2AJIV-SB1820Sound Blaster X5

X5 Quick Start Guide Quick Start Guide 快速入门指南 快速入門指南 使用产品前请阅读使用说明 Model No. / 型號 / 型号: SB1820 声霸卡(耳机放大器)/ 聲霸卡(耳機放大器) CONTENTS: OVERVIEW 1. Power Button (w/ LED) - Press to power ON / OFF 2. Bluetooth Button (w/ LED) - Long Press 2 sec to go into pairing mode - Press once to reconnect to last connected Bluetooth device - Press 5 Secs to reset 3. Display Button - Press to Toggle through different information on playback - Press for 2 second to cycle through brightness level. 4. LED Display (8 Digit 14 Segment) 5. Volume Knob (w/ LED) - When master volume is muted, either from desktop/ mobile or turning the knob physically, the knob LED will be Blinking White. 6. Microphone Mute Button (w/ LED) - Press to mute and unmute microphone 7. Microphone Gain Knob 8. Headphone Gain Switch - Toggles between normal or high gain mode 9. Headphone /Speaker Button - Press to toggle between headphone or speaker mode 10. Direct/DSP Button - Press to toggle between direct audio or DSP mode. 11. EQ Button - Press to cycle between EQ presets 12. PC/Console Switch - Toggle between PC and Console usage scenarios / setting 13. Microphone In Jack 14. Headphone Out (Unbalanced) Jack 15. Headphone Out (Balanced) Jack Note : - The headphone (balanced) output will always have higher priority than the headphone (unbalanced) output. Both of headphone outputs are mutually exclusive. Hence, if the headphone (balanced) jack is plugged in, the headphone (unbalanced) jack will be muted. If not, the audio will always output from the headphone (unbalanced) jack. Auto switch to HP output when HP Out jacks detected. 16. USB Host Audio Streaming Port - connects USB host audio, Example: Mobile Phone 17. USB Data/Power Port - For USB Audio and power 18. Optical In Port 19. Optical Out Port 20. Line In (Left) Port 21. Line In (Right) Port 22. Line Out (Left) Port 23. Line Out (Right) Port Note: BLE Connection For the first-time connection with the mobile app, the app initiates the connection. The Bluetooth button LED will start Fast Blinking Blue and user and single press to consent the BLE connection of the mobile app. If user cancels the connection, the Bluetooth button will revert back to the previous state. Master Reset Long Press both Bluetooth and Display button for 5secs to trigger master reset, or upon triggering Reset Device from the app, the LED display will show “RESET”. Software Download Personalize your audio experience with Sound Blaster X5 on the Creative app. Download the software and its user manual at creative.com/support/SBX5. Creative app PC Download the Creative app for your PC from creative.com/support/SBX5 to gain complete control of your audio experience with the Sound Blaster X5. iOS and Android Control your Sound Blaster X5 even while it’s connected to your console! Simply download the Creative app from Apple’s App Store or Google Play Store to start. With the Creative app, you can: • Access and control our all-new SmartComms Kit’s suite of smart communication features such as VoiceDetect, NoiseClean-in, and NoiseClean-out to improve your online communication experience • Personalize audio effects with Sound Blaster Acoustic Engine’s sound mode features such as Surround, Bass, Crystalizer, Smart Volume, and Dialog Plus • Experience professionally-tuned audio presets for movies, music, and games • Set up speakers and headphones’ configurations • Adjust playback and recording settings TECHNICAL SPECIFICATIONS Bluetooth Version: Bluetooth 5.0 Maximum RF Output Power: 4 dBm Operating RF range: 2402–2480 MHz Supported Bluetooth Profiles: A2DP (Wireless Stereo Bluetooth), AVRCP (Bluetooth Remote Control) Input: 5V 1A Max Operating Temperature:45°C Note: Compliance marking are located at the bottom of the product. OTHER INFORMATION Please visit creative.com/compliance/SBX5 for the user guide and safety and regulatory information. Please visit creative.com/support/ SBX5 for all other support related to your product. PRODUCT REGISTRATION Registering your product ensures you receive the most appropriate service and product support available. You can register your product at creative.com/register. Please note that your warranty rights are not dependent on registration. Warranty Warranty information is supplied with your product in a separate document. Please keep your Proof of Purchase for the duration of the Warranty period. Keep this document for future reference. © 2022 Creative Technology Ltd. All rights reserved. Creative and the Creative logo are trademarks or registered trademarks of Creative Technology Ltd in the United States and/or other countries. The Bluetooth ® word mark and logo are owned by the Bluetooth SIG, Inc. and any use of such marks by Creative Technology is under license. All other trademarks are the property of their respective owners and are hereby recognized as such. All specifications are subjected to change without notice. Actual product may differ slightly from images shown. Use of this product is subjected to a limited warranty. COMPLIANCE ADDITIONAL CONTENTS: Тип оборудования: Звуковые карты Номер Модель, торговая марка: MF8405, Creative Питание: 5V 1A Производитель: Creative Labs Pte. Ltd. Страна происхождения: китай Название и адрес представителя в таможенном союзе: ООО “Прокси”, 142281, Московская область, город Протвино, Оболенское шоссе, д.2, к.216., Номер телефона : +7 (495) 369-00-84 Электронный адрес : [email protected] Название и адрес представителя в таможенном союзе: Российская Федерация, Москва, 111123, проезд Электродный, дом 16, помещение VII, комната No3, основной государственный регистрационный номер: 1177746150779, Номер телефона: +7(495)723-23-71 адрес электронной почты: [email protected] Данная контактнаяинформация только для соответствующих органов таможенного союза (Россия, Белоруссия и Казахстан) по вопросам соответствия продукции Для информации о продукте илигарантии, пожалуйста, посмотрите гарантийный талон из комплекта поставки ата производства (месяц и год):…

