2AD56-HLK-B40Bluetooth Module

ShenzhenHi-LinkElectronicco.,Ltd HLK-B40 Master-slaveintegratedBluetoothtransparenttransmissionmodule UserManual Version：V2.0Verified：2023-7-24Copyright@Hi-Link UserManual HLK-B40 ShenzhenHi-LinkElectronicco.,Ltd Contents Terminology&nouninterpretation.................................................................................2 1.Introduction..................................................................................................................3 2.Pindefinition................................................................................................................4 3.Typicalapplicationcircuits..........................................................................................6 4.Basicfunctionalinstructions........................................................................................7 4.1Theprincipleoftransmission................................................................................7 4.2Moduleoperatingmode(transmissionandATcommandmode).......................8 4.3Descriptionoftheinputandoutputpinfunctions.................................................9 4.4Bluetoothdevicerolesandconnections...............................................................9 5.Aquickstartguide.....................................................................................................10 5.1.Testthedebugbaseplate....................................................................................10 5.2.Quicklyverifybluetoothserialtransmission......................................................11 6.Lowpowersleepfunction..........................................................................................13 7.ATcommand..............................................................................................................13 7.1ATinstructionformatdescription........................................................................13 7.2ATinstructionlistanddescription......................................................................14 8.WirelesssettingsandqueriesviaBluetooth..............................................................18 9.OTAfunctionality......................................................................................................18 10.Contactinfo..............................................................................................................19 UserManual HLK-B40 ShenzhenHi-LinkElectronicco.,Ltd ChartIndex Table1Thetermnameinterpretationtable.......................................................................4 Table2PindefinitionTable..............................................................................................7 Table3Descriptionoftheinputandoutputpinfunctions................................................10 Table4BluetoothtransmissionserviceUUIDdefault.....................................................11 Table5Alistofconfigurationitemstoreducepowerconsumption................................14 Table6ATcommandlistanddescription.........................................................................19 Figure1Pinpositiondiagram............................................................................................6 Figure2Basicminimumcircuit(disableslow-powersleepfunction).............................8 Figure3Basicminimumcircuit(enableslow-powersleepfunction)..............................8 Figure4One-to-oneBluetoothconnectiontransmissionfunctionschematic..................9 Figure5Amapofthemany-to-oneBluetoothconnectiontransmissionfunction...........9 Figure6AdiagramoftheconversionlogicofthetransmissionmodeandtheAT commandmode...................................................................................................................10 Figure7Themoduleteststheappearanceandfunctionalschematicofthebaseplate....12 Figure8Figureoftransmissiontestmeasurementtool....................................................13 Figure9Datatransmissionthroughserialportandapp....................................................13 Figure10Controlandstatetimingafterlowpowerfunctionisturnedon.......................14 UserManual HLK-B40 ShenzhenHi-LinkElectronicco.,Ltd Terminology&nouninterpretation Name.Instructions TransmissionTransparenttransmissionistoforwarddataasisbetweenBluetoothandserialport BluetoothAshort-rangewirelesscommunicationtechnology BLE BluetoothLowEnergy,anewBluetoothtechnologyspecificationthatconsumes lesspowerandhasahighertransmissionandcommunicationdistance GATT BluetoothLowEnergy(BLE)connectionsarebasedontheGATT(Generic AttributeProfile)protocolandareacommonspecificationforsendingand receivingdataoverBluetoothconnections Bluetoothhost OneofTherolesofthedeviceintheBluetoothconnection,thehosttoscanthedevice slaveandactivelyinitiatetheconnectiontothedevice,etc. intheBluetoothconnectionitsleadingrole Bluetoothfrom themachine OneoftherolesofthedeviceinaBluetoothconnection,slavetobroadcastitsown information,passivelywaitingfortheconnection Bluetooth broadcast Bluetoothfromthemachinedevicethroughperiodicbroadcasting,sothatthe surroundinghostequipmentcanscanandidentifythemselves,thehostdevice accordingtothescannedslaveinformationcaninitiateaconnectiontothe computer Broadcastinterval Bluetoothsendsbroadcastsslaveatintervalsthataresmallerandfastertoscanbut thegreaterthepowerconsumption,thesmallerthepowerconsumption Connection interval WhentwoBluetoothdevicesareconnected,thesmallerthebeatofthedata,the smallerthetransmissionspeed,thesmallerthedelaybutthegreaterthepower consumption Pairthebinding AmechanismofcommunicationsecurityinBluetoothtechnology,whichrealizes thesecurityofBluetoothlinklayer OTAAirupgrade,i.e.,thefirmwareofthemoduleiswirelesslyupgradedviaBluetooth Re-connect Intervals Whenthemoduleisthehost,whentheBluetoothconnectionisnotconnectedor disconnected,theintervalisautomaticallyreconnected Table1Thetermnameinterpretationtable UserManual HLK-B40 ShenzhenHi-LinkElectronicco.,Ltd 1.Introduction HLK-B40isakindofMaster-SlaveserialporttransmissionBluetoothmodulebasedonBLE5.1,Allkindsof d…

