2AIIF-12303PGPureBoom Mic Duo

SuperiorCommunicationsDBAPureGear CoveredEquipmentCertificationAttestationLetter 05/15/2026 FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA ATTN.:ReviewingEngineer FCCID:2AIIF-12303PG SuperiorCommunicationsDBAPureGear(“theapplicant”)certifiesthattheequipmentfor whichauthorizationissoughtisnot“covered”equipmentprohibitedfromreceivingan equipmentauthorizationpursuanttosection2.903oftheFCCrules. Note:Iftheequipmentforwhichtheapplicantseeksauthorizationisproducedby anyoftheentitiesidentifiedonthecurrentCoveredList,theapplicantshould includeanexplanationonwhytheequipmentisnot“covered”equipment. SuperiorCommunicationsDBAPureGear(“theapplicant”)certifiesthat,asofthedateofthe filingoftheapplication,theapplicantisnotidentifiedontheCoveredList(asa specificallynamedentityoranyofitssubsidiariesoraffiliates)asanentityproducing “covered”equipment. SuperiorCommunicationsDBAPureGear (“theapplicant”)certifiesthattheequipmentfor whichauthorizationissoughtdoesnotincludecybersecurityoranti-virussoftware producedorprovidedbyKasperskyLab,Inc.oranyofitssuccessorsandassignees, includingequipmentwithintegratedKasperskyLab,Inc.(oranyofitssuccessorsand assignees)cybersecurityoranti-virussoftwarepursuanttoDA-24-886andKDB986446 D01CoveredEquipmentGuidancesectionB(2a). Signed: Printedname:ArthurChen Title:VicePresidentofInternationalOperations-Sales CompanyName:SuperiorCommunicationsDBAPureGear Date:05/15/2026

SuperiorCommunicationsDBAPureGear * theapplicantmustdesignateacontactlocatedintheUnitedStatesforpurposesofactingasthe applicant’sagentforserviceofprocess,regardlessofwhethertheapplicantisadomesticorforeign entity.AnapplicantlocatedintheUnitedStatesmaydesignateitselfastheagentforserviceofprocess. U.S.AgentDesignationforServiceofProcess- CertificationAttestationLetter 05/15/2026 TO:FederalCommunicationsCommission 7435OaklandMillsRoad Columbia,MD21046 ATTN.:ReviewingEngineer FCCID:2AIIF-12303PG FRNofapplicant:0025605841 Persection2.911(d)(7)oftheFCCrules,[SuperiorCommunicationsDBAPureGear](“the applicant”)certifiesthattheequipmentforwhichauthorizationissoughtisdesignatedtothe followingU.S.agent*forserviceofprocess: CompanyName:SuperiorCommunicationsDBAPureGear FCCRegistrationNumber(FRN):0025605841 PhysicalU.S.CompanyAddress:5027IrwindaleAvenueSuite900,Irwindale,California,91706, UnitedStates ContactPerson:ArthurChen AgentEmailAddress:[email protected] Theabovecontactpersonacceptstheobligationforserviceofprocess. Theapplicantacceptstomaintainanagentfornolessthanoneyearafterthegranteehas terminatedallmarketingandimportationortheconclusionofanyCommission-related proceedinginvolvingtheequipment. ApplicantSigned:AgentSigned(ifdifferentfromApplicant): Signed: Printedname:ArthurChen Title:VicePresidentofInternationalOperations- Sales CompanyName:SuperiorCommunications DBAPureGear Date:05/15/2026 Signed: Printedname:ArthurChen Title:VicePresidentofInternationalOperations- Sales CompanyName:SuperiorCommunications DBAPureGear Date:05/15/2026

