2A2PC-J9PROMINI Projector

SHENZHENLIANJIXINGTECHNOLOLGYCO.,LTD Address ： 302,Building6,ZoneC,SouthBiantouIndustrialZone,DongfangCommunity,Song gangStreet,Bao'anDistrict,Shenzhen,Guangdong,China Date:2026-08-18 FederalCommunicationsCommission AuthorizationandEvaluationDivision 1435OaklandMillsRoad Columbia,MD21046 Ref:AttestationStatementsPart2.911(d)(7)Filing SUBJECT:FCCApplicationforFCCID:2A2PC-J9PRO FRN:0031188287 (“SHENZHENLIANJIXINGTECHNOLOLGYCO.,LTD”)certifiesthat,asofthedateofthe filingoftheapplication,TTSMARKETINC.isourdesignatedU.S.agentforserviceof processfortheabovereferencedFCCID.(“SHENZHENLIANJIXINGTECHNOLOLGY CO.,LTD”)acceptstomaintainanagentfornolessthanoneyearafterthegranteehas terminatedallmarketingandimportationortheconclusionofanyCommission-related proceedinginvolvingtheequipment. TTSMARKETINC.accepts,asofthedateofthefilingoftheapplication,theobligationofthe designatedU.S.agentforserviceofprocessfortheabovereferencedFCCID. DesignatedU.S.AgentInformation: CompanyName:TTSMARKETINC. FRN:0036806057 ContactName:MaverickLim Address:1178BroadwaySte324,NewYork,NY10001.USA TelephoneNo:001-(646)305-2908 Email:[email protected] Sincerely, SignedonbehalfofSHENZHENLIANJI XINGTECHNOLOLGYCO.,LTD SignedonbehalfofTTSMARKETINC. Name:HongwuLiName:MaverickLim Title:GeneralManagerTitle:Manager Date:2026-08-18Date:2026-08-18

Rev1/26/2023 SHENZHENLIANJIXINGTECHNOLOLGYCO.,LTD FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:08-18-2026 Ref:AttestationStatementsPart2.911(d)(5)(i)Filing FCCID:2A2PC-J9PRO (“SHENZHENLIANJIXINGTECHNOLOLGYCO.,LTD”)certifiesthattheequipmentforwhichauthorization issoughtisnot“covered”equipmentprohibitedfromreceivinganequipmentauthorizationpursuantto section2.903oftheFCCrules. (“SHENZHENLIANJIXINGTECHNOLOLGYCO.,LTD”)certifiesthattheequipmentforwhichauthorization issoughtdoesnotincludecybersecurityoranti-virussoftwareproducedorprovidedbyKasperskyLab, Inc.oranyofitssuccessorsandassignees,includingequipmentwithintegratedKasperskyLab,Inc.(or anyofitssuccessorsandassignees)cybersecurityoranti-virussoftwarepursuanttoDA-24-886andKDB 986446D01CoveredEquipmentGuidancesectionB(2a). Deviceisinherentlycompliantbasedonhardwarelimitationsorsoftwarecontrols. or ASoftwareBillofMaterials(SBOM)isprovidedtotheTCBforreview,and Theend-userorthirdpartiescannotinstalladditionalsoftwareonthisdevice. Sincerely, (Applicantsignature)HongwuLi (Applicantprintedname) Rev1/26/2023 SHENZHENLIANJIXINGTECHNOLOLGYCO.,LTD FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:08-18-2026 Ref:AttestationStatementsPart2.911(d)(5)(ii)Filing FCCID:2A2PC-J9PRO (“SHENZHENLIANJIXINGTECHNOLOLGYCO.,LTD”)certifiesthat,asofthedateofthefilingofthe application,SHENZHENLIANJIXINGTECHNOLOLGYCO.,LTDisnotidentifiedontheCoveredList(asa specificallynamedentityoranyofitssubsidiariesoraffiliates)asanentityproducing“covered” equipment. Sincerely, (Applicantsignature) (Applicantprintedname)HongwuLi

SHENZHENLIANJIXINGTECHNOLOLGYCO.,LTD Date ： 08-18-2026 Product/ModelNumber:MINIProjector/J9Pro,J21Pro FCCID ： 2A2PC-J9PRO Towhomitmayconcern, Re:ProductCertificationRepresentativeAuthorizationLetter WeauthorizeQAILaboratoriesLtd.3980NorthFraserWay,BurnabyB.C. CanadaV5J5K5toactonourbehalfonallmattersconcerningtheabove namedequipment. Thisshallincludethefollowing: Testing Approvalapplicationsandprocedures WedeclarethatQAILaboratoriesLtd.isallowedtoforwardallinformation relatedtotheapprovalprojecttotheappliedcertificationbodyandtothe notificationentitiesandtodiscussanyissuesconcerningtheapproval application.AnyandallactscarriedoutbyQAILaboratoriesLtd.onour behalfshallhavethesameeffectasactsofourown. By:HongwuLi ContactListedonFCCWesbite Title:GeneralManager Email:[email protected] Telephone:0755-36983616 Onbehalfof:SHENZHENLIANJIXINGTECHNOLOLGYCO.,LTD