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1/1 USAgentforServiceofProcessLETTEROFATTESTATION TO: OfficeofEngineeringTechnology FederalCommunicationsCommission 7435OaklandMillsRoad Columbia,MD21046 USAgentforServiceofProcess: CompanyName:HOPEKCORPORATIONINC Address:16755CoyoteBushDrUnit84,SanDiego,CA92127UnitedStates FRN:0034562900 ContactName:YangyangXu TelephoneNo:(561)875-9826 E-mail:[email protected] ThisletteristoconfirmthattheUSAgentforServiceofProcessacceptsresponsibilitytoactas alocalrepresentativeonbehalfofShenzhenHi-LinkElectronicco.,Ltd. TheUSAgentforServiceofProcessisawareofandagreestocomplywiththerequirements outlinedintheFCCEquipmentAuthorizationProgram,ReportandOrderFCC22-84,andclause §2.911. Applicant: CompanyName:ShenzhenHi-LinkElectronicco.,Ltd. ProductDescription:BluetoothModule FRN:0024259467 GranteeCode:2AD56 FCCID:2AD56-HLK-B40 ContactName:JackyGong Address:1705,1706,1709A,BuildingE,XingheWORLD,MinleCommunity,MinzhiStreet, LonghuaDistrict,ShenzhenChina TelephoneNo:(86)755-23152658 E-mail:[email protected] TheApplicantisawareofandagreestocomplywiththerequirementsoutlinedintheFCC EquipmentAuthorizationProgram,ReportandOrderFCC22-84,andclause§2.911. ThisAgreementisvaliduntil(Permanentlyvalid). Date:2026/6/26 Applicant’sName: ShenzhenHi-LinkElectronicco.,Ltd. USAgentforServiceofProcess’sName: HOPEKCORPORATIONINC Title:ManagerTitle:Manager SignatureSignature

Rev 1/26/2023 Shenzhen Hi-Link Electronic co., Ltd. Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: June 12, 2026, 2026 Ref: Attestation Statements Part 2.911(d)(5)(i) Filing FCC ID: 2AD56-HLK-B40 [Shenzhen Hi-Link Electronic co., Ltd.] certifies that the equipment for which authorization is sought is not “covered” equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. [Shenzhen Hi-Link Electronic co., Ltd.] certifies that the equipment for which authorization is sought does not include cybersecurity or anti-virus software produced or provided by Kaspersky Lab, Inc. or any of its successors and assignees, including equipment with integrated Kaspersky Lab, Inc. (or any of its successors and assignees) cybersecurity or anti-virus software pursuant to DA-24-886 and KDB 986446 D01 Covered Equipment Guidance section B(2a). Device is inherently compliant based on hardware limitations or software controls. or A Software Bill of Materials (SBOM) is provided to the TCB for review, and The end-user or third parties cannot install additional software on this device. Sincerely, (Applicant signature) (Applicant printed name) Jacky Gong Rev 1/26/2023 Shenzhen Hi-Link Electronic co., Ltd. Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: June 12, 2026, 2026 Ref: Attestation Statements Part 2.911(d)(5)(ii) Filing FCC ID: 2AD56-HLK-B40 [Shenzhen Hi-Link Electronic co., Ltd.] certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List (as a specifically named entity or any of its subsidiaries or affiliates) as an entity producing “covered” equipment. Sincerely, (Applicant signature) (Applicant printed name) Jacky Gong