DATE:05/15/2026 FederalCommunicationsCommission Authorization&EvaluationDivision 7345OaklandMillsRoad Columbia,Maryland21046 AuthoritytoActasAgent Onourbehalf,IappointShenzhenEUTestingLaboratoryLimited (101,BuildingB1,FuqiaoFourthArea,QiaotouCommunityFuhaiSubdistrictBaoan District,Shenzhen,China)(NameofAgentcompanynameandaddress)toactasour agentinthepreparationofthisapplicationforequipmentcertification.Icertifythat submitteddocumentsproperlydescribethedeviceorsystemforwhichequipment certificationissought.Ialsocertifythateachunitmanufactured,importedormarketed,as definedintheFederalCommunicationsCommission’sregulationswillhaveaffixedtoita labelidenticaltothatsubmittedforapprovalwiththisapplication. Forinstanceswhereourauthorizedagentsignstheapplicationforcertificationonour behalf,Iacknowledgethatallresponsibilityforcomplyingwiththetermsandconditions forcertification,stillresideswithSuperiorCommunicationsDBAPureGear(5027 IrwindaleAvenueSuite900,Irwindale,California,91706,UnitedStates) (ApplicantNameandaddress) Signed: Printedname:ArthurChen Title:VicePresidentofInternationalOperations-Sales CompanyName:SuperiorCommunicationsDBAPureGear Date:05/15/2026

Date05/15/2026 FederalCommunicationsCommission Authorization&EvaluationDivision 7345OaklandMillsRoad Columbia,Maryland21046 RE:LETTEROFAGENTAUTHORIZATION ToWhomItMayConcern: We,theundersigned,herebyauthorizeComplianceTesting,LLCtoactonourbehalfinallmatters relatingtoapplicationforequipmentauthorization,includingthesigningofalldocumentsrelatingto thesematters. Wealsoherebycertifythatnopartytotheapplicationauthorizedhereunderissubjecttothedenialof benefits,includingFCCbenefits,pursuanttoSection5301oftheAnti-DrugAbuseActof1988,21 U.S.C.853(a). Sincerely, Signed: Printedname:ArthurChen Title:VicePresidentofInternationalOperations-Sales CompanyName:SuperiorCommunicationsDBAPureGear Date:05/15/2026

DATE05/15/2026 EquipmentAutorisationDivision FederalCommunicationsCommission 7435OaklandMillsRoad Columbia,MD21046 FCCID:___2AIIF-12303PG______ ProductName:___PureBoomMicDuo___ RequestforConfidentiality PursuanttoSections0.457and0.459ofthecommission’srules,weherebyrequestthat thefollowingdocumentsbeheldconfidential: (Listherethedocumentsforwhichyouareseekingconfidentiality–forexample...)  Schematics Blockdiagram Operationdescription Thesematerialscontaintradesecretsandproprietaryinformationandarenot customarilyreleasedtothepublic.Thepublicdisclosureofthisinformationmightbe harmfultothecompanyandprovideunjustifiedbenefitstoourcompetitors. Signed: Printedname:ArthurChen Title:VicePresidentofInternationalOperations-Sales CompanyName:SuperiorCommunicationsDBAPureGear Date:05/15/2026

DATE:05/15/2026 EquipmentAutorisationDivision FederalCommunicationsCommission 7435OaklandMillsRoad Columbia,MD21046 FCCID:2AIIF-12303PG ProductName:PureBoomMicDuo RequestforShort-TermConfidentiality PursuanttoSections0.457and0.459ofthecommissionrules,andinaccordancewiththeFCCPublicnotice datedJune15,2004(DA04-1705),weherebyrequestshort-termconfidentialityforthefollowingitemspriorto marketingthedevice.: TestSetupPhotos ExternalPhotos InternalPhotos UserManual Theapplicantrequeststheexhibitsselectedaboveasshorttermconfidentialbewithheldfrompublicview foraperiodof180daysfromthedateoftheGrantofEquipmentAuthorizationandpriortomarketing.This istoavoidprematurereleaseofsensitiveinformationpriortomarketingorreleaseoftheproducttothe public. Signed: Printedname:ArthurChen Title:VicePresidentofInternationalOperations-Sales CompanyName:SuperiorCommunicationsDBAPureGear Date:05/15/2026

