-03-2#). Report No.: TBR-C-202408-0104-14 Page: 2 of 4 TB-RF-074-1. 0 MPE Calculations for FCC 1. Antenna Gain: Antenna Brand Model Name Type Antenna Gain(dBi) LORA N/A N/A Spring 1.1 Antenna Brand Model Name Type Antenna Gain(dBi) Bluetooth LE N/A N/A Ceramic 2.12 2. EUT Operation Condition: Software provided by client enabled the EUT to transmit and receive data at lowest, middle and highest channel individually. 3. Exposure Evaluation: Equation from page 18 of OET Bulletin 65, Edition 97-01 S=(PG)/4πR 2 Where S: power density P: power input to the antenna G: power gain of the antenna in the direction of interest relative to an isotropic radiator. R: distance to the center of radiation of the antenna 4. Simultaneous transmission MPE Considerations According to KDB447498: All transmitters and antennas in the host must be either evaluated for MPE compliance, by measurement or computational modeling, or qualify for the standalone MPE test exclusion in section 7.1. Simultaneous transmission MPE test exclusion applies when the sum of the MPE ratios for all simultaneous transmitting antennas incorporated in a host device, based on the calculated/estimated, numerically modeled or measured field strengths or power density, is ≤ 1.0. This means that: ∑ of MPE ratios ≤ 1.0 Report No.: TBR-C-202408-0104-14 Page: 3 of 4 TB-RF-074-1. 0 5. Standalone MPE Evaluation: LORA(DSS) Worst Maximum MPE Result Mode N TX Freq. (MHz) Conducted Power(max) (dBm) Turn-up Power (dB) Max tune up power (dBm) [P] ANT Gain (dBi) [G] Distance (cm) [R] Power Density (mW/cm 2 ) [S] Limit of Power Density (mW/ cm 2 ) (S) LORA 1 902.3 12.279 12±1 13 1.1 20 0.00511 0.6015 908.9 12.188 12±1 13 1.1 20 0.00511 0.6015 914.9 12.162 12±1 13 1.1 20 0.00511 0.6015 Note: N TX = Number of Transmit Antennas RF Output power specifies that Maximum Conducted Peak Output Power. LORA(DTS) Worst Maximum MPE Result Mode N TX Freq. (MHz) Conducted Power(max) (dBm) Turn-up Power (dB) Max tune up power (dBm) [P] ANT Gain (dBi) [G] Distance (cm) [R] Power Density (mW/cm 2 ) [S] Limit of Power Density (mW/ cm 2 ) (S) LORA 1 903 12.356 12±1 13 1.1 20 0.00511 0.6015 907.8 12.602 12±1 13 1.1 20 0.00511 0.6015 914.2 12.510 12±1 13 1.1 20 0.00511 0.6015 Note: N TX = Number of Transmit Antennas RF Output power specifies that Maximum Conducted Peak Output Power. Bluetooth LE Worst Maximum MPE Result Mode N TX Freq. (MHz) Conducted Power(max) (dBm) Turn-up Power (dB) Max tune up power (dBm) [P] ANT Gain (dBi) [G] Distance (cm) [R] Power Density (mW/cm 2 ) [S] 1M 1 2402 3.047 3±1 4 2.12 20 0.00081 2440 4.539 4±1 5 2.12 20 0.00103 2480 4.000 4±1 5 2.12 20 0.00103 Note: N TX = Number of Transmit Antennas RF Output power specifies that Maximum Conducted Peak Output Power. Remark: 1. Output power including turn-up tolerance; 2. Output power was adjust to duty cycle at 100% if measured duty cycle less than 98%; 3. MPE evaluate distance is 20cm from user manual provide by manufacturer. 4. Only the worst power was evaluated for each wireless function Report No.: TBR-C-202408-0104-14 Page: 4 of 4 TB-RF-074-1. 0 6. Conclusion: As specified in Table 1B of 47 CFR 1.1310- Limits for Maximum Permissible Exposure (MPE), Limits for General Population/ Uncontrolled Exposure Frequency Range (MHz) Power density (mW/ cm 2 ) 300-1,500 F/1500 1,500-100,000 1.0 7. Summary simultaneous transmission information The sample supports two antennas for LORA Antenna and Bluetooth LE Antenna. The LORA Antenna and Bluetooth LE Antenna can transmit simultaneous. The LORA and Bluetooth LE with two different Antenna. According to KDB447498 for Transmitters used in mobile exposure conditions for simultaneous transmission operations; ∑ of MPE ratios ≤ 1.0 8. Summary simultaneous transmission results LORA ANT. + Bluetooth LE ANT. Maximum Simultaneous transmission MPE Ratios is 0.00850+0.00103=0.00953≤1.0. 9. Conclusion: The measurement results comply with the FCC Limit per 47 CFR 2.1091 for the uncontrolled RF Exposure of mobile device. -----END OF THE REPORT-----