Shenzhen Hi-Link Electronic co., Ltd. Federal Communications Commission Equipment Authorization Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: June 30, 2026 Subject; Modular Transmitter Application Company name: Shenzhen Hi-Link Electronic co., Ltd. FCC ID: 2AD56-HLK-B40 Dear Sir/Madam, This letter includes the FCC application requirements for Modular Transmitter Approval Request for;- FCC KDB 996369 D01 ‘Module Certification Guide v02; and FCC KDB 996369 D03 OEM Manual v01 In accordance with 47CFR 15.212 Modular Transmitters and KDB 996369 D01 ‘Module Equip Auth Guide v02’. FCC ID: 2AD56-HLK-B40 has been examined against the following requirements. Requirement per 15.212 and KDB 996369 D01 Explanation from Grantee (do not write yes/no, but explain why product complies/how it is achieved) The radio elements must have the radio frequency circuitry shielded. Physical components and tuning capacitor(s) may be located external to the shield, but must be on the module assembly. The module is equipped with a metal RF shield cover over all radio frequency circuitry The module must have buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal. The FR8016HA GPIO ports are internally buffered, ensuring the module complies with Part 15 requirements under any input signal conditions. The module must contain power supply regulation on the module. The module integrates a dedicated voltage regulator (LDO) to provide stable power to the RF circuitry The module must contain a permanently attached antenna, or contain a unique antenna connector, and be marketed and operated only with specific antenna(s), per §§ 15.203, 15.204(b), 15.204(c), 15.212(a), 2.929(b). The module uses a permanently attached chip antenna. It will be marketed and operated only with this antenna The module must demonstrate compliance in a stand-alone configuration. The module was tested on a dedicated test board without any host product, and AC power was supplied via a standard power supply The module must be labeled with its permanently affixed FCC ID label, or use an electronic display (see KDB Publication 784748). The FCC ID is silkscreened on the module's PCB. The integration manual will instruct host manufacturers to label the final product with “Contains FCC ID: 2AD56-HLK-B40” if the module's ID is not visible. The module must comply with all specific rules applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. The module complies with all applicable rules under FCC Part 15 Subpart C. The user manual contains instructions to maintain compliance The module must comply with RF exposure requirements The module complies with RF exposure requirements for mobile devices (20cm separation distance). The RF exposure report is provided Integration Instructions for host product manufacturers The following items are submitted in support of application for Modular Transmitter FCC ID as noted above as required by the FCC KDB 996369 D03 OEM Manual v01. These items are provided as integration instructions for host product manufacturers (e.g., OEM instruction manual) to use when integrating a module in a host product. Any requirements that are not applicable to the Module are as indicated below. Summary of requirements and Checklist. Refer to the KDB for description of the complete requirements; KDB Ref Sect Requirements of KDB 996369 D03 User Manual Page Number reference 2.2 List of applicable FCC rules P21~P22 2.3 Summarize the specific operational use conditions P21~P22 2.4 Limited module procedures P21~P22 2.5 Trace antenna designs P21~P22 2.6 RF exposure considerations P21~P22 2.7 Antennas P21~P22 2.8 Label and compliance information P21~P22 2.9 Information on test modes and additional testing requirements P21~P22 2.10 Additional testing, Part 15 Subpart B disclaimer P21~P22 Name: Jacky Gong Date: June 30, 2026 Title: Manager Signature of applicant:

Shenzhen Hi-Link Electronic co., Ltd. Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 USA Date: June 26, 2026 Subject; Request for Confidentiality FCC ID: 2AD56-HLK-B40 To Whom It May Concern, Pursuant to the provisions of the Commission’s rules Title 47 Sections §0.457 and §0.459, we are requesting the Commission to withhold the following attachment(s) as confidential documents from public disclosure indefinitely. These documents contain detailed system and equipment descriptions and are considered as proprietary information in operation of the equipment. The public disclosure of these documents might be harmful to our company and would give competitors an unfair advantage in the market. Schematic Diagram Block Diagram Parts List Operational Description Tune-up Procedure Software Security Requirements for UNII devices In additional to above mentioned documents, in order to comply with the marketing regulations in Title 47 CFR §2.803 and the importation rules in Title 47 CFR §2.1204, while ensuring that business sensitive information remains confidential until the actual marketing of newly authorized devices, we request Short Term Confidentiality of the following attachment(s); External Photos Test Setup Photos Internal Photos User Manual For 45 days, pursuant to Public Notice DA 04-1705. OR For 180 days pursuant to KDB 726920 D01. It is our understanding that all measurement test reports, FCC ID label format and correspondence during the certification review process cannot be granted as confidential documents and this information will be available for public review once the grant of equipment authorization is issued. Sincerely, Signature: Name: Jacky Gong Title: Manager

Effective Date: April 2, 2020 QSF 7.6.4-8 – Agent Authorization Letter Template Page 1 of 1 Revision Date: Revision: 0 Shenzhen Hi-Link Electronic co., Ltd. Date: June 12, 2026 Product Model Number: HLK-B40 FCC ID: 2AD56-HLK-B40 To whom it may concern, Re: Product Certification Representative Authorization Letter We authorize QAI Laboratories Ltd. 3980 North Fraser Way, Burnaby B.C. Canada V5J 5K5 to act on our behalf on all matters concerning the above named equipment. This shall include the following:  Testing  Approval applications and procedures We declare that QAI Laboratories Ltd. is allowed to forward all information related to the approval project to the applied certification body and to the notification entities and to discuss any issues concerning the approval application. Any and all acts carried out by QAI Laboratories Ltd. on our behalf shall have the same effect as acts of our own. By: Contact Listed on FCC Wesbite Title: Manager Email: [email protected] Telephone: (86) 755-23152658 On behalf of: Shenzhen Hi-Link Electronic co., Ltd.