SuperiorCommunicationsDBAPureGear DeclarationonModelDifferences We, SuperiorCommunicationsDBAPureGear 5027IrwindaleAvenueSuite900,Irwindale,California,91706,UnitedStates Declarethatthefollowingproduct(s): ProductName:PureBoomMicDuo ModelNo.:12303PG,67077PG FCCID:2AIIF-12303PG Allmodelsaresamewithelectricalparametersandinternalcircuitstructure,butonlydifferin appearancecolorandmodelname.Therefore,the(12303PG)modelwillbetheprimarytest model. Themanufacturerwouldtakealltheresponsibilitiesfortheaboveproduct(s). Forandonbehalfof California,91706,UnitedStates AuthorizedpersonLocation Name:ArthurChen Position:VicePresidentofInternationalOperations-Sales Dateofissue:2026-05-15 *IherebydeclarethatIamentitledtosignonbehalfoftheapplicantandthattheinformationsuppliediscorrectandcomplete.

RFEXPOSUREEVALUATION FCCID:2AIIF-12303PG AccordingtoFCC1.1310:Thecriterialistedinthefollowingtableshallbeused toevaluatetheenvironmentimpactofhumanexposuretoradiofrequency(RF) RadiationasspecifiedinKDB447498D01: RoutineSARevaluationreferstothatspecificallyrequiredby§2.1093,using measurementsorcomputersimulation.WhenroutineSARevaluationisnot required,portabletransmitterswithoutputpowergreaterthantheapplicable lowthresholdrequireSARevaluationtoqualifyforTCBapproval. 2.4G: Channel (MHz) Maximum outputpower (dBm) Tuneup tolerance (dBm) MaxTune UpPower (dBm) Distance (mm) Calculation results Limit Operating Mode 2402-1.01-1.01±1-0.0150.3093 2.4G2440-0.01-0.01±10.9950.3923 24800.320.32±11.3250.4273 TestResults:PASS.

TESTREPORT ReportNo.:8430EU012302W Applicant:SuperiorCommunicationsDBA PureGear Address:5027lrwindaleAvenueSuite900, lrwindale,California, 91706,UnitedStates ProductName:PureBoomMic Duo ModelNo.:12303PG(referto clause2.4) Trademark:pureboom FCC ID:2AIIF-12303PG Test Standard(s):47 CFRPart 15.247 Test Result:Pass Dateof Receipt:Apr. 23, 2026 Test Date:Apr. 23, 2026- May 08, 2026 Dateof Issue:May 12 , 2026 ISSUEDBY: SHENZHENEU TESTINGLABORATORYLIMITED Preparedby:Reviewedand Approvedby: LandonQiu/ EngineerSallyZhang/Manager Page2 of 56ReportNo.: 8430EU012302W TRF Version:A01 RevisionRecord ReportVersionIssuedDateDescriptionStatus V0May 12 , 2026OriginalValid Page3 of 56ReportNo.: 8430EU012302W TRF Version:A01 Tableof Contents 1COVERPAGE...................................................................................................................................................1 2GENERALINFORMATION........................................................................................................................5 2.1APPLICANTINFORMATION...................................................................................................................5 2.2MANUFACTURERINFORMATION...........................................................................................................5 2.3FACTORYINFORMATION......................................................................................................................5 2.4GENERALDESCRIPTIONOFE.U.T......................................................................................................5 2.5TECHNICALINFORMATIONOFE.U.T....................................................................................................6 3TESTSUMMARY.......................................................................................................................................7 3.1TESTSTANDARD................................................................................................................................7 3.2TESTVERDICT...................................................................................................................................7 3.3TESTLABORATORY............................................................................................................................8 4TESTCONFIGURATION...........................................................................................................................9 4.1TESTENVIRONMENT...........................................................................................................................9 4.2TESTEQUIPMENT...............................................................................................................................9 4.3DESCRIPTIONOFSUPPORTUNIT......................................................................................................11 4.4TESTMODE.....................................................................................................................................11 4.5DESCRIPTIONOFCALCULATION........................................................................................................11 4.5.1FieldStrengthCalculation..................................................................................................11 4.5.2DisturbanceCalculation.....................................................................................................11 4.6MEASUREMENTUNCERTAINTY..........................................................................................................12 4.7DEVIATIONFROMSTANDARDS..........................................................................................................12 4.8ABNORMALITIESFROMSTANDARDCONDITION..................................................................................12 5EVALUATIONRESULTS(EVALUATION)..............................................................................................13 5.1ANTENNAREQUIREMENT..................................................................................................................13 5.1.1Test Specification...............................................................................................................13 5.1.2Test Data ............................................................................................................................13 6RADIOSPECTRUMMATTERTESTRESULTS(RF) ............................................................................14 6.1CONDUCTEDEMISSIONATACPOWERLINE......................................................................................14 6.1.1Test Specification...............................................................................................................14 6.1.2E.U.T.Operation.................................................................................................................14 6.1.3Test SetupDiagram...........................................................................................................14 6.1.4Test Data ............................................................................................................................14 6.26DB BANDWIDTH.............................................................................................................................17 6.2.1Test Specification...............................................................................................................17 6.2.2E.U.T.Operation.................................................................................................................17 6.2.3Test SetupDiagram...........................................................................................................18 6.2.4Test Data ............................................................................................................................18 6.3MAXIMUMCONDUCTEDOUTPUTPOWER...........................................................................................19 6.3.1Test Specification..........................................…