Test Report

Approval sheet Page 1 of 9 ASC_RFANT3216120A5T_V05 Apr. 2010 MULTILAYER CERAMIC ANTENNA RFANT Series – RoHS Compliance 2.4 GHz ISM Band Working Frequency P/N: RFANT3216120A5T Series *Contents in this sheet are subject to change without prior notice. Approval sheet Page 2 of 9 ASC_RFANT3216120A5T_V05 Apr. 2010 FEATURES 1. Surface Mounted Devices with a small dimension of 3.2 X 1.6 X1.2 mm 3 meet future miniaturization trend. 2. LTCC process 3. High stability in Temperature / Humidity Change APPLICATIONS 1. 2.4GHz ISM band RF applications 2. Bluetooth, Wireless, HomeRF CONSTRUCTION DIMENSIONS Figure Symbol Dimension (mm) L 3.20 ± 0.20 W 1.60 ± 0.10 T 1.20 ± 0.10 a 0.25 ± 0.15 1. Feeding 2. Identification Mark 3. Soldering terminal W T E a a Approval sheet Page 3 of 9 ASC_RFANT3216120A5T_V05 Apr. 2010 Ground Soldering Pad 50 ΩTransmission Line Unit : mm 19.4 Empty Area 6x6 mm 50Ω ΩΩ ΩFeed line 45mm 20mm Series 1 Series 2 Ground Soldering Pad 50 ΩTransmission Line Unit : mm 19.4 Empty Area 6x6 mm 50Ω ΩΩ ΩFeed line 45mm 20mm Series 1 Series 2 ELECTRICAL CHARACTERISTICS RFANT3216120A5T Specification Working Frequency Range 2450 ± 50 MHz Fc (GHz) 2.9 Gain (dBi) 2.12 (Typical) VSWR 2 max. Series 1 6.8nH Matching component value Series 2 - Operation Temperature -40 ̊C ~ +85 ̊C * This frequency must be adjusted to 2.45GHz with matching circuit. SOLDER LAND PATTERN DESIGN Figure 1.66 0.8 2.3 1.63 6 3.43 1.6 6 1.36 0.36 0.88 0.34 1.88 1.83 0.8 0.54 1.66 0.8 2.3 1.63 6 3.43 1.6 6 1.36 0.36 0.88 0.34 1.88 1.83 0.8 0.54 Approval sheet Page 4 of 9 ASC_RFANT3216120A5T_V05 Apr. 2010 Antenna on Test Board ( Thickness 1.2mm) Antenna S11 on Test Board Antenna VSWR on Test Board E 0.8mm 1.6mm 19.4mm Empty Area 6x6 mm 50Ω ΩΩ ΩFeed line 1.66mm GROUND 0.8mm 1.6mm 19.4mm Empty Area 6x6 mm 50Ω ΩΩ ΩFeed line 1.66mm GROUND 0.8mm 1.6mm 19.4mm Empty Area 6x6 mm 50Ω ΩΩ ΩFeed line 1.66mm GROUND 0.8mm 1.6mm 19.4mm Empty Area 6x6 mm 50Ω ΩΩ ΩFeed line 1.66mm GROUND E Approval sheet Page 5 of 9 ASC_RFANT3216120A5T_V05 Apr. 2010 RADIATION PATTERN Radiation Pattern and Gain were dependent on measurement board design. The specification of RFANT3216120A5T antenna was measured based on the PCB size and installation position as shown in the below figure Test Board Vertical Horizontal Y - Z Plane Average Gain= 0.891 dBi Peak Gain = 2.12dBi Average Gain = 0.64 dBi Peak Gain= -6.07dBi Average Gain=-11.62dBi X - Z Plane Average Gain= -1.846 dBi Peak Gain= -7.78 dBi Average Gain= -11.97dBi Peak Gain= 0.96 dBi Average Gain= -2.29 dBi X - Y Plane Average Gain= -2.556 dBi Peak Gain= -9.41 dBi Average Gain= -15.54dBi Peak Gain= 1.40 dBi Average Gain= -2.78 dBi GROUND X Y Z GROUND X Y Z X Y Z Approval sheet Page 6 of 9 ASC_RFANT3216120A5T_V05 Apr. 2010 RELIABILITY TEST Test item Test condition / Test method Specification Solderability JIS C 0050-4.6 JESD22-B102D *Solder bath temperature:235 ± 5°C *Immersion time:2 ± 0.5 sec *Solder:Sn3Ag0.5Cu for lead-free At least 95% of a surface of each terminal electrode must be covered