SHENZHENLIANJIXINGTECHNOLOLGYCO.,LTD OfficeofEngineeringTechnology FederalCommunicationsCommission 7435OaklandMillsRoad Columbia,MD21046 USA Date:August18,2026 Subject;RequestforConfidentiality FCCID:2A2PC-J9PRO ToWhomItMayConcern, PursuanttotheprovisionsoftheCommission’srulesTitle47Sections§0.457and§0.459,we arerequestingtheCommissiontowithholdthefollowingattachment(s)asconfidential documentsfrompublicdisclosureindefinitely. Thesedocumentscontaindetailedsystemandequipmentdescriptionsandareconsideredas proprietaryinformationinoperationoftheequipment.Thepublicdisclosureofthese documentsmightbeharmfultoourcompanyandwouldgivecompetitorsanunfairadvantage inthemarket. SchematicDiagram BlockDiagram PartsList OperationalDescription Tune-upProcedure SoftwareSecurityRequirementsforUNIIdevices Inadditionaltoabovementioneddocuments,inordertocomplywiththemarketingregulations inTitle47CFR§2.803andtheimportationrulesinTitle47CFR§2.1204,whileensuringthat businesssensitiveinformationremainsconfidentialuntiltheactualmarketingofnewly authorizeddevices,werequestShortTermConfidentialityofthefollowingattachment(s); ExternalPhotos TestSetupPhotos InternalPhotos UserManual For45days,pursuanttoPublicNoticeDA04-1705. OR For180dayspursuanttoKDB726920D01. Itisourunderstandingthatallmeasurementtestreports,FCCIDlabelformatand correspondenceduringthecertificationreviewprocesscannotbegrantedasconfidential documentsandthisinformationwillbeavailableforpublicreviewoncethegrantofequipment authorizationisissued. Sincerely, Signature: Name:HongwuLi Title:GeneralManager

SHENZHENLIANJIXINGTECHNOLOLGYCO.,LTD ProductSimilarityDeclaration Productname:MINIProjector Modelname:J9Pro,J21Pro FCCID:2A2PC-J9PRO We(SHENZHENLIANJIXINGTECHNOLOLGYCO.,LTD)herebystate thatallthemodelsareelectricalidenticalincludingthesame softwareparameterandhardwaredesign(i.e.,circuitdesign,PCB Layout,RFmodule/circuit,antennatype(s)andantennalocation, componentsonPCB,etc.,),samemechanicalstructureand design(includingproductenclosure,materials,etc.,),theonly differencearemodelname,colorandTheshapeofthe appearance. Signature: Name:HongwuLi Title:GeneralManager Place,date:Shenzhen,2026.8.18

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FCCID:2A2PC-J9PRO RFExposureEvaluation AccordingtoKDB447498D01GeneralRFExposureGuidancev06andpart2.1091，Unlessspecifically requiredbythepublishedRFexposureKDBprocedures,standalone1-gheadorbodyand10-gextremity SARevaluationforgeneralpopulationexposureconditions,bymeasurementornumericalsimulation,isnot requiredwhenthecorrespondingSARTestExclusionThresholdcondition(s),listedbelow,is(are)satisfied. Limits Thecriterialistedinthefollowingtableshallbeusedtoevaluatetheenvironmentimpactofhumanexposure toradiofrequency(RF)radiationasspecifiedin1.1307(b) LimitsforMaximumPermissibleExposure(MPE) Frequencyrange (MHz) Electricfield strength (V/m) Magneticfieldstrength (A/m) Powerdensity (mW/cm 2 ) Averagingtime (minutes) (A)LimitsforOccupational/ControlledExposures 0.3–3.06141.63*(100)6 3.0–301842/f4.89/f*(900/f 2 )6 30–30061.40.1631.06 300–1500f/3006 1500–100,00056 (B)LimitsforGeneralPopulation/UncontrolledExposure 0.3–1.346141.63*(100)30 1.34–30824/f2.19/f*(180/f 2 )30 