2AIXN-BS508JDTWS Bluetooth Headset

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

GUANGZHOU U&I TECHNOLOGY COMPANY LIMITED 4th Floor,15th Building,Vtrek Innovation Industrial Park,No.644 Shibei Road,Panyu District, Guangzhou, China Mar.16, 2023 Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 USA Subject: Explanation of differences between product types FCC ID : 2AIXN-BS508JD Model Number: BS508JD, E10, E10pro, E10plus, BS508J2A, BS508J2C, BS508JD-1, BS508JD-2, BS508JD-3, BS508JD-4, BS508JD-5, BS508JD-6, BS508JD-7, BS508JD-8, BS508JD-9 To Whom It May Concern: We, The GUANGZHOU U&I TECHNOLOGY COMPANY LIMITED hereby declare that the models are identical except the model name and color. Except for the different above, no other modification is performed. Sincerely, Signature: Contact person: Paul He

GUANGZHOU U&I TECHNOLOGY COMPANY LIMITED Agent Authorization Company: GUANGZHOU U&I TECHNOLOGY COMPANY LIMITED Address: 4th Floor,15th Building,Vtrek Innovation Industrial Park,No.644 Shibei Road,Panyu District, Guangzhou, China Product Name: TWS Bluetooth Headset Model Number(s): BS508JD, E10, E10pro, E10plus, BS508J2A, BS508J2C, BS508JD-1, BS508JD-2, BS508JD-3, BS508JD-4, BS508JD-5, BS508JD-6, BS508JD-7, BS508JD-8, BS508JD-9 Product Description: TWS Bluetooth Headset We authorize MiCOM Labs Inc., 575 Boulder Court, Pleasanton, California 94566, USA, to act on our behalf on all matters concerning the certification of above named equipment. We declare that MiCOM Labs Inc. is allowed to forward all information related to the approval and certification of equipment to the regulatory agencies as required and to discuss any issues concerning the approval application. Any and all acts carried out by MiCOM Labs on our behalf shall have the same effect as acts of our own. Signature: Date: 2023-03-16 Name: Paul He Company: GUANGZHOU U&I TECHNOLOGY COMPANY LIMITED

Report No.: AGC01082230202AP03 Page 1 of 5 EXTERNAL PHOTOS WHOLE VIEW OF EUT TOP VIEW OF EUT Report No.: AGC01082230202AP03 Page 2 of 5 BOTTOM VIEW OF EUT FRONT VIEW OF EUT Report No.: AGC01082230202AP03 Page 3 of 5 BACK VIEW OF EUT LEFT VIEW OF EUT Report No.: AGC01082230202AP03 Page 4 of 5 RIGHT VIEW OF EUT Left VIEW OF EUT(PORT) Report No.: AGC01082230202AP03 Page 5 of 5 Right VIEW OF EUT(PORT) ****************************************End of Report*************************************

FCC ID Label Location The product does not have enough space to place the label, and FCC ID label is reflected in the user manual and package, as below:

Report No.: AGC01082230202AP03 Page 1 of 5 INTERNAL PHOTOS Left - OPEN VIEW OF EUT VIEW OF BATTERY Report No.: AGC01082230202AP03 Page 2 of 5 INTERNAL VIEW OF EUT (FIGURE 1) INTERNAL VIEW OF EUT (FIGURE 2) BT Antenna Report No.: AGC01082230202AP03 Page 3 of 5 INTERNAL VIEW OF EUT (FIGURE 3) Right - OPEN VIEW OF EUT Report No.: AGC01082230202AP03 Page 4 of 5 VIEW OF BATTERY INTERNAL VIEW OF EUT (FIGURE 1) BT Antenna Report No.: AGC01082230202AP03 Page 5 of 5 INTERNAL VIEW OF EUT (FIGURE 2) INTERNAL VIEW OF EUT (FIGURE 3) ****************************************End of Report*************************************

RF EXPOSURE EVALUATION 1. PRODUCT INFORMATION Product Description TWS Bluetooth Headset Test Model BS508JD Series Model E10, E10pro, E10plus, BS508J2A, BS508J2C, BS508JD-1, BS508JD-2, BS508JD-3, BS508JD-4, BS508JD-5, BS508JD-6, BS508JD-7, BS508JD-8, BS508JD-9 FCC ID 2AIXN-BS508JD 2. EVALUATION METHOD According to 447498 D01 General RF Exposure Guidance v06 The 1-g and 10-g SAR test exclusion thresholds for 100 MHz to 6 GHz at test separation distances ≤ 50 mm are determined by: [(max. power of channel, including tune-up tolerance, mW)/(min. test separation distance, mm)] ·[√f(GHz)] ≤ 3.0 for 1-g SAR and ≤ 7.5 for 10-g extremity SAR. Where f(GHz) is the RF channel transmit frequency in GHz Power and distance are rounded to the nearest mW and mm before calculation 3. CALCULATION BR&EDR: P t =1.584dBm=1.44mW The value of the Maximum output power P t is referred to the test report of the CFR47 §15.247. The result for RF exposure evaluation SAR=(1.44mW / 5mm).[√2.480GHz)]=0.452<3.0 for 1-g SAR and ≤ 7.5 for 10-g extremity SAR. 4. CONCLUSION The SAR evaluation is not required.