by fresh solder. Leaching (Resistance to dissolution of metallization) IEC 60068-2-58 *Solder bath temperature:260 ± 5°C *Leaching immersion time:30 ± 0.5 sec *Solder : SN63A Loss of metallization on the edges of each electrode shall not exceed 25%. Resistance to soldering heat JIS C 0050-5.4 *Preheating temperature:120~150°C, 1 minute. *Solder temperature:270±5°C *Immersion time:10±1 sec *Solder:Sn3Ag0.5Cu for lead-free Measurement to be made after keeping at room temperature for 24±2 hrs No mechanical damage. Samples shall satisfy electrical specification after test. Loss of metallization on the edges of each electrode shall not exceed 25%. Drop Test JIS C 0044 *Height:75 cm *Test Surface:Rigid surface of concrete or steel. *Times:6 surfaces for each units;2 times for each side. No mechanical damage. Samples shall satisfy electrical specification after test. Adhesive Strength of Termination JIS C 0051- 7.4.3 *Pressurizing force: 5N(≦0603);10N(>0603) *Test time:10±1 sec No remarkable damage or removal of the termination. Bending test JIS C 0051- 7.4.1 The middle part of substrate shall be pressurized by means of the pressurizing rod at a rate of about 1 mm/s per second until the deflection becomes 1mm/s and then pressure shall be maintained for 5±1 sec. Measurement to be made after keeping at room temperature for 24±2 hours No mechanical damage. Samples shall satisfy electrical specification after test. Approval sheet Page 7 of 9 ASC_RFANT3216120A5T_V05 Apr. 2010 Temperature cycle JIS C 0025 1. 30±3 minutes at -40°C±3°C, 2. 10~15 minutes at room temperature, 3. 30±3 minutes at +85°C±3°C, 4. 10~15 minutes at room temperature, Total 100 continuous cycles Measurement to be made after keeping at room temperature for 24±2 hrs No mechanical damage. Samples shall satisfy electrical specification after test. Vibration JIS C 0040 *Frequency:10Hz~55Hz~10Hz(1min) *Total amplitude:1.5mm *Test times:6hrs.(Two hrs each in three mutually perpendicular directions) No mechanical damage. Samples shall satisfy electrical specification after test. High temperature JIS C 0021 *Temperature:85°C±2°C *Test duration:1000+24/-0 hours Measurement to be made after keeping at room temperature for 24±2 hrs No mechanical damage. Samples shall satisfy electrical specification after test. Humidity (steady conditions) JIS C 0022 *Humidity:90% to 95% R.H. *Temperature:40±2°C *Time:1000+24/-0 hrs. Measurement to be made after keeping at room temperature for 24±2 hrs ※ 500hrs measuring the first data then 1000hrs data No mechanical damage. Samples shall satisfy electrical specification after test. Low temperature JIS C 0020 *Temperature:-40°C±2°C *Test duration:1000+24/-0 hours Measurement to be made after keeping at room temperature for 24±2 hrs No mechanical damage. Samples shall satisfy electrical specification after test. Approval sheet Page 8 of 9 ASC_RFANT3216120A5T_V05 Apr. 2010 SOLDERING CONDITION Typical examples of soldering processes that provi…

Text truncated - open the document above for the full version.