Ext Photos Model: HLK-B40 Photo 1 Photo 2 Photo 3 Photo 4 Photo 5 Photo 6

length：2cm width：2cm

Int Photos Model: HLK-B40 Photo 1 Photo 2 ANT

- Page 1 of 9 - Report No.: HB20260609001E-02 Add:Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen,China Tel: (86-755) 29989321 Fax: (86-755) 29985110 Web:www.sz-hongbiao.com RF EXPOSURE Test Report Product: Bluetooth Module Trade Mark: Model Number: HLK-B40 FCC ID: 2AD56-HLK-B40 Prepared for Shenzhen Hi-Link Electronic co., Ltd. 1705, 1706, 1709A, Building E, Xinghe WORLD, Minle Community, Minzhi Street, Longhua District, Shenzhen China Prepared by Shenzhen HongBiao Certification& Testing Co., Ltd Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen, China Tel.: +86-755-2998 9321 Fax.: +86-755-2998 5110 Website: http://www.sz-hongbiao.com - Page 2 of 9 - Report No.: HB20260609001E-02 Add:Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen,China Tel: (86-755) 29989321 Fax: (86-755) 29985110 Web:www.sz-hongbiao.com Table of Contents 1 GENERAL DESCRIPTION ..................................................................................................................................... 5 1.1 DESCRIPTION OF EUT ................................................................................................................................................ 5 1.2 TEST MODE .............................................................................................................................................................. 5 1.3 TEST SETUP .............................................................................................................................................................. 5 1.4 ANCILLARY EQUIPMENT .............................................................................................................................................. 5 2 TEST FACILITIES AND ACCREDITATIONS .............................................................................................................. 6 2.1 TEST LABORATORY ..................................................................................................................................................... 6 2.2 ENVIRONMENTAL CONDITIONS ..................................................................................................................................... 6 2.3 MEASUREMENT UNCERTAINTY ..................................................................................................................................... 6 2.4 TEST SOFTWARE ........................................................................................................................................................ 6 3 LIST OF TEST EQUIPMENT .................................................................................................................................. 7 4 RF EXPOSURE..................................................................................................................................................... 8 4.1 STANDALONE SAR TEST EXCLUSION CONSIDERATIONS........................................................................................................ 8 4.1.1. Limit ............................................................................................................................................................ 8 4.1.2. Test Result ................................................................................................................................................... 8 - Page 3 of 9 - Report No.: HB20260609001E-02 Add:Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen,China Tel: (86-755) 29989321 Fax: (86-755) 29985110 Web:www.sz-hongbiao.com TEST RESULT CERTIFICATION Applicant’s Name ................. : Shenzhen Hi-Link Electronic co., Ltd. Address ................................. : 1705, 1706, 1709A, Building E, Xinghe WORLD, Minle Community, Minzhi Street, Longhua District, Shenzhen China Manufacturer's Name .......... : Shenzhen Hi-Link Electronic co., Ltd. Address ................................. : 1705, 1706, 1709A, Building E, Xinghe WORLD, Minle Community, Minzhi Street, Longhua District, Shenzhen China Product description Product name ........................ : Bluetooth Module Model Number ....................... : HLK-B40 Standards ............................. : FCC CFR 47 PART 1 , 1.1310 Test procedure ....................... : KDB 447498 D01 General RF Exposure Guidance v06 This device described above has been tested by Shenzhen HongBiao Certification& Testing Co., Ltd and the test results show that the equipment under test (EUT) is in compliance with the EMC requirements. And it is applicable only to the tested sample identified in the report. Date of Test ........................................... : Date (s) of performance of tests ............. : June 09, 2026~June 12, 2026 Test Result .............................................. : Pass Testing Engineer : ( Z o e Su) Technical Manager : (M i n g L i u) Authorized Signatory : (L e o S u) - Page 4 of 9 - Report No.: HB20260609001E-02 Add:Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen,China Tel: (86-755) 29989321 Fax: (86-755) 29985110 Web:www.sz-hongbiao.com Revision History Revised No. Date of Issue Description 01 June 12, 2026 Original - Page 5 of 9 - Report No.: HB20260609001E-02 Add:Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen,China Tel: (86-755) 29989321 Fax: (86-755) 29985110 Web:www.sz-hongbiao.com 1 General Description 1.1 Description of EUT Product name: Bluetooth Module Model name: HLK-B40 Series Model: N/A Different of series model: N/A Operation frequency: 2402-2480MHz Modul…