SymbolsLWTA Dimensions1.60±0.200.80±0.200.80±0.200.30±0.10 NumberTerminal Name ① INPUT ② NC Dimensions（Unit：mm） L w ①② T ( Side View ) ( Bottom View ) ( Top View ) A Features 1.Surface Mounted Devices with a small dimension of 1.6 x 0.8 x 0.8 mm meet future miniaturization trend. 2,Embedded and LTCC (low temperature co-fired ceramic) technology is able to integrate with system design as well as beatifying the housing of final product. 3.High stability and low tolerance. Applications 1.Bluetooth 2.Wireless LAN 3.ISM band 2.4GHz wireless applications www.surbaner.com.cn SBR Communication has possession of proprietary information provided in this report and this proprietary information shall be kept in strict confidence and not disclosed to any person or firm without the prior written consent of SBR Communication Technology. . Page 1 P/N: SURL160808 SRF08 Evaluation Board and Matching Circuits www.surbaner.com.cn SBR Communication has possession of proprietary information provided in this report and this proprietary information shall be kept in strict confidence and not disclosed to any person or firm without the prior written consent of SBR Communication Technology. . Page 2 P/N: SURL160808 SRF08 Electrical Characteristics Characteristic curve www.surbaner.com.cn SBR Communication has possession of proprietary information provided in this report and this proprietary information shall be kept in strict confidence and not disclosed to any person or firm without the prior written consent of SBR Communication Technology. . Page 3 FeatureSpecification 1 Central frequency2450MHz 2 Bandwidth>100MHz 3 Peak gain3.4dBi 4 VSWR<2 5 PolarizationLinear 6 Azimuth beamwidthOmnidirectional 7 Impedance50 Ω P/N: SURL160808 SRF08 Radiation Pattern coordinates： Y-Z Plane X-Z Plane www.surbaner.com.cn SBR Communication has possession of proprietary information provided in this report and this proprietary information shall be kept in strict confidence and not disclosed to any person or firm without the prior written consent of SBR Communication Technology. . Page 4 P/N: SURL160808 SRF08 3D Radiation Pattern www.surbaner.com.cn SBR Communication has possession of proprietary information provided in this report and this proprietary information shall be kept in strict confidence and not disclosed to any person or firm without the prior written consent of SBR Communication Technology. . Page 5 X-Y Plane Frequency 2400MHz2450MHz2500MHz Avg. gain-1.14-0.85-1.30 Peak gain23.42.5 Efficiency77%82%78% P/N: SURL160808 SRF08 Moisture Proof Temperature：40±2°C Humidity：90~95%RH Duration：500h Recovery conditions：Room temperature Recovery Time：24h (Class1) or 48h (Class2) Sol derabi li ty At least 95% of the terminal electrode is covered by new solder.Preheating conditions:80 to 120°C; 10~30s. SolderTe m p e r at u r e :2 3 5 ± 5°C Duration:2 ±0.5s , SolderTempe r atu re:24 5±5°C Du rat ion:2±0.5s Optimum Solder Amount for Reflow Soldering www.surbaner.com.cn SBR Communication has possession of proprietary information provided in this report and this proprietary information shall be kept in strict confidence and not disclosed to any person or firm without the prior written consent of SBR Communication Technology. . Page 6 Dependability Test Test Temperature: Operating Temperature Temperature Relative Humidity 25°C±3°C -25°C~+85°C 5~40°C 20~70% Too much solderCracks tend to occur due to large stress. Not enough solder Weak holding forcemay cause bad connection between the capacitor and PCB. Recommended Soldering amounts The optimal solder fillet amounts for re-flow soldering 天线厚度 以下 The optimal solder fillet amounts for wave soldering P/N: SURL160808 SRF08 Temperature Cycle Test 10±1S Applied Force: 5NDuration: 10±1S Preheating conditions: up-category temperature, 1h Recovery time: 24±1h Initial Measurement Cycling Times: 5 times, 1 cycle, 4 steps: www.surbaner.com.cn SBR Communication has possession of proprietary information provided in this report and this proprietary information shall be kept in strict confidence and not disclosed to any person or firm without the prior written consent of SBR Communication Technology. . Page 7 Resistanceto SolderingHeat Preheating80 to 120°C; 10~30s.SolderTemperature:235±5°C Duration:2±0.5s，SolderTemperature:245±5°C Duration:2±0.5s，Preheating100to200°C;10±2min. Solder Temperature: 265±5°C Duration: 10±1s Clean the capacitor with solvent and examine it with a 10X(min.) microscope. Recovery Time: 24±2h Recovery condition: Room temperature Resistance to Flexure of Substrate Test Board: Al 2 O 3 or PCBWarp: 1mm Speed: 0.5mm/sec. Unit: mm The measurement should be made with the board in the bending position. P/N: SURL160808 SRF08 www.surbaner.com.cn SBR Communication has possession of proprietary information provided in this report and this proprietary information shall be kept in strict confidence and not disclosed to any person or firm without the prior written consent of SBR Communication Technology. . Page 8 While in preheating,please keep the temperature difference between soldering temperature and surface temperature of chips as: T≤150°C. P/N: SURL160808 SRF08 Dimensions of paper taping for 0603types Reel（4000 pcs/Reel） Storage Period The guaranteed period for solderability is 6 months(Under deliver package condition).Temperature5~40°C /Relative Humidity20~70% www.surbaner.com.cn SBR Communication has possession of proprietary information provided in this report and this proprietary information shall be kept in strict confidence and not disclosed to any person or firm without the prior written consent of SBR Communication Technology. . Page 9 P/N: SURL160808 SRF08 Unit：mm

