2AB6M-BY-WM6BOYA UHF Wireless Microphone System

IMPORTANT FCC USER RESTRICTION: This product shall not be used by the general public. This product is limited for those who create meda for broadcase service, any other shall not use this product without permission.

BoyaAudioEquipment (Shenzhen)Co.,Ltd. FCCConfidentialityRequest Number:CF303 Version:V05 Date:21-05-2012 (Permanentoralsocalledlongtermconfidentialityisthenormalmethodtokeepcertaindocuementsconfidential,andmayapplyto schematics,blockdiagrams,operationaldescriptionandbillofmaterials.) To:FederalCommunicationsCommission EquipmentAuthorizationBranch 7435OaklandMillsRoad Columbia,MD21046 Pursuantto47CFRSection0.459(a)&(b),we, (theapplicant/grantee) CompanynameBoyaAudioEquipment(Shenzhen)Co.,Ltd. AddressBuilding#A16,SiliconValley,IntellectualTerminalIndustrialPark,GuanlanStreet,Longhua District, CityShenzhen CountryChina requestforthiscertificationfilingunder: GranteeCodeProductNumber FCCID:2AB6M-BY-WM6 tomaintainpermanentconfidentialityforthefollowingdocumentssubmittedwithinthisapplication: (pleasecrosswhatisapplicable,oraddotherdocuments,providethefilenameanddescription) ExhibitFileNameDescription √ OperationalDescriptionOperationalDescriptionexplainingthefunctioningoftheblockdiagram √ BlockDiagramsBlockDiagramsshowingthesystematicbuildingblocksoftheEUT √ SchematicsDiagramsSchematicsshowingcomponents,theirvaluesandinterconnection BillofMaterialsListofcomponentsusedonthePCB’softheEUT Abovematerialscrossedcontainsecrets,proprietaryandtechnicalinformation,whichwouldcustomarilybeguardedfrom competitorsunder47CFR,section0.457(d)(2).Disclosureorpublicationoranyportionofthiscompanyconfidentialmaterial tootherpartiescouldcausesubstantialcompetitiveharmandprovideunjustifiedbenefitsforcompetitors.Weunderstandthat pursuantto47CFRsection0.457(d)(1)(ii)disclosureoftheapplicantandallaccompanyingdocumentationwillnotbemade beforethedateofthegrant.Thedocumentsindicatedasconfidentialabove,arenotpubliclyavailableelsewhere. Attestation: CityandCountry:Date:Name: (thismustbeaperson) Function:Signature: (orofficialcompanystamp) Shenzhen,China2015-09-15JaneGuoSalesManager

BoyaAudioEquipment (Shenzhen)Co.,Ltd. FCCAuthorizationLetter Number:CF304 Version:V03 Date:01-08-2011 We, (theapprovalholder) CompanynameBoyaAudioEquipment(Shenzhen)Co.,Ltd. AddressBuilding#A16,SiliconValley,IntellectualTerminalIndustrialPark,GuanlanStreet,Longhua District, CityShenzhen CountryChina declarethatthefollowingrepresentative(agent): Name(person)TomChen CompanynameShenzhenAnbotekComplianceLaboratoryLimited Addresss1/F.,Building1,SECIndustrialPark,No.0409QianhaiRoad,NanshanDistrict, CityShenzhen CountryChina isherebyauthorizedtoapplythefollowingequipmentforcertificationonourbehalf: ProductDescriptionBOYAUHFWirelessMicrophoneSystem TypeorModel(s)BY-WM6 TradenameorBrand(s)BOYA WealsoauthorizeTeleconformity(Mr.M.Koop,ManagerCertification,Address:Rietven31,7534NHEnschede,the Netherlands)toapplyandsignthisapplicationforcertification,registrationorfilingonourbehalf(asrepresentativeagentor certifier). Attestation: CityandCountry:Date:Name: (thismustbeaperson) Function:Signature: (orofficialcompanystamp) Shenzhen,China2015-09-15JaneGuoSalesManager

Figure1 TheEUT-FrontView Figure2 TheEUT-BackView Figure3 TheEUT-TopView Figure4 TheEUT-BottomView

LabelLocationOnEUT

ProductName:BOYAUHFWirelessMicrophoneSystem ModelNo.:BY-WM6 FCCID:2AB6M-BY-WM6 ThisdevicecomplieswithPart15oftheFCCRules.Operation issubjecttothefollowingtwoconditions: (1)Thisdevicemaynotcauseharmfulinterference,and (2)Thisdevicemustacceptanyinterferencereceived,including interferencethatmaycauseundesiredoperation.