30–30027.50.0730.230 300–1500f/150030 1500–100,0001.030 f=frequencyinMHz Friistransmissionformula:Pd=(Pout*G)/(4*pi*r 2 ) Where Pd=powerdensityinmW/cm 2 ,Pout=outputpowertoantennainmW; G=gainofantennainlinearscale,Pi=3.1416; R=distancebetweenobservationpointandcenteroftheradiatorincm PdidthelimitofMPE,1mW/cm 2 .Ifweknowthemaximumgainoftheantennaandthetotalpowerinputto theantenna,throughthecalculation,wewillknowthedistancerwheretheMPElimitisreached. TestProcedure SoftwareprovidedbyclientenabledtheEUTtotransmitandreceivedataatlowest,middleandhighest channelindividually. TestResultofRFExposureEvaluation Remark：1.BTAntennagainis2.71dBi TheMaxCalc.Thresholds:BLE:0.000417≤1 SoaSARtestisnotrequired Modul ation Rate Frequ ency MHz Output power to antenna (dBm) Target power W/toler ance (dBm） Max Outpu t power to anten na (dBm) Antenna Gain MaxOutput powerto antenna (mW) Power Densityat R=20cm (mW/cm2 ) Limit (mW/ cm2) Result BLEGFSK1Mbps 2402-0.81 -0.5±1 0.52.711.1220180.0004171.0PASS 2440-0.98 -1±1 02.711.0000000.0003711.0PASS 2480-0.86 -0.5±1 0.52.711.1220180.0004171.0PASS

承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： WAN3216F245W36 規格 DESCRIPTION ： Chip Antenna 3216 M-Ant 2.45G Type 36 版本 VERSION ： V2.5 日期 ISSUE DATE ： 2022/01/05 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray Tennyson Snow 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112台北市北投區立功街151號1樓 1F, No. 151, Li Gong Street, Beitou District, Taipei City 112, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 ONEWAVE TECHNOLOGY CO., LTD. 2/11 3216 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 3.23 ± 0.20 W 1.66 ± 0.20 T 1.23 ± 0.20 P/N: WAN3216F245W36 ONEWAVE TECHNOLOGY CO., LTD. 3/11 Part Number Information WAN 3216 F 245 W 36 A B C D E F A Product Series Antenna B Dimension L x W 3.2X1.6mm (+-0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode Monopole & Single Feeding F Antenna type Type = 36 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN3216F245W36 Central Frequency 2450 MHz Bandwidth 100 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 2.71 dBi Impedance 50 Ohm Operating Temperature -40～+110 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) ONEWAVE TECHNOLOGY CO., LTD. 4/11 2. Recommended PCB Pattern 1.Evaluation Board Dimension 2.Evaluation Board Dimension (若淨空區夠大，建議使用此Layout，效能較佳) Unit : mm Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感±0.1~0.3nH、電容±0.1pF ONEWAVE TECHNOLOGY CO., LTD. 5/11 1.Layout Dimensions in Clearance area(Size=5.2*5.0mm) 50 ohm transmission Line Matching Circuit 2.Layout Dimensions in Clearance area(Size=8.2*5.0mm) (若淨空區夠大，建議使用此Layout，效能較佳) 50 ohm transmission Line Matching Circuit FootPrint (Unit : mm) ONEWAVE TECHNOLOGY CO., LTD. 6/11 3. Measurement Results Return Loss ONEWAVE TECHNOLOGY CO., LTD. 7/11 Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 55.21 % 1.45 dBi 5.32 dBi 2450MHz 66.45 % 2.71 dBi 5.21 dBi 2500MHz 57.53 % 1.98 dBi 5.29 dBi Chamber Coordinate System X Z Y ONEWAVE TECHNOLOGY CO., LTD. 8/11 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10 ± 0.5 sec. 60 sec . . T E M P ( °C ) 150 °C 2 6 0 °C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C ONEWAVE TECHNOLOGY CO., LTD. 9/11 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 ONEWAVE TECHNOLOGY CO., LTD. 10/11 6.Packaging Information ◆ Tape Specification: W Ao Bo Ko P F E D D1 Po P2 t 8.0 ±0.30 1.80 ±0.05 3.51 ±0.10 1.59 ±0.10 4.00 ±0.05 3.50 ±0.05 1.75 ±0.10 1.50 ±0.10 0.00 ±0.10 4.00 ±0.10 2.00 ±0.05 0.25 ±0.05 ◆ Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2…