Test Report

承认书 SPECIFICATIONFORAPPROVAL 客户名称 CUSTOMERNAME:西达瑞 客户料号 CUSTOMERP/N: 产品料号 PRODUCT P/N:H1C75F1D167A 产品名称 PRODUCTNAME:868-915MHz内置弹簧天线 规格描述: Description: H1C75F1D167A/868-915MHz内置弹簧天线/1.13 黑色线L=33mm+国产IPEX(一代) 版本 REV:B版 出厂签章 S I G N 品质 (DQE) 结构 (ME) 射频 (RF) 客户签章 S I G N 项目 (PM) 结构 (ME) 品质 (DQE) 目录 Contents 一、版本履历表( RevisionHistory ) 二、规格表( SpecificationTable ) 三、成品图( ProductDrawing ) 四、网络分析仪测试环境( Networkanalyzertestenvironment ) 五、测试报告( TestReport ) 六、产品实物图( Productdrawing ) 一、版本履历表(RevisionHistory): 版本号 Reversio n 修订页面 Revision page 变更日期 Change date 修订人 Revised by 修订原因及内容 Reason and content for revision 备注 Remarks A-2024.4.24肖什群初版发行 说明: 本规格书原则上有效期为1年; 若任一方需要修改时,需经双方协商一致,修改后方可执行; 在本规格书有效期满后,双方均未提出修改要求时,则本规格书有效期顺延1 年。 二、规格表(SpecificationTable): 产品主要技术参数 主要技术指标 Maintechnicalspecifications 频率范围 (MHZ) 868-915 FrequencyRange (MHZ) 868-915 特性阻抗(Ω) 50Impedance(Ω)50 增益(dBi) 1±0.5Gain(dBi)1±0.5 输出电压 驻波比 ≤3.5VSWR≤3.5 极化方式 线极化 PolarizationLinear 方向性 全向性 RadiationOmni-directional 连接方式 I-PEX ConnectorType I-PEX 物理性能 PhysicalProperties 天线材料 弹簧 AntennacoverSpring 工作温度 -20 °C ~+70 °C OperatingTemp-20 °C ~+70 °C 保存温度 -20°C~+60°CStorageTemp-20°C~+60°C 三、成品图(Productdrawing): 四、网络分析仪测试环境(Networkanalyzertestenvironment): 五、测试报告(Testreport): 5.1 :网络分析仪测试报告 5.2:天线增益与效率 FreqEffiGain (MHz)(%)(dBi) 86852.60.7 91555.11.1 5.3 :暗室 2D 、 3DRaditationPattern 868MHz 915MHz 六、产品实物图( Productdrawing )