Figure5 TheEUT-InsideView Figure6 PCBoftheEUT-FrontView(WithShielding) Antenna Figure7 PCBoftheEUT-FrontView(WithoutShielding) Figure8 PCBoftheEUT-BackView(WithShielding) Figure9 PCBoftheEUT-BackView(WithoutShielding) Figure10 PCBoftheEUT-FrontView Figure11 PCBoftheEUT-BackView Figure12 PCBoftheEUT-FrontView Figure13 PCBoftheEUT-BackView

RFEXPOSUREEVALUATION FCCID ： 2AB6M-BY-WM6 AccordingtoFCC1.1310:Thecriterialistedinthefollowingtableshallbeusedto evaluatetheenvironmentimpactofhumanexposuretoradiofrequency(RF)Radiation asspecifiedin§1.1307(b): RoutineSARevaluationreferstothatspecificallyrequiredby§2.1093,using measurementsorcomputersimulation.WhenroutineSARevaluationisnotrequired, portabletransmitterswithoutputpowergreaterthantheapplicablelowthreshold requireSARevaluationtoqualifyforTCBapproval. Themaximumoutputpowerforchannellow(584.4MHz)is:0.712dBm=1.178mW Tuneuptoleranceis:0.712 ± 1dBm TheMax.TuneupPower=1.712dBm=1.483mW Thecalculationresults=1.483/5*√0.5844=0.227 ＜ 3 Themaximumoutputpowerforchannelmid(595.6MHz)is:-0.275dBm=0.939mW Tuneuptoleranceis:-0.275 ± 1dBm TheMax.TuneupPower=0.725dBm=1.182mW Thecalculationresults=1.182/5*√0.5956=0.182 ＜ 3 Themaximumoutputpowerforchannelhigh(607.4MHz)is:-1.709dBm=0.675mW Tuneuptoleranceis:-1.709 ± 1dBm TheMax.TuneupPower=-0.709dBm=0.849mW Thecalculationresults=0.849/5*√0.6074=0.132 ＜ 3 TestResults:TheproductisnoneedtoconductSARtest.

Shenzhen Anbotek Compliance Laboratory Limited FCC ID: 2AB6M-BY-WM6 Page 1 of 34 Report No.: R011508386I Shenzhen Anbotek Compliance Laboratory Limited Tel:(86)755-26066544 Fax:(86)755-26014772 www.anbotek.com FCC TEST REPORT for Boya Audio Equipment (Shenzhen) Co., Ltd. BOYA UHF Wireless Microphone System Model No.: BY-WM6 Report Number:R011508386I Date of Test:Aug. 18~ Sept. 10, 2015 Date of Report:Sept. 10, 2015 Prepare dfor:Boya Audio Equipment (Shenzhen) Co., Ltd. Address:Building#A16, Silicon Valley, Intellectual Terminal Industrial Park, Guanlan Street, Longhua District, Shenzhen, China Prepare dBy:Shenzhen Anbotek Compliance LaboratoryLimited Address:1/F., Building 1, SEC Industrial Park, No.0409 Qianhai Road, Nanshan District, Shenzhen, Guangdong, China Tel: (86) 755-26066544 Fax: (86) 755-26014772 Shenzhen Anbotek Compliance Laboratory Limited FCC ID: 2AB6M-BY-WM6 Page 2 of 34 Report No.: R011508386I Shenzhen Anbotek Compliance Laboratory Limited Tel:(86)755-26066544 Fax:(86)755-26014772 www.anbotek.com TABLE OF CONTENTS Description Page Test Report 1. GENERAL INFORMATION......................................................................................................4 1.1. Description of Device (EUT)................................................................................................................4 1.2. Auxiliary Equipment Used during Test................................................................................................ 5 1.3. Description of Test Facility.................................................................................................................. 5 1.4. Measurement Uncertainty.....................................................................................................................5 1.5. Operating Frequency.............................................................................................................................6 2. TRANSMITTER OUTPUT POWER.........................................................................................7 2.1. Requirements........................................................................................................................................ 7 2.2. Test Setup..............................................................................................................................................7 2.3. Test Equipment..................................................................................................................................... 7 2.4. Test Results...........................................................................................................................................8 3. SPURIOUS RADIATION EMISSIONS.................................................................................. 10 3.1. Requirements...................................................................................................................................... 10 3.2. Test Procedure.................................................................................................................................... 10 3.3. Test Equipment...................................................................................................................................11 3.4. Test Results.........................................................................................................................................11 4. OPERATING BANDWIDTH AND EMISSIONS MASK......................................................15 4.1. Requirements...................................................................................................................................... 15 4.2. Test Setup............................................................................................................................................15 4.3. Test Procedure.................................................................................................................................... 15 4.4. Test Equipment...................................................................................................................................17 4.5. Test Results.........................................................................................................................................17 5. FREQUENCY TOLERANCE...................................................................................................21 5.1. Requirements...................................................................................................................................... 21 5.2. Test Setup............................................................................................................................................21 5.3. Test Equipment...................................................................................................................................21 5.4. Test Results.........................................................................................................................................21 6. MODULATION CHARACTERISTICS..................................................................................24 6.1. Requirements...................................................................................................................................... 24 6.2. Test Setup............................................................................................................................................24 6.3. Test Procedure.................................................................................................................................... 25 6.4. Test Equipment...................................................................................................................................25 6.5. Test Results.........................................................................................................................................25 7. PHOTOGRAPH.....................................................…

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