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Page1of17 FCC_BLE(Part15.247)TestData FCCID:2A2PC-J9PRO Product:MINIProjector ModelName:J9Pro,J21Pro Brand:N/A ReportNo.:SZNTT26032645E1-1 Preparedfor SHENZHENLIANJIXINGTECHNOLOLGYCO.,LTD 302,Building6,ZoneC,SouthBiantouIndustrialZone,DongfangCommunity,SonggangStreet,Bao'an District,Shenzhen,Guangdong,China Preparedby ShenzhenNTTTestingTechnologyCo.,Ltd. 1B,Building2,FactoryBuilding&103,Building3,FactoryBuilding,DayangIndustrialParkNo.4,Industrial Avenue,TangweiCommunity,FuhaiSub-district,Bao'anDistrict,ShenzhenCity,China TEL:0755-27889935 Page2of17 TableofContents 1.-6dBBandwidth.......................................................................................................................................................3 2.99%OccupiedBandwidth....................................................................................................................................5 3.DutyCycle.................................................................................................................................................................7 4.PeakOutputPower.................................................................................................................................................9 5.PowerSpectralDensity.......................................................................................................................................11 6.Bandedge................................................................................................................................................................13 7.SpuriousEmission.................................................................................................................................................15 Page3of17 1.-6dBBandwidth ConditionAntennaRateFrequency(MHz)-6dBBW(kHz)limit(kHz)Result NVNTANT11Mbps2402.00520.15500Pass NVNTANT11Mbps2440.00535.01500Pass NVNTANT11Mbps2480.00537.43500Pass -6dB_Bandwidth_NVNT_ANT1_1Mbps_2402 -6dB_Bandwidth_NVNT_ANT1_1Mbps_2440 -6dB_Bandwidth_NVNT_ANT1_1Mbps_2480 Page4of17 Page5of17 2.99%OccupiedBandwidth ConditionAntennaRateFrequency(MHz)99%%BW(MHz) NVNTANT11Mbps2402.001.148 NVNTANT11Mbps2440.001.190 NVNTANT11Mbps2480.001.191 99%_Occupied_Bandwidth_NVNT_ANT1_1Mbps_2402 99%_Occupied_Bandwidth_NVNT_ANT1_1Mbps_2440 99%_Occupied_Bandwidth_NVNT_ANT1_1Mbps_2480 Page6of17 Page7of17 3.DutyCycle ConditionAntennaRateFrequency(MHz)Dutycycle(%)Duty_factor NVNTANT11Mbps2402.0015.638.06 NVNTANT11Mbps2440.0018.757.27 NVNTANT11Mbps2480.0015.638.06 Duty_Cycle_NVNT_ANT1_1Mbps_2402 Duty_Cycle_NVNT_ANT1_1Mbps_2440 Duty_Cycle_NVNT_ANT1_1Mbps_2480 Page8of17 Page9of17 4.PeakOutputPower ConditionAntennaRate Frequency (MHz) Max.Conducted Power(dBm) Max.Conducted Power(mW) Limit(mW)Result NVNTANT11Mbps2402.00-0.810.831000Pass NVNTANT11Mbps2440.00-0.980.801000Pass NVNTANT11Mbps2480.00-0.860.821000Pass Peak_Output_Power_NVNT_ANT1_1Mbps_2402 Peak_Output_Power_NVNT_ANT1_1Mbps_2440 Peak_Output_Power_NVNT_ANT1_1Mbps_2480 Page10of17 Page11of17 5.PowerSpectralDensity ConditionAntennaRateFrequency(MHz) PowerSpectral Density(dBm/3kHz) Limit(dBm/3kHz)Result NVNTANT11Mbps2402.00-21.048Pass NVNTANT11Mbps2440.00-21.318Pass NVNTANT11Mbps2480.00-21.688Pass Power_Spectral_Density_NVNT_ANT1_1Mbps_2402 Power_Spectral_Density_NVNT_ANT1_1Mbps_2440 Power_Spectral_Density_NVNT_ANT1_1Mbps_2480 Page12of17 Page13of17 