Page 1 of 56 FCC Test Report Report No.: AGC01082230202FE03 FCC ID : 2AIXN-BS508JD APPLICATION PURPOSE : Original Equipment PRODUCT DESIGNATION : TWS Bluetooth Headset BRAND NAME : N/A MODEL NAME : BS508JD, E10, E10pro, E10plus, BS508J2A, BS508J2C, BS508JD-1, BS508JD-2, BS508JD-3, BS508JD-4, BS508JD-5, BS508JD-6, BS508JD-7, BS508JD-8, BS508JD-9 APPLICANT : GuangZhou U&I Technology Company Limited DATE OF ISSUE : Mar. 07, 2023 STANDARD(S) : FCC Part 15.247 REPORT VERSION : V1.0 Attestation of Global Compliance (Shenzhen) Co., Ltd Report No.: AGC01082230202FE03 Page 2 of 56 REPORT REVISE RECORD Report Version Revise Time Issued Date Valid Version Notes V1.0 / Mar. 07, 2023 Valid Initial Release Report No.: AGC01082230202FE03 Page 3 of 56 TABLE OF CONTENTS 1. VERIFICATION OF CONFORMITY .................................................................................................................. 5 2. GENERAL INFORMATION .............................................................................................................................. 6 2.1. PRODUCT DESCRIPTION ........................................................................................................................ 6 2.2. TABLE OF CARRIER FREQUENCYS ....................................................................................................... 6 2.3. RECEIVER INPUT BANDWIDTH .............................................................................................................. 7 2.4. EXAMPLE OF A HOPPING SEQUENCY IN DATA MODE ......................................................................... 7 2.5. EQUALLY AVERAGE USE OF FREQUENCIES AND BEHAVIOUR ......................................................... 7 2.6. RELATED SUBMITTAL(S) / GRANT (S) .................................................................................................... 8 2.7. TEST METHODOLOGY ............................................................................................................................. 8 2.8. SPECIAL ACCESSORIES ......................................................................................................................... 8 2.9. EQUIPMENT MODIFICATIONS ................................................................................................................. 8 2.10. ANTENNA REQUIREMENT..................................................................................................................... 8 3. MEASUREMENT UNCERTAINTY ................................................................................................................... 9 4. DESCRIPTION OF TEST MODES ................................................................................................................. 10 5. SYSTEM TEST CONFIGURATION ................................................................................................................ 11 5.1. CONFIGURATION OF EUT SYSTEM ...................................................................................................... 11 5.2. EQUIPMENT USED IN TESTED SYSTEM .............................................................................................. 11 5.3. SUMMARY OF TEST RESULTS .............................................................................................................. 11 6. TEST FACILITY .............................................................................................................................................. 12 7. PEAK OUTPUT POWER ................................................................................................................................ 13 7.1. MEASUREMENT PROCEDURE ............................................................................................................. 13 7.2. TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) .................................................................... 13 7.3. LIMITS AND MEASUREMENT RESULT .................................................................................................. 14 8. 20DB BANDWIDTH ........................................................................................................................................ 18 8.1. MEASUREMENT PROCEDURE ............................................................................................................. 18 8.2. TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) .................................................................... 18 8.3. LIMITS AND MEASUREMENT RESULTS ............................................................................................... 19 9. CONDUCTED SPURIOUS EMISSION........................................................................................................... 23 9.1. MEASUREMENT PROCEDURE ............................................................................................................. 23 Report No.: AGC01082230202FE03 Page 4 of 56 9.2. TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) .................................................................... 23 9.3. MEASUREMENT EQUIPMENT USED .................................................................................................... 23 9.4. LIMITS AND MEASUREMENT RESULT .................................................................................................. 23 10. RADIATED EMISSION ................................................................................................................................. 37 10.1. MEASUREMENT PROCEDURE ........................................................................................................... 37 10.2. TEST SETUP ......................................................................................................................................... 39 10.3. LIMITS AND MEASUREMENT RESULT ............................................................................................... 40 10.4. TEST RESULT............................................................................................…

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Report No.: AGC01082230202AP02 Page 1 of 2 TEST SETUP PHOTOS RADIATED EMISSION TEST SETUP BELOW 1GHz RADIATED EMISSION TEST SETUP ABOVE 1GHz Report No.: AGC01082230202AP02 Page 2 of 2 RF CONDUCTED TEST SETUP ****************************************End of Report*************************************