Text truncated - open the document above for the full version.

CreativeLabsPte.Ltd. 31InternationalBusinessPark,#03-01,Singapore609921 Sep.21,2022 FederalCommunicationCommission AuthorizationandEvaluationDivision FCCID:2AJIV-SB1820 Re:ConfidentialityRequest PursuanttoSections0.457and0.459oftheCommission’sRules,theapplicanthereby requestsconfidentialtreatmentofinformationappliedthisapplicationasoutlinedbelow: 1:BlockDiagram 2:Schematics 3:OperationalDescription Theabovematerialscontaintradesecretsandproprietaryinformationnotcustomarily releasedtothepublic.Thepublicdisclosureofthesemattersmightbeharmfultothe applicantandprovideunjustifiedbenefitstoitscompetitors. TheApplicantunderstandsthatpursuanttoRules0.457,disclosureofthisApplicationand allaccompanyingdocumentationwillnotbemadebeforethedateoftheGrantforthis application. Sincerely, CreativeLabsPte.Ltd. Contactperson: Title:RegulatoryManager

Report No.: AGC03061220802AP03 Page 1 of 4 EXTERNAL PHOTOS ALL VIEW OF EUT TOP VIEW OF EUT Report No.: AGC03061220802AP03 Page 2 of 4 BOTTOM VIEW OF EUT FRONT VIEW OF EUT Report No.: AGC03061220802AP03 Page 3 of 4 BACK VIEW OF EUT LEFT VIEW OF EUT Report No.: AGC03061220802AP03 Page 4 of 4 RIGHT VIEW OF EUT ****************************************End of Report****************************************

FCC ID and IC Label Location 40mm*40mm FCC ID: 2AJIV-SB1820 IC: 20469-SB1820 HVIN: SB1820 Sound Blaster X5 Creative

Report No.: AGC03061220802AP03 Page 1 of 4 INTERNAL PHOTOS OPEN VIEW OF EUT (FIGURE 1) OPEN VIEW OF EUT (FIGURE 2) Report No.: AGC03061220802AP03 Page 2 of 4 INTERNAL VIEW OF EUT (FIGURE 1) INTERNAL VIEW OF EUT (FIGURE 2) Report No.: AGC03061220802AP03 Page 3 of 4 INTERNAL VIEW OF EUT (FIGURE 3) INTERNAL VIEW OF EUT (FIGURE 4) Report No.: AGC03061220802AP03 Page 4 of 4 ANTENNA CLOSE-UP PHOTO-1 ****************************************End of Report**************************************** BT Antenna