6.Bandedge ConditionAntennaModulation TX_Frequency (MHz) Max. Mark_freq(MHz) Ref_level(dBm) Spurious level(dBm) limit(dBm)Result NVNTANT11Mbps2402.002378.020-0.967-48.978-20.967Pass NVNTANT11Mbps2480.002495.625-1.018-58.230-21.018Pass 1_Reference_Level_NVNT_ANT1_1Mbps_2402 2_Bandedge_NVNT_ANT1_1Mbps_2402 1_Reference_Level_NVNT_ANT1_1Mbps_2480 Page14of17 2_Bandedge_NVNT_ANT1_1Mbps_2480 Page15of17 7.SpuriousEmission ConditionAntennaModulation TX_Frequency (MHz) Ref_level(dBm) Spurious level(dBm) limit(dBm)Result NVNTANT11Mbps2402.00-0.967-48.327-20.967Pass NVNTANT11Mbps2440.00-1.163-45.799-21.163Pass NVNTANT11Mbps2480.00-1.018-46.981-21.018Pass 1_Reference_Level_NVNT_ANT1_1Mbps_2402 2_Spurious_Emission_NVNT_ANT1_1Mbps_2402 1_Reference_Level_NVNT_ANT1_1Mbps_2440 Page16of17 2_Spurious_Emission_NVNT_ANT1_1Mbps_2440 1_Reference_Level_NVNT_ANT1_1Mbps_2480 Page17of17 2_Spurious_Emission_NVNT_ANT1_1Mbps_2480

SZNTT-TR828-0Page1of34 Hotline:0755-27889935http://www.ntt-testing.com FCCTESTREPORT FCCID:2A2PC-J9PRO Product:MINIProjector ModelName:J9Pro,J21Pro Brand:N/A ReportNo.:SZNTT26032645E1-1 Preparedfor SHENZHENLIANJIXINGTECHNOLOLGYCO.,LTD 302,Building6,ZoneC,SouthBiantouIndustrialZone,DongfangCommunity,Songgang Street,Bao'anDistrict,Shenzhen,Guangdong,China Preparedby ShenzhenNTTTestingTechnologyCo.,Ltd. 1B,Building2,FactoryBuilding&103,Building3,FactoryBuilding,DayangIndustrial ParkNo.4,IndustrialAvenue,TangweiCommunity,FuhaiSub-district,Bao'anDistrict, ShenzhenCity,China TEL:0755-27889935 ReportNo.:SZNTT26032645E1-1 SZNTT-TR828-0Page2of34 Hotline:0755-27889935http://www.ntt-testing.com 1TESTRESULTCERTIFICATION Applicant’sname:SHENZHENLIANJIXINGTECHNOLOLGYCO.,LTD Address: 302,Building6,ZoneC,SouthBiantouIndustrialZone,Dongfang Community,SonggangStreet,Bao'anDistrict,Shenzhen, Guangdong,China Manufacture'sname:SHENZHENLIANJIXINGTECHNOLOLGYCO.,LTD Address: 302,Building6,ZoneC,SouthBiantouIndustrialZone,Dongfang Community,SonggangStreet,Bao'anDistrict,Shenzhen, Guangdong,China Productname:MINIProjector Modelname:J9Pro Additionalmodel:J21Pro Standards:FCCCFR47Part15Section15.247 Testprocedure: ANSIC63.10-2020+Cor.1-2023+C63.10a-2024+Erratato C63.10a-2024 KDB558074D0115.247MeasGuidancev05r02 TestDate:Aug.02,2026toAug.13,2026 DateofIssue:Aug.13,2026 TestResult:Pass ThisdevicedescribedabovehasbeentestedbyNTT,andthetestresultsshowthatthe equipmentundertest(EUT)isincompliancewiththeFCCrequirements.Anditisapplicableonly tothetestedsampleidentifiedinthereport. Thisreportshallnotbereproducedexceptinfull,withoutthewrittenapprovalofNTT,this documentmaybealteredorrevisedbyNTT,personalonly,andshallbenotedintherevisionof thedocument. Preparedby(TestEngineer): CindyQin Reviewer(Supervisor): KenWu Approved(Manager): AbelYu ReportNo.:SZNTT26032645E1-1 SZNTT-TR828-0Page3of34 Hotline:0755-27889935http://www.ntt-testing.com Contents Page 1TESTRESULTCERTIFICATION...................................................................................................................2 2TESTSUMMARY............................................................................................................................................5 3TESTFACILITY...............................................................................................................................................6 4GENERALINFORMATION.............................................................................................................................7 