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承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： WAN2012F245C0X 規格 DESCRIPTION ： Chip Antenna 2012 L Ant 2.45G Type 02,04,06 版本 VERSION ： V2.2 日期 ISSUE DATE ： 2017/02/23 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray James Thor 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112台北市北投區中央南路二段36號3樓 2F., No.163, Sec. 1, Xi'an St., Beitou Dist., Taipei City 112, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 2/11 ONEWAVE TECHNOLOGY CO., LTD. 2012 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 2.05 ± 0.20 W 1.23 ± 0.20 T 0.45 ± 0.20 P/N: WAN2012F245C02 WAN2012F245C04 WAN2012F245C06 3/11 ONEWAVE TECHNOLOGY CO., LTD. Part Number Information WAN 2012 F 245 C 0X A B C D E F A Product Series Antenna B Dimension L x W 2.05X1.23mm ( ± 0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode PIFA & Single Feeding F Antenna type 0X=02,04,06 / Type=02,04,06 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN2012F245C02 WAN2012F245C04 WAN2012F245C06 Central Frequency 2450 MHz Bandwidth 85 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 2.72 dBi Impedance 50 Ohm Operating Temperature -40～+85 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Ni / Au (Leadless) 4/11 ONEWAVE TECHNOLOGY CO., LTD. 2. Recommended PCB Pattern Evaluation Board Dimension (board size 80x40mm) 2 nd Evaluation Board Dimension Evaluation Board Dimension (board size 80x40mm) Suggested Matching Circuit 1.0pF 5/11 ONEWAVE TECHNOLOGY CO., LTD. Layout Dimensions in Clearance area( Size=3.0*5.0mm) FootPrint (Unit : mm)  2 nd Layout Dimensions in Clearance area( Size=8.0*2.5mm) Matching circuit Tuning Component Matching circuit Tuning Component 6/11 ONEWAVE TECHNOLOGY CO., LTD. 3. Measurement Results Return Loss 7/11 ONEWAVE TECHNOLOGY CO., LTD. Radiation Pattern Efficiency Peak Gain Directivity 2450MHz 84.56 % 2.72dBi 5.26 dBi Chamber Coordinate System Z X Y 8/11 ONEWAVE TECHNOLOGY CO., LTD. 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10 ± 0.5 sec. 60 sec . . T E M P ( °C ) 150 °C 2 6 0 °C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +85±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +85°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 85±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C 9/11 ONEWAVE TECHNOLOGY CO., LTD. 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 10/11 ONEWAVE TECHNOLOGY CO., LTD. 6.Packaging Information Tape Specification: Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 13.5±0.5 178±2 3000 11/11 ONEWAVE TECHNOLOGY CO., LTD. 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity…

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- Page 1 of 49 - Report No.: HB20260609001E-01 Add:Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen,China Tel: (86-755) 29989321 Fax: (86-755) 29985110 Web:www.sz-hongbiao.com Test Report Product: Bluetooth Module Trade Mark: Model Number: HLK-B40 FCC ID: 2AD56-HLK-B40 Prepared for Shenzhen Hi-Link Electronic co., Ltd. 1705, 1706, 1709A, Building E, Xinghe WORLD, Minle Community, Minzhi Street, Longhua District, Shenzhen China Prepared by Shenzhen HongBiao Certification& Testing Co., Ltd Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen, China Tel.: +86-755-2998 9321 Fax.: +86-755-2998 5110 Website: http://www.sz-hongbiao.com - Page 2 of 49 - Report No.: HB20260609001E-01 Add:Room 102, 201, Building 2, Yuanwanggu RFID Industrial Park, Tongguan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen,China Tel: (86-755) 29989321 Fax: (86-755) 29985110 Web:www.sz-hongbiao.com Table of Contents 1 GENERAL DESCRIPTION ..................................................................................................................................... 6 1.1 DESCRIPTION OF EUT ................................................................................................................................................ 6 1.2 TEST MODE .............................................................................................................................................................. 6 1.3 OPERATION CHANNEL LIST ........................................................................................................................................... 6 1.4 T…

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