Text truncated - open the document above for the full version.

承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： WAN3216F245H08 規格 DESCRIPTION ： Chip Antenna 3216 L Ant 2.45G Type H08 版本 VERSION ： V1.1 日期 ISSUE DATE ： 2020/02/27 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray Tennyson Snow 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 11261台北市北投區立功街151號1樓 1F, No. 151, Li Gong Street, Beitou District, Taipei City 11261, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 2/11 ONEWAVE TECHNOLOGY CO., LTD. 3216 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 3.23 ± 0.20 W 1.66 ± 0.20 T 0.45 ± 0.20 P/N: WAN3216F245H08 3/11 ONEWAVE TECHNOLOGY CO., LTD. Part Number Information WAN 3216 F 245 H 08 A B C D E F A Product Series Antenna B Dimension L x W 3.2 x 1.6mm (±0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode PIFA & Single Feeding F Antenna type Type = 08 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN3216F245H08 Central Frequency 2450 MHz Bandwidth 120 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 3.3dBi Impedance 50 Ohm Operating Temperature -40～+110 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Ni / Au (Leadless) 4/11 ONEWAVE TECHNOLOGY CO., LTD. 2. Recommended PCB Pattern Evaluation Board Dimension 2 nd Evaluation Board Dimension Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感±0.1~0.3nH、電容±0.1pF 5/11 ONEWAVE TECHNOLOGY CO., LTD. Layout Dimensions in Clearance area( Size=5.9*5.0mm) FootPrint (Unit : mm) ◆ 2 nd Layout Dimensions in Clearance area( Size=8.0*3.0mm) Matching Circuit 50 ohm transmission Line 6/11 ONEWAVE TECHNOLOGY CO., LTD. 3.Measurement Results Return Loss 7/11 ONEWAVE TECHNOLOGY CO., LTD. Radiation Pattern Efficiency Peak Gain 2400MHz 55.21% 3.1 dBi 2450MHz 66.45% 3.3 dBi 2500MHz 57.53% 3.5 dBi Chamber Coordinate System X Y Z 8/11 ONEWAVE TECHNOLOGY CO., LTD. 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10 ± 0.5 sec. 60 sec . . T E M P ( °C ) 150 °C 2 6 0 °C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C 9/11 ONEWAVE TECHNOLOGY CO., LTD. 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 10/11 ONEWAVE TECHNOLOGY CO., LTD. 6.Packaging Information Tape Specification: Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 13.5±0.5 178±2 3000 11/11 ONEWAVE TECHNOLOGY CO., LTD. 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: -10~ 40°C and 30~70% RH. 2. Recommended products should be used within 6 months from the time of de…

Text truncated - open the document above for the full version.