4.1GENERALDESCRIPTIONOFE.U.T...........................................................................................................7 4.2CHANNELLIST.......................................................................................................................................8 4.3TESTSETUPCONFIGURATION................................................................................................................9 4.4TESTMODE...........................................................................................................................................9 5EQUIPMENTDURINGTEST........................................................................................................................10 5.1EQUIPMENTSLIST................................................................................................................................10 5.2MEASUREMENTUNCERTAINTY..............................................................................................................12 5.3DESCRIPTIONOFSUPPORTUNITS........................................................................................................12 6CONDUCTEDEMISSION.............................................................................................................................13 6.1E.U.T.OPERATION..............................................................................................................................13 6.2EUTSETUP.........................................................................................................................................13 6.3TESTSET-UP(BLOCKDIAGRAMOFCONFIGURATION).........................................................................13 6.4MEASUREMENTPROCEDURE................................................................................................................14 6.5CONDUCTEDEMISSIONLIMIT................................................................................................................14 6.6MEASUREMENTDESCRIPTION...............................................................................................................14 6.7CONDUCTEDEMISSIONTESTRESULT...................................................................................................14 7RADIATEDSPURIOUSEMISSIONS...........................................................................................................17 7.1EUTOPERATION.................................................................................................................................17 7.2TESTSETUP........................................................................................................................................18 7.3SPECTRUMANALYZERSETUP...............................................................................................................19 7.4TESTPROCEDURE...............................................................................................................................19 7.5SUMMARYOFTESTRESULTS...............................................................................................................21 8CONDUCTBANDEDGEANDSPURIOUSEMISSIONSMEASUREMENT...............................................28 8.1TESTSETUP........................................................................................................................................28 8.2TESTPROCEDURE..................................................................................…

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