RF EXPOSURE EVALUATION 1. PRODUCT INFORMATION Product Description Sound Blaster X5 Model Name SB1820 FCC ID 2AJIV-SB1820 2. EVALUATION METHOD According to 447498 D01 General RF Exposure Guidance v06 The 1-g and 10-g SAR test exclusion thresholds for 100 MHz to 6 GHz at test separation distances ≤ 50 mm are determined by: [(max. power of channel, including tune-up tolerance, mW)/(min. test separation distance, mm)] ·[√f(GHz)] ≤ 3.0 for 1-g SAR and ≤ 7.5 for 10-g extremity SAR. Where f(GHz) is the RF channel transmit frequency in GHz Power and distance are rounded to the nearest mW and mm before calculation 3. CALCULATION BR/EDR P t = -1.155dBm=0.76mW The value of the Maximum output power P t is referred to the test report of the CFR47 §15.247. The result for RF exposure evaluation SAR=(0.76mW /5mm) .[√2.480GHz)]=0.24<3.0 for 1-g SAR and ≤ 7.5 for 10-g extremity SAR. BLE P t = -6.664dBm=0.22mW The value of the Maximum output power P t is referred to the test report of the CFR47 §15.247. The result for RF exposure evaluation SAR=(0.22mW /5mm) .[√2.480GHz)]=0.07<3.0 for 1-g SAR and ≤ 7.5 for 10-g extremity SAR. 4. CONCLUSION The SAR evaluation is not required.

承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： WAN3216F245C04 規格 DESCRIPTION ： Chip Antenna 3216 L Ant 2.45G Type 04 版本 VERSION ： V1.2 日期 ISSUE DATE ： 2020/02/27 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray Tennyson Snow 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 11261台北市北投區立功街151號1樓 1F, No. 151, Li Gong Street, Beitou District, Taipei City 11261, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 2/11 ONEWAVE TECHNOLOGY CO., LTD. 3216 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 3.23 ± 0.20 W 1.66 ± 0.20 T 0.45 ± 0.20 P/N: WAN3216F245C04 3/11 ONEWAVE TECHNOLOGY CO., LTD. Part Number Information WAN 3216 F 245 C 04 A B C D E F A Product Series Antenna B Dimension L x W 3.2 x 1.6mm (±0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode PIFA & Single Feeding F Antenna type Type = 04 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN3216F245C04 Central Frequency 2450 MHz Bandwidth 120 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 1.75 dBi Impedance 50 Ohm Operating Temperature -40～+110 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Ni / Au (Leadless) 4/11 ONEWAVE TECHNOLOGY CO., LTD. 2. Recommended PCB Pa�ern Evaluation Board Dimension 2 nd Evaluation Board Dimension Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感±0.1~0.3nH、電容±0.1pF 5/11 ONEWAVE TECHNOLOGY CO., LTD. Layout Dimensions in Clearance area( Size=5.9*5.0mm) FootPrint (Unit : mm) ◆ 2 nd Layout Dimensions in Clearance area( Size=8.0*3.0mm) Matching Circuit 50 ohm transmission Line 6/11 ONEWAVE TECHNOLOGY CO., LTD. 3. Measurement Results Return Loss 7/11 ONEWAVE TECHNOLOGY CO., LTD. Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 82.36% 1.69 dBi 2.53 dBi 2450MHz 85.65% 1.75 dBi 2.42 dBi 2500MHz 83.88% 1.71 dBi 2.47 dBi Chamber Coordinate System X Y Z 8/11 ONEWAVE TECHNOLOGY CO., LTD. 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10 ± 0.5 sec. 60 sec . . T E M P ( °C ) 150 °C 2 6 0 °C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C 9/11 ONEWAVE TECHNOLOGY CO., LTD. 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 10/11 ONEWAVE TECHNOLOGY CO., LTD. 6.Packaging Information Tape Specification: Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 13.5±0.5 178±2 3000 11/11 ONEWAVE TECHNOLOGY CO., LTD. 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: -10~ 40°C and 30~70% RH. 2. Recommended products should …

Text truncated - open the document above for the full version.