Test Report

Shenzhen Toby Technology Co., Ltd. Http://www.tobylab.cn Add:1/F.,Building 6, Rundongsheng Industrial Zone, Longzhu, Xixiang, Bao'an District, Shenzhen, Guangdong, China. Report No.: TBR-C-202408-0104-11 Page: 1 of 27 FCC ID: 2A2GJ-HT-N5262 TB-RF-074-1.0 RF Test Data for Bluetooth LE (Conducted Measurements) General Description of EUT Product Name: Mesh Node Test Model: HT-n5262 Sample ID: HC-C-202408-0104-01-03-2# Environmental Conditions Temperature: 23.8°C Relative Humidity: 48% Test Voltage: DC 5V Test Engineer: Rick chen Note: For a more detailed features description, please refer to the report TBR-C-202408-0104-11 The report only show the worst case data. Shenzhen Toby Technology Co., Ltd. Http://www.tobylab.cn Add:1/F.,Building 6, Rundongsheng Industrial Zone, Longzhu, Xixiang, Bao'an District, Shenzhen, Guangdong, China. Report No.: TBR-C-202408-0104-11 Page: 2 of 27 FCC ID: 2A2GJ-HT-N5262 TB-RF-074-1.0 Contents 1. Duty Cycle ..................................................................................................................................................................................... 3 2. Maximum Conducted Output Power ............................................................................................................................................ 6 3. -6dB Bandwidth ............................................................................................................................................................................. 9 4. Occupied Channel Bandwidth .................................................................................................................................................... 12 5. Maximum Power Spectral Density Level ................................................................................................................................... 15 6. Band Edge ................................................................................................................................................................................... 18 7. Conducted RF Spurious Emission ............................................................................................................................................. 21 8. Restrict Band ............................................................................................................................................................................... 25 Shenzhen Toby Technology Co., Ltd. Http://www.tobylab.cn Add:1/F.,Building 6, Rundongsheng Industrial Zone, Longzhu, Xixiang, Bao'an District, Shenzhen, Guangdong, China. Report No.: TBR-C-202408-0104-11 Page: 3 of 27 FCC ID: 2A2GJ-HT-N5262 TB-RF-074-1.0 1. Duty Cycle Condition Mode Frequency (MHz) Antenna Duty Cycle (%) Correction Factor (dB) 1/T (kHz) NVNT BLE 1Mbps 2402 Ant1 83.6 0.78 0.48 NVNT BLE 1Mbps 2440 Ant1 84 0.76 0.48 NVNT BLE 1Mbps 2480 Ant1 84 0.76 0.48 Shenzhen Toby Technology Co., Ltd. Http://www.tobylab.cn Add:1/F.,Building 6, Rundongsheng Industrial Zone, Longzhu, Xixiang, Bao'an District, Shenzhen, Guangdong, China. Report No.: TBR-C-202408-0104-11 Page: 4 of 27 FCC ID: 2A2GJ-HT-N5262 TB-RF-074-1.0 Test Graphs Duty Cycle NVNT BLE 1Mbps 2402MHz Ant1 Duty Cycle NVNT BLE 1Mbps 2440MHz Ant1 Shenzhen Toby Technology Co., Ltd. Http://www.tobylab.cn Add:1/F.,Building 6, Rundongsheng Industrial Zone, Longzhu, Xixiang, Bao'an District, Shenzhen, Guangdong, China. Report No.: TBR-C-202408-0104-11 Page: 5 of 27 FCC ID: 2A2GJ-HT-N5262 TB-RF-074-1.0 Duty Cycle NVNT BLE 1Mbps 2480MHz Ant1 Shenzhen Toby Technology Co., Ltd. Http://www.tobylab.cn Add:1/F.,Building 6, Rundongsheng Industrial Zone, Longzhu, Xixiang, Bao'an District, Shenzhen, Guangdong, China. Report No.: TBR-C-202408-0104-11 Page: 6 of 27 FCC ID: 2A2GJ-HT-N5262 TB-RF-074-1.0 2. Maximum Conducted Output Power Condition Mode Frequency (MHz) Antenna Conducted Power (dBm) Limit (dBm) Verdict NVNT BLE 1Mbps 2402 Ant1 3.047 30 Pass NVNT BLE 1Mbps 2440 Ant1 4.539 30 Pass NVNT BLE 1Mbps 2480 Ant1 4.000 30 Pass Shenzhen Toby Technology Co., Ltd. Http://www.tobylab.cn Add:1/F.,Building 6, Rundongsheng Industrial Zone, Longzhu, Xixiang, Bao'an District, Shenzhen, Guangdong, China. Report No.: TBR-C-202408-0104-11 Page: 7 of 27 FCC ID: 2A2GJ-HT-N5262 TB-RF-074-1.0 Test Graphs Power NVNT BLE 1Mbps 2402MHz Ant1 Power NVNT BLE 1Mbps 2440MHz Ant1 Shenzhen Toby Technology Co., Ltd. Http://www.tobylab.cn Add:1/F.,Building 6, Rundongsheng Industrial Zone, Longzhu, Xixiang, Bao'an District, Shenzhen, Guangdong, China. Report No.: TBR-C-202408-0104-11 Page: 8 of 27 FCC ID: 2A2GJ-HT-N5262 TB-RF-074-1.0 Power NVNT BLE 1Mbps 2480MHz Ant1 Shenzhen Toby Technology Co., Ltd. Http://www.tobylab.cn Add:1/F.,Building 6, Rundongsheng Industrial Zone, Longzhu, Xixiang, Bao'an District, Shenzhen, Guangdong, China. Report No.: TBR-C-202408-0104-11 Page: 9 of 27 FCC ID: 2A2GJ-HT-N5262 TB-RF-074-1.0 3. -6dB Bandwidth Condition Mode Frequency (MHz) Antenna -6 dB Bandwidth (MHz) Limit -6 dB Bandwidth (MHz) Verdict NVNT BLE 1Mbps 2402 Ant1 0.63 0.5 Pass NVNT BLE 1Mbps 2440 Ant1 0.65 0.5 Pass NVNT BLE 1Mbps 2480 Ant1 0.64 0.5 Pass Shenzhen Toby Technology Co., Ltd. Http://www.tobylab.cn Add:1/F.,Building 6, Rundongsheng Industrial Zone, Longzhu, Xixiang, Bao'an District, Shenzhen, Guangdong, China. Report No.: TBR-C-202408-0104-11 Page: 10 of 27 FCC ID: 2A2GJ-HT-N5262 TB-RF-074-1.0 Test Graphs -6dB Bandwidth NVNT BLE 1Mbps 2402MHz Ant1 -6dB Bandwidth NVNT BLE 1Mbps 2440MHz Ant1 Shenzhen Toby Technology Co., Ltd. Http://www.tobylab.cn Add:1/F.,Building 6, Rundongsheng Industrial Zone, Longzhu, Xixiang, Bao'an District, Shenzhen, Guangdong, China. Report No.: TBR-C-202408-0104-11 Page: 11 of 27 FCC ID: 2A2GJ-HT-N5262 TB-RF-074-1.0 -6dB Bandwidth NVNT BLE 1Mbps 2480MHz Ant1 Shenzhen Toby Technology Co., Ltd. Http://www.tobylab.cn Add:1/F.,Building 6, Rundongsheng Industrial Zone, Longzhu, Xixiang, Bao'an District, Shenzhen, Guangdong, China. Report No.: TBR-C-202408-0104-11 Pag…