Page 1 of 44 FCC Test Report Report No.: AGC03061220802FE02 FCC ID : 2AJIV-SB1820 APPLICATION PURPOSE : Original Equipment PRODUCT DESIGNATION : Sound Blaster X5 BRAND NAME : Creative MODEL NAME : SB1820 APPLICANT : Creative Labs Pte. Ltd. DATE OF ISSUE : Sep. 17, 2022 STANDARD(S) : FCC Part 15.247 REPORT VERSION : V1.0 Attestation of Global Compliance (Shenzhen) Co., Ltd Report No.: AGC03061220802FE02 Page 2 of 44 REPORT REVISE RECORD Report Version Revise Time Issued Date Valid Version Notes V1.0 / Sep. 17, 2022 Valid Initial Release Report No.: AGC03061220802FE02 Page 3 of 44 TABLE OF CONTENTS 1. VERIFICATION OF COMPLIANCE .................................................................................................................. 5 2. GENERAL INFORMATION .............................................................................................................................. 6 2.1. PRODUCT DESCRIPTION ........................................................................................................................ 6 2.2. TABLE OF CARRIER FREQUENCYS ....................................................................................................... 6 2.3. RELATED SUBMITTAL(S)/GRANT(S) ....................................................................................................... 7 2.4. TEST METHODOLOGY ............................................................................................................................. 7 2.5. SPECIAL ACCESSORIES .......................................................................................................................... 7 2.6. EQUIPMENT MODIFICATIONS ................................................................................................................. 7 2.7. ANTENNA REQUIREMENT ....................................................................................................................... 7 3. MEASUREMENT UNCERTAINTY ................................................................................................................... 8 4. DESCRIPTION OF TEST MODES ................................................................................................................... 9 5. SYSTEM TEST CONFIGURATION ................................................................................................................ 10 5.1. CONFIGURATION OF TESTED SYSTEM ............................................................................................... 10 5.2. EQUIPMENT USED IN TESTED SYSTEM .............................................................................................. 10 5.3. SUMMARY OF TEST RESULTS .............................................................................................................. 10 6. TEST FACILITY ............................................................................................................................................... 11 7. PEAK OUTPUT POWER ................................................................................................................................ 12 7.1. MEASUREMENT PROCEDURE .............................................................................................................. 12 7.2. TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) .................................................................... 12 7.3. LIMITS AND MEASUREMENT RESULT .................................................................................................. 13 8. BANDWIDTH .................................................................................................................................................. 15 8.1. MEASUREMENT PROCEDURE .............................................................................................................. 15 8.2. TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) .................................................................... 15 8.3. LIMITS AND MEASUREMENT RESULTS ............................................................................................... 15 9. CONDUCTED SPURIOUS EMISSION........................................................................................................... 19 9.1. MEASUREMENT PROCEDURE .............................................................................................................. 19 9.2. TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) .................................................................... 19 9.3. MEASUREMENT EQUIPMENT USED .................................................................................................... 19 9.4. LIMITS AND MEASUREMENT RESULT .................................................................................................. 19 10. MAXIMUM CONDUCTED OUTPUT POWER SPECTRAL DENSITY ........................................................ 26 Report No.: AGC03061220802FE02 Page 4 of 44 10.1. MEASUREMENT PROCEDURE ............................................................................................................ 26 10.2. TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) .................................................................. 26 10.3. MEASUREMENT EQUIPMENT USED .................................................................................................. 26 10.4. LIMITS AND MEASUREMENT RESULT................................................................................................ 26 11. RADIATED EMISSION ................................................................................................................................. 28 11.1. MEASUREMENT PROCEDURE ............................................................................................................ 28 11.2. TEST SETUP .......................................................................................................................................... 29 11.3. LIMITS AND MEASUREMENT RESULT................................................................................................…

Text truncated - open the document above for the full version.

Report No.: AGC03061220802AP02 Page 1 of 2 TEST SETUP PHOTOS RADIATED EMISSION TEST SETUP BELOW 1GHz RADIATED EMISSION TEST SETUP ABOVE 1GHz Report No.: AGC03061220802AP02 Page 2 of 2 AC POWER LINE CONDUCTED TEST SETUP RF CONDUCTED TEST SETUP ****************************************End of Report*************************************