Text truncated - open the document above for the full version.

Test Report

Shenzhen Toby Technology Co., Ltd. Report No.: TBR-C-202408-0…

Text truncated - open the document above for the full version.

Contact Information

Applicant

Aaron Li(General Manager)
[email protected]+86 18080100260Fax: 028-62374838

Test Firm

Shenzhen Toby Technology Co., Ltd.Ray Lai
[email protected]---

Technical Specifications

#Rule PartsFrequency RangePower Output
215C2.40 GHz - 2.48 GHz2.80 mW
Confidentiality
Long Term
Grant Notes
Output Power listed is peak conducted. RF exposure compliance is addressed for 1.1310 and 2.1091 MPE limits. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons. End Users must be provided with transmitter operation conditions for satisfying RF exposure compliance. This LoRa product contains Hybrid Mode.

Other Applications from Heltec Automation Technology Co., Ltd

Mesh Node T096 - FCC ID 2A2GJ-MESHNODET096 - Heltec Automation Technology Co., Ltd
2A2GJ-MESHNODET096

Mesh Node T096

Jul 22, 2026

Equipment Class

DTS - Digital Transmission System
WiFi HaLow Module - FCC ID 2A2GJ-HT-HC01 - Heltec Automation Technology Co., Ltd
2A2GJ-HT-HC01

WiFi HaLow Module

Jul 13, 2026

Equipment Class

DTS - Digital Transmission System
Vision Master - FCC ID 2A2GJ-HT-VME290 - Heltec Automation Technology Co., Ltd
2A2GJ-HT-VME290

Vision Master

Oct 11, 2024

Equipment Class

DTS - Digital Transmission System
Wireless mini shell - FCC ID 2A2GJ-HT-CT62 - Heltec Automation Technology Co., Ltd
2A2GJ-HT-CT62

Wireless mini shell

Sep 10, 2024

Equipment Class

DSS - Part 15 Spread Spectrum Transmitter
Sensor Hub - FCC ID 2A2GJ-HRI-3621 - Heltec Automation Technology Co., Ltd
2A2GJ-HRI-3621

Sensor Hub

Aug 12, 2024

Equipment Class

DSS - Part 15 Spread Spectrum Transmitter